EMI / RFI Shielding Material Industrial Sealants
from Quantaflex Printed Electronics Inc.
A high level of custom engineering and problem solving. Designing electrical shielding components requires a high level of custom engineering and problem solving. Nothing should be left to chance because the goal is to create a part that protects the electronic device (and your customers) from the... [See More]
- Features: EMI/RFI Shielding; Gap Filler, Foam in Place Gasket; Thermally Conductive
- Industry: Electronics; Semiconductors, IC's
- Type / Form: Liquid; Sheet or Film
from Master Bond, Inc.
Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]
- Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Flexible; Gap Filler, Foam in Place Gasket; Anti-static, ESD
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer System EP65HT-1 represents a breakthrough in epoxy adhesive technology in that it features the unusual combination of ultra-fast cures and high temperature resistance. While typical fast setting epoxies normally possess glass transition temperatures below 85 °C, EP65HT-1 has... [See More]
- Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Gap Filler, Foam in Place Gasket; Anti-static, ESD
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer Adhesive EP51 is a fast "5 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi at room temperature. The... [See More]
- Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Anti-static, ESD
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer System EP65HT represents a breakthrough in epoxy adhesive technology in that it features the unusual combination of ultra-fast cures and high temperature resistance. While typical fast setting epoxies normally possess glass transition temperatures below 85 °C, EP65HT has an... [See More]
- Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Gap Filler, Foam in Place Gasket; Anti-static, ESD
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer Adhesive EP51M is a fast "3 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi at room temperature. The... [See More]
- Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Anti-static, ESD
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4500 psi. In addition, unlike many structural epoxies, EP31 also has a high peel strength exceeding 40 pli. The service... [See More]
- Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Flexible; Gap Filler, Foam in Place Gasket; Anti-static, ESD
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Type / Form: Grease, Paste
from Master Bond, Inc.
Master Bond Polymer Adhesive EP33 is a unique room temperature curing two component epoxy adhesive for high temperature bonding applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures. Master Bond Polymer Adhesive EP33 produces high strength bonds whose... [See More]
- Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Flexible; Gap Filler, Foam in Place Gasket; Anti-static, ESD
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer System EP29LP is a two component high performance epoxy resin system featuring low viscosity, long pot life and low exotherm. As an adhesive this versatile material will form bond strengths in excess of 2,500 psi (aluminum to aluminum). It bonds well to a variety of substrates... [See More]
- Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Flexible; Gap Filler, Foam in Place Gasket; Anti-static, ESD
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. Not only is EP29LPSP able to function as an adhesive, sealant and protective coating at temperatures as low as 4K, but it is... [See More]
- Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Encapsulant or Conformal Coating; Flexible; Gap Filler, Foam in Place Gasket; Anti-static, ESD
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer System EP76M is a two component, nickel filled, electrically conductive adhesive for high performance bonding, sealing, and coating formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part nickel conductive systems, EP76M... [See More]
- Features: Electrically Conductive; EMI/RFI Shielding; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket; Thermally Conductive; Anti-static, ESD
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer System EP36 is a unique one component high performance toughened epoxy system for electrical potting, casting, encapsulation, baked coatings and adhesive applications. It features an outstanding combination of properties including high temperature stability up to 500 °F,... [See More]
- Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Encapsulant, Potting Compound; Flexible; Gap Filler, Foam in Place Gasket; Anti-static, ESD
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Master Bond, Inc.
Master Bond Polymer Adhesive EP65 represents a breakthrough in epoxy adhesive technology featuring hitherto unattainable balance of processing strengths. This two component adhesive system is formulated to cure exceptionally quickly at ambient temperatures e.g. 8-10 minutes, shorter lives at higher... [See More]
- Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Gap Filler, Foam in Place Gasket; Anti-static, ESD
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer System EP79 is a two component, silver coated nickel filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. EP79 offers a convenient one-to-one mix ratio by weight or... [See More]
- Features: Electrically Conductive; EMI/RFI Shielding; Gap Filler, Foam in Place Gasket; Thermally Conductive; Anti-static, ESD
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Featuring a low volume resistivity of 5-10 ohm-cm, EP21TDCN-LO is a nickel conductive system for high performance bonding and sealing applications. This smooth paste formulation is easy to handle and has a one to one mix ratio by weight or volume. It is a toughened system, formulated to withstand... [See More]
- Features: Electrically Conductive; EMI/RFI Shielding; Flexible; Non-corrosive; Thermally Conductive
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Shiu Li Technology Co., Ltd
LiPOLY TEM96D is a thermally conductive absorber based upon soft magnetic materials dispersed in a polymeric resin. It has a thermalconductivity of 5.0 W/m*K and dissipates electromagnetic radiation rapidly to mitigate against EMI issues. [See More]
- Features: High Dielectric; EMI/RFI Shielding; Gap Filler, Foam in Place Gasket; Thermally Conductive; UL Rating
- Type / Form: Sheet or Film
- Chemical System: Silicone
- Industry: Aerospace; Automotive; Electronics; Electric Power; Laminaes; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
from MAST Technologies
MAST Technologies ’ suite of resistive caulk and ink materials can meet a variety of demanding electrical and environmental specifications. MAST utilizes resistive fillers to achieve specific surface or volume resistivities in a variety of different binder types and viscosities. MAST... [See More]
- Features: Caulk, Grout; EMI/RFI Shielding