Electrical Insulation / Dielectric Material Industrial Sealants
from ELANTAS North America LLC
ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]
- Features: High Dielectric; Non-corrosive; Gap Filler, Foam in Place Gasket
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Ellsworth Adhesives
Dow 3-4237 Dielectric Firm Gel Clear-Green is a two component, room temperature curing, silicone gel that is used for potting, sealing, encapsulating, and protecting electrical components from contaminants, moisture, and stress. It is durable, flexible, self healing, and offers long working times. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound
- Cure / Technology: Two Component
- Chemical System: Silicone
- Industry: Electronics
from Master Bond, Inc.
MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Flexible; Leveling Filling; Non-corrosive; Phase Change; Gap Filler, Foam in Place Gasket; Thermally Conductive
- Composition: Unfilled
- Chemical System: Silicone
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing; Addition Cure
from Ellsworth Adhesives
Dow DOWSIL ™ 3-4150 Dielectric Gel Clear-Green is a two component, fast room temperature curing, silicone gel that is used for potting, sealing, encapsulating, and protecting a variety of materials in the electronics industry. It offers flexibility, stress relief, and offers excellent... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound
- Cure / Technology: Two Component
- Chemical System: Silicone
- Viscosity: 480
from Master Bond, Inc.
Master Bond Polymer System EP22 is an aluminum filled, two component epoxy adhesive for high performance bonding, sealing, and coating. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non-critical one-to-one mix ratio by weight or volume. The EP22... [See More]
- Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Flexible; Gap Filler, Foam in Place Gasket; Anti-static, ESD
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Ellsworth Adhesives
Dow DOWSIL ™ EG-3810 Dielectric Gel is a one component, clear, heat curing silicone gel that is used for potting, sealing, encapsulating, and protecting a variety of materials in the electronics industry. It offers a wide range of operating temperatures ranging from -60 °C to 200 °C,... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound
- Cure / Technology: Single Component
- Chemical System: Silicone
- Industry: Electronics; Semiconductors, IC's
from Master Bond, Inc.
EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Flexible; Flame Retardant; Leveling Filling; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Ellsworth Adhesives
Dow DOWSIL ™ Q3-6575 Dielectric Gel Clear is a two component, heat curing, low temperature, silicone gel that is used for protecting and sealing electronic devices from high voltages, moisture, mechanical and thermal shock. 1:1 mix ratio by weight or volume. 0.9 kg Kit.This is a Dow product... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound
- Cure / Technology: Two Component
- Chemical System: Silicone
- Viscosity: 750
from Master Bond, Inc.
One part, nano silica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Glob Top, Daub, Doming or Overfill; Leveling Filling; Non-corrosive; Phase Change; Thermally Conductive
- Cure / Technology: UV or Radiation Cured; Single Component; Dual Curing
- Composition: Filled
- Type / Form: Liquid
from Ellsworth Adhesives
Dow DOWSIL ™ Q3-6575 Dielectric Gel Clear is a two component, heat curing, low temperature, silicone gel that is used for protecting and sealing electronic devices from high voltages, moisture, mechanical and thermal shock. 1:1 mix ratio by weight or volume. 35 kg Kit. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound
- Cure / Technology: Two Component
- Chemical System: Silicone
- Viscosity: 750
from Master Bond, Inc.
EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Ellsworth Adhesives
Dow SYLGARD ™ 527 Silicone Dielectric Gel is a two component, room temperature and heat curing gel that is used for coating, encapsulating, potting, and sealing electronic devices. It provides flexibility, good flow, and low viscosity. 1:1 mix ratio. 0.9 kg Kit. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound
- Cure / Technology: Two Component
- Chemical System: Silicone
- Industry: Electronics
from Master Bond, Inc.
EP35SP is a two component epoxy system specially formulated to resist high temperatures and aggressive chemicals. It has a paste viscosity with little to no flow when curing. [See More]
- Features: High Dielectric; Encapsulant or Conformal Coating; Non-corrosive; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Ellsworth Adhesives
Dow SYLGARD ™ 527 Silicone Dielectric Gel is a two component, room temperature and heat curing gel that is used for coating, encapsulating, potting, and sealing electronic devices. It provides flexibility, good flow, and low viscosity. 1:1 mix ratio. 36.3 kg Kit. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound
- Cure / Technology: Two Component
- Chemical System: Silicone
- Industry: Electronics
from Master Bond, Inc.
Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Non-corrosive; Phase Change; Thermal Insulation
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Ellsworth Adhesives
Dow SYLGARD ™ 527 Silicone Dielectric Gel is a two component, room temperature and heat curing gel that is used for coating, encapsulating, potting, and sealing electronic devices. It provides flexibility, good flow, and low viscosity. 1:1 mix ratio. 7.2 kg Kit. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound
- Cure / Technology: Two Component
- Chemical System: Silicone
- Industry: Electronics
from Master Bond, Inc.
EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Flame Retardant; Leveling Filling; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Ellsworth Adhesives
Dow SYLGARD ™ 527 Silicone Dielectric Gel is a two component, room temperature and heat curing gel that is used for coating, encapsulating, potting, and sealing electronic devices. It provides flexibility, good flow, and low viscosity. 1:1 mix ratio. Part B, 18.1 kg Pail. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound
- Cure / Technology: Two Component
- Chemical System: Silicone
- Industry: Electronics
from Master Bond, Inc.
EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Flexible; Leveling Filling; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Flexible; Leveling Filling; Non-corrosive; Phase Change; Thermally Conductive
- Composition: Unfilled
- Chemical System: Silicone
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
Master Bond Polymer Adhesive EP51 is a fast "5 minute" curing two component epoxy adhesive for general purpose bonding formulated to cure at room temperature with a one-to-one mix ratio by weight or volume. It readily develops a high bonding strength of more than 2000 psi at room temperature. The... [See More]
- Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Anti-static, ESD
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer System EP31 is a two component room temperature curing epoxy for high performance structural bonding applications featuring lap shear strengths exceeding 4500 psi. In addition, unlike many structural epoxies, EP31 also has a high peel strength exceeding 40 pli. The service... [See More]
- Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Flexible; Gap Filler, Foam in Place Gasket; Anti-static, ESD
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Type / Form: Grease, Paste
from Master Bond, Inc.
Master Bond Polymer System EP13 is a one component heat curing epoxy featuring high shear strength and very high temperature resistance. This one component system is formulated to cure at temperatures from 300 °F to 350 °F for 60-90 minutes. Upon cure, EP13 readily attains tensile shear... [See More]
- Features: High Dielectric; Encapsulant or Conformal Coating; Non-corrosive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Master Bond, Inc.
Master Bond Polymer System 125 is a two component toughened epoxy resin for prolonged service above 500 °F with truly outstanding chemical resistance. High strength bonds serviceable up to 600 °F can be obtained with this exceptionally thermally stable and chemically resistant epoxy resin... [See More]
- Features: High Dielectric; Leveling Filling; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermal Insulation
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer Adhesive EP33 is a unique room temperature curing two component epoxy adhesive for high temperature bonding applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures. Master Bond Polymer Adhesive EP33 produces high strength bonds whose... [See More]
- Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Flexible; Gap Filler, Foam in Place Gasket; Anti-static, ESD
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer System EP29LP is a two component high performance epoxy resin system featuring low viscosity, long pot life and low exotherm. As an adhesive this versatile material will form bond strengths in excess of 2,500 psi (aluminum to aluminum). It bonds well to a variety of substrates... [See More]
- Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Flexible; Gap Filler, Foam in Place Gasket; Anti-static, ESD
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. Not only is EP29LPSP able to function as an adhesive, sealant and protective coating at temperatures as low as 4K, but it is... [See More]
- Features: High Dielectric; Electrically Conductive; EMI/RFI Shielding; Encapsulant or Conformal Coating; Flexible; Gap Filler, Foam in Place Gasket; Anti-static, ESD
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronicc/ structural applications. The two components are combined in a convenient noncritical mix... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Leveling Filling; Non-corrosive; Gap Filler, Foam in Place Gasket; Solvent Based; Thermal Insulation
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Leveling Filling; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
Master Bond Polymer System EP38 is a fast curing, low viscosity, optically clear two component epoxy system for high performance coating, bonding and sealing. It is 100% reactive and does not contain any volatiles. The mix ratio is a convenient 3 to 1 by weight. EP38 is very fast curing. Coatings as... [See More]
- Features: High Dielectric; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond EP30NS is a nano silica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically clear and meets NASA low outgassing specifications. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Leveling Filling; Non-corrosive; Gap Filler, Foam in Place Gasket; Thermally Conductive
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Protavic America, Inc.
PNE-47207 ™ is an adhesive/sealant and potting compound. PNE-47207 ™ is designed to provide air free potting and casting of electronic devices. PNE-47207 ™ will bond difficult substrates such as glass, ceramics, and metals. It passes UL 94V0 for fire retardant properties,and has a... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Flame Retardant; Gap Filler, Foam in Place Gasket
- Composition: Filled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Bluestar Silicones USA Corp.
Stiff, Tacky Dielectric Compound Lubricant and Sealant. Description. Bluesil V-711 is a silica-thickened, high molecular weight dimethyl silicone compound. It is a non-curing grease-like paste with a tacky, stiff consistency. Bluesil V-711 possesses excellent dielectric properties and is useful for... [See More]
- Features: High Dielectric
- Use Temperature: -67 to 400
- Type / Form: Grease, Paste
- Dielectric Strength: 503
from OMEGA Engineering, Inc.
Air Set Cements set or cure through loss of moisture by evaporation. Atmospheric conditions therefore affect the drying rate. Air Set Cements are used mainly in thin film applications (applied in thicknesses less than 1/4")*. SELECTION CRITERIA FOR CEMENTS. 1. Type of Application Potting, sealing,... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Thermally Conductive
- Cure / Technology: Air Setting / Film Drying; Two Component (optional feature); Single Component (optional feature)
- Chemical System: Ceramic
- Type / Form: Liquid (optional feature); Powder (optional feature)
from Aremco Products, Inc.
High fired strength, dense ceramics [See More]
- Features: High Dielectric; Gap Filler, Foam in Place Gasket; Thermally Conductive; Threadlocker or Retainer
- Composition: Filled
- Chemical System: Ceramic
- Cure / Technology: Thermoset
from Shiu Li Technology Co., Ltd
LiPOLY S393 is a product with high ductile thermal conductivity. Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material. It won't easy to break and deformwhether stamped, punched, strip type, or custom cutting. Your best choice... [See More]
- Features: High Dielectric; Gap Filler, Foam in Place Gasket; Thermally Conductive; UL Rating
- Type / Form: Sheet or Film
- Chemical System: Silicone
- Industry: Aerospace; Automotive; Electronics; Electric Power; Laminaes; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
from Epoxies Etc...
UV Cure 60-7170 is a one- component epoxy that cures with low intensity black light or high intensity UV lamps. UV 60-7170 is water clear and is designed to be used as an adhesive, coating, or encapsulant. This system is moisture and chemical resistant. UV Cure 60-7170 is a good choice for potting... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound
- Cure / Technology: UV or Radiation Cured; Single Component
- Chemical System: Epoxy
- Type / Form: Liquid
from Henkel Corporation - Industrial
LOCTITE ABLESTIK A 304-6, Epoxy, Adhesive and Sealant LOCTITE ® ABLESTIK A 304-6 epoxy adhesive and sealant is designed for high throughput assembly operations. Non-conductive. One component. Readily pourable. Fast cure. Good toughness. Excellent chemical resistance [See More]
- Features: High Dielectric
- Cure / Technology: Single Component
- Chemical System: Epoxy
- Viscosity: 21500
from Sauereisen, Inc.
Sauereisen Aluseal Adhesive Cement No. 2 is a ceramic cement paste offering good bond strength and thermal shock. resistant properties for assembling, sealing and cementing porcelain, glass, metal and other materials. Its fine particle size. and excellent flow characteristics make No. 2 a good... [See More]
- Features: High Dielectric; Flexible; Thermally Conductive
- Composition: Unfilled
- Chemical System: Ceramic
- Cure / Technology: Air Setting / Film Drying; Single Component
from Epoxy Technology
Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting hostile environments,... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Thermally Conductive
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Type / Form: Grease, Paste
from Wacker Chemical Corp.
SEMICOSIL ® 925 is a high purity, one-component addition curing RTV-2 silicone gel. Special features. Low ion content. Low volatile content. Low viscosity. Good mechanical damping properties. Application. SEMICOSIL ® 925 is a dielectric gel especially designed to seal, protect and preserve... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Flexible
- Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
- Chemical System: Silicone
- Type / Form: Liquid
from Protavic America, Inc.
Fast flow, fast cure capillary reworkable underfill. The rheology of the PROTAVIC ANA 10199 R in combination with its fineness make the product perfectly adapted to high reliability small gap underfill applications. It presents a good pot life at room temperature 20-22C and a high reactivity at... [See More]
- Features: High Dielectric; Gap Filler, Foam in Place Gasket; Thermal Insulation
- Cure / Technology: Thermoset; Single Component
- Composition: Unfilled
- Type / Form: Liquid
from OMEGA Engineering, Inc.
Chemical Set Cements set or cure by an internal chemical action which does not require exposure to air. Chemical Set Cements can be used in thick applications (applied in thicknesses greater than 1/4")*. SELECTION CRITERIA FOR CEMENTS. 1. Type of Application Potting, sealing, encapsulating,... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Encapsulant or Conformal Coating; Thermally Conductive
- Cure / Technology: Air Setting / Film Drying; Two Component (optional feature); Single Component (optional feature)
- Chemical System: Ceramic
- Type / Form: Liquid (optional feature); Powder (optional feature)
from Shiu Li Technology Co., Ltd
LiPOLY S818 is a product with high ductile thermal conductivity.Having good stretchability and high deformation. The toughness structure can enhance the operability and durability of material.It won't easy to break and deform whether stamped, punched, strip type, or custom cutting. Your best choice... [See More]
- Features: High Dielectric; Gap Filler, Foam in Place Gasket; Thermally Conductive; UL Rating
- Type / Form: Sheet or Film
- Chemical System: Silicone
- Industry: Aerospace; Automotive; Electronics; Electric Power; Laminaes; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
from Epoxies Etc...
10-3022 is a two component epoxy adhesive and sealant. This structural adhesive has excellent chemical and heat resistance. 10-3022 is widely used as a stencil and screen adhesive due to its bonding strength and toughness. It has been used extensively to bond polyester mesh to aluminum frames and... [See More]
- Features: High Dielectric; Gap Filler, Foam in Place Gasket
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Sauereisen, Inc.
Sauereisen Cement No. 31 is a white, porcelain-like cement that is widely used throughout industry in a variety of applications. including assembling, sealing, insulating and cementing of ceramics, porcelain, metal, and glass. [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Flame Retardant; Gap Filler, Foam in Place Gasket; Thermally Conductive
- Composition: Unfilled
- Chemical System: Ceramic
- Cure / Technology: Two Component ; Chemically Set
from Shiu Li Technology Co., Ltd
LiPOLY DCTP140-s is a thermal insulator uses fiberglass cloth as a reinforcement material, combined with thermal conductive silicon, giving it high thermal conduction and great compression strength. The thermal conductivity is 4.5 W/m*K, the thickness is 0.25~0.45mm. Its high insulation and... [See More]
- Features: High Dielectric; Gap Filler, Foam in Place Gasket; Thermally Conductive; UL Rating
- Type / Form: Sheet or Film
- Chemical System: Silicone
- Industry: Aerospace; Automotive; Electronics; Electric Power; Laminaes; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
from Epoxies Etc...
20-2100 FR is a two component, room temperature curing, low viscosity polyurethane system for potting, casting, encapsulating and sealing electronic components and assemblies. 20-2100 FR is a flame retardant self extinguishing system. It meets the stringent requirements of UL 94-VO. Designed for... [See More]
- Features: High Dielectric; Encapsulant, Potting Compound; Flexible; Flame Retardant; Gap Filler, Foam in Place Gasket; UL Rating
- Composition: Unfilled
- Chemical System: Elastomeric; Polyurethane
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Shiu Li Technology Co., Ltd
LiPOLY T-top99-s offers outstanding thermal conductivity at 24.0 W/m*K and extremely low thermal resistance under minimal force.T-top99-s offers excellent compression, filling small air gaps on uneven surfaces, ensuring an efficient and consistent transfer of heat. [See More]
- Features: High Dielectric; Gap Filler, Foam in Place Gasket; Thermally Conductive; UL Rating
- Type / Form: Sheet or Film
- Chemical System: Silicone
- Industry: Aerospace; Automotive; Electronics; Electric Power; Laminaes; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
from Shiu Li Technology Co., Ltd
LiPOLY TEM96D is a thermally conductive absorber based upon soft magnetic materials dispersed in a polymeric resin. It has a thermalconductivity of 5.0 W/m*K and dissipates electromagnetic radiation rapidly to mitigate against EMI issues. [See More]
- Features: High Dielectric; EMI/RFI Shielding; Gap Filler, Foam in Place Gasket; Thermally Conductive; UL Rating
- Type / Form: Sheet or Film
- Chemical System: Silicone
- Industry: Aerospace; Automotive; Electronics; Electric Power; Laminaes; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
from Shiu Li Technology Co., Ltd
LiPOLY HC-93 is a stereoscopic thermal conductive silicone rubber cap as substrate through a special production process. Due to its excellent characteristic of high thermal conductivity, insulation, shockproof and convenient assembly, it is widely used in heat transistor refer to TO220 / TO3P,... [See More]
- Features: High Dielectric; Gap Filler, Foam in Place Gasket; Thermally Conductive; UL Rating
- Type / Form: Sheet or Film
- Chemical System: Silicone
- Substrate Compatibility: Rubber or Elastomer
from Shiu Li Technology Co., Ltd
LiPOLY SP is a stereoscopic thermal conductive silicone rubber cap as substrate through a special production process. Due to its excellent characteristic of high thermal conductivity, insulation, shockproof and convenient assembly, it is widely used in heat transistor refer to TO220 / TO3P, diode,... [See More]
- Features: High Dielectric; Gap Filler, Foam in Place Gasket; Thermally Conductive; UL Rating
- Type / Form: Sheet or Film
- Chemical System: Silicone
- Substrate Compatibility: Rubber or Elastomer
from Shiu Li Technology Co., Ltd
LiPOLY TP200 is a stereoscopic thermal conductive silicone rubber cap as substrate through a special production process. Due to its excellent characteristic of high thermal conductivity, insulation, shockproof and convenient assembly, it is widely used in heat transistor refer to TO220 / TO3P,... [See More]
- Features: High Dielectric; Gap Filler, Foam in Place Gasket; Thermally Conductive; UL Rating
- Type / Form: Sheet or Film
- Chemical System: Silicone
- Substrate Compatibility: Rubber or Elastomer
from Shiu Li Technology Co., Ltd
AS17 is an advanced insulation material composed of a fiber composite made from porous silica, aluminum nitride, and other materials, with an extremely low thermal conductivity of 0.028 W/m·K. AS17 is notable for its ability to prevent thermal runaway, its ultra-low density, and its high-temperature... [See More]
- Features: High Dielectric; Gap Filler, Foam in Place Gasket; Thermal Insulation
- Substrate Compatibility: Textiles or Fabrics
- Type / Form: Sheet or Film
- Industry: Aerospace; Automotive; Electronics; Electric Power; Laminaes; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
from Shiu Li Technology Co., Ltd
AS27 is an advanced insulation material composed of nanoscale porous silica, carbon, and other materials, with an extremely low thermal conductivity of 0.009 W/m·K, making it one of the lowest-known thermal conductivity solid materials. AS27 is renowned for its ultra-low density, exceptional thermal... [See More]
- Features: High Dielectric; Gap Filler, Foam in Place Gasket; Thermal Insulation
- Substrate Compatibility: Textiles or Fabrics
- Type / Form: Sheet or Film
- Industry: Aerospace; Automotive; Electronics; Electric Power; Laminaes; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling
from Shiu Li Technology Co., Ltd
LiPOLY AS02-s is a material with double sided inherent tack, low thermal resistance and high thermal conductivity. It has excellent compressive strength characteristics and good electrical isolation function for high-power electronic components, making it the best choice for thin design... [See More]
- Features: High Dielectric; Gap Filler, Foam in Place Gasket; Thermally Conductive; UL Rating
- Type / Form: Sheet or Film
- Chemical System: Silicone
- Industry: Aerospace; Automotive; Electronics; Electric Power; Laminaes; Marine; Military; Photonics; OEM or Industrial; Semiconductors, IC's; Tooling