Gap Filling Sealant / FIP Gasket Industrial Sealants

Bostik Chem-Calk 1200 Clear is a one component, moisture curing, silicone sealant that is used for bonding nonporous materials, aluminum, glass, plastics, and ceramics. It is typically used for sealing doors, windows, skylights, and other building components. 10.1 oz Cartridge. [See More]

• Features: Caulk, Grout; Leveling Filling; Gap Filler, Foam in Place Gasket
• Cure / Technology: Single Component

• Chemical System: Silicone
• Substrate Compatibility: Ceramic, Glass

MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]

• Features: High Dielectric; Encapsulant, Potting Compound; Flexible; Leveling Filling; Non-corrosive; Phase Change; Gap Filler, Foam in Place Gasket; Thermally Conductive
• Composition: Unfilled

• Chemical System: Silicone
• Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing; Addition Cure

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

• Features: High Dielectric; Non-corrosive; Gap Filler, Foam in Place Gasket
• Composition: Filled

• Chemical System: Epoxy
• Cure / Technology: Thermoset; Two Component  

NH nonhardening heat transfer compound is used where thermal expansion and contraction could break the bond of a hardened compound. Typically installed between plate-type heating coils or with systems that require periodic disassembly, NH remains pliable indefinitely, allowing the compound to expand... [See More]

• Features: Gap Filler, Foam in Place Gasket; Thermally Conductive
• Type / Form: Liquid

• Cure / Technology: Single Component
• Use Temperature: 32 to 410

Sauereisen Low Expansion Cement Liquid No. 29 Off-White is an inorganic cement that is used for aerospace applications, insulating thermocouples, embedding heating elements, mechanically sealing parts, and coating resistors and coils. It bonds well with metal, glass, ceramics, and porcelain. It... [See More]

• Features: Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
• Cure / Technology: Two Component  

• Chemical System: Ceramic
• Tensile (Break): 425

Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]

• Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Flexible; Gap Filler, Foam in Place Gasket; Anti-static, ESD
• Composition: Filled

• Chemical System: Epoxy
• Cure / Technology: Thermoset; Two Component  

SnapTrace is a preformed flexible heat transfer compound designed for rapid, consistent installation over steam trace tubing on straight piping. SnapTrace also includes TFK channel, providing mechanical and weather protection to the installation. Thermon's heat transfer compounds provide an... [See More]

• Features: Gap Filler, Foam in Place Gasket; Thermally Conductive
• Thermal Conductivity: 34.61 to 69.23

• Use Temperature: 14 to 450

Sauereisen Low Expansion Cement Liquid No. 29 Tan is an inorganic cement that is used for aerospace applications, insulating thermocouples, embedding heating elements, mechanically sealing parts, and coating resistors and coils. It bonds well with metal, glass, ceramics, and porcelain. It insulates... [See More]

• Features: Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
• Cure / Technology: Two Component  

• Chemical System: Ceramic
• Tensile (Break): 425

EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]

• Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Flexible; Flame Retardant; Leveling Filling; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermally Conductive
• Composition: Unfilled

• Chemical System: Epoxy
• Cure / Technology: Thermoset; Single Component

T-3 heat transfer compound now has higher temperature ratings than ever before while still creating an efficient thermal bond between a steam or electric heater and process pipes or equipment. A single "Thermonized ™"steam tracer utilizing Thermon's heat transfer compound is more cost... [See More]

• Features: Gap Filler, Foam in Place Gasket; Thermally Conductive
• Type / Form: Grease, Paste

• Cure / Technology: Single Component
• Use Temperature: 32 to 850

Sauereisen Low Expansion Cement Powder No. 29 Off-White is an inorganic cement that is used for aerospace applications, insulating thermocouples, embedding heating elements, mechanically sealing parts, and coating resistors and coils. It bonds well with metal, glass, ceramics, and porcelain. It... [See More]

• Features: Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
• Cure / Technology: Two Component  

• Chemical System: Ceramic
• Tensile (Break): 425

MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]

• Features: Electrically Conductive; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Flexible; Leveling Filling; Non-corrosive; Phase Change; Gap Filler, Foam in Place Gasket; Thermally Conductive
• Composition: Filled

• Chemical System: Silicone
• Cure / Technology: Thermoset; Two Component  ; Addition Cure

Sauereisen Low Expansion Cement Powder No. 29 Tan is an inorganic cement that is used for aerospace applications, insulating thermocouples, embedding heating elements, mechanically sealing parts, and coating resistors and coils. It bonds well with metal, glass, ceramics, and porcelain. It insulates... [See More]

• Features: Encapsulant, Potting Compound; Gap Filler, Foam in Place Gasket
• Cure / Technology: Two Component  

• Chemical System: Ceramic
• Tensile (Break): 425

EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]

• Features: High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermally Conductive
• Composition: Unfilled

• Chemical System: Epoxy
• Cure / Technology: Thermoset; Single Component

EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]

• Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Flame Retardant; Leveling Filling; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermally Conductive
• Composition: Unfilled

• Chemical System: Epoxy
• Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing

EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]

• Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Flexible; Leveling Filling; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermally Conductive
• Composition: Unfilled

• Chemical System: Epoxy
• Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing

Master Bond Polymer System EP39-2 is a fast curing, low viscosity, optically clear two component epoxy system for high performance bonding, sealing, coating and casting. It is 100% reactive and does not contain any diluents, solvents or other volatiles. The mix ratio is a convenient 2 to 1 by... [See More]

• Features: Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
• Composition: Unfilled

• Chemical System: Epoxy
• Cure / Technology: Thermoset; Two Component  

Master Bond EP62-1 is a two component heat cured and chemically resistant epoxy resin system featuring a long pot life at ambient temperatures and efficient cures at moderately elevated temperatures. The recommended mix ratio is 100 parts of component A to 10 parts of component B. The pot life of... [See More]

• Features: Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
• Type / Form: Liquid

• Cure / Technology: Thermoset; Two Component  
• Substrate Compatibility: Ceramic, Glass; Composites; Metal; Porous Surfaces

Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4500 psi. In addition, unlike many structural epoxies, EP31 also has a high peel strength exceeding 40 pli. The service... [See More]

• Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Flexible; Gap Filler, Foam in Place Gasket; Anti-static, ESD
• Cure / Technology: Thermoset; Two Component  

• Chemical System: Epoxy
• Type / Form: Grease, Paste

Master Bond Polymer System EP45HT is a two component epoxy system for high performance structural bonding and casting. It is suitable for applications where long term exposure to temperatures from -80 °F to +500 °F is required. lt is 100% reactive and does not contain any solvents or... [See More]

• Features: Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
• Composition: Unfilled

• Chemical System: Epoxy
• Cure / Technology: Thermoset; Two Component  

Master Bond Polymer System 125 is a two component toughened epoxy resin for prolonged service above 500 °F with truly outstanding chemical resistance. High strength bonds serviceable up to 600 °F can be obtained with this exceptionally thermally stable and chemically resistant epoxy resin... [See More]

• Features: High Dielectric; Leveling Filling; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermal Insulation
• Composition: Unfilled

• Chemical System: Epoxy
• Cure / Technology: Thermoset; Two Component  

Master Bond Polymer Adhesive EP33 is a unique room temperature curing two component epoxy adhesive for high temperature bonding applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures. Master Bond Polymer Adhesive EP33 produces high strength bonds whose... [See More]

• Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Flexible; Gap Filler, Foam in Place Gasket; Anti-static, ESD
• Composition: Unfilled

• Chemical System: Epoxy
• Cure / Technology: Thermoset; Two Component  

Master Bond Polymer System EP29LP is a two component high performance epoxy resin system featuring low viscosity, long pot life and low exotherm. As an adhesive this versatile material will form bond strengths in excess of 2,500 psi (aluminum to aluminum). It bonds well to a variety of substrates... [See More]

• Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Flexible; Gap Filler, Foam in Place Gasket; Anti-static, ESD
• Composition: Unfilled

• Chemical System: Epoxy
• Cure / Technology: Thermoset; Two Component  

Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. Not only is EP29LPSP able to function as an adhesive, sealant and protective coating at temperatures as low as 4K, but it is... [See More]

• Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Encapsulant or Conformal Coating; Flexible; Gap Filler, Foam in Place Gasket; Anti-static, ESD
• Composition: Unfilled

• Chemical System: Epoxy
• Cure / Technology: Thermoset; Two Component  

black, two component, low density Silicone Aerospace Sealant. Properties. Viscosity 190000. Hardness Sha 56. Description. Bluesil V-622 is a black, two component addition cure, flowable silicone aerospace sealant. It is specifically designed for, and qualified to, Pratt & Whitney Specification... [See More]

• Features: Gap Filler, Foam in Place Gasket
• Cure / Technology: Two Component  

• Chemical System: Silicone
• Substrate Compatibility: Metal; Plastic

PNE-47207 ™ is an adhesive/sealant and potting compound. PNE-47207 ™ is designed to provide air free potting and casting of electronic devices. PNE-47207 ™ will bond difficult substrates such as glass, ceramics, and metals. It passes UL 94V0 for fire retardant properties,and has a... [See More]

• Features: High Dielectric; Encapsulant, Potting Compound; Flame Retardant; Gap Filler, Foam in Place Gasket
• Composition: Filled

• Chemical System: Epoxy
• Cure / Technology: Thermoset; Two Component  

24-017 is a plural component, polyurea, crack sealing system developed for sealing cracks and joints in concrete and asphalt. This system can also be used for wood and masonry applications. This system can be machine processed or applied using various types of plural component caulking guns, and it... [See More]

• Features: Caulk, Grout; Gap Filler, Foam in Place Gasket
• Cure / Technology: Two Component  

• Chemical System: Polyethylene
• Type / Form: Liquid

Thermal Interface Materials - Gap Fillers and Pads, Films, Tapes, Hardware. Electronic devices continue to become faster, smaller, and more powerful every day, enabling technological advancements across all industries. The Internet of Things, powered by embedded electronics and its complex... [See More]

• Features: Gap Filler, Foam in Place Gasket; Thermally Conductive; Thermal Insulation

• Type / Form: Sheet or Film

GAP PAD ™ HC 5.0 is a soft and compliant gap filling material with a thermal conductivity of 5.0 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique filler package and low-modulus resin formulation. The enhanced material is ideal for applications... [See More]

• Features: Gap Filler, Foam in Place Gasket; Thermally Conductive

• Industry: Electronics

INSTAbond ® 392HD - High temperature studlock compound for larger diameter and coarse thread parts. [See More]

• Features: Gap Filler, Foam in Place Gasket
• Type / Form: Liquid

• Cure / Technology: Anaerobic
• Viscosity: 350000

Anaerobic Gasket Makers alleviate the need for preformed gaskets. Remaining liquid when exposed to air, they cure when confined between mating flanges. Typically used on thermostats, pumps, gearboxes, compressors, transmission housings, axle covers and more [See More]

• Features: Gap Filler, Foam in Place Gasket
• Cure / Technology: Anaerobic; Single Component

• Chemical System: Silicone
• Type / Form: Liquid

Krylex KT722 is a high strength, high viscosity, high service temperature, anaerobic thread locker. KT722 cures when confined in the absence of air between close-fitting metal surfaces. KT722 is formulated to lock all metric and imperial nuts and bolts, preventing vibration loosening and leakage... [See More]

• Features: Gap Filler, Foam in Place Gasket; Threadlocker or Retainer
• Type / Form: Liquid

• Cure / Technology: Anaerobic; Two Component   (optional feature); Single Component
• Substrate Compatibility: Metal

Used for repairing metal components, pinholes, cracks, and filling seams. [See More]

• Features: Leveling Filling; Gap Filler, Foam in Place Gasket; Thermally Conductive; Water Based 
• Composition: Filled

• Chemical System: Ceramic
• Cure / Technology: Air Setting / Film Drying; Thermoset

3M ™ Scotch-Weld ™ Core Splice Adhesive Film AF 3002 is a 250-350 °F (121-177 °C) curing, low density, expandable product designed for the purpose of filling mismatched areas, and for splicing and reinforcing honeycomb core. High performance over the -67F to 250F (-55C to 12C)... [See More]

• Features: Gap Filler, Foam in Place Gasket
• Cure / Technology: Thermoset; Single Component

• Chemical System: Epoxy
• Type / Form: Sheet or Film

LOCTITE DSP 190024, Acrylic, Bonding LOCTITE ® DSP 190024 is primarily designed for bonding rigid and flexible PVC to polycarbonate where large gap filling capabilities (0.25mm) and a flexible joint are desired. Its flexibility enhances the load bearing and shock absorbing characteristics of the... [See More]

• Features: Gap Filler, Foam in Place Gasket

A radically different form of PTFE fluorocarbon material, although very strong and tough, it is soft and "marshmallowy" in character, permitting it to conform easily to irregular surfaces and to compress to a thin, wide ribbon under pressure. Because it is 100% PTFE fluorocarbon, it can be used in... [See More]

• Features: Non-corrosive; Gap Filler, Foam in Place Gasket
• Use Temperature: -450 to 600

• Industry: OEM or Industrial

Classic cyanoacrylates are represented by the ethyl and methyl chemistries. Generally, the methyls offer better bond strengths on metals, the ethyls providing better strengths on everything else. Substrate selection and bond line configuration directly influence adhesive performance. [See More]

• Features: Gap Filler, Foam in Place Gasket
• Cure / Technology: Single Component; Room Temperature Vulcanizing or Curing

• Chemical System: Cyanoacrylate
• Type / Form: Liquid

Devcon Aluminum Putty (F) is an aluminum filled epoxy putty for cost effective repairs to aluminum castings, components & equipment. It bonds to most metals & rigid plastics and is resistant to CFC's & chemicals. This putty is used on applications requiring an aluminum, non- rusting... [See More]

• Features: Gap Filler, Foam in Place Gasket
• Substrate Compatibility: Metal

• Chemical System: Epoxy

LiPOLY BS75K is a soft thermally conductive gap filler. With a thermal conductivity of 3.0 W/m*K and a low thermal impedance, BS75K is suitable for a wide range of applications. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for a wide... [See More]

• Features: Gap Filler, Foam in Place Gasket; Thermally Conductive; UL Rating
• Type / Form: Sheet or Film

• Chemical System: Silicone
• Industry: Electronics

10-3022 is a two component epoxy adhesive and sealant. This structural adhesive has excellent chemical and heat resistance. 10-3022 is widely used as a stencil and screen adhesive due to its bonding strength and toughness. It has been used extensively to bond polyester mesh to aluminum frames and... [See More]

• Features: High Dielectric; Gap Filler, Foam in Place Gasket
• Composition: Unfilled

• Chemical System: Epoxy
• Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing

FireStop Putty Pads provide acoustical protection for wall penetrations in the form of a release lined pad for easy application to electrical boxes or other penetrates. The pad is conveniently sized to fit a typical 1 ½" deep 4S box with no cutting or piercing required. Faced on both sides with a... [See More]

• Features: Flexible; Flame Retardant; Gap Filler, Foam in Place Gasket; UL Rating
• Type / Form: Grease, Paste

• Cure / Technology: Single Component
• Substrate Compatibility: Metal; Plastic; Rubber or Elastomer

Caulks are used to fix imperfections and small gaps in a variety of applications. . 10 oz Gorilla Waterproof Caulk & Seal. 100% Silicone Sealant - White. [See More]

• Features: Caulk, Grout; Gap Filler, Foam in Place Gasket

• Substrate Compatibility: Kitchen, Bath, Window, Door, Plumbing, Gutters, Auto, Marine

ELASTOSIL ® 5100 is a one-component, acid-curing, low modulus silicone sealant for sanitary applications. Special features. suitable for use in sanitary areas. non-sag. ready gunnability at low (+ 5 °C) and high (+ 40 °C) temperatures. flexible at low (- 40 °C) and high temperatures... [See More]

• Features: Caulk, Grout; Gap Filler, Foam in Place Gasket
• Cure / Technology: Thermoset; Single Component; Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing

• Chemical System: Silicone; Elastomeric
• Type / Form: Gel

ArmorSeal ®CRACK FILLER is a two-component, fast set epoxy paste developed specifically for sealing, smoothing, and fairing applications on concrete, metals, plastics (FRP), wood, or masonry. The smooth consistency and excellent non-sagging properties allow the product to be used on vertical and... [See More]

• Features: Flame Retardant; Leveling Filling; Gap Filler, Foam in Place Gasket
• Composition: Unfilled

• Chemical System: Epoxy
• Cure / Technology: Thermoset; Two Component  

Sauereisen Cement No. 31 is a white, porcelain-like cement that is widely used throughout industry in a variety of applications. including assembling, sealing, insulating and cementing of ceramics, porcelain, metal, and glass. [See More]

• Features: High Dielectric; Encapsulant, Potting Compound; Flame Retardant; Gap Filler, Foam in Place Gasket; Thermally Conductive
• Composition: Unfilled

• Chemical System: Ceramic
• Cure / Technology: Two Component  ; Chemically Set

High thixotropy, suitable for filling and bonding of large gaps, suitable for materials with low surface energy and difficult to stick. Surfaces such as PTFE, PE, PP are low-energy surfaces. [See More]

• Features: Gap Filler, Foam in Place Gasket
• Substrate Compatibility: Plastic

• Cure / Technology: UV or Radiation Cured

Fast flow, fast cure capillary reworkable underfill. The rheology of the PROTAVIC ANA 10199 R in combination with its fineness make the product perfectly adapted to high reliability small gap underfill applications. It presents a good pot life at room temperature 20-22C and a high reactivity at... [See More]

• Features: High Dielectric; Gap Filler, Foam in Place Gasket; Thermal Insulation
• Cure / Technology: Thermoset; Single Component

• Composition: Unfilled
• Type / Form: Liquid

Vibra-Tite anaerobic retaining compounds are designed to increase shear strength on non-threaded cylindrical metal assemblies. The liquid anaerobic material fills the voids between close-fitting metal parts and cures to a toughened thermoset-plastic which creates a solid one piece assembly. [See More]

• Features: Gap Filler, Foam in Place Gasket; Threadlocker or Retainer
• Type / Form: Liquid

• Cure / Technology: Anaerobic; Single Component
• Substrate Compatibility: Metal

KG105 is a single component, thixotropic, low-medium strength, high temperature anaerobic gasket compound. KG105 cures rapidly when confined in the absence of air on close-fitting metal surfaces. KG105 will give an almost instant low-pressure seal (up to 0.5 Bar after 20 mins.) to allow on-line... [See More]

• Features: Gap Filler, Foam in Place Gasket
• Type / Form: Grease, Paste

• Cure / Technology: Anaerobic; Two Component   (optional feature); Single Component
• Substrate Compatibility: Metal

A two part, room temperature curing, low density void filling compound. It is designed for reinforcement of honeycomb sandwich constructions typically found in aircraft interior structures, honeycomb joining and bonding (interior furnishing, ceiling panels), edge panel sealing, inserts bonding,... [See More]

• Features: Flame Retardant; Leveling Filling; Gap Filler, Foam in Place Gasket
• Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing

• Chemical System: Epoxy
• Type / Form: Grease, Paste

A universal gasket made from 100% expanded PTFE. Although very strong and tough, it is soft and "marshmallowy" in character, permitting it to conform easily to irregular surfaces and to compress to a thin, wide ribbon under pressure. It comes in the form of a continuous cord with an adhesive bead to... [See More]

• Features: Non-corrosive; Gap Filler, Foam in Place Gasket
• Use Temperature: -450 to 600

• Industry: Sanitary; OEM or Industrial

The Nuts N ’ Bolts is an anaerobic adhesive, used in nut and bolt assemblies. When the adhesive is confined between substrates, the oxygen is eliminated and the adhesive cures. These thread locking adhesives offer a wide-range of strengths, viscosities, and temperature ranges for just about... [See More]

• Features: Gap Filler, Foam in Place Gasket; Threadlocker or Retainer
• Cure / Technology: Anaerobic; Single Component

• Chemical System: Acrylic
• Type / Form: Liquid

Devcon Plastic Steel Putty A is the original metal filled epoxy putty for economical, dependable maintenance and repair work. In a 1 KG size, this product is also known as Devcon 10115. Devcon plastic steel putty is recommended for repairing cracks and breaks in equipment, machinery or castings,... [See More]

• Features: Gap Filler, Foam in Place Gasket
• Substrate Compatibility: Metal

• Chemical System: Epoxy

LiPOLY ’s S282 is a thermally conductive pad designed for gap filling. The thermal conductivity is 1.7 W/m*K. It uses fiberglass cloth as the reinforcement material with great self-adhesive that can fit closely with non-flat heat sinks to increase the contact area. The low stress damped... [See More]

• Features: Gap Filler, Foam in Place Gasket; Thermally Conductive; UL Rating
• Type / Form: Sheet or Film

• Chemical System: Silicone
• Industry: Electronics

UV 60-7016 is a high performance Ultraviolet Curable Adhesive, Sealant, and Potting Compound. This new one component urethane acrylate system was specifically designed for the difficult bonding of glass to metal. UV 60-7016 has outstanding thermal shock and impact resistance, and is an excellent... [See More]

• Features: Encapsulant, Potting Compound; Flexible; Gap Filler, Foam in Place Gasket
• Composition: Unfilled

• Chemical System: Elastomeric; Polyurethane
• Cure / Technology: UV or Radiation Cured; Single Component

SSP Firestop Putty is perfect for metallic conduits, telephone, data or electrical power cable penetrations. A variety of sleeved and non-sleeved applications have been tested and proven providing the ultimate in installation versatility. Non-hardening and reusable, SSP Firestop Putty addresses the... [See More]

• Features: Flexible; Flame Retardant; Gap Filler, Foam in Place Gasket; UL Rating
• Type / Form: Grease, Paste

• Cure / Technology: Single Component
• Substrate Compatibility: Metal; Plastic; Rubber or Elastomer

Fillers are used to repair, patch or fix imperfections and small gaps in a variety of applications. . 8 oz Gorilla Wall Repair - White. [See More]

• Features: Gap Filler, Foam in Place Gasket

• Substrate Compatibility: Walls & Ceilings

HEAVY DUTY BLOCK FILLER is a pure acrylic resin block filler for use on interior and exterior poured and precast concrete, concrete block, and cinder block. Excellent moisture resistance. Excellent filling characteristics. Suitable for use in USDA inspected facilities. Resurface spalled and... [See More]

• Features: Flame Retardant; Leveling Filling; Gap Filler, Foam in Place Gasket; Solvent Based (optional feature); Water Based  (optional feature)
• Composition: Unfilled

• Chemical System: Acrylic
• Cure / Technology: Thermoset; Single Component

Vibra-Tite anaerobic thread sealants secure metal pipes and fittings by filling the space between threaded metal parts. Thread sealants prevent leakage caused by tape shredding, vibration loosening, solvent evaporation, and damaged threads. Vibra-Tite products are designed for both low and high... [See More]

• Features: Gap Filler, Foam in Place Gasket; Threadlocker or Retainer
• Type / Form: Liquid

• Cure / Technology: Anaerobic; Single Component
• Substrate Compatibility: Metal

KSC1802 is a low viscosity, high performance, thermally conductive, liquid gap filling material. It is formulated to develop a soft, 'form in place' elastomer ideal for coupling hot PC board components to heat sinks. KSC1802 is supplied as a two part, 1:1 mix ratio silicone that when mixed will cure... [See More]

• Features: Gap Filler, Foam in Place Gasket
• Cure / Technology: Single Component

• Chemical System: Silicone
• Type / Form: Grease, Paste

Structural one-part low weight void filler for aircraft interiors. One-part low weight filler combining extreme low density with high extrusion rate for manual and automatic applications. Pumpable. Full stand alone FST properties with patented non-halogen based FST system. Low flow for ease of... [See More]

• Features: Leveling Filling; Gap Filler, Foam in Place Gasket
• Cure / Technology: Single Component

• Chemical System: Epoxy
• Type / Form: Grease, Paste

Phelps Style 9816 is 100% silicone sealant. This product can be used for gasketing and as an adhesive, and sticks to metal and glass surfaces. For best results clean with a solvent such as xylol, toluol or methyl ethyl ketone. Phelps Silicone Sealant exhibits high degree of flexibility without... [See More]

• Features: Non-corrosive; Gap Filler, Foam in Place Gasket
• Composition: Unfilled

• Chemical System: Silicone
• Cure / Technology: Room Temperature Vulcanizing or Curing

The Quantum ® group of HERNON ® cyanoacrylates offers specialized performance attributes. This range of grades has been engineered to provide solutions to specific cyanoacrylate challenges. Three categories are offered: surface insensitive, toughened, and low odor-low blooming. [See More]

• Features: Gap Filler, Foam in Place Gasket
• Cure / Technology: Single Component; Room Temperature Vulcanizing or Curing

• Chemical System: Cyanoacrylate
• Type / Form: Liquid

Devcon Stainless Steel Putty is a steel-filled epoxy designed for rebuilding and repairing stainless steel equipment. It will repair cracks, dents and breaks in stainless steel machinery or castings. Intended uses include repairs to diary equipment and repairs to stainless steel holding tanks. [See More]

• Features: Gap Filler, Foam in Place Gasket
• Substrate Compatibility: Metal

• Chemical System: Epoxy

LiPOLY S393 is a product with high ductile thermal conductivity. Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material. It won't easy to break and deformwhether stamped, punched, strip type, or custom cutting. Your best choice... [See More]

• Features: High Dielectric; Gap Filler, Foam in Place Gasket; Thermally Conductive; UL Rating
• Type / Form: Sheet or Film

• Chemical System: Silicone
• Industry: Aerospace; Automotive; Electronics; Electric Power; Laminaes; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling

20-2100 FR is a two component, room temperature curing, low viscosity polyurethane system for potting, casting, encapsulating and sealing electronic components and assemblies. 20-2100 FR is a flame retardant self extinguishing system. It meets the stringent requirements of UL 94-VO. Designed for... [See More]

• Features: High Dielectric; Encapsulant, Potting Compound; Flexible; Flame Retardant; Gap Filler, Foam in Place Gasket; UL Rating
• Composition: Unfilled

• Chemical System: Elastomeric; Polyurethane
• Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing

The Professional's Choice For Spray-Applied Protection of Joints & Penetrations of all types. SpecSeal Sealant has been UL tested and classified for a wide variety of common construction joint applications including floor-to-floor, floor-to-wall, wall-to-floor, wall-to-wall, and head-of-wall... [See More]

• Features: Caulk, Grout; Flexible; Flame Retardant; Gap Filler, Foam in Place Gasket; UL Rating
• Cure / Technology: Single Component

• Chemical System: Elastomeric
• Type / Form: Grease, Paste

Sealants are used to repair, patch or fix imperfections and small gaps in a variety of applications. . 16 oz Gorilla Waterproof Patch and Seal Spray - Black. [See More]

• Features: Gap Filler, Foam in Place Gasket

• Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Rubber or Elastomer; Textiles or Fabrics; Wood; Metal, Concrete, Wood, Aluminum, Brick, Tile, Fabric, Rubber, Glass

KEM ® Cati-Coat ® HS EPOXY FILLER/SEALER is a high performance, interior/exterior, VOC compliant, epoxy block filler. Designed for tenacious adhesion to masonry substrates while filling voids and crevices to smooth the surface. Excellent resistance to moisture, humidity, impact, and... [See More]

• Features: Flame Retardant; Leveling Filling; Gap Filler, Foam in Place Gasket
• Composition: Unfilled

• Chemical System: Epoxy
• Cure / Technology: Thermoset; Single Component

HERNON ® offers a complete line of structural acrylic adhesives. These systems are two-part, no mix, and reactive adhesives. Each acrylic adhesive has two components: the adhesive base or resin, and the Activator. Structural acrylic adhesives are termed “reactive ” cure systems. The... [See More]

• Features: Gap Filler, Foam in Place Gasket
• Cure / Technology: Two Component  ; Reactive or Moisture Cured

• Chemical System: Acrylic
• Type / Form: Liquid

Devcon Wear Resistant Putty is a smooth, non-rusting ceramic-filled epoxy putty used to repair and rebuild interfacing metallic, low-friction surfaces such as machine ways and flanges. This product will repair in tight spots where a fine flowing putty is required, it will easily bond to steel, iron,... [See More]

• Features: Gap Filler, Foam in Place Gasket
• Cure / Technology: Thermoset

• Chemical System: Epoxy
• Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic

LiPOLY S818 is a product with high ductile thermal conductivity.Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material.It won't easy to break and deform whether stamped, punched, strip type, or custom cutting. Your best choice... [See More]

• Features: High Dielectric; Gap Filler, Foam in Place Gasket; Thermally Conductive; UL Rating
• Type / Form: Sheet or Film

• Chemical System: Silicone
• Industry: Aerospace; Automotive; Electronics; Electric Power; Laminaes; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling

HERNON ® offers a complete line of ultraviolet curing adhesives and compounds, the Ultrabond ® line of products. These products are single component systems offering either ultraviolet light or ultraviolet light & primer initiated curing mechanisms. All Ultrabond ® products cure upon... [See More]

• Features: Gap Filler, Foam in Place Gasket
• Cure / Technology: UV or Radiation Cured; Single Component

• Chemical System: Acrylic
• Type / Form: Liquid

knottec ® is a unique knot-filling hot melt adhesive which has been specially formulated for the fast and effective repair of not only knot defects, but also deep scratches and other forms of deep wood damage. Because of its tough characteristics knottec ® is perfect for repairing wooden... [See More]

• Features: Gap Filler, Foam in Place Gasket

• Cure / Technology: Thermoplastic / Hot Melt

LiPOLY DCTP140-s is a thermal insulator uses fiberglass cloth as a reinforcement material, combined with thermal conductive silicon, giving it high thermal conduction and great compression strength. The thermal conductivity is 4.5 W/m*K, the thickness is 0.25~0.45mm. Its high insulation and... [See More]

• Features: High Dielectric; Gap Filler, Foam in Place Gasket; Thermally Conductive; UL Rating
• Type / Form: Sheet or Film

• Chemical System: Silicone
• Industry: Aerospace; Automotive; Electronics; Electric Power; Laminaes; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling

knottec ® is a unique knot-filling hot melt adhesive which has been specially formulated for the fast and effective repair of not only knot defects, but also deep scratches and other forms of deep wood damage. Because of its tough characteristics knottec ® is perfect for repairing wooden... [See More]

• Features: Gap Filler, Foam in Place Gasket

• Cure / Technology: Thermoplastic / Hot Melt

Our high thermally conductive gap filler T-work 7000 provides excellent compression and extremely low thermal resistance in form shape with high thermal conductivity for gap filling between electrical component and heatsink. [See More]

• Features: Gap Filler, Foam in Place Gasket; Thermally Conductive; UL Rating
• Type / Form: Sheet or Film

• Chemical System: Silicone
• Industry: Electronics

knottec ® is a unique knot-filling hot melt adhesive which has been specially formulated for the fast and effective repair of not only knot defects, but also deep scratches and other forms of deep wood damage. Because of its tough characteristics knottec ® is perfect for repairing wooden... [See More]

• Features: Gap Filler, Foam in Place Gasket

• Cure / Technology: Thermoplastic / Hot Melt

LiPOLY T-top99-s offers outstanding thermal conductivity at 24.0 W/m*K and extremely low thermal resistance under minimal force.T-top99-s offers excellent compression, filling small air gaps on uneven surfaces, ensuring an efficient and consistent transfer of heat. [See More]

• Features: High Dielectric; Gap Filler, Foam in Place Gasket; Thermally Conductive; UL Rating
• Type / Form: Sheet or Film

• Chemical System: Silicone
• Industry: Aerospace; Automotive; Electronics; Electric Power; Laminaes; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling

knottec ® is a unique knot-filling hot melt adhesive which has been specially formulated for the fast and effective repair of not only knot defects, but also deep scratches and other forms of deep wood damage. Because of its tough characteristics knottec ® is perfect for repairing wooden... [See More]

• Features: Gap Filler, Foam in Place Gasket

• Cure / Technology: Thermoplastic / Hot Melt

LiPOLY's TPS series is a low-density, potting material. Its low density and lightweight properties enhance product performance, reduce production costs. The product has a thermal conductivity of 0.55-1.50 W/m*K and can cure at room temperature or high temperatures. [See More]

• Features: Encapsulant, Potting Compound; Leveling Filling; Gap Filler, Foam in Place Gasket; Thermally Conductive
• Cure / Technology: Room Temperature Vulcanizing or Curing

• Chemical System: Silicone
• Type / Form: Grease, Paste; Liquid

knottec ® is a unique knot-filling hot melt adhesive which has been specially formulated for the fast and effective repair of not only knot defects, but also deep scratches and other forms of deep wood damage. Because of its tough characteristics knottec ® is perfect for repairing wooden... [See More]

• Features: Gap Filler, Foam in Place Gasket

• Cure / Technology: Thermoplastic / Hot Melt

LiPOLY EP770 is a two-part epoxy material for gap filling. Extremely low viscosity and flowability. Good dispersion and no delamination. The high deformation material, which filling the gap closely, cover the tolerance, and has outstanding conductivity, makes is suitable for filling the peculiar... [See More]

• Features: Gap Filler, Foam in Place Gasket; Thermally Conductive
• Industry: Electronics

• Chemical System: Epoxy
• Viscosity: 100000

knottec ® is a unique knot-filling hot melt adhesive which has been specially formulated for the fast and effective repair of not only knot defects, but also deep scratches and other forms of deep wood damage. Because of its tough characteristics knottec ® is perfect for repairing wooden... [See More]

• Features: Gap Filler, Foam in Place Gasket

• Cure / Technology: Thermoplastic / Hot Melt

LiPOLY's NL-putty series is a silicone free, low-density gel filling material. Its low density and lightweight characteristics enhance product performance, reduce production costs. Commonly used in electronic products and automotive electronic devices, this series has a thermal conductivity of... [See More]

• Features: Gap Filler, Foam in Place Gasket; Thermally Conductive
• Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial

• Type / Form: Gel; Liquid
• Viscosity: 2.50E6

LOCTITE ® 620 has been designed for the bonding of cylindrical fitting parts. This product cures when confined in the absence of air between close fitting metal surfaces and prevents loosening and leakage from shock and vibration. The LOCTITE ® 620 is particularly suitable for applications... [See More]

• Features: Gap Filler, Foam in Place Gasket; Threadlocker or Retainer

LiPOLY ’s PK223 is a material designed for gap filling. The thermal conductivity is 2.0W/m*K. The hardness is Shore 00/30 with high flexibility, high compressibility, highly insulating, great self-adhesive, which can cover the tolerance of design making it very stable. It also offers... [See More]

• Features: Gap Filler, Foam in Place Gasket; Thermally Conductive; UL Rating
• Type / Form: Sheet or Film

• Chemical System: Silicone
• Industry: Electronics

Loctite ® 641 is designed for the bonding of cylindrical fitting parts, particularly where disassembly is required for service operations. The product cures in the absence of air between close fitting metal surfaces and vibration. Typical applications include retention of bearings onto shafts... [See More]

• Features: Gap Filler, Foam in Place Gasket; Threadlocker or Retainer

LiPOLY ’s PK404 is a material designed for gap filling. The thermal conductivity is 4.0W/m*K. The hardness is Shore 00/40 with high flexibility, high compressibility, highly insulating, great self-adhesive, which can cover the tolerance of design making it very stable. It also offers... [See More]

• Features: Gap Filler, Foam in Place Gasket; Thermally Conductive; UL Rating
• Type / Form: Sheet or Film

• Chemical System: Silicone
• Industry: Electronics

LOCTITE ® SI 5980 is a flange sealant designed especially for gasketing applications. It withstands in-line, low-pressure tests carried out after assembly of the flanges. Typical applications include stamped sheet metal covers where good oil resistance and the ability to withstand high joint... [See More]

• Features: Gap Filler, Foam in Place Gasket

LiPOLY ’s PK605 is a material designed for gap filling. The thermal conductivity is 6.0 W/m*K. The hardness is Shore 00/60 with high flexibility, high compressibility, highly insulating, great self-adhesive, which can cover the tolerance of design making it very stable. It also offers... [See More]

• Features: Gap Filler, Foam in Place Gasket; Thermally Conductive; UL Rating
• Type / Form: Sheet or Film

• Chemical System: Silicone
• Industry: Electronics

Techsil ® RTV15930 is a single component, room temperature silicone liquid gasket which begins to set in minutes. This grade is perfect for sealing complex three point surfaces of cylinder blocks, oil pans, valve covers and joint surfaces with large clearances to prevent oil, water, gasoline and... [See More]

• Features: Gap Filler, Foam in Place Gasket
• Use Temperature: -60 to 250

• Chemical System: Silicone; Elastomeric

LiPOLY ’s PK700 is a material designed for gap filling. The thermal conductivity is 7.0 W/m*K. The hardness is Shore 00/55 with high flexibility, high compressibility, highly insulating, great self-adhesive, which can cover the tolerance of design making it very stable. It also offers... [See More]

• Features: Gap Filler, Foam in Place Gasket; Thermally Conductive; UL Rating
• Type / Form: Sheet or Film

• Chemical System: Silicone
• Industry: Electronics

Techsil ® TIM11123 (GB) Grey is a 200 micron, self-gapping, non-corrosive, 1-part room temperature vulcanizing (RTV) silicone rubber. It is one of a new family of products called acetone cure sealants. These products are cured rapidly in contact with atmospheric moisture to a tough rubber that... [See More]

• Features: Electrically Conductive; Gap Filler, Foam in Place Gasket; Thermally Conductive

LiPOLY TEM96D is a thermally conductive absorber based upon soft magnetic materials dispersed in a polymeric resin. It has a thermalconductivity of 5.0 W/m*K and dissipates electromagnetic radiation rapidly to mitigate against EMI issues. [See More]

• Features: High Dielectric; EMI/RFI Shielding; Gap Filler, Foam in Place Gasket; Thermally Conductive; UL Rating
• Type / Form: Sheet or Film

• Chemical System: Silicone
• Industry: Aerospace; Automotive; Electronics; Electric Power; Laminaes; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling