Two Component System Industrial Sealants
from Ellsworth Adhesives
3M Scotch-Weld Epoxy Adhesive DP105 Clear is a two component, fast curing, epoxy sealant/adhesive that is used for bonding dissimilar surfaces that may be exposed to thermal expansion. It offers high peel strength and flexibility. 1:1 mix ratio by volume. 200 mL Duo-Pak Cartridge. [See More]
- Cure / Technology: Two Component
- Viscosity: 1000 to 16000
- Chemical System: Epoxy
- Thermal Conductivity: 0.0850
from RS Components, Ltd.
Two Components Silicone Gel - 1 liter [See More]
- Cure / Technology: Two Component
- Industry: Insulation
- Features: Encapsulant, Potting Compound
from ELANTAS North America LLC
ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]
- Cure / Technology: Thermoset; Two Component
- Composition: Filled
- Chemical System: Epoxy
- Type / Form: Grease, Paste
from Master Bond, Inc.
MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing; Addition Cure
- Composition: Unfilled
- Chemical System: Silicone
- Type / Form: Liquid
from Ellsworth Adhesives
3M Scotch-Weld Epoxy Adhesive DP105 Clear is a two component, fast curing, epoxy sealant/adhesive that is used for bonding dissimilar surfaces that may be exposed to thermal expansion. It offers high peel strength and flexibility. 1:1 mix ratio by volume. 48.5 mL Duo-Pak Cartridge. [See More]
- Cure / Technology: Two Component
- Viscosity: 1000 to 16000
- Chemical System: Epoxy
- Thermal Conductivity: 0.0850
from Master Bond, Inc.
Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]
- Cure / Technology: Thermoset; Two Component
- Composition: Filled
- Chemical System: Epoxy
- Type / Form: Grease, Paste
from Ellsworth Adhesives
3M Scotch-Weld Epoxy Potting Compound/Adhesive DP270 Black is a two component, epoxy resin system that is used for sealing, encapsulating, and potting electronic and heat sensitive components. It offers low viscosity, long handling times, noncorrosive to copper, good electrical properties, and... [See More]
- Cure / Technology: Two Component
- Features: Encapsulant, Potting Compound
- Chemical System: Epoxy
- Viscosity: 6000 to 16000
from Master Bond, Inc.
MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]
- Cure / Technology: Thermoset; Two Component ; Addition Cure
- Composition: Filled
- Chemical System: Silicone
- Type / Form: Grease, Paste
from Ellsworth Adhesives
3M Scotch-Weld Epoxy Potting Compound/Adhesive DP270 Clear is a two component, epoxy resin system that is used for sealing, encapsulating, and potting electronic and heat sensitive components. It offers low viscosity, long handling times, noncorrosive to copper, good electrical properties, and... [See More]
- Cure / Technology: Two Component
- Features: Encapsulant, Potting Compound
- Chemical System: Epoxy
- Viscosity: 6000 to 16000
from Master Bond, Inc.
EP35SP is a two component epoxy system specially formulated to resist high temperatures and aggressive chemicals. It has a paste viscosity with little to no flow when curing. [See More]
- Cure / Technology: Thermoset; Two Component
- Composition: Unfilled
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Ellsworth Adhesives
Ashland PLIOGRIP Urethane Adhesive System 7770 is a two component structural adhesive that is used for sealing, repairing, and bonding of thermoplastics, thermoset composites, CFRP, wood, concrete, metal, and other materials. It offers long cure times, odorless, no VOCs, and easy applications. It is... [See More]
- Cure / Technology: Two Component
- Substrate Compatibility: Composites; Metal; Plastic; Wood
- Chemical System: Polyurethane
- Viscosity: 7400 to 20500
from Master Bond, Inc.
Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Composition: Unfilled
- Chemical System: Epoxy
- Type / Form: Liquid
from Ellsworth Adhesives
Ashland PLIOGRIP Urethane Adhesive System 7771 is a two component structural adhesive that is used for sealing, repairing, and bonding of thermoplastics, thermoset composites, CFRP, wood, concrete, metal, and other materials. It offers fast cure times, odorless, no VOCs, and easy applications. It is... [See More]
- Cure / Technology: Two Component
- Substrate Compatibility: Composites; Metal; Plastic; Wood
- Chemical System: Polyurethane
- Viscosity: 15000 to 20500
from Master Bond, Inc.
EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Composition: Unfilled
- Chemical System: Epoxy
- Type / Form: Liquid
from Ellsworth Adhesives
Ashland PLIOGRIP Urethane Adhesive System 7779 is a two component structural adhesive that is used for sealing, repairing, and bonding of thermoplastics, thermoset composites, CFRP, wood, concrete, metal, and other materials. It offers long cure times, odorless, no VOCs, and easy applications. It is... [See More]
- Cure / Technology: Two Component
- Substrate Compatibility: Composites; Metal; Plastic; Wood
- Chemical System: Polyurethane
- Viscosity: 15000 to 20500
from Master Bond, Inc.
EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Composition: Unfilled
- Chemical System: Epoxy
- Type / Form: Liquid
from Ellsworth Adhesives
Bostik Epoxy Adhesive 7575 Clear is a two component, structural adhesive that is used for bonding phenolic plastics, glass, wood, masonry, rubber, ceramics, metal, and polyesters. It is typically used for sealing electrical components, encapsulation, and potting applications. It offers fast cure... [See More]
- Cure / Technology: Two Component
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Rubber or Elastomer; Wood
- Chemical System: Epoxy
- Viscosity: 12000 to 16000
from Master Bond, Inc.
MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Composition: Unfilled
- Chemical System: Silicone
- Type / Form: Liquid
from Ellsworth Adhesives
Dow DOWSIL ™ 3-4150 Dielectric Gel Clear-Green is a two component, fast room temperature curing, silicone gel that is used for potting, sealing, encapsulating, and protecting a variety of materials in the electronics industry. It offers flexibility, stress relief, and offers excellent... [See More]
- Cure / Technology: Two Component
- Features: High Dielectric; Encapsulant, Potting Compound
- Chemical System: Silicone
- Viscosity: 480
from Master Bond, Inc.
Master Bond Polymer Adhesive EP51 is a fast "5 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi at room temperature. The... [See More]
- Cure / Technology: Thermoset; Two Component
- Composition: Unfilled
- Chemical System: Epoxy
- Type / Form: Liquid
from Ellsworth Adhesives
Dow DOWSIL ™ 3-4680 Silicone Gel Clear-Blue is a two component, room temperature curing, low viscosity, dielectric gel that is used for potting, sealing, encapsulating, and protecting electrical components from contaminants, moisture, and stress. It is durable, flexible, and fast curing. 1:1... [See More]
- Cure / Technology: Two Component
- Features: Encapsulant, Potting Compound
- Chemical System: Silicone
- Viscosity: 275
from Master Bond, Inc.
Master Bond Polymer System EP39-2 is a fast curing, low viscosity, optically clear two component epoxy system for high performance bonding, sealing, coating and casting. It is 100% reactive and does not contain any diluents, solvents or other volatiles. The mix ratio is a convenient 2 to 1 by... [See More]
- Cure / Technology: Thermoset; Two Component
- Composition: Unfilled
- Chemical System: Epoxy
- Type / Form: Grease, Paste
from Ellsworth Adhesives
Dow DOWSIL ™ 3-6121 Low Temperature Elastomer Clear is a two component, room to high temperature curing, silicone encapsulant that is used to protect electrical components from contaminants, moisture, and stress. It is fast curing, flowable, tear resistant, and has high tensile strength. 10:1... [See More]
- Cure / Technology: Two Component
- Features: Encapsulant, Potting Compound
- Chemical System: Silicone
- Viscosity: 19250
from Master Bond, Inc.
Master Bond EP62-1 is a two component heat cured and chemically resistant epoxy resin system featuring a long pot life at ambient temperatures and efficient cures at moderately elevated temperatures. The recommended mix ratio is 100 parts of component A to 10 parts of component B. The pot life of... [See More]
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Porous Surfaces
- Type / Form: Liquid
- Features: Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
from Ellsworth Adhesives
Dow DOWSIL ™ 90-006-2 RF Aerospace Sealant is a two component, room temperature curing, silicone elastomer that is used for bonding to primed surfaces such as glass, metals, polyester, epoxies, cured silicone rubber, and silicone resin laminates. It offers short working times, high viscosity... [See More]
- Cure / Technology: Two Component
- Viscosity: 1.20E6
- Chemical System: Silicone
- Tensile (Break): 600
from Master Bond, Inc.
Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4500 psi. In addition, unlike many structural epoxies, EP31 also has a high peel strength exceeding 40 pli. The service... [See More]
- Cure / Technology: Thermoset; Two Component
- Type / Form: Grease, Paste
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
from Ellsworth Adhesives
Dow DOWSIL ™ 93-500 Thixotropic Space Grade Encapsulant and 93-500 Space Grade Encapsulant Clear are two component, silicone elastomers that are used for aerospace applications such as sealing optical sensors, encapsulating/potting electronic components, and bonding solar cells to substrates,... [See More]
- Cure / Technology: Two Component
- Features: Encapsulant, Potting Compound
- Chemical System: Silicone
- Thermal Conductivity: 0.2000
from Master Bond, Inc.
Master Bond Polymer System EP45HT is a two component epoxy system for high performance structural bonding and casting. It is suitable for applications where long term exposure to temperatures from -80 °F to +500 °F is required. lt is 100% reactive and does not contain any solvents or... [See More]
- Cure / Technology: Thermoset; Two Component
- Composition: Unfilled
- Chemical System: Epoxy
- Type / Form: Grease, Paste
from Ellsworth Adhesives
Dow DOWSIL ™ CY 52-276 Kit Clear is a two component, low volatility silicone gel that is used for protecting and sealing electronic devices from thermal shock, vibration, fuels, and solvents. with addition cure, It offers flexibility and a low temperature cure. 1:1 mix ratio. Part A, 1 kg... [See More]
- Cure / Technology: Two Component
- Features: Encapsulant, Potting Compound
- Chemical System: Silicone
- Viscosity: 900 to 1200
from Master Bond, Inc.
Master Bond Polymer System 125 is a two component toughened epoxy resin for prolonged service above 500 °F with truly outstanding chemical resistance. High strength bonds serviceable up to 600 °F can be obtained with this exceptionally thermally stable and chemically resistant epoxy resin... [See More]
- Cure / Technology: Thermoset; Two Component
- Composition: Unfilled
- Chemical System: Epoxy
- Type / Form: Grease, Paste; Powder
from Ellsworth Adhesives
Dow DOWSIL ™ CY 52-276 Kit Clear is a two component, low volatility silicone gel that is used for protecting and sealing electronic devices from thermal shock, vibration, fuels, and solvents. with addition cure, It offers flexibility and a low temperature cure. 1:1 mix ratio. Part B, 1 kg... [See More]
- Cure / Technology: Two Component
- Features: Encapsulant, Potting Compound
- Chemical System: Silicone
- Viscosity: 900
from Master Bond, Inc.
Master Bond Polymer Adhesive EP33 is a unique room temperature curing two component epoxy adhesive for high temperature bonding applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures. Master Bond Polymer Adhesive EP33 produces high strength bonds whose... [See More]
- Cure / Technology: Thermoset; Two Component
- Composition: Unfilled
- Chemical System: Epoxy
- Type / Form: Grease, Paste
from Ellsworth Adhesives
Dow DOWSIL ™ Q3-6575 Dielectric Gel Clear is a two component, heat curing, low temperature, silicone gel that is used for protecting and sealing electronic devices from high voltages, moisture, mechanical and thermal shock. 1:1 mix ratio by weight or volume. 0.9 kg Kit.This is a Dow product... [See More]
- Cure / Technology: Two Component
- Features: High Dielectric; Encapsulant, Potting Compound
- Chemical System: Silicone
- Viscosity: 750
from Master Bond, Inc.
Master Bond Polymer System EP29LP is a two component high performance epoxy resin system featuring low viscosity, long pot life and low exotherm. As an adhesive this versatile material will form bond strengths in excess of 2,500 psi (aluminum to aluminum). It bonds well to a variety of substrates... [See More]
- Cure / Technology: Thermoset; Two Component
- Composition: Unfilled
- Chemical System: Epoxy
- Type / Form: Grease, Paste
from Ellsworth Adhesives
Dow DOWSIL ™ Q3-6575 Dielectric Gel Clear is a two component, heat curing, low temperature, silicone gel that is used for protecting and sealing electronic devices from high voltages, moisture, mechanical and thermal shock. 1:1 mix ratio by weight or volume. 35 kg Kit. [See More]
- Cure / Technology: Two Component
- Features: High Dielectric; Encapsulant, Potting Compound
- Chemical System: Silicone
- Viscosity: 750
from Master Bond, Inc.
Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. Not only is EP29LPSP able to function as an adhesive, sealant and protective coating at temperatures as low as 4K, but it is... [See More]
- Cure / Technology: Thermoset; Two Component
- Composition: Unfilled
- Chemical System: Epoxy
- Type / Form: Liquid
from Ellsworth Adhesives
Dow DOWSIL ™ Q5-8401 Adhesive Dark Gray is a two component, heat curing, silicone adhesive that is used for sealing, gasketing, and attaching connectors, baseplates, controllers, housings, lids, and lighting. It provides flowability, high tensile strength, and a quick cure. 1:1 mix ratio. 210... [See More]
- Cure / Technology: Two Component
- Viscosity: 120000
- Chemical System: Silicone
- Tensile (Break): 870
from Master Bond, Inc.
Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronicc/ structural applications. The two components are combined in a convenient noncritical mix... [See More]
- Cure / Technology: Thermoset; Two Component
- Composition: Unfilled
- Chemical System: Epoxy
- Type / Form: Liquid
from Ellsworth Adhesives
Dow HIPEC ™ Q3-6646 Semiconductor Protective Coating Kit Clear is a two component, low modulus LED gel encapsulant that is used for protecting and sealing LEDs. It offers stress relief, low viscosity, and long working times. 210 mL Kit. [See More]
- Cure / Technology: Two Component
- Viscosity: 630 to 660
- Features: Encapsulant, Potting Compound
from Master Bond, Inc.
Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Composition: Unfilled
- Chemical System: Epoxy
- Type / Form: Liquid
from Ellsworth Adhesives
Dow SILASTIC ™ 3-8186 Thixotropic Foam Black is a two component, medium density, silicone elastomer that is used for robotic dispensed-in-place gasketing applications and sealing lighting and automotive parts. It has low sealing force, low durometer, and reduced flow. 1:1 mixed ratio by... [See More]
- Cure / Technology: Two Component
- Industry: Automotive
- Chemical System: Silicone
- Viscosity: 200000
from Master Bond, Inc.
Master Bond Polymer System EP38 is a fast curing, low viscosity, optically clear two component epoxy system for high performance coating, bonding and sealing. It is 100% reactive and does not contain any volatiles. The mix ratio is a convenient 3 to 1 by weight. EP38 is very fast curing. Coatings as... [See More]
- Cure / Technology: Thermoset; Two Component
- Composition: Unfilled
- Chemical System: Epoxy
- Type / Form: Grease, Paste
from Ellsworth Adhesives
Dow SILASTIC ™ Q3-3636 Adhesive White is a two component, thixotropic, room temperature curing paste that is used for sealing and bonding applications that are exposed to high temperatures. It offers quick cure, durability, and low fogging characteristics. Base, 25 kg Pail. Requires Dow... [See More]
- Cure / Technology: Two Component
- Viscosity: 200000
- Chemical System: Silicone
- Tensile (Break): 261
from Master Bond, Inc.
Master Bond EP30NS is a nano silica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically clear and meets NASA low outgassing specifications. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Composition: Filled
- Chemical System: Epoxy
- Type / Form: Liquid
from Bluestar Silicones USA Corp.
Two-Component, Flowable Silicone Aerospace Sealant. Properties. Viscosity 190000. Hardness Sha 58. Description. Bluesil V-695 is a black, two component addition cure, flowable silicone aerospace sealant. It is specifically designed for, and qualified to, General Electric Aircraft Engine... [See More]
- Cure / Technology: Two Component
- Substrate Compatibility: Metal; Plastic
- Chemical System: Silicone
- Industry: Aerospace
from Epoxy Technology
EPO-TEK ® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries. Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market... [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Type / Form: Liquid
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Edge Sealer ES2000 is a two-part edge sealer. It is a clear, non-yellowing and UV stable, durable sealer system having excellent resistance to environmental and ultra-violet (UV) exposure. [See More]
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Paints, Primers, and Films
- Type / Form: Grease, Paste
- Industry: Aerospace; OEM or Industrial
from NCFI Polyurethanes
24-017 is a plural component, polyurea, crack sealing system developed for sealing cracks and joints in concrete and asphalt. This system can also be used for wood and masonry applications. This system can be machine processed or applied using various types of plural component caulking guns, and it... [See More]
- Cure / Technology: Two Component
- Type / Form: Liquid
- Chemical System: Polyethylene
- Features: Caulk, Grout; Gap Filler, Foam in Place Gasket
from Sherwin-Williams Protective & Marine Coatings
ENVIROLASTIC AR530 BRUSH GRADE is a 100% solids, fluid applied polyurea elastomer repair material that is based on proprietary polyurea formulation and a modified amine curing mechanism. It can be applied at thicknesses of 30 - 250 mils in consecutive multiple applications. Fast cure short downtime. [See More]
- Cure / Technology: Thermoset; Two Component
- Composition: Unfilled
- Chemical System: Polyurethane
- Type / Form: Pellets
from ACCRAbond, Inc.
CONATHANE ® FP-1301 is an unfilled two-component urethane system designed for use as a sealant. [See More]
- Cure / Technology: Two Component
from Hapco, Inc.
Filter-bond ™ is a series of casting and potting compounds ideally suited for potting, sealing, and bonding filtration and ultrafiltration products. The Filter-bond ™ E-Series is manufactured to ultra-high quality standards and has been used by customers to pass FDA approval. Filter-bond... [See More]
- Cure / Technology: Two Component
- Type / Form: Liquid
- Chemical System: Elastomeric; Polyurethane
- Features: Encapsulant, Potting Compound; Flexible
from Materion Corporation
Thermotech TE ™ is a Silver-filled, electrically conductive high-vacuum compound specifically manufactured by Pure Tech for the sputtering target industry. Thermotech TE combines the excellent thermal and electrical conductive properties of pure Silver with a low vapor pressure sealant,... [See More]
- Cure / Technology: Two Component
- Industry: Electronics
- Features: Electrically Conductive; Leveling Filling
from Protavic America, Inc.
PNE-47207 ™ is an adhesive/sealant and potting compound. PNE-47207 ™ is designed to provide air free potting and casting of electronic devices. PNE-47207 ™ will bond difficult substrates such as glass, ceramics, and metals. It passes UL 94V0 for fire retardant properties,and has a... [See More]
- Cure / Technology: Thermoset; Two Component
- Composition: Filled
- Chemical System: Epoxy
- Type / Form: Liquid
from GAF
EverGuard ® Water Block. Description. One-part butyl-based high-viscosity sealant. Benefit/Application. Suitable for sealing between flashing membrane and substrate surface behind exposed termination bars. Suitable for sealing between roofing membrane and drain flanges [See More]
- Cure / Technology: Two Component
- Substrate Compatibility: Plastic
- Type / Form: Liquid
- Industry: Construction
from Hi-Tech Seals, Inc.
HERNON ® offers a complete line of structural acrylic adhesives. These systems are two-part, no mix, and reactive adhesives. Each acrylic adhesive has two components: the adhesive base or resin, and the Activator. Structural acrylic adhesives are termed “reactive ” cure systems. The... [See More]
- Cure / Technology: Two Component ; Reactive or Moisture Cured
- Type / Form: Liquid
- Chemical System: Acrylic
- Substrate Compatibility: Metal; Plastic
from Sauereisen, Inc.
Sauereisen Aguapoxy No. 28 is a three component, water cleanable, general purpose epoxy grout for bonding chemical resistant masonry units. The No. 28, combined with brick or tile, offers rapid installation and clean up with potable water. The water cleanable feature of Aguapoxy No. 28 is designed... [See More]
- Cure / Technology: Two Component
- Type / Form: Liquid; Powder
- Chemical System: Epoxy
- Substrate Compatibility: Concrete, Masonry
from Henkel Corporation - Industrial
LOCTITE STYCAST US 0138, Urethane, Potting and Encapsulating, Extended polybutadiene/MDI base Sealant. LOCTITE ® STYCAST US 0138 is an extended polybutadiene/MDI base encapsulant/sealant formulated for potting electronics or devices for protection against environmental hazards. It exhibits very... [See More]
- Cure / Technology: Two Component
- Type / Form: Liquid
- Chemical System: Polyurethane
- Features: UL Rating
from Epoxies Etc...
10-3022 is a two component epoxy adhesive and sealant. This structural adhesive has excellent chemical and heat resistance. 10-3022 is widely used as a stencil and screen adhesive due to its bonding strength and toughness. It has been used extensively to bond polyester mesh to aluminum frames and... [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Composition: Unfilled
- Chemical System: Epoxy
- Type / Form: Liquid
from Wacker Chemical Corp.
ELASTOSIL ® SC 870 A/B is a thixotropic, additioncuring, two-part silicone rubber, forming a mainly closed cell foam. Special features. two-component system. thixotropic. fast foaming and cure. medium foam density. no ozone damaging blowing agents. high compressibility. low compression set. [See More]
- Cure / Technology: Thermoset; Two Component
- Type / Form: Liquid
- Chemical System: Silicone; Elastomeric
- Industry: OEM or Industrial
from 3M Aerospace and Aircraft Maintenance Division
Two-Part, 30/70 Mix Ratio of Base to Hardener. Designed to cure at room temperature of 70-80F [21-27C]. Cured material exhibits excellent flexibility and adhesion. Low flow, soft paste viscosity permits application on vertical or overhead surfaces with a minimum of run-off. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Type / Form: Grease, Paste
- Chemical System: Epoxy
- Features: Flexible
from Sherwin-Williams Protective & Marine Coatings
KEM CATI-COAT HS N EPOXY FILLER/SEALER is a high performance, interior/exterior, low VOC, epoxy. Designed for tenacious adhesion to masonry and concrete substrates. This product meets specific design requirements for nuclear safety related qualification*. This product is quality manufactured to the... [See More]
- Cure / Technology: Air Setting / Film Drying; Two Component
- Substrate Compatibility: Concrete, Masonry
- Chemical System: Epoxy
- Features: Leveling Filling
from Hapco, Inc.
HIGH PERFORMANCE HYBRID ELASTOMERIC POLYMER ALLOYS. The Hapflex ™ 1000 Series products are soft, colorless, Shore A elastomers. These materials are available in both a fast and slow gel time and can also be combined to yield customized gel times without the addition of heat. Hapflex ™... [See More]
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Composition: Unfilled
- Chemical System: Elastomeric; Polyurethane
- Type / Form: Liquid
from Sauereisen, Inc.
Sauereisen Cement No. 31 is a white, porcelain-like cement that is widely used throughout industry in a variety of applications. including assembling, sealing, insulating and cementing of ceramics, porcelain, metal, and glass. [See More]
- Cure / Technology: Two Component ; Chemically Set
- Composition: Unfilled
- Chemical System: Ceramic
- Type / Form: Liquid; Powder
from Henkel Corporation - Industrial
2-part, industrial, elastic bonding adhesive. Good resistance to fungus, UV light and weathering. High strength and short tack-free time. TEROSON ® MS 9399 is a 2-part, high viscosity, thixotropic, industrial elastomeric bonding adhesive that cures independently of air/humidity. It offers a... [See More]
- Cure / Technology: Two Component
- Use Temperature: 104 to 212
- Viscosity: 550000
from Epoxies Etc...
20-2100 FR is a two component, room temperature curing, low viscosity polyurethane system for potting, casting, encapsulating and sealing electronic components and assemblies. 20-2100 FR is a flame retardant self extinguishing system. It meets the stringent requirements of UL 94-VO. Designed for... [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Composition: Unfilled
- Chemical System: Elastomeric; Polyurethane
- Type / Form: Liquid
from Wacker Chemical Corp.
GENIOSIL® WP1 is a polyether-based silane-terminated polymer suitable asbinder in moisture curing formulations. It is a clear liquid with a slight but characteristic odor and differs to conventional silylated polymers due to its high reactivity. This is a direct consequence of the structural... [See More]
- Cure / Technology: Two Component
- Type / Form: Liquid
- Chemical System: Silicone
- Features: Encapsulant, Potting Compound
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Core Splice Adhesive EC-3500 B/A is a two-part core splicing material designed for filling mismatch areas and reinforcing honeycomb core. [See More]
- Cure / Technology: Thermoset; Two Component
- Type / Form: Grease, Paste
- Chemical System: Epoxy
- Substrate Compatibility: Honeycomb Core
from Sherwin-Williams Protective & Marine Coatings
Cement-Plexl ® 875 is a heavy duty, interior/exterior, VOC compliant, two component, cementitious, acrylic, waterborne block filler, which accepts both conventional and high performance topcoats. When topcoated, this product provides an excellent coating system for moderate service environments... [See More]
- Cure / Technology: Thermoset; Two Component
- Composition: Unfilled
- Chemical System: Ceramic; Acrylic
- Type / Form: Liquid
from Hapco, Inc.
HIGH PERFORMANCE HYBRID ELASTOMERIC POLYMER ALLOYS. The Hapflex ™ 500 Series offers soft durometer elastomers ranging from 45 - 95 Shore A. All are relatively fast, room curing, flexible systems that can be accelerated with moderate heat for faster cycle times. Most 500 Series products are... [See More]
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Composition: Unfilled
- Chemical System: Elastomeric; Polyurethane
- Type / Form: Liquid
from Henkel Corporation - Industrial
Epoxy black 2-part adhesive for general purpose applications involving metal, plastic, or wood substrates. LOCTITE ® EA 11C is a black, 2-part, epoxy, general purpose adhesive and sealant that is suitable for materials that include metals, most plastics, and wood. Offering room-temperature cure... [See More]
- Cure / Technology: Two Component
- Chemical System: Epoxy
from 3M Aerospace and Aircraft Maintenance Division
A two part, room temperature curing, low density void filling compound. It is designed for reinforcement of honeycomb sandwich constructions typically found in aircraft interior structures, honeycomb joining and bonding (interior furnishing, ceiling panels), edge panel sealing, inserts bonding,... [See More]
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Type / Form: Grease, Paste
- Chemical System: Epoxy
- Substrate Compatibility: Honeycomb Core
from Hapco, Inc.
HIGH PERFORMANCE HYBRID ELASTOMERIC POLYMER ALLOYS. The Hapflex ™ 600 series are relatively fast, semi-rigid, room temperature curing systems. This series yields harder durometers ranging from 50 - 70 Shore D. Most. 600 Series products are offered in 2 speeds: a standard 20-25 minute working... [See More]
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Composition: Unfilled
- Chemical System: Elastomeric; Polyurethane
- Type / Form: Liquid
from Henkel Corporation - Industrial
Designed to repair rubber, urethane, PVC and other parts quickly and durably. Unique for its exceptional handling, curing and performance properties LOCTITE ® PC 7393 is an adhesive, sealant and repair compound all in one convenient, self-mixing belt repair system designed to repair rubber,... [See More]
- Cure / Technology: Two Component
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic; Rubber or Elastomer
- Chemical System: Polyurethane
from Hapco, Inc.
HIGH PERFORMANCE HYBRID ELASTOMERIC POLYMER ALLOYS. Hapflex ™ 700/800 products are colorless, high strength elastomers available in hardnesses ranging from 65A to 72D. Hapflex ™ 700/800 products exhibit high tensile strength, high tear strength, and excellent elongation. All Hapflex... [See More]
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Composition: Unfilled
- Chemical System: Elastomeric; Polyurethane
- Type / Form: Liquid
from Henkel Corporation - Industrial
LOCTITE ® 5613 Silicone, Black is designed for superior fluid resistance and fast room temperature cure. Pneumatic dispensing recommended, non-corrosive and low odor. Tack-free in 10 minutes. Black in color. [See More]
- Cure / Technology: Two Component
- Chemical System: Silicone
from Hapco, Inc.
Solid Reaction Injection Molding. S-RIM ™ is a series of advanced casting resins that exhibit high physical properties and are extremely fast curing. Easy to mix with a 1:1 ratio by volume. Available in black or natural/tan. Available in 60 or 240 second gel time. 6260/61 can be de-molded in... [See More]
- Cure / Technology: Two Component
- Type / Form: Liquid
- Composition: Unfilled
- Industry: OEM or Industrial; Tooling
from Hapco, Inc.
Elastomeric Series. Various hardness elastomers, shore 20A - 72D. Clear in color. Available in 2 speeds - fast and slow. STERalloy FDG is the first Liquid Molding Polymer Alloy Series that has been specifically designed for food and drug applications. All of the products in the STERalloy FDG Series... [See More]
- Cure / Technology: Two Component
- Composition: Unfilled
- Chemical System: Elastomeric; Polyurethane
- Type / Form: Liquid
from Hapco, Inc.
Rigid Series. Rigid, tough polymer alloy plastics. High heat distortion. High physical properties. STERalloy FDG is the first Liquid Molding Polymer Alloy Series that has been specifically designed for food and drug applications. All of the products in the STERalloy FDG Series exhibit unique... [See More]
- Cure / Technology: Two Component
- Composition: Unfilled
- Chemical System: Polyurethane
- Type / Form: Liquid