Tooling / Mold Material Industrial Sealants
from Ellsworth Adhesives
Dow SILASTIC ™ RTV-3110 Base is easily mixed and poured, cures at room temperature, gives accurate reproduction of masters for mold making with primer, provides wide service temperature ranges and absorbs mechanical shock and vibration. Base only. 18.1 kg Pail. [See More]
- Industry: Tooling
- Cure / Technology: Two Component
- Chemical System: Silicone; Elastomeric
- Viscosity: 13000
from Master Bond, Inc.
Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Laminaes; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from RS Components, Ltd.
Urethane Red 250ml [See More]
- Industry: Tooling; Armature Coils, Boxes, Bus Bars, Commutator Ends, Controls, Electric Motor Windings, Housings, Solenoids, Terminals, Tools, Transformer Connectors
- Type / Form: Liquid
- Chemical System: Polyurethane
- Use Temperature: -40 to 248
from Ellsworth Adhesives
Dow SILASTIC ™ RTV-3110 Base is easily mixed and poured, cures at room temperature, gives accurate reproduction of masters for mold making with primer, provides wide service temperature ranges and absorbs mechanical shock and vibration. Base only. 4 kg Pail. [See More]
- Industry: Tooling
- Cure / Technology: Two Component
- Chemical System: Silicone; Elastomeric
- Viscosity: 13000
from Master Bond, Inc.
Master Bond X21 is a specially formulated one component system for bonding and priming polyolefinic surfaces. X21 is a very low viscosity( <250 cps) solvent based system that is easy to apply and process. Most often, it is used as a primer to promote adhesion of polyolefinic substrates to other... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Unfilled
- Chemical System: Elastomeric
- Cure / Technology: Thermoset; Single Component
from Ellsworth Adhesives
Dow SILASTIC ™ RTV-3110 Base is easily mixed and poured, cures at room temperature, gives accurate reproduction of masters for mold making with primer, provides wide service temperature ranges and absorbs mechanical shock and vibration. Base only. 453 g Jar. [See More]
- Industry: Tooling
- Cure / Technology: Two Component
- Chemical System: Silicone; Elastomeric
- Viscosity: 13000
from Master Bond, Inc.
Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Ellsworth Adhesives
Dow SILASTIC ™ RTV-3112 Base is easily mixed and poured, cures at room temperature, gives accurate reproduction of masters for mold making with primer, provides wide service temperature ranges and absorbs mechanical shock and vibration. Base only. 18.1 kg Pail. [See More]
- Industry: Tooling
- Cure / Technology: Two Component
- Chemical System: Silicone; Elastomeric
- Viscosity: 28000
from Master Bond, Inc.
Master Bond Polymer Adhesive EP51 is a fast "5 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi at room temperature. The... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Ellsworth Adhesives
Dow SILASTIC ™ RTV-3112 Base is easily mixed and poured, cures at room temperature, gives accurate reproduction of masters for mold making with primer, provides wide service temperature ranges and absorbs mechanical shock and vibration. Base only. 4 kg Pail. [See More]
- Industry: Tooling
- Cure / Technology: Two Component
- Chemical System: Silicone; Elastomeric
- Viscosity: 28000
from Master Bond, Inc.
Master Bond Polymer System EP39-2 is a fast curing, low viscosity, optically clear two component epoxy system for high performance bonding, sealing, coating and casting. It is 100% reactive and does not contain any diluents, solvents or other volatiles. The mix ratio is a convenient 2 to 1 by... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Ellsworth Adhesives
Dow SILASTIC ™ RTV-3112 Base is easily mixed and poured, cures at room temperature, gives accurate reproduction of masters for mold making with primer, provides wide service temperature ranges and absorbs mechanical shock and vibration. Base only. 453 g Jar. [See More]
- Industry: Tooling
- Cure / Technology: Two Component
- Chemical System: Silicone; Elastomeric
- Viscosity: 28000
from Master Bond, Inc.
Master Bond EP62-1 is a two component heat cured and chemically resistant epoxy resin system featuring a long pot life at ambient temperatures and efficient cures at moderately elevated temperatures. The recommended mix ratio is 100 parts of component A to 10 parts of component B. The pot life of... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Laminaes; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Porous Surfaces
from Ellsworth Adhesives
Dow SILASTIC ™ RTV-3120 Base is easily mixed and poured, cures at room temperature, gives accurate reproduction of masters for mold making with primer, provides wide service temperature ranges and absorbs mechanical shock and vibration. Base only. 18.1 kg Pail. [See More]
- Industry: Tooling
- Cure / Technology: Two Component
- Chemical System: Silicone; Elastomeric
- Viscosity: 13000 to 40000
from Master Bond, Inc.
Master Bond X-5 is specially formulated, synthetic elastomer-based, one component adhesive for high performance bonding and sealing. This synthetic elastomer based adhesive bonds well in both shear and peel to similar and dissimilar surfaces including metals, woods, most plastics, ceramics, glass,... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Unfilled
- Chemical System: Elastomeric
- Cure / Technology: Thermoset; Single Component
from Ellsworth Adhesives
Dow SILASTIC ™ RTV-3120 Base is easily mixed and poured, cures at room temperature, gives accurate reproduction of masters for mold making with primer, provides wide service temperature ranges and absorbs mechanical shock and vibration. Base only. 4 kg Pail. [See More]
- Industry: Tooling
- Cure / Technology: Two Component
- Chemical System: Silicone; Elastomeric
- Viscosity: 13000 to 40000
from Master Bond, Inc.
Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4500 psi. In addition, unlike many structural epoxies, EP31 also has a high peel strength exceeding 40 pli. The service... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Laminaes; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Type / Form: Grease, Paste
from Ellsworth Adhesives
Dow SILASTIC ™ RTV-3120 Base is easily mixed and poured, cures at room temperature, gives accurate reproduction of masters for mold making with primer, provides wide service temperature ranges and absorbs mechanical shock and vibration. Base only. 453 g Jar. [See More]
- Industry: Tooling
- Cure / Technology: Two Component
- Chemical System: Silicone; Elastomeric
- Viscosity: 13000 to 40000
from Master Bond, Inc.
Master Bond Polymer System EP45HT is a two component epoxy system for high performance structural bonding and casting. It is suitable for applications where long term exposure to temperatures from -80 °F to +500 °F is required. lt is 100% reactive and does not contain any solvents or... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer System EP13 is a one component heat curing epoxy featuring high shear strength and very high temperature resistance. This one component system is formulated to cure at temperatures from 300 °F to 350 °F for 60-90 minutes. Upon cure, EP13 readily attains tensile shear... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Master Bond, Inc.
Master Bond Polymer System 125 is a two component toughened epoxy resin for prolonged service above 500 °F with truly outstanding chemical resistance. High strength bonds serviceable up to 600 °F can be obtained with this exceptionally thermally stable and chemically resistant epoxy resin... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Laminaes; Marine; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer Adhesive EP33 is a unique room temperature curing two component epoxy adhesive for high temperature bonding applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures. Master Bond Polymer Adhesive EP33 produces high strength bonds whose... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Laminaes; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer System EP15 is a one component heat curing epoxy featuring high tensile strength that is utilized in testing the adhesion or cohesive strength of flame-sprayed coatings. This standard test is fully detailed in ASTM specification C 633. EP15 is formulated to cure at temperatures... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Master Bond, Inc.
Master Bond Polymer System EP29LP is a two component high performance epoxy resin system featuring low viscosity, long pot life and low exotherm. As an adhesive this versatile material will form bond strengths in excess of 2,500 psi (aluminum to aluminum). It bonds well to a variety of substrates... [See More]
- Industry: Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. Not only is EP29LPSP able to function as an adhesive, sealant and protective coating at temperatures as low as 4K, but it is... [See More]
- Industry: Aerospace; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronicc/ structural applications. The two components are combined in a convenient noncritical mix... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Laminaes; Marine; Optical; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer System EP38 is a fast curing, low viscosity, optically clear two component epoxy system for high performance coating, bonding and sealing. It is 100% reactive and does not contain any volatiles. The mix ratio is a convenient 3 to 1 by weight. EP38 is very fast curing. Coatings as... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond EP30NS is a nano silica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically clear and meets NASA low outgassing specifications. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
Master Bond Polymer System EP76M is a two component, nickel filled, electrically conductive adhesive for high performance bonding, sealing, and coating formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part nickel conductive systems, EP76M... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer System FL901AO is a one component high performance, thermally conductive, electrically insulative epoxy resin based adhesive film with outstanding performance characteristics. Unlike many other such epoxy film products, it does not require refrigerated storage although this is... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Master Bond, Inc.
Master Bond Polymer System EP36 is a unique one component high performance toughened epoxy system for electrical potting, casting, encapsulation, baked coatings and adhesive applications. It features an outstanding combination of properties including high temperature stability up to 500 °F,... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Master Bond, Inc.
Master Bond Polymer System EP19HT is a storage stable one component liquid epoxy resin system for durable, high performance adhesive/sealants, impregnates and liners. It features remarkably long shelf life and excellent storage characteristics at ambient temperatures yet cures readily at elevated... [See More]
- Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Master Bond, Inc.
Master Bond UV10 and UV10TK are one component UV curable modified epoxy compounds, ready for use as supplied, for high performance casting, coatings, sealing and bonding applications. UV10 is a low viscosity amber liquid at room temperature and UV10TK is a medium viscosity amber liquid at room... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Laminaes; Marine; Military; Optical; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Type / Form: Liquid
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
Master Bond Polymer System EP30 is a low viscosity, two component epoxy adhesive for general purpose bonding, coating, sealing and casting formulated to cure at room temperature or more rapidly at elevated temperatures with a four (4) to one (1) mix ratio by weight. This adhesive is 100% reactive... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Laminaes; Marine; Optical; OEM or Industrial; Semiconductors, IC's; Tooling
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Type / Form: Liquid
from Master Bond, Inc.
Master Bond EP121AO is a two component, high performance epoxy resin system featuring high thermal stability, high thermal conductivity, superior electrical insulation properties and outstanding dimensional stability for coating, sealing, potting and encapsulation for service up to 450-500 °F. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Hapco, Inc.
HIGH PERFORMANCE HYBRID ELASTOMERIC POLYMER ALLOYS. The Hapflex ™ 1000 Series products are soft, colorless, Shore A elastomers. These materials are available in both a fast and slow gel time and can also be combined to yield customized gel times without the addition of heat. Hapflex ™... [See More]
- Industry: Electronics; OEM or Industrial; Tooling
- Composition: Unfilled
- Chemical System: Elastomeric; Polyurethane
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
from Shiu Li Technology Co., Ltd
LiPOLY S393 is a product with high ductile thermal conductivity. Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material. It won't easy to break and deformwhether stamped, punched, strip type, or custom cutting. Your best choice... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Laminaes; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Type / Form: Sheet or Film
- Chemical System: Silicone
- Features: High Dielectric; Gap Filler, Foam in Place Gasket; Thermally Conductive; UL Rating
from DME Company
Resists Corrosion, Leakage and Loosening From Vibration and Moisture. Anaerobic Sealant Chemically Cures In The Absence of Air. Use From -65 ˚F To +350 ˚F. Allows Final Adjustments Up To 24 Hours After Application. Use For Hydraulics, Pneumatics, Process Piping or Steam. Locks And Seals... [See More]
- Industry: Tooling
- Type / Form: Grease, Paste
- Cure / Technology: Anaerobic
- Substrate Compatibility: Metal; Dissimilar Substrates
from Aremco Products, Inc.
Aremco offers an expansive range of ceramic-based materials used for the assembly of high temperature, high power electrical devices, and high temperature fixtures, molds and tooling. These materials, based on aluminum oxide, aluminum nitride, magnesium oxide, silicon dioxide, silicon carbide,... [See More]
- Industry: Electronics; Tooling
- Substrate Compatibility: Ceramic, Glass; Textiles or Fabrics; Dissimilar Substrates
- Type / Form: Liquid
- Features: Encapsulant or Conformal Coating
from McGee Industries, Inc. / McLube Division
McLube mold sealer is effective on new and seasoned molds of all types. Our sealer will reduce or effectively eliminate porosity on the surface of your mold and leave a high-gloss finish. [See More]
- Industry: Tooling
- Type / Form: Liquid
- Cure / Technology: Air Setting / Film Drying; Single Component
- Features: Leveling Filling; Solvent Based
from Hapco, Inc.
HIGH PERFORMANCE HYBRID ELASTOMERIC POLYMER ALLOYS. The Hapflex ™ 500 Series offers soft durometer elastomers ranging from 45 - 95 Shore A. All are relatively fast, room curing, flexible systems that can be accelerated with moderate heat for faster cycle times. Most 500 Series products are... [See More]
- Industry: OEM or Industrial; Tooling
- Composition: Unfilled
- Chemical System: Elastomeric; Polyurethane
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
from Shiu Li Technology Co., Ltd
LiPOLY S818 is a product with high ductile thermal conductivity.Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material.It won't easy to break and deform whether stamped, punched, strip type, or custom cutting. Your best choice... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Laminaes; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Type / Form: Sheet or Film
- Chemical System: Silicone
- Features: High Dielectric; Gap Filler, Foam in Place Gasket; Thermally Conductive; UL Rating
from DME Company
RTV Silicone Adhesive Sealant. Bonds Most Plastics Many Assembly Uses. Cures at Room Temperature To A Tough Flexible Rubber. Resists Shrinkage. Perfect For Caulking, Sealing, Waterproofing & Bonding. Bonds & Seals Terminals, Connectors, Mounting Fixtures, Mechanical Gaskets, Glass, Metal,... [See More]
- Industry: Tooling
- Cure / Technology: Room Temperature Vulcanizing or Curing
- Chemical System: Silicone
- Type / Form: Grease, Paste
from Hapco, Inc.
HIGH PERFORMANCE HYBRID ELASTOMERIC POLYMER ALLOYS. The Hapflex ™ 600 series are relatively fast, semi-rigid, room temperature curing systems. This series yields harder durometers ranging from 50 - 70 Shore D. Most. 600 Series products are offered in 2 speeds: a standard 20-25 minute working... [See More]
- Industry: OEM or Industrial; Tooling
- Composition: Unfilled
- Chemical System: Elastomeric; Polyurethane
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
from Shiu Li Technology Co., Ltd
LiPOLY DCTP140-s is a thermal insulator uses fiberglass cloth as a reinforcement material, combined with thermal conductive silicon, giving it high thermal conduction and great compression strength. The thermal conductivity is 4.5 W/m*K, the thickness is 0.25~0.45mm. Its high insulation and... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Laminaes; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Type / Form: Sheet or Film
- Chemical System: Silicone
- Features: High Dielectric; Gap Filler, Foam in Place Gasket; Thermally Conductive; UL Rating
from Hapco, Inc.
HIGH PERFORMANCE HYBRID ELASTOMERIC POLYMER ALLOYS. Hapflex ™ 700/800 products are colorless, high strength elastomers available in hardnesses ranging from 65A to 72D. Hapflex ™ 700/800 products exhibit high tensile strength, high tear strength, and excellent elongation. All Hapflex... [See More]
- Industry: Electronics; OEM or Industrial; Tooling
- Composition: Unfilled
- Chemical System: Elastomeric; Polyurethane
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
from Shiu Li Technology Co., Ltd
LiPOLY T-top99-s offers outstanding thermal conductivity at 24.0 W/m*K and extremely low thermal resistance under minimal force.T-top99-s offers excellent compression, filling small air gaps on uneven surfaces, ensuring an efficient and consistent transfer of heat. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Laminaes; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Type / Form: Sheet or Film
- Chemical System: Silicone
- Features: High Dielectric; Gap Filler, Foam in Place Gasket; Thermally Conductive; UL Rating
from Hapco, Inc.
Hapsil 360 ™ is a high tear strength, tin-catalyzed RTV-2 silicone rubber, which was designed for casting Hapco's wide variety of rigid and flexible polyurethane resins. Hapsil 360 ™ is not sensitive to inhibition, meaning it will cure at room temperature over virtually any surface. [See More]
- Industry: OEM or Industrial; Tooling
- Composition: Unfilled
- Chemical System: Silicone; Elastomeric
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
from Shiu Li Technology Co., Ltd
LiPOLY TEM96D is a thermally conductive absorber based upon soft magnetic materials dispersed in a polymeric resin. It has a thermalconductivity of 5.0 W/m*K and dissipates electromagnetic radiation rapidly to mitigate against EMI issues. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Laminaes; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Type / Form: Sheet or Film
- Chemical System: Silicone
- Features: High Dielectric; EMI/RFI Shielding; Gap Filler, Foam in Place Gasket; Thermally Conductive; UL Rating
from Hapco, Inc.
Solid Reaction Injection Molding. S-RIM ™ is a series of advanced casting resins that exhibit high physical properties and are extremely fast curing. Easy to mix with a 1:1 ratio by volume. Available in black or natural/tan. Available in 60 or 240 second gel time. 6260/61 can be de-molded in... [See More]
- Industry: OEM or Industrial; Tooling
- Cure / Technology: Two Component
- Composition: Unfilled
- Type / Form: Liquid
from Shiu Li Technology Co., Ltd
LiPOLY HC-93 is a stereoscopic thermal conductive silicone rubber cap as substrate through a special production process. Due to its excellent characteristic of high thermal conductivity, insulation, shockproof and convenient assembly, it is widely used in heat transistor refer to TO220 / TO3P,... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Laminaes; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Type / Form: Sheet or Film
- Chemical System: Silicone
- Substrate Compatibility: Rubber or Elastomer
from Hapco, Inc.
Elastomeric Series. Various hardness elastomers, shore 20A - 72D. Clear in color. Available in 2 speeds - fast and slow. STERalloy FDG is the first Liquid Molding Polymer Alloy Series that has been specifically designed for food and drug applications. All of the products in the STERalloy FDG Series... [See More]
- Industry: Sanitary; Tooling
- Composition: Unfilled
- Chemical System: Elastomeric; Polyurethane
- Cure / Technology: Two Component
from Shiu Li Technology Co., Ltd
LiPOLY SP is a stereoscopic thermal conductive silicone rubber cap as substrate through a special production process. Due to its excellent characteristic of high thermal conductivity, insulation, shockproof and convenient assembly, it is widely used in heat transistor refer to TO220 / TO3P, diode,... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Laminaes; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Type / Form: Sheet or Film
- Chemical System: Silicone
- Substrate Compatibility: Rubber or Elastomer
from Hapco, Inc.
Rigid Series. Rigid, tough polymer alloy plastics. High heat distortion. High physical properties. STERalloy FDG is the first Liquid Molding Polymer Alloy Series that has been specifically designed for food and drug applications. All of the products in the STERalloy FDG Series exhibit unique... [See More]
- Industry: Sanitary; Tooling
- Composition: Unfilled
- Chemical System: Polyurethane
- Cure / Technology: Two Component
from Shiu Li Technology Co., Ltd
LiPOLY TP200 is a stereoscopic thermal conductive silicone rubber cap as substrate through a special production process. Due to its excellent characteristic of high thermal conductivity, insulation, shockproof and convenient assembly, it is widely used in heat transistor refer to TO220 / TO3P,... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Laminaes; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Type / Form: Sheet or Film
- Chemical System: Silicone
- Substrate Compatibility: Rubber or Elastomer
from Shiu Li Technology Co., Ltd
AS17 is an advanced insulation material composed of a fiber composite made from porous silica, aluminum nitride, and other materials, with an extremely low thermal conductivity of 0.028 W/m·K. AS17 is notable for its ability to prevent thermal runaway, its ultra-low density, and its high-temperature... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Laminaes; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Substrate Compatibility: Textiles or Fabrics
- Type / Form: Sheet or Film
- Features: High Dielectric; Gap Filler, Foam in Place Gasket; Thermal Insulation
from Shiu Li Technology Co., Ltd
AS27 is an advanced insulation material composed of nanoscale porous silica, carbon, and other materials, with an extremely low thermal conductivity of 0.009 W/m·K, making it one of the lowest-known thermal conductivity solid materials. AS27 is renowned for its ultra-low density, exceptional thermal... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Laminaes; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Substrate Compatibility: Textiles or Fabrics
- Type / Form: Sheet or Film
- Features: High Dielectric; Gap Filler, Foam in Place Gasket; Thermal Insulation
from Shiu Li Technology Co., Ltd
LiPOLY AS02-s is a material with double sided inherent tack, low thermal resistance and high thermal conductivity. It has excellent compressive strength characteristics and good electrical isolation function for high-power electronic components, making it the best choice for thin design... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Laminaes; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Type / Form: Sheet or Film
- Chemical System: Silicone
- Features: High Dielectric; Gap Filler, Foam in Place Gasket; Thermally Conductive; UL Rating