Epoxy (EP) Industrial Sealants
from ELANTAS North America LLC
ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
- Composition: Filled
- Type / Form: Grease, Paste
from Ellsworth Adhesives
3M Scotch-Weld Epoxy Adhesive DP105 Clear is a two component, fast curing, epoxy sealant/adhesive that is used for bonding dissimilar surfaces that may be exposed to thermal expansion. It offers high peel strength and flexibility. 1:1 mix ratio by volume. 200 mL Duo-Pak Cartridge. [See More]
- Chemical System: Epoxy
- Viscosity: 1000 to 16000
- Cure / Technology: Two Component
- Thermal Conductivity: 0.0850
from RS Components, Ltd.
MG Chemicals 843ER-800ml [See More]
- Chemical System: Epoxy
- Industry: Aerospace; Automotive; Military; Aerospace, aluminium flanges, automotive, engines, military equipment, oil & gas sectors
- Type / Form: Liquid
from Master Bond, Inc.
Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
- Composition: Filled
- Type / Form: Grease, Paste
from Ellsworth Adhesives
3M Scotch-Weld Epoxy Adhesive DP105 Clear is a two component, fast curing, epoxy sealant/adhesive that is used for bonding dissimilar surfaces that may be exposed to thermal expansion. It offers high peel strength and flexibility. 1:1 mix ratio by volume. 48.5 mL Duo-Pak Cartridge. [See More]
- Chemical System: Epoxy
- Viscosity: 1000 to 16000
- Cure / Technology: Two Component
- Thermal Conductivity: 0.0850
from RS Components, Ltd.
MG Black flexible epoxy 832FX 450ml [See More]
- Chemical System: Epoxy
- Features: Encapsulant, Potting Compound
- Type / Form: Liquid
from Master Bond, Inc.
EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
- Composition: Unfilled
- Type / Form: Liquid
from Ellsworth Adhesives
3M Scotch-Weld Epoxy Potting Compound/Adhesive DP270 Black is a two component, epoxy resin system that is used for sealing, encapsulating, and potting electronic and heat sensitive components. It offers low viscosity, long handling times, noncorrosive to copper, good electrical properties, and... [See More]
- Chemical System: Epoxy
- Features: Encapsulant, Potting Compound
- Cure / Technology: Two Component
- Viscosity: 6000 to 16000
from RS Components, Ltd.
MG Translucent epoxy 832C 450ml [See More]
- Chemical System: Epoxy
- Features: Encapsulant, Potting Compound
- Type / Form: Liquid
from Master Bond, Inc.
EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
- Composition: Unfilled
- Type / Form: Liquid
from Ellsworth Adhesives
3M Scotch-Weld Epoxy Potting Compound/Adhesive DP270 Clear is a two component, epoxy resin system that is used for sealing, encapsulating, and potting electronic and heat sensitive components. It offers low viscosity, long handling times, noncorrosive to copper, good electrical properties, and... [See More]
- Chemical System: Epoxy
- Features: Encapsulant, Potting Compound
- Cure / Technology: Two Component
- Viscosity: 6000 to 16000
from RS Components, Ltd.
ER1448 Black RF Epoxy Resin Pack, 250g [See More]
- Chemical System: Epoxy
- Features: Encapsulant, Potting Compound
- Type / Form: Liquid
from Master Bond, Inc.
EP35SP is a two component epoxy system specially formulated to resist high temperatures and aggressive chemicals. It has a paste viscosity with little to no flow when curing. [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
- Composition: Unfilled
- Substrate Compatibility: Ceramic, Glass; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates
from Ellsworth Adhesives
Bostik Epoxy Adhesive 7575 Clear is a two component, structural adhesive that is used for bonding phenolic plastics, glass, wood, masonry, rubber, ceramics, metal, and polyesters. It is typically used for sealing electrical components, encapsulation, and potting applications. It offers fast cure... [See More]
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic; Rubber or Elastomer; Wood
- Cure / Technology: Two Component
- Viscosity: 12000 to 16000
from RS Components, Ltd.
Water clear epoxy potting compound 375ml [See More]
- Chemical System: Epoxy
- Features: Encapsulant, Potting Compound
- Type / Form: Liquid
from Master Bond, Inc.
Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating. [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Composition: Unfilled
- Type / Form: Liquid
from Ellsworth Adhesives
ELANTAS PDG CONAPOXY AD-10 Epoxy Brown is a one component, structural adhesive that is used for bonding and sealing electronics, metals, plastics, ceramics, batteries, structural materials, and mini potting. It offers fast heat curing, good dielectric properties, thermal stability, and reduces... [See More]
- Chemical System: Epoxy
- Features: Encapsulant, Potting Compound
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
- Dielectric Strength: 0.0095
from RS Components, Ltd.
Water clear epoxy potting compound 3L [See More]
- Chemical System: Epoxy
- Features: Encapsulant, Potting Compound
- Type / Form: Liquid
from Master Bond, Inc.
EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Composition: Unfilled
- Type / Form: Liquid
from Ellsworth Adhesives
HARDMAN DOUBLE/BUBBLE 4008 Non-Sag Epoxy is Opaque White in color, two component, fast setting adhesive that is used for sealing, gap filling, fixturing, and tacking for industrial and electrical applications. It bonds to aluminum, epoxy, glass, wood, and stone. It is thixotropic and sag resistant. [See More]
- Chemical System: Epoxy
- Cure / Technology: Two Component
from RS Components, Ltd.
Black epoxy flame retardant 450ml [See More]
- Chemical System: Epoxy
- Features: Encapsulant, Potting Compound
- Type / Form: Liquid
from Master Bond, Inc.
EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Composition: Unfilled
- Type / Form: Liquid
from Ellsworth Adhesives
Henkel Loctite EA 11C is a two component general purpose epoxy adhesive and sealant that bonds, seals and repairs a wide variety of materials including metals, plastics, and wood. 4 oz Kit. [See More]
- Chemical System: Epoxy
- Substrate Compatibility: Metal; Plastic; Wood
- Cure / Technology: Two Component
- Viscosity: 140000 to 900000
from RS Components, Ltd.
MG Chemicals 9410-3ML Syringe [See More]
- Chemical System: Epoxy
- Features: Encapsulant, Potting Compound
from Master Bond, Inc.
Master Bond Polymer Adhesive EP51 is a fast "5 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi at room temperature. The... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
- Composition: Unfilled
- Type / Form: Liquid
from Ellsworth Adhesives
The Henkel Loctite EA 1C is a general purpose adhesive and sealant that has excellent environmental resistance and the ability to bond, seal, and repair materials like metal, wood, and most plastics. 17 lb Kit. [See More]
- Chemical System: Epoxy
- Substrate Compatibility: Metal; Plastic; Wood
- Cure / Technology: Two Component
- Viscosity: 120000 to 900000
from RS Components, Ltd.
9510 One-part epoxy potting compound [See More]
- Chemical System: Epoxy
- Features: Encapsulant, Potting Compound
- Type / Form: Liquid
from Master Bond, Inc.
Master Bond Polymer System EP39-2 is a fast curing, low viscosity, optically clear two component epoxy system for high performance bonding, sealing, coating and casting. It is 100% reactive and does not contain any diluents, solvents or other volatiles. The mix ratio is a convenient 2 to 1 by... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
- Composition: Unfilled
- Type / Form: Grease, Paste
from Ellsworth Adhesives
Henkel Loctite EA 1C is a high viscosity, chemically resistant epoxy adhesive and sealant that bonds, seals and repairs a wide variety of materials including metals, plastics, and wood. 4 oz Kit. [See More]
- Chemical System: Epoxy
- Substrate Compatibility: Metal; Plastic; Wood
- Cure / Technology: Two Component
- Viscosity: 120000 to 900000
from RS Components, Ltd.
9510 One-part epoxy potting compound [See More]
- Chemical System: Epoxy
- Features: Encapsulant, Potting Compound
- Type / Form: Liquid
from Master Bond, Inc.
Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4500 psi. In addition, unlike many structural epoxies, EP31 also has a high peel strength exceeding 40 pli. The service... [See More]
- Chemical System: Epoxy
- Type / Form: Grease, Paste
- Cure / Technology: Thermoset; Two Component
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Composites; Metal; Plastic; Porous Surfaces; Rubber or Elastomer; Dissimilar Substrates; Metal/Plastic/Glass/Ceramic/Elast.&Wood
from Ellsworth Adhesives
Henkel Loctite EA 1C-LV is a high temperature and chemical resistant adhesive that is a lower viscosity version of Loctite EA 1C. It bonds, seals and repairs a wide variety of materials. 50 mL Cartridge. [See More]
- Chemical System: Epoxy
- Viscosity: 20000 to 102000
- Cure / Technology: Two Component
- Tensile (Break): 2800
from RS Components, Ltd.
RS PRO 1991468 Potting Compound [See More]
- Chemical System: Epoxy
- Features: Encapsulant, Potting Compound
- Type / Form: Liquid
from Master Bond, Inc.
Master Bond Polymer System EP45HT is a two component epoxy system for high performance structural bonding and casting. It is suitable for applications where long term exposure to temperatures from -80 °F to +500 °F is required. lt is 100% reactive and does not contain any solvents or... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
- Composition: Unfilled
- Type / Form: Grease, Paste
from Ellsworth Adhesives
Henkel Loctite STYCAST 2662 Black, formerly Emerson and Cuming, is a two component, filled, epoxy encapsulant that is used for sealing and potting components that are exposed to high temperatures. It is resistant to chemicals, moisture, and high temperature. 1 gal Pail. [See More]
- Chemical System: Epoxy
- Features: Encapsulant, Potting Compound
- Cure / Technology: Two Component
- Industry: Electronics
from RS Components, Ltd.
EPOXY RESIN 250 G [See More]
- Chemical System: Epoxy
- Features: Encapsulant, Potting Compound; Flame Retardant; Thermally Conductive
- Type / Form: Liquid
from Master Bond, Inc.
Master Bond Polymer System EP13 is a one component heat curing epoxy featuring high shear strength and very high temperature resistance. This one component system is formulated to cure at temperatures from 300 °F to 350 °F for 60-90 minutes. Upon cure, EP13 readily attains tensile shear... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
- Composition: Unfilled
- Substrate Compatibility: Ceramic, Glass; Metal
from Ellsworth Adhesives
Henkel Loctite STYCAST 2662 Black, formerly Emerson and Cuming, is a two component, filled, epoxy encapsulant that is used for bonding, sealing, and potting electronic components that are exposed to high temperatures. It offers excellent electrical and physical properties; it is resistant to... [See More]
- Chemical System: Epoxy
- Features: Encapsulant, Potting Compound
- Cure / Technology: Two Component
- Industry: Electronics
from RS Components, Ltd.
RS PRO 552668 Potting Compound [See More]
- Chemical System: Epoxy
- Features: Encapsulant, Potting Compound
- Type / Form: Liquid
from Master Bond, Inc.
Master Bond Polymer System 125 is a two component toughened epoxy resin for prolonged service above 500 °F with truly outstanding chemical resistance. High strength bonds serviceable up to 600 °F can be obtained with this exceptionally thermally stable and chemically resistant epoxy resin... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
- Composition: Unfilled
- Type / Form: Grease, Paste; Powder
from Ellsworth Adhesives
Henkel Loctite STYCAST 2741 Black, formerly Emerson and Cuming, is a two component, room temperature or heat curing, filled epoxy encapsulant that is used for cementing, sealing, and embedding electronic components, plastics, metal, and ceramics. It offers flexibility and crack resistance at low... [See More]
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
- Cure / Technology: Two Component
- Features: Encapsulant, Potting Compound
from RS Components, Ltd.
Electrolube ER2218RP250G [See More]
- Chemical System: Epoxy
- Features: Encapsulant, Potting Compound; Flame Retardant
- Type / Form: Liquid
from Master Bond, Inc.
Master Bond Polymer Adhesive EP33 is a unique room temperature curing two component epoxy adhesive for high temperature bonding applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures. Master Bond Polymer Adhesive EP33 produces high strength bonds whose... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
- Composition: Unfilled
- Type / Form: Grease, Paste
from Ellsworth Adhesives
Henkel Loctite STYCAST 2741 LV Black, formerly Emerson and Cuming, is a two component, room temperature curing, filled epoxy encapsulant that is used for cementing, sealing, bonding, and embedding electronic components, plastics, metal, and glass. It offers low viscosity, flexibility, impact and... [See More]
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
- Cure / Technology: Two Component
- Features: Encapsulant, Potting Compound
from RS Components, Ltd.
Blk general purpose 2 syringe epoxy,50ml [See More]
- Chemical System: Epoxy
- Features: Encapsulant, Potting Compound
from Master Bond, Inc.
Master Bond Polymer System EP15 is a one component heat curing epoxy featuring high tensile strength that is utilized in testing the adhesion or cohesive strength of flame-sprayed coatings. This standard test is fully detailed in ASTM specification C 633. EP15 is formulated to cure at temperatures... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
- Composition: Unfilled
- Type / Form: Grease, Paste
from Ellsworth Adhesives
Henkel Loctite STYCAST 2741 LV Black, formerly Emerson and Cuming, is a two component, room temperature curing, filled epoxy encapsulant that is used for cementing, sealing, bonding, and embedding electronic components, plastics, metal, and glass. It offers low viscosity, flexibility, impact and... [See More]
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
- Cure / Technology: Two Component
- Features: Encapsulant, Potting Compound
from RS Components, Ltd.
MG black epoxy 832B 375ml [See More]
- Chemical System: Epoxy
- Features: Encapsulant, Potting Compound
- Type / Form: Liquid
from Master Bond, Inc.
Master Bond Polymer System EP29LP is a two component high performance epoxy resin system featuring low viscosity, long pot life and low exotherm. As an adhesive this versatile material will form bond strengths in excess of 2,500 psi (aluminum to aluminum). It bonds well to a variety of substrates... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
- Composition: Unfilled
- Type / Form: Grease, Paste
from Ellsworth Adhesives
HumiSeal ® 2A53A Epoxy Conformal Coating is a two component epoxy system that is used for circuit boards and applications that require resistance to chemicals or solvents. It fluoresces under UV light to aid inspection and can be applied by spraying, brushing, or dipping methods. Part A only, 1... [See More]
- Chemical System: Epoxy
- Features: Encapsulant or Conformal Coating
- Cure / Technology: Two Component
- Viscosity: 150 to 350
from RS Components, Ltd.
MG black translucent 832C 3L [See More]
- Chemical System: Epoxy
- Features: Encapsulant, Potting Compound
- Type / Form: Liquid
from Master Bond, Inc.
Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. Not only is EP29LPSP able to function as an adhesive, sealant and protective coating at temperatures as low as 4K, but it is... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
- Composition: Unfilled
- Type / Form: Liquid
from Ellsworth Adhesives
HumiSeal ® 2A53A Epoxy Conformal Coating is a two component epoxy system that is used for circuit boards and applications that require resistance to chemicals or solvents. It fluoresces under UV light to aid inspection and can be applied by spraying, brushing, or dipping methods. Part A only, 5... [See More]
- Chemical System: Epoxy
- Features: Encapsulant or Conformal Coating
- Cure / Technology: Two Component
- Viscosity: 150 to 350
from RS Components, Ltd.
MG black epoxy 832B 3L [See More]
- Chemical System: Epoxy
- Features: Encapsulant, Potting Compound
- Type / Form: Liquid
from Master Bond, Inc.
Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronicc/ structural applications. The two components are combined in a convenient noncritical mix... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
- Composition: Unfilled
- Type / Form: Liquid
from Ellsworth Adhesives
HumiSeal ® 2A53B Epoxy Conformal Coating is a two component epoxy system that is used for circuit boards and applications that require resistance to chemicals or solvents. It fluoresces under UV light to aid inspection and can be applied by spraying, brushing, or dipping methods. Part B, 1 L... [See More]
- Chemical System: Epoxy
- Features: Encapsulant or Conformal Coating
- Cure / Technology: Two Component
- Viscosity: 150 to 350
from RS Components, Ltd.
MG black translucent 832C 375ml [See More]
- Chemical System: Epoxy
- Features: Encapsulant, Potting Compound
- Type / Form: Liquid
from Master Bond, Inc.
Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Composition: Unfilled
- Type / Form: Liquid
from Ellsworth Adhesives
HumiSeal ® 2A53B Epoxy Conformal Coating is a two component epoxy system that is used for circuit boards and applications that require resistance to chemicals or solvents. It fluoresces under UV light to aid inspection and can be applied by spraying, brushing, or dipping methods. Part B only, 5... [See More]
- Chemical System: Epoxy
- Features: Encapsulant or Conformal Coating
- Cure / Technology: Two Component
- Viscosity: 150 to 350
from RS Components, Ltd.
MG thermally conductive epoxy 832TC [See More]
- Chemical System: Epoxy
- Features: Encapsulant, Potting Compound; Thermally Conductive
- Type / Form: Liquid
from Master Bond, Inc.
Master Bond Polymer System EP38 is a fast curing, low viscosity, optically clear two component epoxy system for high performance coating, bonding and sealing. It is 100% reactive and does not contain any volatiles. The mix ratio is a convenient 3 to 1 by weight. EP38 is very fast curing. Coatings as... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
- Composition: Unfilled
- Type / Form: Grease, Paste
from RS Components, Ltd.
MG high temperature epoxy 832HT 375ml [See More]
- Chemical System: Epoxy
- Features: Encapsulant, Potting Compound
- Type / Form: Liquid
from Master Bond, Inc.
Master Bond EP30NS is a nano silica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically clear and meets NASA low outgassing specifications. [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Composition: Filled
- Type / Form: Liquid
from RS Components, Ltd.
Resin pack ERER2223RP 250g [See More]
- Chemical System: Epoxy
- Type / Form: Liquid
from Master Bond, Inc.
EP42-2LV Black is a two component, room temperature curing epoxy compound featuring low viscosity and superior chemical resistance. It meets NASA low outgassing specifications, is black in color and optically opaque. [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Composition: Unfilled
- Type / Form: Liquid
from RS Components, Ltd.
Loctite 248211 Epoxy Adhesive [See More]
- Chemical System: Epoxy
- Type / Form: Liquid
from Master Bond, Inc.
Master Bond Polymer System EP76M is a two component, nickel filled, electrically conductive adhesive for high performance bonding, sealing, and coating formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part nickel conductive systems, EP76M... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
- Composition: Filled
- Type / Form: Grease, Paste
from Sauereisen, Inc.
Sauereisen Aguapoxy No. 28 is a three component, water cleanable, general purpose epoxy grout for bonding chemical resistant masonry units. The No. 28, combined with brick or tile, offers rapid installation and clean up with potable water. The water cleanable feature of Aguapoxy No. 28 is designed... [See More]
- Chemical System: Epoxy
- Type / Form: Liquid; Powder
- Cure / Technology: Two Component
- Substrate Compatibility: Concrete, Masonry
from Sherwin-Williams Protective & Marine Coatings
COR-COTE E.N. 7000 is a 100% solids, two component, high build, epoxy novolac coating designed to protect substrates against severe chemical attack. Low viscosity and excellent adhesion characteristics ensure a tight bond to properly prepared concrete and steel surfaces. High build. Chemical... [See More]
- Chemical System: Epoxy; Phenolic
- Cure / Technology: Thermoset; Two Component
- Composition: Unfilled
- Type / Form: Pellets
from Shiu Li Technology Co., Ltd
LiPOLY EP770 is a two-part epoxy material for gap filling. Extremely low viscosity and flowability. Good dispersion and no delamination. The high deformation material, which filling the gap closely, cover the tolerance, and has outstanding conductivity, makes is suitable for filling the peculiar... [See More]
- Chemical System: Epoxy
- Industry: Electronics
- Features: Gap Filler, Foam in Place Gasket; Thermally Conductive
- Viscosity: 100000
from Henkel Corporation - Electronics
Loctite ® 5089 ™ Nuva-Sil ® Silicone Gasket / Sealant is used for gasketing and sealing applications. Upon exposure to sufficient UV light and/or atmospheric moisture, this product cures to form a durable, flexible rubber sealant. Typical applications include gasketing/sealing of... [See More]
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Metal; Plastic
- Cure / Technology: Single Component
- Industry: Electronics
from Techsil Limited
Devcon Aluminum Putty (F) is an aluminum filled epoxy putty for cost effective repairs to aluminum castings, components & equipment. It bonds to most metals & rigid plastics and is resistant to CFC's & chemicals. This putty is used on applications requiring an aluminum, non- rusting... [See More]
- Chemical System: Epoxy
- Features: Gap Filler, Foam in Place Gasket
- Substrate Compatibility: Metal
from Epoxies Etc...
UV Cure 60-7170 is a one- component epoxy that cures with low intensity black light or high intensity UV lamps. UV 60-7170 is water clear and is designed to be used as an adhesive, coating, or encapsulant. This system is moisture and chemical resistant. UV Cure 60-7170 is a good choice for potting... [See More]
- Chemical System: Epoxy
- Type / Form: Liquid
- Cure / Technology: UV or Radiation Cured; Single Component
- Substrate Compatibility: Ceramic, Glass; Metal; Paper or Paperboard; Plastic
from Epoxy Technology
EPO-TEK ® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries. Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market... [See More]
- Chemical System: Epoxy
- Type / Form: Liquid
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Ceramic, Glass
from Protavic America, Inc.
PNE-47207 ™ is an adhesive/sealant and potting compound. PNE-47207 ™ is designed to provide air free potting and casting of electronic devices. PNE-47207 ™ will bond difficult substrates such as glass, ceramics, and metals. It passes UL 94V0 for fire retardant properties,and has a... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
- Composition: Filled
- Type / Form: Liquid
from 3M Aerospace and Aircraft Maintenance Division
Two-Part, 30/70 Mix Ratio of Base to Hardener. Designed to cure at room temperature of 70-80F [21-27C]. Cured material exhibits excellent flexibility and adhesion. Low flow, soft paste viscosity permits application on vertical or overhead surfaces with a minimum of run-off. [See More]
- Chemical System: Epoxy
- Type / Form: Grease, Paste
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Features: Flexible
from Henkel Corporation - Industrial
LOCTITE 3220W, Epoxy, Adhesive and Sealant LOCTITE ® 3220W is designed for use in heat sensitive optoelectronic components and other microelectronic devices. This material offers excellent light reflection characteristics. LOCTITE 3220W is an white colored version of LOCTITE 3220 adhesive. One... [See More]
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass
- Cure / Technology: Single Component
- Viscosity: 31800
from ACCRAbond, Inc.
INSTAbond ® Big Green 8121 -- A highly effective epoxy compound designed to use as a chocking or grouting material. The cured material is designed for service in environments that require high compression strength, wide range of service temperatures and environment resistance to water, oils,... [See More]
- Chemical System: Epoxy
- Features: Caulk, Grout
from Sherwin-Williams Protective & Marine Coatings
DURA-PLATE 2300 is a three component, epoxy modified cementitious resurfacer containing Portland Cement, hydrophobic thixotropes, fiber reinforcement, graded silica sand and other abrasion resistant aggregates. It is used for resurfacing, patching and filling voids (bugholes) in concrete and masonry... [See More]
- Chemical System: Epoxy
- Substrate Compatibility: Concrete, Masonry
- Cure / Technology: Air Setting / Film Drying
- Features: Leveling Filling
from Techsil Limited
Devcon Plastic Steel Putty A is the original metal filled epoxy putty for economical, dependable maintenance and repair work. In a 1 KG size, this product is also known as Devcon 10115. Devcon plastic steel putty is recommended for repairing cracks and breaks in equipment, machinery or castings,... [See More]
- Chemical System: Epoxy
- Features: Gap Filler, Foam in Place Gasket
- Substrate Compatibility: Metal
from Epoxies Etc...
10-3022 is a two component epoxy adhesive and sealant. This structural adhesive has excellent chemical and heat resistance. 10-3022 is widely used as a stencil and screen adhesive due to its bonding strength and toughness. It has been used extensively to bond polyester mesh to aluminum frames and... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Composition: Unfilled
- Type / Form: Liquid
from 3M Aerospace and Aircraft Maintenance Division
3M ™ Scotch-Weld ™ Core Splice Adhesive Film AF 3002 is a 250-350 °F (121-177 °C) curing, low density, expandable product designed for the purpose of filling mismatched areas, and for splicing and reinforcing honeycomb core. High performance over the -67F to 250F (-55C to 12C)... [See More]
- Chemical System: Epoxy
- Type / Form: Sheet or Film
- Cure / Technology: Thermoset; Single Component
- Substrate Compatibility: Honeycomb Core
from Henkel Corporation - Industrial
LOCTITE ABLESTIK A 304-6, Epoxy, Adhesive and Sealant LOCTITE ® ABLESTIK A 304-6 epoxy adhesive and sealant is designed for high throughput assembly operations. Non-conductive. One component. Readily pourable. Fast cure. Good toughness. Excellent chemical resistance [See More]
- Chemical System: Epoxy
- Features: High Dielectric
- Cure / Technology: Single Component
- Viscosity: 21500
from Sherwin-Williams Protective & Marine Coatings
KEM ® Cati-Coat ® HS EPOXY FILLER/SEALER is a high performance, interior/exterior, VOC compliant, epoxy block filler. Designed for tenacious adhesion to masonry substrates while filling voids and crevices to smooth the surface. Excellent resistance to moisture, humidity, impact, and... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
- Composition: Unfilled
- Type / Form: Liquid
from Techsil Limited
Devcon Stainless Steel Putty is a steel-filled epoxy designed for rebuilding and repairing stainless steel equipment. It will repair cracks, dents and breaks in stainless steel machinery or castings. Intended uses include repairs to diary equipment and repairs to stainless steel holding tanks. [See More]
- Chemical System: Epoxy
- Features: Gap Filler, Foam in Place Gasket
- Substrate Compatibility: Metal
from Epoxies Etc...
Epoxies, Etc's resins are used to protect, insulate, and conceal circuitry, components, and devices. These formulations were designed to satisfy the requirements of many demanding potting, encapsulating, and casting applications in the electronic, electrical, automotive, and aerospace industries. [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
- Composition: Unfilled
- Type / Form: Liquid
from 3M Aerospace and Aircraft Maintenance Division
A two part, room temperature curing, low density void filling compound. It is designed for reinforcement of honeycomb sandwich constructions typically found in aircraft interior structures, honeycomb joining and bonding (interior furnishing, ceiling panels), edge panel sealing, inserts bonding,... [See More]
- Chemical System: Epoxy
- Type / Form: Grease, Paste
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Substrate Compatibility: Honeycomb Core
from Henkel Corporation - Industrial
LOCTITE ABLESTIK E 3508 MOD3, Epoxy, Adhesive, Sealant, Assembly LOCTITE ® ABLESTIK E 3508 MOD3 epoxy adhesive and sealant is designed for high throughput assembly operations. It is also recommended for bonding, sealing or insulating heat sensitive parts. One component, requires no mixing. Fast... [See More]
- Chemical System: Epoxy
- Viscosity: 32500
- Cure / Technology: Single Component
- Use Temperature: 40 to 302
from Techsil Limited
Devcon Wear Resistant Putty is a smooth, non-rusting ceramic-filled epoxy putty used to repair and rebuild interfacing metallic, low-friction surfaces such as machine ways and flanges. This product will repair in tight spots where a fine flowing putty is required, it will easily bond to steel, iron,... [See More]
- Chemical System: Epoxy
- Substrate Compatibility: Ceramic, Glass; Concrete, Masonry; Metal; Plastic
- Cure / Technology: Thermoset
- Features: Gap Filler, Foam in Place Gasket
from 3M Aerospace and Aircraft Maintenance Division
Structural one-part low weight void filler for aircraft interiors. One-part low weight filler combining extreme low density with high extrusion rate for manual and automatic applications. Pumpable. Full stand alone FST properties with patented non-halogen based FST system. Low flow for ease of... [See More]
- Chemical System: Epoxy
- Type / Form: Grease, Paste
- Cure / Technology: Single Component
- Substrate Compatibility: Honeycomb Core
from Henkel Corporation - Industrial
LOCTITE ABLESTIK E 3517, Epoxy, Low Electrical Conductivity, Sealant LOCTITE ® ABLESTIK E 3517 is used in applications where a low electrical conductive sealant is required. One component, requires no mixing. Electrically conductive. Low viscosity. Good dispense and flow behavior. High... [See More]
- Chemical System: Epoxy
- Viscosity: ? to 6000
- Cure / Technology: Single Component
from Techsil Limited
Elecolit ® 6603 is a thermally conductive epoxy with very good metal adhesion and slight flexibility. This grade has very good flow behavior and can easily be processed using a dispenser, spreading knife or spatula. Although designed for bonding applications, 6603 can also be used as a potting... [See More]
- Chemical System: Epoxy
- Features: Electrically Conductive; Thermally Conductive
- Cure / Technology: Thermoset
- Industry: Electronics
from Henkel Corporation - Industrial
LOCTITE ABLESTIK G 500HF, Epoxy, Assembly LOCTITE ® ABLESTIK G 500HF is a general purpose epoxy adhesive and sealant that cures to a high gloss finish. One component. Sag resistant. Process ease. Non-abrasive. No flow during cure even on vertical surface. High adhesion strength at elevated... [See More]
- Chemical System: Epoxy
- Substrate Compatibility: Metal
- Cure / Technology: Single Component
- Use Temperature: 40 to 356
from Techsil Limited
Elecolit ® 323 is a silver filled two part epoxy adhesive specially developed for bonding open chip components. This semiconducting grade has passed the autoclave test (1000h) and is suitable for use on semi conductors, it has no effect on bond wire adhesion. It can cured at either room... [See More]
- Chemical System: Epoxy
- Features: Electrically Conductive
- Cure / Technology: Thermoset
- Industry: Electronics
from Henkel Corporation - Industrial
LOCTITE ABLESTIK NCA 2350, Epoxy, Adhesive and Sealant LOCTITE ® ABLESTIK NCA 2350 is designed for use in heat sensitive devices. Fast cure at low temperature. One component. Good adhesion [See More]
- Chemical System: Epoxy
- Type / Form: Liquid
- Cure / Technology: Single Component
- Viscosity: 13670
from Techsil Limited
Elecolit ® 3653 is a 1 component silver filled, solvent-free conductive epoxy adhesive used in applications which are subject to vibrations or quick temperature fluctuations. This unique product can be cured thermally in a very short period of time and cures to a 60 - 75 Shore D material. Silver... [See More]
- Chemical System: Epoxy
- Features: Electrically Conductive
- Cure / Technology: Thermoset
- Industry: Electronics
from Henkel Corporation - Industrial
LOCTITE ABLESTIK NCA 2360, Epoxy, Adhesive and Sealant LOCTITE ® ABLESTIK NCA 2360 is designed for use in heat sensitive devices. One component. Fast cure at low temperature. Good adhesion [See More]
- Chemical System: Epoxy
- Type / Form: Liquid
- Cure / Technology: Single Component
from Techsil Limited
Elecolit ® 414 is a single component silver-filled, electrically conductive coating substance that hardens into a flexible, chemical resistant, expandable, non-deformable and friction resistant film. Grey in colour, Elecolit ® 414 has a viscosity of 20,000 to 25,000 mPas and when used with... [See More]
- Chemical System: Epoxy
- Features: Electrically Conductive
- Cure / Technology: Thermoset
- Industry: Electronics
from Henkel Corporation - Industrial
General purpose, one-part silicone adhesive sealant which cures at room temperature to form a tough rubber seal. LOCTITE ® SI 593 BLACK is a black, general purpose, one-part silicone adhesive sealant which cures at room temperature to form a tough rubber seal. Will not slump in overhead or... [See More]
- Chemical System: Epoxy
- Use Temperature: 65 to 450
from Techsil Limited
Structalit ® 701 is a two part, thermal curing adhesive which offers great bonding to a wide range of materials including metals (aluminum, steel, stainless steel) and many plastics. With a long pot life and short curing time, 701 is a very easy adhesive to work with. It appears amber in color... [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset
from Henkel Corporation - Industrial
Epoxy black 2-part adhesive for general purpose applications involving metal, plastic, or wood substrates. LOCTITE ® EA 11C is a black, 2-part, epoxy, general purpose adhesive and sealant that is suitable for materials that include metals, most plastics, and wood. Offering room-temperature cure... [See More]
- Chemical System: Epoxy
- Cure / Technology: Two Component
from Techsil Limited
ThreeBond 3114 is an epoxy resin based solvent- free ultraviolet-curing resin. Since the resin cures through optical cationic polymerization it is not inhibited from curing by oxygen, and it excels in surface curability. TB3114 cures to a free, fast setting anaerobic reactive pipe sealant compound. [See More]
- Chemical System: Epoxy
- Cure / Technology: Thermoset; UV or Radiation Cured
from Henkel Corporation - Industrial
Epoxy off-white 2-part adhesive for general purpose applications involving metal, plastic, or wood substrates. LOCTITE ® EA 1C is an off-white, 2-part, epoxy, general purpose adhesive and sealant that can be used on metals, most plastics, and wood. Providing room-temperature cure after mixing of... [See More]
- Chemical System: Epoxy
- Viscosity: 350000