Electronics Industrial Sealants
from ELANTAS North America LLC
ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]
- Industry: Aerospace; Electronics; Laminaes; Military; OEM or Industrial
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Optical; Photonics; OEM or Industrial; Semiconductors, IC's
- Composition: Unfilled
- Chemical System: Silicone
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing; Addition Cure
from Quantaflex Printed Electronics Inc.
A high level of custom engineering and problem solving. Designing electrical shielding components requires a high level of custom engineering and problem solving. Nothing should be left to chance because the goal is to create a part that protects the electronic device (and your customers) from the... [See More]
- Industry: Electronics; Semiconductors, IC's
- Features: EMI/RFI Shielding; Gap Filler, Foam in Place Gasket; Thermally Conductive
- Type / Form: Liquid; Sheet or Film
from Hernon Manufacturing, Inc.
Blank Ammunition Sealant 48641 Is a medium viscosity, UV and LED curable compound formulated to provide high performance, fast curing, coating and sealing of ammunition blank tips. This product is also used for shallow potting applications. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
from Waytek, Inc.
3M 7000005872 Water Activated Paper Tape Rolls. Category: Sealing & Bonding Tape. Manufacturer: 3M. Series: Scotch ®. Thickness: 45 mil. Voltage Rating: 600VDC. Temperature range: 176 °F (80 °C) to 0 °F (-18 °C). Dielectric Strength: 300VDC/mil. Seals high-voltage cables... [See More]
- Industry: Electronics
- Use Temperature: 0 to 176
from CHT USA Inc.
CHT's AS1821 is is a non-corrosive, neutral cure, 1-part, RTV (Room Temperature Vulcanising) silicone adhesive sealant. It is one in a range of Acetone cure products which are solvent free. It exhibits excellent primerless adhesion to many substrates and cures rapidly at room temperature when in... [See More]
- Industry: Automotive; Electronics
- Cure / Technology: Single Component; Acetone
- Chemical System: Silicone
- Viscosity: 20000
from RS Components, Ltd.
Silver conductive paint,3gm bottle [See More]
- Industry: Electronics; Electronics, PCBs
- Use Temperature: -112 to 257
from Ellsworth Adhesives
Dow 3-4237 Dielectric Firm Gel Clear-Green is a two component, room temperature curing, silicone gel that is used for potting, sealing, encapsulating, and protecting electrical components from contaminants, moisture, and stress. It is durable, flexible, self healing, and offers long working times. [See More]
- Industry: Electronics
- Cure / Technology: Two Component
- Chemical System: Silicone
- Features: High Dielectric; Encapsulant, Potting Compound
from Master Bond, Inc.
Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Laminaes; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Hernon Manufacturing, Inc.
Blank Ammunition Sealant 53162 Is a medium viscosity, UV and LED curable compound formulated to provide high performance, fast curing, coating and sealing of ammunition blank tips. This product is also used for shallow potting applications. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
from CHT USA Inc.
AS5702 is a non-corrosive, neutral cure, 1-part, RTV (Room Temperature Vulcanising) silicone adhesive sealant. It is one in a range of Alkoxy cure products which are solvent free. It exhibits excellent primerless adhesion to many substrates and cures at room temperature when in contact with... [See More]
- Industry: Automotive; Electronics
- Cure / Technology: Single Component; Alkoxy
- Chemical System: Silicone
- Use Temperature: -76 to 392
from RS Components, Ltd.
Sliver-loaded elec conductive paint 5g [See More]
- Industry: Electronics; Electronics, PCBs
from Ellsworth Adhesives
Dow DOWSIL ™ 6-1104 CV Sealant Clear is a one component, moisture curing, space grade silicone sealant that is used to increase performance, reliability, and safety of devices. It offers high elongation, non-flowing, no required mixing, and fast in-line processing. 142 g Tube. [See More]
- Industry: Electronics; Photonics
- Cure / Technology: Single Component
- Chemical System: Silicone
- Viscosity: 200000
from Master Bond, Inc.
EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's; Aerospace
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Hernon Manufacturing, Inc.
External Ammunition Sealant 76040 is a single component, U.V curable anaerobic sealant. 76040 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. It is specially formulated for pre-assembled components; it works by capillary action sealing... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; Room Temperature Vulcanizing or Curing
from RS Components, Ltd.
MG Super Shield Nickel conduct coating [See More]
- Industry: Aerospace; Electronics; Aerospace, Antennas, Audio Equipment, Cable Boxes, Cellphones, Communication Devices, Consumer Electronics, Controllers, Drones & Other RC Vehicles
- Use Temperature: -40 to 248
from Ellsworth Adhesives
Dow DOWSIL ™ EG-3810 Dielectric Gel is a one component, clear, heat curing silicone gel that is used for potting, sealing, encapsulating, and protecting a variety of materials in the electronics industry. It offers a wide range of operating temperatures ranging from -60 °C to 200 °C,... [See More]
- Industry: Electronics; Semiconductors, IC's
- Cure / Technology: Single Component
- Chemical System: Silicone
- Features: High Dielectric; Encapsulant, Potting Compound
from Master Bond, Inc.
One part, nano silica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; OEM or Industrial; Semiconductors, IC's
- Cure / Technology: UV or Radiation Cured; Single Component; Dual Curing
- Composition: Filled
- Type / Form: Liquid
from Hernon Manufacturing, Inc.
External Ammunition Sealant 76041 is a single component U.V. anaerobic sealant. 76041 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. It is specially formulated for pre-assembled components; it works by capillary action sealing... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; Room Temperature Vulcanizing or Curing
from RS Components, Ltd.
MG Super Shield Nickel conduct coating [See More]
- Industry: Aerospace; Electronics; Aerospace, Antennas, Audio Equipment, Cable Boxes, Cellphones, Communication Devices, Consumer Electronics, Controllers, Drones & Other RC Vehicles
- Use Temperature: -40 to 248
- Type / Form: Liquid
from Ellsworth Adhesives
Dow SYLGARD ™ 527 Silicone Dielectric Gel is a two component, room temperature and heat curing gel that is used for coating, encapsulating, potting, and sealing electronic devices. It provides flexibility, good flow, and low viscosity. 1:1 mix ratio. 0.9 kg Kit. [See More]
- Industry: Electronics
- Cure / Technology: Two Component
- Chemical System: Silicone
- Features: High Dielectric; Encapsulant, Potting Compound
from Master Bond, Inc.
Master Bond X21 is a specially formulated one component system for bonding and priming polyolefinic surfaces. X21 is a very low viscosity( <250 cps) solvent based system that is easy to apply and process. Most often, it is used as a primer to promote adhesion of polyolefinic substrates to other... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Unfilled
- Chemical System: Elastomeric
- Cure / Technology: Thermoset; Single Component
from Hernon Manufacturing, Inc.
External Ammunition Sealant 76060 is a single component U.V. anaerobic sealant. 76060 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. It is specially formulated for pre-assembled components; it works by capillary action sealing... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; Room Temperature Vulcanizing or Curing
from RS Components, Ltd.
MG Super Shield Nickel conduct coating [See More]
- Industry: Aerospace; Electronics; Aerospace, Antennas, Audio Equipment, Cable Boxes, Cellphones, Communication Devices, Consumer Electronics, Controllers, Drones & Other RC Vehicles
- Use Temperature: -40 to 248
from Ellsworth Adhesives
Dow SYLGARD ™ 527 Silicone Dielectric Gel is a two component, room temperature and heat curing gel that is used for coating, encapsulating, potting, and sealing electronic devices. It provides flexibility, good flow, and low viscosity. 1:1 mix ratio. 36.3 kg Kit. [See More]
- Industry: Electronics
- Cure / Technology: Two Component
- Chemical System: Silicone
- Features: High Dielectric; Encapsulant, Potting Compound
from Master Bond, Inc.
MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's
- Composition: Filled
- Chemical System: Silicone
- Cure / Technology: Thermoset; Two Component ; Addition Cure
from Hernon Manufacturing, Inc.
External Ammunition Sealant 76061 is a single component U.V. anaerobic sealant. 76061 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. It is specially formulated for pre-assembled components; it works by capillary action sealing... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; Room Temperature Vulcanizing or Curing
from RS Components, Ltd.
MG Super Shield Silver coated copper [See More]
- Industry: Aerospace; Electronics; Aerospace, Antennas, Audio Equipment, Cable Boxes, Cellphones, Communication Devices, Consumer Electronics, Controllers, Drones & Other RC Vehicles
- Type / Form: Liquid
- Chemical System: Acrylic
- Use Temperature: -40 to 248
from Ellsworth Adhesives
Dow SYLGARD ™ 527 Silicone Dielectric Gel is a two component, room temperature and heat curing gel that is used for coating, encapsulating, potting, and sealing electronic devices. It provides flexibility, good flow, and low viscosity. 1:1 mix ratio. 7.2 kg Kit. [See More]
- Industry: Electronics
- Cure / Technology: Two Component
- Chemical System: Silicone
- Features: High Dielectric; Encapsulant, Potting Compound
from Master Bond, Inc.
EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; OEM or Industrial; Semiconductors, IC's
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Hernon Manufacturing, Inc.
External Ammunition Sealant 76081 is a single component U.V. anaerobic sealant. 76081 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. This Sealant is specially formulated for Ammunition that needs greater fit tolerance and higher bullet... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; Room Temperature Vulcanizing or Curing
from RS Components, Ltd.
Graphit 33, 200ml [See More]
- Industry: Electronics; Electronics, PCBs
- Use Temperature: 482 to 572
- Type / Form: Liquid
from Ellsworth Adhesives
Dow SYLGARD ™ 527 Silicone Dielectric Gel is a two component, room temperature and heat curing gel that is used for coating, encapsulating, potting, and sealing electronic devices. It provides flexibility, good flow, and low viscosity. 1:1 mix ratio. Part B, 18.1 kg Pail. [See More]
- Industry: Electronics
- Cure / Technology: Two Component
- Chemical System: Silicone
- Features: High Dielectric; Encapsulant, Potting Compound
from Master Bond, Inc.
EP35SP is a two component epoxy system specially formulated to resist high temperatures and aggressive chemicals. It has a paste viscosity with little to no flow when curing. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; OEM or Industrial; Semiconductors, IC's; Downhole
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Hernon Manufacturing, Inc.
External Ammunition Sealant 76082 is a single component U.V. anaerobic sealant. 76082 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. This Sealant is specially formulated for Ammunition that needs greater fit tolerance and higher bullet... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; Room Temperature Vulcanizing or Curing
from RS Components, Ltd.
Urethan 71, 200ml [See More]
- Industry: Electronics; Electronics, PCBs
- Type / Form: Liquid
- Chemical System: Polyurethane
- Use Temperature: 248
from Ellsworth Adhesives
Henkel Loctite STYCAST 2662 Black, formerly Emerson and Cuming, is a two component, filled, epoxy encapsulant that is used for sealing and potting components that are exposed to high temperatures. It is resistant to chemicals, moisture, and high temperature. 1 gal Pail. [See More]
- Industry: Electronics
- Cure / Technology: Two Component
- Chemical System: Epoxy
- Features: Encapsulant, Potting Compound
from Master Bond, Inc.
Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Hernon Manufacturing, Inc.
External Ammunition Sealant 76083 is a single component U.V. anaerobic sealant. 76083 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. This Sealant is specially formulated for Ammunition that needs greater fit tolerance and higher bullet... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; Room Temperature Vulcanizing or Curing
from RS Components, Ltd.
TROPICOAT V1 520ML [See More]
- Industry: Electronics; Electronics, PCBs
- Type / Form: Liquid
- Chemical System: Acrylic
- Use Temperature: 284
from Ellsworth Adhesives
Henkel Loctite STYCAST 2662 Black, formerly Emerson and Cuming, is a two component, filled, epoxy encapsulant that is used for bonding, sealing, and potting electronic components that are exposed to high temperatures. It offers excellent electrical and physical properties; it is resistant to... [See More]
- Industry: Electronics
- Cure / Technology: Two Component
- Chemical System: Epoxy
- Features: Encapsulant, Potting Compound
from Master Bond, Inc.
EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; OEM or Industrial; Semiconductors, IC's
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Hernon Manufacturing, Inc.
External Ammunition Sealant 76084 is a single component U.V. anaerobic sealant. 76084 has a low viscosity penetrating material capable of bonding and sealing primers and case mouths in ammunition. This Sealant is specially formulated for Ammunition that needs greater fit tolerance and higher bullet... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; Room Temperature Vulcanizing or Curing
from RS Components, Ltd.
ELECTROFUGE VARNISH 200-ND 5 L [See More]
- Industry: Aerospace; Automotive; Electronics; Marine; Aerospace, Automotive, Electronics, Marine, Telecommunications
- Dielectric Strength: 2032
- Chemical System: Silicone
from Master Bond, Inc.
EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]
- Industry: Electronics; Sanitary; OEM or Industrial
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Hernon Manufacturing, Inc.
LT YELLOW-AMBER, 1 LITER [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
from RS Components, Ltd.
ELECTROFUGE VARNISH 200-ND 650 ML [See More]
- Industry: Aerospace; Automotive; Electronics; Marine; Aerospace, Automotive, Electronics, Marine, Telecommunications
- Type / Form: Liquid
- Chemical System: Silicone
- Dielectric Strength: 2032
from Master Bond, Inc.
MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]
- Industry: Aerospace; Electronics; Optical; Photonics; OEM or Industrial; Semiconductors, IC's
- Composition: Unfilled
- Chemical System: Silicone
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Hernon Manufacturing, Inc.
Ammunition Primer Sealant 34194 is a single component 100% solid system offering a tough, dry coating with superior chemical and environmental resistance after cure. Ammunition Primer Sealant 34194 will cure rapidly when exposed to high intensity U.V. light. This coating is formulated to migrate... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: UV or Radiation Cured; Single Component
from RS Components, Ltd.
Varnish E200 400ml [See More]
- Industry: Electronics; Electronics, PCBs
- Dielectric Strength: 2032
- Type / Form: Liquid
from Master Bond, Inc.
Master Bond Polymer Adhesive EP51 is a fast "5 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi at room temperature. The... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Hernon Manufacturing, Inc.
Grenade Igniter Case Sealant 40995 is a single component anaerobic thread locking and sealing adhesive. Grenade Igniter Case Sealant 40995 is a low viscosity penetrating material that works by capillary action between mating surfaces. The cured adhesive is a high-performance thermoset plastic... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; Room Temperature Vulcanizing or Curing
from RS Components, Ltd.
Silver conductive paint, 0.02-0.05 ohms/ [See More]
- Industry: Electronics; Electronics, PCBs
- Use Temperature: 401
from Master Bond, Inc.
Master Bond Polymer System EP39-2 is a fast curing, low viscosity, optically clear two component epoxy system for high performance bonding, sealing, coating and casting. It is 100% reactive and does not contain any diluents, solvents or other volatiles. The mix ratio is a convenient 2 to 1 by... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Hernon Manufacturing, Inc.
Grenade Igniter Case Sealant 47422 is a single component UV and anaerobic curing adhesive. Grenade Igniter Case Sealant 47422 is a low viscosity penetrating material that works by capillary action between mating surfaces. The cured adhesive is a high performance thermoset plastic suitable for... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; Room Temperature Vulcanizing or Curing
from RS Components, Ltd.
VARNISH KF 1282 [See More]
- Industry: Electronics; Electronics, PCBs
- Type / Form: Liquid
- Chemical System: Acrylic
- Use Temperature: -40 to 257
from Master Bond, Inc.
Master Bond EP62-1 is a two component heat cured and chemically resistant epoxy resin system featuring a long pot life at ambient temperatures and efficient cures at moderately elevated temperatures. The recommended mix ratio is 100 parts of component A to 10 parts of component B. The pot life of... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Laminaes; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Porous Surfaces
from Hernon Manufacturing, Inc.
Bullet Proof 650 is an environmentally friendly, single component, room temperature cure sealant and coating material. Bullet Proof 650 is formulated to waterproof and seal the interface between a bullet and cartridge. Bullet Proof 650 coats the inside of large shells to prevent the corrosive attack... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Single Component; Room Temperature Vulcanizing or Curing
from RS Components, Ltd.
TROPICOAT V1 520ML [See More]
- Industry: Electronics; Electronics, PCBs
- Type / Form: Liquid
- Chemical System: Acrylic
- Use Temperature: 284
from Master Bond, Inc.
Master Bond X-5 is specially formulated, synthetic elastomer-based, one component adhesive for high performance bonding and sealing. This synthetic elastomer based adhesive bonds well in both shear and peel to similar and dissimilar surfaces including metals, woods, most plastics, ceramics, glass,... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Unfilled
- Chemical System: Elastomeric
- Cure / Technology: Thermoset; Single Component
from Hernon Manufacturing, Inc.
UV Curable Cylinlock ® 820 is a fast curing, high-strength anaerobic adhesive designed to retain and seal cylindrical assemblies. Curing occurs when adhesive is confined between mating surfaces. The cured adhesive is a thermoset plastic suitable for exposure to most solvents. Augments or... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Features: Threadlocker or Retainer
- Cure / Technology: Thermoset; Room Temperature Vulcanizing or Curing
from RS Components, Ltd.
Circuit Works micro tip conductive pen [See More]
- Industry: Electronics; Electronics, PCBs
from Master Bond, Inc.
Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4500 psi. In addition, unlike many structural epoxies, EP31 also has a high peel strength exceeding 40 pli. The service... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Laminaes; Marine; OEM or Industrial; Semiconductors, IC's; Tooling
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Type / Form: Grease, Paste
from Hernon Manufacturing, Inc.
Dripstop ® 912 provides maximum solvent resistance on threaded fittings and pipe up to 3 ” in diameter. It is recommended for refrigeration systems and service with strong chemicals. Dripstop ® 912 is not for slip fitted tube joints. Dripstop ® 912 has excellent solvent... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
from RS Components, Ltd.
Chemical,PCB Blind Coating [See More]
- Industry: Electronics; Electronics, PCBs
from Master Bond, Inc.
Master Bond Polymer System EP45HT is a two component epoxy system for high performance structural bonding and casting. It is suitable for applications where long term exposure to temperatures from -80 °F to +500 °F is required. lt is 100% reactive and does not contain any solvents or... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Hernon Manufacturing, Inc.
Dripstop ® 920 is a general-purpose anaerobic pipe sealant which contains Teflon ®. It has superior sealing and mild locking performance compared to tapes and non-hardening dopes. The properties of this Dripstop ® prevents galling on Stainless Steel, Aluminum, and other metal pipe... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
from RS Components, Ltd.
PLASTIK 70, 400ml [See More]
- Industry: Electronics; Electronics, PCBs
- Type / Form: Liquid
- Chemical System: Acrylic
- Use Temperature: 140
from Shiu Li Technology Co., Ltd
LiPOLY DTT44 is a soft thermally conductive gel pad specifically designed for networking applications. DTT44 is designed to focus on Dk and Df to reduce interference in RF modules. DTT44 has a thermal conductivity of 3.0 W/m*K. This product can be supplied as standard sheets, custom die-cuts or... [See More]
- Industry: Electronics
- Type / Form: Sheet or Film
- Chemical System: Silicone
- Features: Thermally Conductive; UL Rating
from Henkel Corporation - Electronics
HYSOL ECCOBOND DS7300 one component non-conductive epoxy perimeter sealant is designed to be used in display applications. [See More]
- Industry: Electronics
- Viscosity: 1200
from Wacker Chemical Corp.
ELASTOSIL ® N199 is a non-slump RTV-1 silicone sealant that cures at room temperature on contact with moisture in the air. Special features. ready-to-use, one-part system. non-slump. translucent. medium hardness. high flexibility. Excellent adhesion. Application. general-purpose adhesive for the... [See More]
- Industry: Electronics
- Cure / Technology: Thermoset; Single Component; Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing
- Chemical System: Silicone; Elastomeric
- Type / Form: Grease, Paste
from Aremco Products, Inc.
Aremco offers an expansive range of ceramic-based materials used for the assembly of high temperature, high power electrical devices, and high temperature fixtures, molds and tooling. These materials, based on aluminum oxide, aluminum nitride, magnesium oxide, silicon dioxide, silicon carbide,... [See More]
- Industry: Electronics
- Substrate Compatibility: Ceramic, Glass; Textiles or Fabrics; Dissimilar Substrates
- Type / Form: Liquid
- Features: Encapsulant or Conformal Coating; Thermally Conductive
from Phelps Industrial Products
Phelps Style 9815 is 100% RTV (room temperature vulcanizing) silicone that can be used anywhere a high temperature sealant/adhesive is required. This high temp silicone sealant builds a formed-in-place gasket at operating temperatures up to 310 °C. Phelps Style 9815 high temperature silicone... [See More]
- Industry: Electronics; Construction; OEM or Industrial
- Composition: Unfilled
- Chemical System: Silicone
- Cure / Technology: Room Temperature Vulcanizing or Curing
from Sauereisen, Inc.
Sauereisen Cement No. 31 is a white, porcelain-like cement that is widely used throughout industry in a variety of applications. including assembling, sealing, insulating and cementing of ceramics, porcelain, metal, and glass. [See More]
- Industry: Electronics; Electric Power
- Composition: Unfilled
- Chemical System: Ceramic
- Cure / Technology: Two Component ; Chemically Set
from Materion Corporation
Thermotech TE ™ is a Silver-filled, electrically conductive high-vacuum compound specifically manufactured by Pure Tech for the sputtering target industry. Thermotech TE combines the excellent thermal and electrical conductive properties of pure Silver with a low vapor pressure sealant,... [See More]
- Industry: Electronics
- Features: Electrically Conductive; Leveling Filling
- Cure / Technology: Two Component
from Protavic America, Inc.
PNE-47207 ™ is an adhesive/sealant and potting compound. PNE-47207 ™ is designed to provide air free potting and casting of electronic devices. PNE-47207 ™ will bond difficult substrates such as glass, ceramics, and metals. It passes UL 94V0 for fire retardant properties,and has a... [See More]
- Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Techsil Limited
Elecolit ® 6603 is a thermally conductive epoxy with very good metal adhesion and slight flexibility. This grade has very good flow behavior and can easily be processed using a dispenser, spreading knife or spatula. Although designed for bonding applications, 6603 can also be used as a potting... [See More]
- Industry: Electronics
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Features: Electrically Conductive; Thermally Conductive
from Acoustical Solutions, Inc.
FireStop Putty Pads provide acoustical protection for wall penetrations in the form of a release lined pad for easy application to electrical boxes or other penetrates. The pad is conveniently sized to fit a typical 1 ½" deep 4S box with no cutting or piercing required. Faced on both sides with a... [See More]
- Industry: Electronics; Construction; Firestop, Acoustical
- Type / Form: Grease, Paste
- Cure / Technology: Single Component
- Substrate Compatibility: Metal; Plastic; Rubber or Elastomer
from Epoxy Technology
Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting hostile environments,... [See More]
- Industry: Electronics; Semiconductors, IC's
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Type / Form: Grease, Paste
from Epoxies Etc...
10-3022 is a two component epoxy adhesive and sealant. This structural adhesive has excellent chemical and heat resistance. 10-3022 is widely used as a stencil and screen adhesive due to its bonding strength and toughness. It has been used extensively to bond polyester mesh to aluminum frames and... [See More]
- Industry: Electronics; OEM or Industrial
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Chemence Inc.
KSC1802 is a low viscosity, high performance, thermally conductive, liquid gap filling material. It is formulated to develop a soft, 'form in place' elastomer ideal for coupling hot PC board components to heat sinks. KSC1802 is supplied as a two part, 1:1 mix ratio silicone that when mixed will cure... [See More]
- Industry: Electronics
- Cure / Technology: Single Component
- Chemical System: Silicone
- Type / Form: Grease, Paste
from Hapco, Inc.
HIGH PERFORMANCE HYBRID ELASTOMERIC POLYMER ALLOYS. The Hapflex ™ 1000 Series products are soft, colorless, Shore A elastomers. These materials are available in both a fast and slow gel time and can also be combined to yield customized gel times without the addition of heat. Hapflex ™... [See More]
- Industry: Electronics; OEM or Industrial; Tooling
- Composition: Unfilled
- Chemical System: Elastomeric; Polyurethane
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
from Hi-Tech Seals, Inc.
Classic cyanoacrylates are represented by the ethyl and methyl chemistries. Generally, the methyls offer better bond strengths on metals, the ethyls providing better strengths on everything else. Substrate selection and bond line configuration directly influence adhesive performance. [See More]
- Industry: Electronics; OEM or Industrial
- Cure / Technology: Single Component; Room Temperature Vulcanizing or Curing
- Chemical System: Cyanoacrylate
- Type / Form: Liquid
from Shiu Li Technology Co., Ltd
LiPOLY DTT65 is a soft thermally conductive gel pad specifically designed for networking applications. DTT65 is designed to focus on Dk and Df to reduce interference in RF modules. DTT65 has a thermal conductivity of 5.0 W/m*K. This product can be supplied as standard sheets, custom die-cuts or... [See More]
- Industry: Electronics
- Type / Form: Sheet or Film
- Chemical System: Silicone
- Features: Thermally Conductive; UL Rating
from Henkel Corporation - Electronics
GAP PAD ™ HC 5.0 is a soft and compliant gap filling material with a thermal conductivity of 5.0 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique filler package and low-modulus resin formulation. The enhanced material is ideal for applications... [See More]
- Industry: Electronics
- Features: Gap Filler, Foam in Place Gasket; Thermally Conductive
from Aremco Products, Inc.
High fired strength, dense ceramics [See More]
- Industry: Electronics; OEM or Industrial; Gas Ignitors, Sagger Plates, Temp Probes
- Composition: Filled
- Chemical System: Ceramic
- Cure / Technology: Thermoset
from Protavic America, Inc.
Fast flow, fast cure capillary reworkable underfill. The rheology of the PROTAVIC ANA 10199 R in combination with its fineness make the product perfectly adapted to high reliability small gap underfill applications. It presents a good pot life at room temperature 20-22C and a high reactivity at... [See More]
- Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Cure / Technology: Thermoset; Single Component
- Composition: Unfilled
- Type / Form: Liquid
from Techsil Limited
MG Chemicals 4226 Super Corona Dope is a highly insulating coating with excellent arc and corona resistance. This low viscosity, one part varnish is ready to use and adheres well to many substrates. This products insulates transformers, coils, motor windings, and various electronic generator parts... [See More]
- Industry: Electronics
from Acoustical Solutions, Inc.
SSP Firestop Putty is perfect for metallic conduits, telephone, data or electrical power cable penetrations. A variety of sleeved and non-sleeved applications have been tested and proven providing the ultimate in installation versatility. Non-hardening and reusable, SSP Firestop Putty addresses the... [See More]
- Industry: Electronics; Construction; Firestop, Acoustical
- Type / Form: Grease, Paste
- Cure / Technology: Single Component
- Substrate Compatibility: Metal; Plastic; Rubber or Elastomer
from Epoxies Etc...
UV 60-7016 is a high performance Ultraviolet Curable Adhesive, Sealant, and Potting Compound. This new one component urethane acrylate system was specifically designed for the difficult bonding of glass to metal. UV 60-7016 has outstanding thermal shock and impact resistance, and is an excellent... [See More]
- Industry: Electronics; OEM or Industrial
- Composition: Unfilled
- Chemical System: Elastomeric; Polyurethane
- Cure / Technology: UV or Radiation Cured; Single Component
from Hapco, Inc.
HIGH PERFORMANCE HYBRID ELASTOMERIC POLYMER ALLOYS. Hapflex ™ 700/800 products are colorless, high strength elastomers available in hardnesses ranging from 65A to 72D. Hapflex ™ 700/800 products exhibit high tensile strength, high tear strength, and excellent elongation. All Hapflex... [See More]
- Industry: Electronics; OEM or Industrial; Tooling
- Composition: Unfilled
- Chemical System: Elastomeric; Polyurethane
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
from Hi-Tech Seals, Inc.
HERNON ® offers a complete line of ultraviolet curing adhesives and compounds, the Ultrabond ® line of products. These products are single component systems offering either ultraviolet light or ultraviolet light & primer initiated curing mechanisms. All Ultrabond ® products cure upon... [See More]
- Industry: Electronics; OEM or Industrial
- Cure / Technology: UV or Radiation Cured; Single Component
- Chemical System: Acrylic
- Type / Form: Liquid
from Shiu Li Technology Co., Ltd
LiPOLY G566 Graphite Sheet has great thermal conductivity on the X and Y axis. The thermal conductivity is 1700W/m*K. It is flexible, which is suitable for thin products and high capability mobile devices. [See More]
- Industry: Electronics
- Features: Thermally Conductive
- Type / Form: Sheet or Film
- Gap Fill: 8.27E-4
from Techsil Limited
MG Chemicals 4226 Super Corona Dope is a highly insulating coating with excellent arc and corona resistance. This low viscosity, one part varnish is ready to use and adheres well to many substrates. This products insulates transformers, coils, motor windings, and various electronic generator parts... [See More]
- Industry: Electronics
from Epoxies Etc...
20-2100 FR is a two component, room temperature curing, low viscosity polyurethane system for potting, casting, encapsulating and sealing electronic components and assemblies. 20-2100 FR is a flame retardant self extinguishing system. It meets the stringent requirements of UL 94-VO. Designed for... [See More]
- Industry: Electronics
- Composition: Unfilled
- Chemical System: Elastomeric; Polyurethane
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Shiu Li Technology Co., Ltd
LiPOLY TR332CU has outstanding parallel thermal conduction and has high flexibility, which is suitable for thin products like mobile devices. [See More]
- Industry: Electronics
- Features: Thermally Conductive
- Type / Form: Sheet or Film
- Gap Fill: 0.0039 to 0.0059
from Techsil Limited
Momentive RTV160 is an electronic grade silicone adhesive sealant from Momentive Performance Materials. This material cures to a tough, resilient silicone rubber at room temperature. Product Benefits. Easy to use, one-component material. Cures at room temperature and ambient humidity. Offers... [See More]
- Industry: Electronics
- Use Temperature: -60 to 204
- Chemical System: Silicone; Elastomeric
from Shiu Li Technology Co., Ltd
LiPOLY BS75K is a soft thermally conductive gap filler. With a thermal conductivity of 3.0 W/m*K and a low thermal impedance, BS75K is suitable for a wide range of applications. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for a wide... [See More]
- Industry: Electronics
- Type / Form: Sheet or Film
- Chemical System: Silicone
- Features: Gap Filler, Foam in Place Gasket; Thermally Conductive; UL Rating
from Techsil Limited
Momentive RTV162 is an electronic grade silicone adhesive sealant from Momentive Performance Materials. This material cures to a tough, resilient silicone rubber at room temperature. Product Benefits. Easy to use, one-component material. Cures at room temperature and ambient humidity. Offers... [See More]
- Industry: Electronics
- Use Temperature: -60 to 204
- Chemical System: Silicone; Elastomeric
from Shiu Li Technology Co., Ltd
LiPOLY BS87 is an ultra-soft thermally conductive gel pad with a thermal conductivity of 3.0 W/m*K. BS87 offers excellent compression under minimal force with high recovery characteristics. This product can be supplied as standard sheets, custom die-cuts or custom molded parts making it suitable for... [See More]
- Industry: Electronics
- Type / Form: Sheet or Film
- Chemical System: Silicone
- Features: Thermally Conductive; UL Rating
from Techsil Limited
Momentive RTV162 is an electronic grade silicone adhesive sealant from Momentive Performance Materials. This material cures to a tough, resilient silicone rubber at room temperature. Product Benefits. Easy to use, one-component material. Cures at room temperature and ambient humidity. Offers... [See More]
- Industry: Electronics
- Use Temperature: -60 to 204
- Chemical System: Silicone; Elastomeric
from Shiu Li Technology Co., Ltd
LiPOLY ’s S282 is a thermally conductive pad designed for gap filling. The thermal conductivity is 1.7 W/m*K. It uses fiberglass cloth as the reinforcement material with great self-adhesive that can fit closely with non-flat heat sinks to increase the contact area. The low stress damped... [See More]
- Industry: Electronics
- Type / Form: Sheet or Film
- Chemical System: Silicone
- Features: Gap Filler, Foam in Place Gasket; Thermally Conductive; UL Rating
from Techsil Limited
Momentive RTV162 is an electronic grade silicone adhesive sealant from Momentive Performance Materials. This material cures to a tough, resilient silicone rubber at room temperature. Product Benefits. Easy to use, one-component material. Cures at room temperature and ambient humidity. Offers... [See More]
- Industry: Electronics
- Use Temperature: -60 to 204
- Chemical System: Silicone; Elastomeric
from Shiu Li Technology Co., Ltd
LiPOLY S393 is a product with high ductile thermal conductivity. Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material. It won't easy to break and deformwhether stamped, punched, strip type, or custom cutting. Your best choice... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Laminaes; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Type / Form: Sheet or Film
- Chemical System: Silicone
- Features: High Dielectric; Gap Filler, Foam in Place Gasket; Thermally Conductive; UL Rating
from Techsil Limited
Momentive RTV167 is an electronic grade silicone adhesive sealant from Momentive Performance Materials. This material cures to a tough, resilient silicone rubber at room temperature. Product Benefits. Easy to use, one-component material. Cures at room temperature and ambient humidity. Offers... [See More]
- Industry: Electronics
- Use Temperature: -60 to 204
- Chemical System: Silicone; Elastomeric
from Shiu Li Technology Co., Ltd
LiPOLY S818 is a product with high ductile thermal conductivity.Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material.It won't easy to break and deform whether stamped, punched, strip type, or custom cutting. Your best choice... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Laminaes; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Type / Form: Sheet or Film
- Chemical System: Silicone
- Features: High Dielectric; Gap Filler, Foam in Place Gasket; Thermally Conductive; UL Rating
from Techsil Limited
Momentive RTV167 is an electronic grade silicone adhesive sealant from Momentive Performance Materials. This material cures to a tough, resilient silicone rubber at room temperature. Product Benefits. Easy to use, one-component material. Cures at room temperature and ambient humidity. Offers... [See More]
- Industry: Electronics
- Use Temperature: -60 to 204
- Chemical System: Silicone; Elastomeric
from Shiu Li Technology Co., Ltd
LiPOLY DCTP140-s is a thermal insulator uses fiberglass cloth as a reinforcement material, combined with thermal conductive silicon, giving it high thermal conduction and great compression strength. The thermal conductivity is 4.5 W/m*K, the thickness is 0.25~0.45mm. Its high insulation and... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Laminaes; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Type / Form: Sheet or Film
- Chemical System: Silicone
- Features: High Dielectric; Gap Filler, Foam in Place Gasket; Thermally Conductive; UL Rating
from Techsil Limited
Momentive RTV5242 is an electronic grade silicone adhesive sealants which exhibits high strength that will maintain a strong bond even when exposed to moist environments. RTV5242 is a true neutral curing silicone sealant and cures at room temperature, unlike most alkoxy curing silicones, RTV5242... [See More]
- Industry: Electronics
- Use Temperature: -60 to 204
- Chemical System: Silicone; Elastomeric
from Shiu Li Technology Co., Ltd
LiPOLY PR27 is a very thin high insulator with a thickness of 0.15mm. It uses Polyimide Film as the reinforcement material, which can increase the tensile strength. It has great dielectric strength and can withstand 12K voltages. It ’s suitable for high power transistors, electrical equipment,... [See More]
- Industry: Electronics
- Type / Form: Sheet or Film
- Chemical System: Silicone
- Features: Thermally Conductive; UL Rating
from Techsil Limited
Momentive RTV5243 is an electronic grade silicone adhesive sealants which exhibits high strength that will maintain a strong bond even when exposed to moist environments. RTV5243 is a true neutral curing silicone sealant and cures at room temperature, unlike most alkoxy curing silicones, RTV5243... [See More]
- Industry: Electronics
- Use Temperature: -60 to 204
- Chemical System: Silicone; Elastomeric
from Shiu Li Technology Co., Ltd
LiPOLY ’s thermal insulator SH1500/2000/3000 uses fiberglass cloth as a reinforcement material, combined with thermal conductive silicon, giving it high thermal conduction and great compression strength. The thermal conductivity is 1.5/2.0/3.0 W/m*K, the thickness is 0.23~0.35mm. Its high... [See More]
- Industry: Electronics
- Type / Form: Sheet or Film
- Chemical System: Silicone
- Features: Thermally Conductive; UL Rating
from Techsil Limited
Momentive RTV5249 is an electronic grade silicone adhesive sealants which exhibits high strength that will maintain a strong bond even when exposed to moist environments. RTV5249 is a true neutral curing silicone sealant and cures at room temperature, unlike most alkoxy curing silicones, RTV5249... [See More]
- Industry: Electronics
- Use Temperature: -60 to 204
- Chemical System: Silicone; Elastomeric
from Shiu Li Technology Co., Ltd
LiPOLY T-top81 is an ultra-soft, highly conformable, non-flammable interface material. T-top81 is a high deflection material, designed to allow minimal stress on components while offering excellent thermal conductivity and low thermal resistance. With a thermal conductivity of 8.0 W/m*K, T-top81... [See More]
- Industry: Electronics
- Type / Form: Sheet or Film
- Chemical System: Silicone
- Features: Thermally Conductive; UL Rating
from Techsil Limited
TSE3281-G is a thermally conductive silicone adhesive from Momentive Performance Materials. This one component material is non-corrosive and has excellent adhesion properties to a wide variety of substrates. Potential applications for TSE3281-G include sealing and bonding for thermally conductive... [See More]
- Industry: Electronics
- Features: Thermally Conductive
- Chemical System: Silicone; Elastomeric
from Shiu Li Technology Co., Ltd
Our high thermally conductive gap filler T-work 7000 provides excellent compression and extremely low thermal resistance in form shape with high thermal conductivity for gap filling between electrical component and heatsink. [See More]
- Industry: Electronics
- Type / Form: Sheet or Film
- Chemical System: Silicone
- Features: Gap Filler, Foam in Place Gasket; Thermally Conductive; UL Rating
from Techsil Limited
TSE3397 B is a black one-component, fast-cure, non corrosive silicone adhesive sealant that offers excellent corrosion- free adhesion to metals, including copper, plastics, ceramics, glass, etc. without the use of primers. Dispenses as a flowable paste, TSE 397B has a tack-free time of 10 mins (at... [See More]
- Industry: Electronics
- Chemical System: Silicone; Elastomeric
from Shiu Li Technology Co., Ltd
LiPOLY T-work 8000 is a high performance thermally conductive interface pad. T-work 8000 offers outstanding thermal conductivity at 15.0 W/m*K and extremely low thermal resistance under minimal force. T-work 8000 offers excellent compression, filling small air gaps and uneven surfaces, ensuring an... [See More]
- Industry: Electronics
- Type / Form: Sheet or Film
- Chemical System: Silicone
- Features: Thermally Conductive; UL Rating
from Techsil Limited
Elecolit ® 323 is a silver filled two part epoxy adhesive specially developed for bonding open chip components. This semiconducting grade has passed the autoclave test (1000h) and is suitable for use on semi conductors, it has no effect on bond wire adhesion. It can cured at either room... [See More]
- Industry: Electronics
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Features: Electrically Conductive
from Shiu Li Technology Co., Ltd
LiPOLY T-work 9000 offers outstanding thermal conductivity at 20.0 W/m*K and extremely low thermal resistance under minimal force. T-work 9000 offers excellent compression, filling small air gaps on uneven surfaces, ensuring an efficient and consistent transfer of heat. [See More]
- Industry: Electronics
- Type / Form: Sheet or Film
- Chemical System: Silicone
- Features: Thermally Conductive; UL Rating
from Techsil Limited
Elecolit ® 3653 is a 1 component silver filled, solvent-free conductive epoxy adhesive used in applications which are subject to vibrations or quick temperature fluctuations. This unique product can be cured thermally in a very short period of time and cures to a 60 - 75 Shore D material. Silver... [See More]
- Industry: Electronics
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Features: Electrically Conductive
from Shiu Li Technology Co., Ltd
LiPOLY T-top99-s offers outstanding thermal conductivity at 24.0 W/m*K and extremely low thermal resistance under minimal force.T-top99-s offers excellent compression, filling small air gaps on uneven surfaces, ensuring an efficient and consistent transfer of heat. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Laminaes; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
- Type / Form: Sheet or Film
- Chemical System: Silicone
- Features: High Dielectric; Gap Filler, Foam in Place Gasket; Thermally Conductive; UL Rating
from Techsil Limited
Elecolit ® 414 is a single component silver-filled, electrically conductive coating substance that hardens into a flexible, chemical resistant, expandable, non-deformable and friction resistant film. Grey in colour, Elecolit ® 414 has a viscosity of 20,000 to 25,000 mPas and when used with... [See More]
- Industry: Electronics
- Cure / Technology: Thermoset
- Chemical System: Epoxy
- Features: Electrically Conductive
from Shiu Li Technology Co., Ltd
LiPOLY's TPS series is a low-density, potting material. Its low density and lightweight properties enhance product performance, reduce production costs. The product has a thermal conductivity of 0.55-1.50 W/m*K and can cure at room temperature or high temperatures. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Room Temperature Vulcanizing or Curing
- Chemical System: Silicone
- Type / Form: Grease, Paste; Liquid
from Techsil Limited
Techsil ® PU 217 is a two-component Polyurethane which offers high strength & outstanding abrasion resistance with a slow cure. Techsil ® PU217 is a black resin with medium viscosity and is ideal for cable jointing. Once cured, PU217 is 78A Shore. If heat cured, PU217 requires 2hrs at... [See More]
- Industry: Electronics
- Chemical System: Polyurethane