Polysulfide Encapsulants and Potting Compounds

Electrically Conductive Die Attach Epoxy With High Glass Transition Temperature -- EP17HTS-DA
from Master Bond, Inc.

Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]

  • Chemical System: Polyphenylene Sulfide; Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
  • Type: Electrically Conductive; Thermally Conductive
  • Composition: Filled
Oil And Fuel Resistant Polysulfide Based Adhesive -- EP21TP-2NV
from Master Bond, Inc.

Master Bond Polymer Adhesive EP21TP-2 is a two component polysulfide/epoxy based adhesive/sealant formulated to cure at room temperature or more rapidly at elevated temperatures, with a 100 to 100 mix ratio (A/B) by weight. It readily develops a high bonding strength of more than lOOO psi at room... [See More]

  • Chemical System: Polyphenylene Sulfide; Epoxy
  • Cure / Technology: Thermoset; Two Component  
  • Form / Function: Optional Premixed and Frozen; Gap Filler, Foam in Place Gasket; Liquid
  • Features: Flexible; Dissimilar Substrates
Thermally Conductive Epoxy Polysulfide Adhesive -- EP21TPFL-1AO
from Master Bond, Inc.

Master Bond EP21TPFL-1AO is an electrically insulative, two part epoxy polysulfide system with a thermal conductivity of 9-10 BTU •in/ft2 •hr • °F [1.30-1.44 W/(m •K)]. As a polysulfide based system, it has very good chemical resistance, particularly to fuels, oils, hydraulic... [See More]

  • Chemical System: Polyphenylene Sulfide; Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Type: High Dielectric; Thermally Conductive
  • Composition: Unfilled
Tough Epoxy Polysulfide Adhesive Resists High Temperatures -- EP21TPHT
from Master Bond, Inc.

Master Bond EP21TPHT is an epoxy polysulfide compound that withstands temperatures up to 350°F which gives it a higher resistance to elevated temperatures than most polysulfide systems. [See More]

  • Chemical System: Polyphenylene Sulfide; Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Type: High Dielectric; Thermally Conductive
  • Composition: Unfilled
Polysulfide -- CS 3100
from ACCRAbond, Inc.

CS 3100 is used for potting and sealing electrical connectors and components for protection from moisture, fuels, dirt and other contaminants. CS 3100 is a two-part polysulfide component that cures at room temperature to a firm, flexible rubber. CS 3100 cures by a chemical reaction that is... [See More]

  • Chemical System: Polyphenylene Sulfide