Thermal Insulation / Heat Insulating Industrial Sealants
from Master Bond, Inc.
Featuring an exceedingly low coefficient of thermal expansion of 9-12 x 10-6 in/in/ °C, EP42HT-2LTE is a two component epoxy for bonding, sealing, coating and select casting applications. It has outstanding dimensional stability and will bond well to a wide variety of substrates, including... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermal Insulation
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Non-corrosive; Phase Change; Thermal Insulation
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
Master Bond Polymer Adhesive EP30-4 is a unique low viscosity, two component epoxy adhesive for bonding, coating, and sealing formulated to cure at room temperature or more rapidly at elevated temperatures, with a two (2) to one (1) mix ratio by weight. This adhesive is 100% reactive and does not... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Flexible; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermal Insulation
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Type / Form: Liquid
from Master Bond, Inc.
Passing both USP Class VI testing and ISO cytotoxicity specifications, MasterSil 910Med is formulated for bonding, sealing, coating in medical device applications. As an acetoxy type system, it bonds exceptionally well to a wide variety of substrates including metals, composites, ceramics, glass as... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Flexible; Gap Filler, Foam in Place Gasket; Thermal Insulation
- Composition: Unfilled
- Chemical System: Silicone
- Cure / Technology: Thermoset; Single Component
from Master Bond, Inc.
Master Bond Polymer System 125 is a two component toughened epoxy resin for prolonged service above 500 °F with truly outstanding chemical resistance. High strength bonds serviceable up to 600 °F can be obtained with this exceptionally thermally stable and chemically resistant epoxy resin... [See More]
- Features: High Dielectric; Leveling Filling; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermal Insulation
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronicc/ structural applications. The two components are combined in a convenient noncritical mix... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Leveling Filling; Non-corrosive; Gap Filler, Foam in Place Gasket; Solvent Based; Thermal Insulation
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond UV10 and UV10TK are one component UV curable modified epoxy compounds, ready for use as supplied, for high performance casting, coatings, sealing and bonding applications. UV10 is a low viscosity amber liquid at room temperature and UV10TK is a medium viscosity amber liquid at room... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Leveling Filling; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermal Insulation
- Type / Form: Liquid
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Master Bond, Inc.
Master Bond Polymer System EP30 is a low viscosity, two component epoxy adhesive for general purpose bonding, coating, sealing and casting formulated to cure at room temperature or more rapidly at elevated temperatures with a four (4) to one (1) mix ratio by weight. This adhesive is 100% reactive... [See More]
- Features: Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Flexible; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermal Insulation
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Type / Form: Liquid
from Master Bond, Inc.
Master Bond EP121CL is a two component, high performance epoxy resin system featuring high thermal stability, superior electrical insulation properties and outstanding dimensional stability for casting, sealing, potting, encapsulation and impregnation for service up to 450-500 °F. It cures... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Leveling Filling; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermal Insulation
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer System EP121 is a new superior and cost effective two component epoxy resin system for electrical potting and encapsulation which combines high physical strength properties, remarkable thermal shock and heat resistance, inertness to water and chemicals with good electrical... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Leveling Filling; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermal Insulation
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Boyd
Thermal Interface Materials - Gap Fillers and Pads, Films, Tapes, Hardware. Electronic devices continue to become faster, smaller, and more powerful every day, enabling technological advancements across all industries. The Internet of Things, powered by embedded electronics and its complex... [See More]
- Features: Gap Filler, Foam in Place Gasket; Thermally Conductive; Thermal Insulation
- Type / Form: Sheet or Film
from Shiu Li Technology Co., Ltd
AS17 is an advanced insulation material composed of a fiber composite made from porous silica, aluminum nitride, and other materials, with an extremely low thermal conductivity of 0.028 W/m·K. AS17 is notable for its ability to prevent thermal runaway, its ultra-low density, and its high-temperature... [See More]
- Features: High Dielectric; Gap Filler, Foam in Place Gasket; Thermal Insulation
- Substrate Compatibility: Textiles or Fabrics
- Type / Form: Sheet or Film
- Industry: Aerospace; Automotive; Electronics; Electric Power; Laminaes; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
from Epoxy Technology
We have served the optical market since 301 was introduced in 1969. Our products encapsulate, coat, bond and seal plastics, crystals and glass together for optical components, such as prism, filters, and mirrors. EPO-TEK ® fabricated components are the building blocks of camera, laser,... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Thermal Insulation
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Type / Form: Liquid
from Protavic America, Inc.
Fast flow, fast cure capillary reworkable underfill. The rheology of the PROTAVIC ANA 10199 R in combination with its fineness make the product perfectly adapted to high reliability small gap underfill applications. It presents a good pot life at room temperature 20-22C and a high reactivity at... [See More]
- Features: High Dielectric; Gap Filler, Foam in Place Gasket; Thermal Insulation
- Cure / Technology: Thermoset; Single Component
- Composition: Unfilled
- Type / Form: Liquid
from GAF
Elastomeric Roof Coating. Topcoat ® 322 White Elastomeric Coating is a styrene acrylic-based roof coating that forms a seamless and flexible layer of protection for your roof. This coating is designed to seal and dramatically reduce the surface temperatures and to resist heat absorption and... [See More]
- Features: Flexible; Thermal Insulation
- Cure / Technology: Air Setting / Film Drying; Single Component
- Chemical System: Elastomeric
- Type / Form: Liquid
from Shiu Li Technology Co., Ltd
AS27 is an advanced insulation material composed of nanoscale porous silica, carbon, and other materials, with an extremely low thermal conductivity of 0.009 W/m·K, making it one of the lowest-known thermal conductivity solid materials. AS27 is renowned for its ultra-low density, exceptional thermal... [See More]
- Features: High Dielectric; Gap Filler, Foam in Place Gasket; Thermal Insulation
- Substrate Compatibility: Textiles or Fabrics
- Type / Form: Sheet or Film
- Industry: Aerospace; Automotive; Electronics; Electric Power; Laminaes; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling