Conformal Coating Industrial Sealants
from Ellsworth Adhesives
Dow DOWSIL ™ 3140 RTV Coating Clear is a one component, room temperature curing, solvent free coating that is used for pin sealing, increased solder joint coverage, thin section encapsulation, and protecting sensitive components from corrosion. It is self leveling, flowable, and flame... [See More]
- Features: Encapsulant or Conformal Coating
- Cure / Technology: Single Component
- Chemical System: Silicone
- Viscosity: 30000
from Master Bond, Inc.
EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Flexible; Flame Retardant; Leveling Filling; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Ellsworth Adhesives
Dow DOWSIL ™ 3140 RTV Coating Clear is a one component, room temperature curing, solvent free coating that is used for pin sealing, increased solder joint coverage, thin section encapsulation, and protecting sensitive components from corrosion. It is self leveling, flowable, and flame... [See More]
- Features: Encapsulant or Conformal Coating
- Cure / Technology: Single Component
- Chemical System: Silicone
- Viscosity: 30000
from Master Bond, Inc.
One part, nano silica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Glob Top, Daub, Doming or Overfill; Leveling Filling; Non-corrosive; Phase Change; Thermally Conductive
- Cure / Technology: UV or Radiation Cured; Single Component; Dual Curing
- Composition: Filled
- Type / Form: Liquid
from Ellsworth Adhesives
Dow DOWSIL ™ 3140 RTV Coating Clear is a one component, room temperature curing, solvent free coating that is used for pin sealing, increased solder joint coverage, thin section encapsulation, and protecting sensitive components from corrosion. It is self leveling, flowable, and flame... [See More]
- Features: Encapsulant or Conformal Coating
- Cure / Technology: Single Component
- Chemical System: Silicone
- Viscosity: 35950
from Master Bond, Inc.
MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]
- Features: Electrically Conductive; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Flexible; Leveling Filling; Non-corrosive; Phase Change; Gap Filler, Foam in Place Gasket; Thermally Conductive
- Composition: Filled
- Chemical System: Silicone
- Cure / Technology: Thermoset; Two Component ; Addition Cure
from Ellsworth Adhesives
HumiSeal ® 1122 Polyurethane Conformal Coating is a water reducible, heat cured, urethane conformal coating offering the same basic performance of HumiSeal ® solvent based urethanes but contains no free isocyanates and is nonflammable. The cured coating fluoresces under UV light to aid... [See More]
- Features: Encapsulant or Conformal Coating
- Cure / Technology: Single Component
- Chemical System: Polyurethane
- Viscosity: 1500 to 3500
from Master Bond, Inc.
EP35SP is a two component epoxy system specially formulated to resist high temperatures and aggressive chemicals. It has a paste viscosity with little to no flow when curing. [See More]
- Features: High Dielectric; Encapsulant or Conformal Coating; Non-corrosive; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Ellsworth Adhesives
HumiSeal ® 1122 Polyurethane Conformal Coating is a water reducible, heat cured, urethane conformal coating offering the same basic performance of HumiSeal solvent based urethanes but contains no free isocyanates and is nonflammable. The cured coating fluoresces under UV light to aid... [See More]
- Features: Encapsulant or Conformal Coating
- Cure / Technology: Single Component
- Chemical System: Polyurethane
- Viscosity: 1500 to 3500
from Master Bond, Inc.
Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Non-corrosive; Phase Change; Thermal Insulation
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Ellsworth Adhesives
HumiSeal ® 1A20 Urethane Conformal Coating is a one component, fast curing polyurethane coating that fluoresces under UV light to aid inspection and is chemically resistant. It can be applied by spraying, brushing, or dipping methods. 1 L Can. [See More]
- Features: Encapsulant or Conformal Coating
- Cure / Technology: Single Component
- Chemical System: Polyurethane
- Viscosity: 30 to 100
from Master Bond, Inc.
EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Flame Retardant; Leveling Filling; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Ellsworth Adhesives
HumiSeal ® 1A20 Urethane Conformal Coating is a one component, fast curing polyurethane coating that fluoresces under UV light to aid inspection and is chemically resistant. It can be applied by spraying, brushing, or dipping methods. 20 L Pail. [See More]
- Features: Encapsulant or Conformal Coating
- Cure / Technology: Single Component
- Chemical System: Polyurethane
- Viscosity: 30 to 100
from Master Bond, Inc.
EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Flexible; Leveling Filling; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Ellsworth Adhesives
HumiSeal ® 1A20 Urethane Conformal Coating is a one component, fast curing polyurethane coating that fluoresces under UV light to aid inspection and is chemically resistant. It can be applied by spraying, brushing, or dipping methods. 5 L Pail. [See More]
- Features: Encapsulant or Conformal Coating
- Cure / Technology: Single Component
- Chemical System: Polyurethane
- Viscosity: 30 to 100
from Master Bond, Inc.
Master Bond Polymer System EP39-2 is a fast curing, low viscosity, optically clear two component epoxy system for high performance bonding, sealing, coating and casting. It is 100% reactive and does not contain any diluents, solvents or other volatiles. The mix ratio is a convenient 2 to 1 by... [See More]
- Features: Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Ellsworth Adhesives
HumiSeal ® 1A20R Urethane Conformal Coating is a one component, fast curing, polyurethane coating that is chemically resistant and fluoresces under UV light to aid inspection. 1 L Can. [See More]
- Features: Encapsulant or Conformal Coating
- Chemical System: Polyurethane
from Master Bond, Inc.
Master Bond EP62-1 is a two component heat cured and chemically resistant epoxy resin system featuring a long pot life at ambient temperatures and efficient cures at moderately elevated temperatures. The recommended mix ratio is 100 parts of component A to 10 parts of component B. The pot life of... [See More]
- Features: Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Porous Surfaces
from Ellsworth Adhesives
HumiSeal ® 1A20R Urethane Conformal Coating is a one component, fast curing, polyurethane coating that is chemically resistant and fluoresces under UV light to aid inspection. 5 L Can. [See More]
- Features: Encapsulant or Conformal Coating
- Cure / Technology: Single Component
- Chemical System: Polyurethane
from Master Bond, Inc.
Master Bond Polymer System EP45HT is a two component epoxy system for high performance structural bonding and casting. It is suitable for applications where long term exposure to temperatures from -80 °F to +500 °F is required. lt is 100% reactive and does not contain any solvents or... [See More]
- Features: Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Ellsworth Adhesives
HumiSeal ® 1A27 Aerosol Conformal Coating is a one component, polyurethane coating that is widely used for circuit board applications. It contains no free isocyanates and can also be applied by brushing or dipping methods. 300 g Aerosol. [See More]
- Features: Encapsulant or Conformal Coating
- Cure / Technology: Single Component
- Chemical System: Polyurethane
- Viscosity: 1000 to 3000
from Master Bond, Inc.
Master Bond Polymer System EP13 is a one component heat curing epoxy featuring high shear strength and very high temperature resistance. This one component system is formulated to cure at temperatures from 300 °F to 350 °F for 60-90 minutes. Upon cure, EP13 readily attains tensile shear... [See More]
- Features: High Dielectric; Encapsulant or Conformal Coating; Non-corrosive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Ellsworth Adhesives
HumiSeal ® 1A27 Conformal Coating is a one component, polyurethane coating that is widely used for circuit board applications. It contains no free isocyanates and can be applied by spraying, brushing, or dipping methods. 5 L Can. [See More]
- Features: Encapsulant or Conformal Coating
- Cure / Technology: Single Component
- Chemical System: Polyurethane
- Viscosity: 1000 to 3000
from Master Bond, Inc.
Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. Not only is EP29LPSP able to function as an adhesive, sealant and protective coating at temperatures as low as 4K, but it is... [See More]
- Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Encapsulant or Conformal Coating; Flexible; Gap Filler, Foam in Place Gasket; Anti-static, ESD
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Ellsworth Adhesives
HumiSeal ® 1A27LU Polyurethane Conformal Coating is a one component, fast air curing coating that is widely used for circuit board applications. It provides good resistance to chemicals, fungus, moisture, insulation, and weather. It can be applied by spraying, brushing, or dipping methods. 5 L... [See More]
- Features: Encapsulant or Conformal Coating
- Cure / Technology: Single Component
- Chemical System: Polyurethane
- Viscosity: 300 to 3500
from Master Bond, Inc.
Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronicc/ structural applications. The two components are combined in a convenient noncritical mix... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Leveling Filling; Non-corrosive; Gap Filler, Foam in Place Gasket; Solvent Based; Thermal Insulation
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Ellsworth Adhesives
HumiSeal ® 1A33 Urethane Conformal Coating is a one component, polyurethane coating that is used for circuit board applications. It contains no free isocyanates and fluoresces under UV light to aid inspection. It can be applied by spraying, brushing, or dipping methods. 1 L Can. [See More]
- Features: Encapsulant or Conformal Coating
- Cure / Technology: Single Component
- Chemical System: Polyurethane
- Viscosity: 30 to 200
from Master Bond, Inc.
Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Leveling Filling; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Ellsworth Adhesives
HumiSeal ® 1A33 Urethane Conformal Coating is a one component, polyurethane coating that is used for print board applications. It contains no free isocyanates and fluoresces under UV light to aid inspection. It can be applied by spraying, brushing, or dipping methods. 20 L Pail. [See More]
- Features: Encapsulant or Conformal Coating
- Cure / Technology: Single Component
- Chemical System: Polyurethane
- Viscosity: 30 to 200
from Master Bond, Inc.
Master Bond Polymer System EP38 is a fast curing, low viscosity, optically clear two component epoxy system for high performance coating, bonding and sealing. It is 100% reactive and does not contain any volatiles. The mix ratio is a convenient 3 to 1 by weight. EP38 is very fast curing. Coatings as... [See More]
- Features: High Dielectric; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Ellsworth Adhesives
HumiSeal ® 1A33 Urethane Conformal Coating is a one component, polyurethane coating that is used for circuit board applications. It contains no free isocyanates and fluoresces under UV light to aid inspection. It can be applied by spraying, brushing, or dipping methods. 5 L Pail. [See More]
- Features: Encapsulant or Conformal Coating
- Cure / Technology: Single Component
- Chemical System: Polyurethane
- Viscosity: 30 to 200
from Master Bond, Inc.
Master Bond EP30NS is a nano silica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically clear and meets NASA low outgassing specifications. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Leveling Filling; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermally Conductive
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Ellsworth Adhesives
HumiSeal ® 1A33/521 PB25 Urethane Conformal Coating is a one component, fast curing polyurethane coating that is designed to be used with spray equipment without additional thinning. It is flexible, easy to repair, and fluoresces under UV light to aid inspection. 5 L Pail. [See More]
- Features: Encapsulant or Conformal Coating
- Cure / Technology: Single Component
- Chemical System: Polyurethane
- Viscosity: 65
from Master Bond, Inc.
EP42-2LV Black is a two component, room temperature curing epoxy compound featuring low viscosity and superior chemical resistance. It meets NASA low outgassing specifications, is black in color and optically opaque. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Leveling Filling; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Ellsworth Adhesives
HumiSeal ® 1A33 GEL is a one component thixotropic polyurethane paste that is used for circuit board applications. It contains no free isocyanates and fluoresces under UV light to aid inspection. 1 L Can. [See More]
- Features: Encapsulant or Conformal Coating
- Cure / Technology: Single Component
- Chemical System: Polyurethane
from Master Bond, Inc.
Master Bond Polymer System EP76M is a two component, nickel filled, electrically conductive adhesive for high performance bonding, sealing, and coating formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part nickel conductive systems, EP76M... [See More]
- Features: Electrically Conductive; EMI/RFI Shielding; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket; Thermally Conductive; Anti-static, ESD
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Ellsworth Adhesives
HumiSeal ® 1B12 Acrylic Conformal Coating is a one component, low viscosity, fast curing acrylic coating that is used for circuit board assemblies, coating ferrite cores, impregnating coil, and can be easily soldered or chemically removed. 5 L Jug. [See More]
- Features: Encapsulant or Conformal Coating
- Cure / Technology: Single Component
- Chemical System: Acrylic
- Viscosity: 5 to 30
from Master Bond, Inc.
Master Bond UV10TK40M is a higher viscosity, one part UV system for bonding, sealing and coating with good optical clarity, excellent physical properties and a high glass transition temperature. [See More]
- Features: High Dielectric; Encapsulant or Conformal Coating; Non-corrosive; Thermally Conductive
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; UV curing system
- Composition: Unfilled
- Type / Form: Liquid
from Ellsworth Adhesives
HumiSeal ® 1B15 Acrylic Conformal Coating is a one component, fast curing acrylic coating that is used for circuit assemblies and can be easily repaired. It can be applied by spraying, brushing, or dipping methods. 1 L Can. [See More]
- Features: Encapsulant or Conformal Coating
- Cure / Technology: Single Component
- Chemical System: Acrylic
- Viscosity: 20 to 470
from Master Bond, Inc.
Master Bond Polymer System EP19HT is a storage stable one component liquid epoxy resin system for durable, high performance adhesive/sealants, impregnates and liners. It features remarkably long shelf life and excellent storage characteristics at ambient temperatures yet cures readily at elevated... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Ellsworth Adhesives
HumiSeal ® 1B15 Acrylic Conformal Coating is a one component, fast curing acrylic coating that is used for circuit assemblies and can be easily repaired. It can be applied by spraying, brushing, or dipping methods. 5 L Can. [See More]
- Features: Encapsulant or Conformal Coating
- Cure / Technology: Single Component
- Chemical System: Acrylic
- Viscosity: 20 to 470
from Master Bond, Inc.
Master Bond UV10 and UV10TK are one component UV curable modified epoxy compounds, ready for use as supplied, for high performance casting, coatings, sealing and bonding applications. UV10 is a low viscosity amber liquid at room temperature and UV10TK is a medium viscosity amber liquid at room... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Leveling Filling; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermal Insulation
- Type / Form: Liquid
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Ellsworth Adhesives
HumiSeal ® 1B18 Acrylic Conformal Coating is a single component, fast curing acrylic coating that is used for circuit assemblies and can be easily repaired. It offers excellent electrical properties, flexibility, and fluoresces under UV light to aid inspection. It can be applied by spraying,... [See More]
- Features: Encapsulant or Conformal Coating
- Cure / Technology: Single Component
- Chemical System: Acrylic
- Viscosity: 20 to 250
from Master Bond, Inc.
Master Bond Polymer System EP30 is a low viscosity, two component epoxy adhesive for general purpose bonding, coating, sealing and casting formulated to cure at room temperature or more rapidly at elevated temperatures with a four (4) to one (1) mix ratio by weight. This adhesive is 100% reactive... [See More]
- Features: Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Flexible; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermal Insulation
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Type / Form: Liquid
from Ellsworth Adhesives
HumiSeal ® 1B31 Acrylic Conformal Coating is a one component, fast curing acrylic coating that is used for circuit assemblies and can be easily repaired. It offers excellent flexibility, moisture and environmental protection, and fluoresces under UV light to aid inspection. It can be applied by... [See More]
- Features: Encapsulant or Conformal Coating
- Cure / Technology: Single Component
- Chemical System: Acrylic
- Viscosity: 15 to 200
from Master Bond, Inc.
Formulated to have special optical transmission properties, EP30-2LB is an optically clear epoxy that does not permit UV light transmission, but transmits well from 450-900 nm and above. It is a user friendly compound that has a non-critical ten to one mix ratio by weight. This system cures readily... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Leveling Filling; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Ellsworth Adhesives
HumiSeal ® 1B31 Acrylic Conformal Coating is a one component, fast curing acrylic coating that is used for circuit assemblies and can be easily repaired. It offers excellent flexibility, moisture and environmental protection, and fluoresces under UV light to aid inspection. It can be applied by... [See More]
- Features: Encapsulant or Conformal Coating
- Cure / Technology: Single Component
- Chemical System: Acrylic
- Viscosity: 15 to 200
from Master Bond, Inc.
Formulated for thermal management applications, EP30TC is a two component epoxy that contains robust thermally conductive fillers with very fine particle sizes. It has thermal conductivity of 18-20 BTU •in/ft2 •hr • °F [2.60-2.88 W/(m •K)] and can be applied in sections as... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Leveling Filling; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermally Conductive
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Ellsworth Adhesives
HumiSeal ® 1B31 Acrylic Conformal Coating is a one component, fast curing acrylic coating that is used for circuit assemblies and dispensed from an aerosol can. It is environmentally safe and fluoresces under UV light to aid inspection. 300 g Aerosol. [See More]
- Features: Encapsulant or Conformal Coating
- Cure / Technology: Single Component
- Chemical System: Acrylic
- Viscosity: 15 to 200
from Master Bond, Inc.
EP41S-5 is chemically resistant and withstands acids, bases, alcohols, fuels and many solvents. This two part epoxy is widely used for bonding, sealing, coating, and encapsulating. It provides high physical strength properties and electrical insulation values. EP41S-5 offers convenient handling with... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Non-corrosive; Thermally Conductive
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Epoxy
- Type / Form: Liquid
from OMEGA Engineering, Inc.
Air Set Cements set or cure through loss of moisture by evaporation. Atmospheric conditions therefore affect the drying rate. Air Set Cements are used mainly in thin film applications (applied in thicknesses less than 1/4")*. SELECTION CRITERIA FOR CEMENTS. 1. Type of Application Potting, sealing,... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Thermally Conductive
- Cure / Technology: Air Setting / Film Drying; Two Component (optional feature); Single Component (optional feature)
- Chemical System: Ceramic
- Type / Form: Liquid (optional feature); Powder (optional feature)
from Aremco Products, Inc.
Aremco offers an expansive range of ceramic-based materials used for the assembly of high temperature, high power electrical devices, and high temperature fixtures, molds and tooling. These materials, based on aluminum oxide, aluminum nitride, magnesium oxide, silicon dioxide, silicon carbide,... [See More]
- Features: Encapsulant or Conformal Coating; Thermally Conductive
- Substrate Compatibility: Ceramic, Glass; Textiles or Fabrics; Dissimilar Substrates
- Type / Form: Liquid
- Industry: Electronics
from Sauereisen, Inc.
Sauereisen Electric Refractory Cement No. 350 is a chemically-setting inorganic cement specified for high temperature bonding applications. The product is supplied as a two-component sodium silicate cement consisting of a Powder and Liquid which are mixed together as used. The excellent coating... [See More]
- Features: High Dielectric; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket; Thermally Conductive
- Composition: Unfilled
- Chemical System: Ceramic
- Cure / Technology: Two Component ; Chemically Set
from OMEGA Engineering, Inc.
Chemical Set Cements set or cure by an internal chemical action which does not require exposure to air. Chemical Set Cements can be used in thick applications (applied in thicknesses greater than 1/4")*. SELECTION CRITERIA FOR CEMENTS. 1. Type of Application Potting, sealing, encapsulating,... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Thermally Conductive
- Cure / Technology: Air Setting / Film Drying; Two Component (optional feature); Single Component (optional feature)
- Chemical System: Ceramic
- Type / Form: Liquid (optional feature); Powder (optional feature)
from Aremco Products, Inc.
Exceptional electrical, moisture & chemical resistance [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
- Composition: Filled
- Chemical System: Silicone
- Cure / Technology: Thermoset