Leveling / Filling Compound Industrial Sealants
from RS Components, Ltd.
Interface material PCM Triumphant 3.5 W/ [See More]
- Features: Leveling Filling
- Thermal Conductivity: 3.5
from Ellsworth Adhesives
Bostik Chem-Calk 1200 Clear is a one component, moisture curing, silicone sealant that is used for bonding nonporous materials, aluminum, glass, plastics, and ceramics. It is typically used for sealing doors, windows, skylights, and other building components. 10.1 oz Cartridge. [See More]
- Features: Caulk, Grout; Leveling Filling; Gap Filler, Foam in Place Gasket
- Cure / Technology: Single Component
- Chemical System: Silicone
- Substrate Compatibility: Ceramic, Glass
from Master Bond, Inc.
MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Flexible; Leveling Filling; Non-corrosive; Phase Change; Gap Filler, Foam in Place Gasket; Thermally Conductive
- Composition: Unfilled
- Chemical System: Silicone
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing; Addition Cure
from RS Components, Ltd.
Thermal Putty, 3.0 W/m K, non silicone, [See More]
- Features: Leveling Filling; Thermally Conductive
- Thermal Conductivity: 3
- Use Temperature: -22 to 302
from Master Bond, Inc.
EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Flexible; Flame Retardant; Leveling Filling; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from RS Components, Ltd.
Silicon Putty,5.0 W/m K,55ml [See More]
- Features: Leveling Filling
- Use Temperature: -58 to 392
- Chemical System: Silicone
- Thermal Conductivity: 5
from Master Bond, Inc.
One part, nano silica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Glob Top, Daub, Doming or Overfill; Leveling Filling; Non-corrosive; Phase Change; Thermally Conductive
- Cure / Technology: UV or Radiation Cured; Single Component; Dual Curing
- Composition: Filled
- Type / Form: Liquid
from RS Components, Ltd.
Thermal Putty with EMI, 2.0 W/m K, 55ml [See More]
- Features: Leveling Filling; Thermally Conductive
- Use Temperature: -58 to 392
- Chemical System: Silicone
- Thermal Conductivity: 2
from Master Bond, Inc.
MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]
- Features: Electrically Conductive; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Flexible; Leveling Filling; Non-corrosive; Phase Change; Gap Filler, Foam in Place Gasket; Thermally Conductive
- Composition: Filled
- Chemical System: Silicone
- Cure / Technology: Thermoset; Two Component ; Addition Cure
from RS Components, Ltd.
Thermal Putty, 2.0 W/m K, 55ml [See More]
- Features: Leveling Filling; Thermally Conductive
- Use Temperature: -58 to 392
- Chemical System: Silicone
- Thermal Conductivity: 2
from Master Bond, Inc.
EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Flame Retardant; Leveling Filling; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from RS Components, Ltd.
Silicon Putty,3.0 W/m K,55ml [See More]
- Features: Leveling Filling
- Use Temperature: -58 to 392
- Chemical System: Silicone
- Thermal Conductivity: 3
from Master Bond, Inc.
EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Flexible; Leveling Filling; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from RS Components, Ltd.
Silicone putty, 2.0 W/m K 1kg [See More]
- Features: Leveling Filling
- Use Temperature: -58 to 392
- Chemical System: Silicone
- Thermal Conductivity: 2
from Master Bond, Inc.
MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Flexible; Leveling Filling; Non-corrosive; Phase Change; Thermally Conductive
- Composition: Unfilled
- Chemical System: Silicone
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from RS Components, Ltd.
Silicone putty, 3.0 W/m K 1kg [See More]
- Features: Leveling Filling
- Use Temperature: -58 to 392
- Chemical System: Silicone
- Thermal Conductivity: 3
from Master Bond, Inc.
Master Bond Polymer System 125 is a two component toughened epoxy resin for prolonged service above 500 °F with truly outstanding chemical resistance. High strength bonds serviceable up to 600 °F can be obtained with this exceptionally thermally stable and chemically resistant epoxy resin... [See More]
- Features: High Dielectric; Leveling Filling; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermal Insulation
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from RS Components, Ltd.
Thermal Putty [See More]
- Features: Leveling Filling; Thermally Conductive
- Use Temperature: -40 to 392
- Chemical System: Silicone
- Thermal Conductivity: 2
from Master Bond, Inc.
Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronicc/ structural applications. The two components are combined in a convenient noncritical mix... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Leveling Filling; Non-corrosive; Gap Filler, Foam in Place Gasket; Solvent Based; Thermal Insulation
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from RS Components, Ltd.
Thermal Putty [See More]
- Features: Leveling Filling; Thermally Conductive
- Use Temperature: -40 to 392
- Chemical System: Silicone
- Thermal Conductivity: 3
from Master Bond, Inc.
Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Leveling Filling; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from RS Components, Ltd.
Thermal Putty [See More]
- Features: Leveling Filling; Thermally Conductive
- Use Temperature: -40 to 392
- Chemical System: Silicone
- Thermal Conductivity: 5
from Master Bond, Inc.
Master Bond EP30NS is a nano silica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically clear and meets NASA low outgassing specifications. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Leveling Filling; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermally Conductive
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from RS Components, Ltd.
Thermal Putty [See More]
- Features: Leveling Filling; Thermally Conductive
- Use Temperature: -58 to 392
- Chemical System: Silicone
- Thermal Conductivity: 7
from Master Bond, Inc.
EP42-2LV Black is a two component, room temperature curing epoxy compound featuring low viscosity and superior chemical resistance. It meets NASA low outgassing specifications, is black in color and optically opaque. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Leveling Filling; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from RS Components, Ltd.
METAL REPAIR COMPOUND [See More]
- Features: Leveling Filling
- Use Temperature: 39 to 109
from Master Bond, Inc.
Master Bond UV10 and UV10TK are one component UV curable modified epoxy compounds, ready for use as supplied, for high performance casting, coatings, sealing and bonding applications. UV10 is a low viscosity amber liquid at room temperature and UV10TK is a medium viscosity amber liquid at room... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Leveling Filling; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermal Insulation
- Type / Form: Liquid
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from RS Components, Ltd.
CRC Minute Mend Epoxy Putty 4OZ [See More]
- Features: Leveling Filling
- Industry: Sealing
from Master Bond, Inc.
Supreme 3HTND-2DM is a rapid curing, toughened, one part epoxy system used for the dam-and-fill method for chip-on-board encapsulation. It passes ASTM E595 specifications for NASA low outgassing allowing it to be used in vacuum, aerospace, electro-optic and other related applications. Supreme... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Glob Top, Daub, Doming or Overfill; Leveling Filling; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from RS Components, Ltd.
RESIN 3463 [See More]
- Features: Leveling Filling
- Use Temperature: -22 to 248
from Master Bond, Inc.
Formulated to have special optical transmission properties, EP30-2LB is an optically clear epoxy that does not permit UV light transmission, but transmits well from 450-900 nm and above. It is a user friendly compound that has a non-critical ten to one mix ratio by weight. This system cures readily... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Leveling Filling; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from RS Components, Ltd.
LOCTITE 3463,METAL MAGIC STEEL [See More]
- Features: Leveling Filling
- Industry: Repairing, Sealing, Smoothing
from Master Bond, Inc.
Formulated for thermal management applications, EP30TC is a two component epoxy that contains robust thermally conductive fillers with very fine particle sizes. It has thermal conductivity of 18-20 BTU •in/ft2 •hr • °F [2.60-2.88 W/(m •K)] and can be applied in sections as... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Leveling Filling; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermally Conductive
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from RS Components, Ltd.
LOCTITE 3463 50 GR [See More]
- Features: Leveling Filling
- Industry: Filling, Sealing
from Master Bond, Inc.
Master Bond EP121AO is a two component, high performance epoxy resin system featuring high thermal stability, high thermal conductivity, superior electrical insulation properties and outstanding dimensional stability for coating, sealing, potting and encapsulation for service up to 450-500 °F. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermally Conductive
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from RS Components, Ltd.
Wear resistant liquid,500gm tub [See More]
- Features: Leveling Filling
- Industry: Protective Jacketing, Repairing
- Type / Form: Liquid
- Use Temperature: 250
from Master Bond, Inc.
Two component EP46HT-2AO Black is ideal for demanding bonding, sealing and encapsulation applications where thermal conductivity, electrical insulation and high temperature resistance are required. It has a service temperature range of -100 °F to +500 °F with a glass transition temperature... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Leveling Filling; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from RS Components, Ltd.
Plastic steel(R) liquid,500gm tub [See More]
- Features: Leveling Filling
- Industry: Filling, Support
- Type / Form: Liquid
- Use Temperature: 250
from Master Bond, Inc.
Master Bond EP121CL is a two component, high performance epoxy resin system featuring high thermal stability, superior electrical insulation properties and outstanding dimensional stability for casting, sealing, potting, encapsulation and impregnation for service up to 450-500 °F. It cures... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermal Insulation
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from RS Components, Ltd.
Flexane(R) 60 liquid urethane,500gm [See More]
- Features: Leveling Filling
- Industry: Casting, Corrosion Protection, Noise Dampening, Wear Protection
- Type / Form: Liquid
- Use Temperature: 180
from Master Bond, Inc.
Master Bond EP21TPHT is an epoxy polysulfide compound that withstands temperatures up to 350°F which gives it a higher resistance to elevated temperatures than most polysulfide systems. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Flexible; Leveling Filling; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermally Conductive
- Composition: Unfilled
- Chemical System: Polyphenylene Sulfide; Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from RS Components, Ltd.
Flexane(R) 80 liquid urethane,500gm [See More]
- Features: Leveling Filling
- Industry: Casting, Corrosion Protection, Noise Dampening, Wear Protection
- Type / Form: Liquid
- Use Temperature: 180
from Master Bond, Inc.
EP62-1BF is a two part epoxy featuring the ability to withstand exposure to aggressive chemicals including acids, bases and solvents, even at high temperatures. This low exotherm system has a mixed viscosity of 2,000-5,000 cps, enabling it to be used for potting small components. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from RS Components, Ltd.
Flexane(R) 94 liquid urethane,500gm [See More]
- Features: Leveling Filling
- Industry: Casting, Corrosion Protection, Noise Dampening, Wear Protection
- Type / Form: Liquid
- Use Temperature: 180
from Master Bond, Inc.
Master Bond EP88FL is a low viscosity, optically clear, two component epoxy system featuring good flexibility for high performance bonding, coating, sealing and potting. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Flexible; Leveling Filling; Non-corrosive; Gap Filler, Foam in Place Gasket (optional feature); Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from RS Components, Ltd.
Magic power gel 1000ml [See More]
- Features: Leveling Filling
- Industry: Sealing
from Master Bond, Inc.
Master Bond Polymer System EP121 is a new superior and cost effective two component epoxy resin system for electrical potting and encapsulation which combines high physical strength properties, remarkable thermal shock and heat resistance, inertness to water and chemicals with good electrical... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Leveling Filling; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermal Insulation
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from RS Components, Ltd.
Firestop 400 acrylic sealant,310ml [See More]
- Features: Leveling Filling
from Master Bond, Inc.
Master Bond EP39MAOHT is a two component, thermally conductive, electrically insulative epoxy for bonding, sealing, coating, potting and encapsulation. Its low exotherm makes it well suited for large castings and potting applications. It withstands rigorous thermal cycling, vibration and shock. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Leveling Filling; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from RS Components, Ltd.
57g metal epoxy putty [See More]
- Features: Leveling Filling
- Industry: Leak Sealing
from Master Bond, Inc.
Master Bond Supreme 112 is a two part epoxy for bonding, sealing, potting, and impregnation applications with a high glass transition temperature of 190-195°C and very low viscosity. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Sauereisen, Inc.
Sauereisen Elastomeric Joint Compound No. 69 is used as a flexible expansion joint in acid pickling tanks; in concrete, brick and tile floors; for sealing joints of ducts and conduits; and for general caulking and sealing where permanent flexibility and adhesion are required, along with resistance... [See More]
- Features: Leveling Filling
- Cure / Technology: Two Component
- Chemical System: Elastomeric
- Type / Form: Liquid
from Shiu Li Technology Co., Ltd
LiPOLY's TPS series is a low-density, potting material. Its low density and lightweight properties enhance product performance, reduce production costs. The product has a thermal conductivity of 0.55-1.50 W/m*K and can cure at room temperature or high temperatures. [See More]
- Features: Encapsulant, Potting Compound; Leveling Filling; Gap Filler, Foam in Place Gasket; Thermally Conductive
- Cure / Technology: Room Temperature Vulcanizing or Curing
- Chemical System: Silicone
- Type / Form: Grease, Paste; Liquid
from Materion Corporation
Thermotech TE ™ is a Silver-filled, electrically conductive high-vacuum compound specifically manufactured by Pure Tech for the sputtering target industry. Thermotech TE combines the excellent thermal and electrical conductive properties of pure Silver with a low vapor pressure sealant,... [See More]
- Features: Electrically Conductive; Leveling Filling
- Industry: Electronics
- Cure / Technology: Two Component
from R. S. Hughes Company, Inc.
3M 03602 black gasket adhesive/sealant is compatible with metal materials. [See More]
- Features: Leveling Filling
- Type / Form: Liquid
from Aremco Products, Inc.
Used for repairing metal components, pinholes, cracks, and filling seams. [See More]
- Features: Leveling Filling; Gap Filler, Foam in Place Gasket; Thermally Conductive; Water Based
- Composition: Filled
- Chemical System: Ceramic
- Cure / Technology: Air Setting / Film Drying; Thermoset
from Fosroc Limited
Nitofi ll UR63 is a two part liquid polyurethane which reacts to form a tough, slightly fl exible resin. Nitofi ll UR63 has good adhesion to concrete and masonry and when injected into cracks it allows some movement without loss of bond. [See More]
- Features: Caulk, Grout; Leveling Filling
from Sherwin-Williams Protective & Marine Coatings
ArmorSeal ®5020 EPOXY FLOOR RESURFACER is a trowelable epoxy surfacing and leveling compound for new and old floors of concrete, wood, or steel where a high degree of chemical and abrasion resistance is required. The physical properties of ArmorSeal ®5020 are much higher than those of... [See More]
- Features: Flame Retardant; Leveling Filling
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from 3M Aerospace and Aircraft Maintenance Division
A two part, room temperature curing, low density void filling compound. It is designed for reinforcement of honeycomb sandwich constructions typically found in aircraft interior structures, honeycomb joining and bonding (interior furnishing, ceiling panels), edge panel sealing, inserts bonding,... [See More]
- Features: Flame Retardant; Leveling Filling; Gap Filler, Foam in Place Gasket
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Epoxy
- Type / Form: Grease, Paste
from Henkel Corporation - Industrial
Gasket sealant paste with resin, isopropanol and fillers. It remains pliable and flexible and seals flanges, threaded connections and fasteners. LOCTITE ® NS 5109 (known as LOCTITE GASKET MAKER HIGH TEMPERATURE) is a gray, solvent-based, slow drying, viscous gasket sealant paste with resin,... [See More]
- Features: Leveling Filling
- Type / Form: Liquid
- Cure / Technology: Single Component
- Use Temperature: 50 to 600
from Wacker Chemical Corp.
EL E952 *PLP,BL OH,18 is a self-levelling one-component silicone rubber with very good mechanical properties, which cures at room temperature under the influence of atmospheric moisture. Special features. acetic acid-curing system. self-levelling. excellent primerless adhesion to many substrates. [See More]
- Features: Leveling Filling
- Cure / Technology: Thermoset; Single Component; Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing
- Chemical System: Silicone; Elastomeric
- Type / Form: Grease, Paste
from McGee Industries, Inc. / McLube Division
McLube mold sealer is effective on new and seasoned molds of all types. Our sealer will reduce or effectively eliminate porosity on the surface of your mold and leave a high-gloss finish. [See More]
- Features: Leveling Filling; Solvent Based
- Type / Form: Liquid
- Cure / Technology: Air Setting / Film Drying; Single Component
- Industry: Tooling
from R. S. Hughes Company, Inc.
3M 046013 off-white filler is compatible with fiberglass and wood materials. Provides a 15 min working time. Delivers great performance with a shear strength of 682 psi and tensile strength of 3128 psi. [See More]
- Features: Leveling Filling
- Type / Form: Grease, Paste
from Fosroc Limited
Nitokit LV or Nitokit TH basic pack incorporates a two-part epoxy crack injection resin contained in a patented single cartridge, complete with injection nipples and hoses. A selection of either Nitokit LV, a low viscosity system or Nitokit TH, a thixotropic system, ensures the most cost effective... [See More]
- Features: Caulk, Grout; Leveling Filling
from Sherwin-Williams Protective & Marine Coatings
DURA-PLATE 2300 is a three component, epoxy modified cementitious resurfacer containing Portland Cement, hydrophobic thixotropes, fiber reinforcement, graded silica sand and other abrasion resistant aggregates. It is used for resurfacing, patching and filling voids (bugholes) in concrete and masonry... [See More]
- Features: Leveling Filling
- Cure / Technology: Air Setting / Film Drying
- Chemical System: Epoxy
- Substrate Compatibility: Concrete, Masonry
from 3M Aerospace and Aircraft Maintenance Division
Structural one-part low weight void filler for aircraft interiors. One-part low weight filler combining extreme low density with high extrusion rate for manual and automatic applications. Pumpable. Full stand alone FST properties with patented non-halogen based FST system. Low flow for ease of... [See More]
- Features: Leveling Filling; Gap Filler, Foam in Place Gasket
- Cure / Technology: Single Component
- Chemical System: Epoxy
- Type / Form: Grease, Paste
from Henkel Corporation - Industrial
UV-cured alkoxy silicone used for gasketing and sealing that requires a rapid-curing, post-applied sealant that facilitates immediate on-part inspection. LOCTITE ® SI 5089 is a straw-colored, medium viscosity, fluorescent UV-cured alkoxy silicone used for gasketing and sealing applications. It... [See More]
- Features: Leveling Filling
- Cure / Technology: UV or Radiation Cured; Single Component
- Chemical System: Silicone
- Type / Form: Liquid
from R. S. Hughes Company, Inc.
3M 05815 red filler is compatible with fabric and fiberglass materials. Provides a 3 to 5 min working time. [See More]
- Features: Leveling Filling
- Type / Form: Grease, Paste
from Sherwin-Williams Protective & Marine Coatings
HEAVY DUTY BLOCK FILLER is a pure acrylic resin block filler for use on interior and exterior poured and precast concrete, concrete block, and cinder block. Excellent moisture resistance. Excellent filling characteristics. Suitable for use in USDA inspected facilities. Resurface spalled and... [See More]
- Features: Flame Retardant; Leveling Filling; Gap Filler, Foam in Place Gasket; Solvent Based (optional feature); Water Based (optional feature)
- Composition: Unfilled
- Chemical System: Acrylic
- Cure / Technology: Thermoset; Single Component
from Henkel Corporation - Industrial
An anaerobic sealant specifically designed for sealing and retaining engine cup plugs. [See More]
- Features: Leveling Filling
- Use Temperature: 65 to 300
- Cure / Technology: Anaerobic
from R. S. Hughes Company, Inc.
3M 05816 red filler is compatible with fabric and fiberglass materials. Provides a 20 to 30 min working time. [See More]
- Features: Leveling Filling
- Type / Form: Grease, Paste
from Sherwin-Williams Protective & Marine Coatings
Cement-Plexl ® 875 is a heavy duty, interior/exterior, VOC compliant, two component, cementitious, acrylic, waterborne block filler, which accepts both conventional and high performance topcoats. When topcoated, this product provides an excellent coating system for moderate service environments... [See More]
- Features: Leveling Filling; Water Based
- Composition: Unfilled
- Chemical System: Ceramic; Acrylic
- Cure / Technology: Thermoset; Two Component
from Henkel Corporation - Industrial
Thixotropic, methacrylate ester acrylic thread sealant liquid designed for threaded fittings commonly found in hydraulic and pneumatic systems. LOCTITE ® 5452 is a purple, thixotropic, methacrylate ester acrylic thread sealant liquid designed for threaded fittings commonly found in hydraulic... [See More]
- Features: Leveling Filling
- Cure / Technology: Anaerobic; Single Component
- Chemical System: Acrylic
- Type / Form: Liquid
from R. S. Hughes Company, Inc.
3M 05836 clear filler is compatible with fiberglass materials. [See More]
- Features: Leveling Filling
- Type / Form: Liquid
from Sherwin-Williams Protective & Marine Coatings
KEM ® Cati-Coat ® HS EPOXY FILLER/SEALER is a high performance, interior/exterior, VOC compliant, epoxy block filler. Designed for tenacious adhesion to masonry substrates while filling voids and crevices to smooth the surface. Excellent resistance to moisture, humidity, impact, and... [See More]
- Features: Flame Retardant; Leveling Filling; Gap Filler, Foam in Place Gasket
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Henkel Corporation - Industrial
High lubricity thread sealant for locking and sealing metal pipes and small fittings with fine threads. LOCTITE ® 545 is a pipe thread sealant designed for locking and sealing of metal pipes and fittings. It is specially formulated to offer high lubricity for easy assembly and removal. [See More]
- Features: Leveling Filling
- Viscosity: 14500
- Type / Form: Liquid
- Use Temperature: 65 to 300
from R. S. Hughes Company, Inc.
3M 08001 yellow gasket adhesive/sealant is compatible with cork, paper and rubber materials with a 4 min cure time. Minimum operating temperature is -20 F. [See More]
- Features: Leveling Filling
- Viscosity: 4500
- Type / Form: Liquid
- Use Temperature: -20 to ?
from Henkel Corporation - Industrial
Thread sealant liquid with polymeric material, fillers and isopropyl alcohol, designed for sealing threaded plastic pipes, pipe fittings and flanges. LOCTITE ® MR 5438 (known as LOCTITE NO MORE LEAKS) is a white thread sealant liquid with polymeric material, fillers and isopropyl alcohol,... [See More]
- Features: Leveling Filling
- Substrate Compatibility: Plastic
- Type / Form: Liquid
- Use Temperature: 65 to 300
from R. S. Hughes Company, Inc.
3M 08002 yellow gasket adhesive/sealant. [See More]
- Features: Leveling Filling
- Viscosity: 4000 to 6800
- Type / Form: Liquid
from R. S. Hughes Company, Inc.
3M 08008 black gasket adhesive/sealant is compatible with cork, paper and rubber materials. [See More]
- Features: Leveling Filling
from R. S. Hughes Company, Inc.
3M 08011 black gasket adhesive/sealant is compatible with rubber materials with a 24 hr cure time. Delivers great performance with peel strength of 15 piw. Minimum to maximum operating temperatures are -40 F to +250 F. [See More]
- Features: Leveling Filling
- Viscosity: 7500 to 18000
- Type / Form: Liquid
- Use Temperature: -40 to 250
from R. S. Hughes Company, Inc.
3M 08031 amber gasket adhesive/sealant is compatible with fabric, metal and wood materials. Delivers great performance with a shear strength of 24 psi. Minimum to maximum operating temperatures are -20 F to +175 F. [See More]
- Features: Leveling Filling
- Viscosity: 450 to 1250
- Type / Form: Liquid
- Use Temperature: -20 to 175
from R. S. Hughes Company, Inc.
3M 1000 NS gray firestop sealant. Has a 3 hr fire rating. Delivers great performance with tensile strength of 85 psi. Maximum operating temperature is +300 F. [See More]
- Features: Leveling Filling; UL Rating
- Use Temperature: 300
- Type / Form: Grease, Paste
from R. S. Hughes Company, Inc.
3M 1000 NS gray firestop sealant. Has a 3 hr fire rating. Delivers great performance with tensile strength of 85 psi. Maximum operating temperature is +300 F. [See More]
- Features: Leveling Filling; UL Rating
- Use Temperature: 300
- Type / Form: Grease, Paste
from R. S. Hughes Company, Inc.
3M 1000 NS gray firestop sealant. Has a 3 hr fire rating. Delivers great performance with tensile strength of 85 psi. Maximum operating temperature is +300 F. [See More]
- Features: Leveling Filling; UL Rating
- Use Temperature: 300
- Type / Form: Grease, Paste
from R. S. Hughes Company, Inc.
3M 1003 SL gray firestop sealant. Has a 3 hr fire rating. Delivers great performance with tensile strength of 85 psi. Maximum operating temperature is +300 F. [See More]
- Features: Leveling Filling; UL Rating
- Use Temperature: 300
- Type / Form: Grease, Paste
from R. S. Hughes Company, Inc.
3M 1003 SL gray firestop sealant. Has a 3 hr fire rating. Delivers great performance with tensile strength of 85 psi. Maximum operating temperature is +300 F. [See More]
- Features: Leveling Filling; UL Rating
- Use Temperature: 300
- Type / Form: Grease, Paste
from R. S. Hughes Company, Inc.
3M 1003 SL gray firestop sealant. Has a 3 hr fire rating. Delivers great performance with tensile strength of 85 psi. Maximum operating temperature is +300 F. [See More]
- Features: Leveling Filling; UL Rating
- Use Temperature: 300
- Type / Form: Grease, Paste
from R. S. Hughes Company, Inc.
3M 16777 off-white filler. [See More]
- Features: Leveling Filling
- Type / Form: Liquid
from R. S. Hughes Company, Inc.
3M 18081 off-white asphalt & concrete sealant with a 60 min cure time. [See More]
- Features: Leveling Filling
- Type / Form: Liquid
from R. S. Hughes Company, Inc.
3M 2000+ gray firestop sealant. Has a 4 hr fire rating. Delivers great performance with tensile strength of 350 psi. Maximum operating temperature is +300 F. [See More]
- Features: Leveling Filling; UL Rating
- Use Temperature: 300
- Type / Form: Grease, Paste
from R. S. Hughes Company, Inc.
3M 2000+ gray firestop sealant. Has a 4 hr fire rating. Delivers great performance with tensile strength of 350 psi. Maximum operating temperature is +300 F. [See More]
- Features: Leveling Filling; UL Rating
- Use Temperature: 300
- Type / Form: Grease, Paste
from R. S. Hughes Company, Inc.
3M 3000 WT gray firestop sealant. Has a 4 hr fire rating. Maximum operating temperature is +230 F. [See More]
- Features: Leveling Filling; UL Rating
- Use Temperature: 230
- Type / Form: Grease, Paste
from R. S. Hughes Company, Inc.
3M 3000 WT gray firestop sealant. Has a 4 hr fire rating. Maximum operating temperature is +230 F. [See More]
- Features: Leveling Filling; UL Rating
- Use Temperature: 230
- Type / Form: Grease, Paste
from R. S. Hughes Company, Inc.
3M 3000 WT gray firestop sealant. Has a 4 hr fire rating. Maximum operating temperature is +230 F. [See More]
- Features: Leveling Filling; UL Rating
- Use Temperature: 230
- Type / Form: Grease, Paste
from R. S. Hughes Company, Inc.
3M 33010 filler. [See More]
- Features: Leveling Filling
from R. S. Hughes Company, Inc.
3M 46004 amber filler is compatible with fiberglass, metal and wood materials. Provides a 10 min working time. Delivers great performance with a shear strength of 669 psi and tensile strength of 1396 psi. [See More]
- Features: Leveling Filling
- Type / Form: Liquid