Specialty / Other Encapsulants and Potting Compounds

ELAN-Cast® -- Y-363A Resin / Y-363B Hardener
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Chemical System: Natural Oil Base
  • Form / Function: Liquid
  • Type: High Dielectric
  • Composition: Unfilled
Dual Curing, Thixotropic Adhesive -- UV22DC80-10F
from Master Bond, Inc.

One part, nanosilica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]

  • Chemical System: UV Curing
  • Form / Function: Liquid; Encapsulant or Conformal Coating; Glob Top, Daub, Doming or Overfill
  • Type: High Dielectric; Thermally Conductive
  • Composition: Filled
Fluorinated Conformal Coating Agent -- SURECO™ CC Series
from AGC Chemicals Americas, Inc.

SURECO ™ CC series are surface treatment agents containing a fluorinated polymer compound. By forming a thin layer on a variety of surfaces, it provides excellent water & oil repellency, anti-corrosion, moisture protection and waterproofing. It can be used as a conformal coating for PCB... [See More]

  • Chemical System: Fluorinated Polymer
  • Industry: Electronics
  • Form / Function: Liquid; Encapsulant or Conformal Coating
  • Use Temperature: 392
Carbon Fiber Encapsulation -- Wraptite®
from Arnold Magnetic Technologies

Arnold Magnetic Technologies offers composite and metallic encapsulation solutions for a wide range of permanent magnet systems and applications. While metallic sleeved magnet containment solutions are used extensively for magnet containment, Wraptite composite sleeves offer a superior design... [See More]

  • Chemical System: Include Carbon Fiber, Zylon Fiber And Glass Fiber Composites
  • Industry: Aerospace; Automotive; OEM or Industrial; Oil and Gas
  • Cure / Technology: Wound in place or pressed on sleeve
  • Use Temperature: 338
Potting Resin -- 588122-000
from TE Connectivity

Body Features. Color  : Blue. Electrical Characteristics. Potting Resin Voltage Rating  : ≤ 1, ≤ 7.2. Industry Standards. CSA Certified  : No. Standards  : EN 50393, HD 631.1 S2. UL Rating  : No. Operation/Application. Application  : Potting, Low &... [See More]

  • Chemical System: Polyurethane; Two-Part Polyurethane
1016343
from RS Components, Ltd.

A flexible, transparent modified silicone resin conformal coating. For use in the protection of electronic circuitry to meet aerospace and defence standards. Resistant to most solvents, lubricants and cooling fluids. Excellent resistance to mould growth and UV light and to prolonged exposure to... [See More]

  • Chemical System: Silicone Resin
  • Use Temperature: -94 to 392
  • Form / Function: Aerosol; Liquid; Encapsulant or Conformal Coating
All Polyimide High Temperature Bonding Film -- Pyralux® HT
from DuPont Electronics & Imaging

DuPont ™ Pyralux ® HT bonding film can be used in conjunction with Pyralux ® AP to create a complete all-polyimide flex laminate system that includes a double-sided, copper-clad laminate and a unique all-polyimide coverfilm or bonding material that becomes a flexible coverlay after... [See More]

  • Chemical System: Polyimide
  • Industry: Electronics; OEM or Industrial
  • Features: UL Rating
  • Use Temperature: 437
Low Viscosity, Thermally Conductive Underfill Epoxy -- EP3UF-1
from Master Bond, Inc.

Master Bond EP3UF-1 is a one component, highly flowable epoxy for bonding and underfill applications. [See More]

  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid
  • Type: High Dielectric; Thermally Conductive
  • Composition: Unfilled
Potting Resin -- 759934-000
from TE Connectivity

Body Features. Color  : Black. Industry Standards. UL Rating  : No. Operation/Application. Application  : Potting. Halogen Free  : Yes. Isocyanate-Free  : No. Label-Free Acc REACH & CLP  : No. Marine-Offshore-Shipbuilding Certified  : No. [See More]

  • Chemical System: Polyurethane; Two-Component Polyurethane
283268
from RS Components, Ltd.

Electrolube LFCC is a flexible, transparent, fast drying modified silicone conformal coating specifically designed for the protection of electronic circuitry processed with lead free soldering products. It has been formulated to offer excellent adhesion properties to these lead free flux residues... [See More]

  • Chemical System: Silicone Resin
  • Use Temperature: -58 to 302
  • Form / Function: Aerosol; Liquid; Encapsulant or Conformal Coating
One Part Silver Conductive Epoxy with Ultra High Heat Transfer Capability -- EP3HTSDA-2
from Master Bond, Inc.

Master Bond EP3HTSDA-2 is a fast curing, one part silver filled system offering exceptionally high thermal and electrical conductivity, along with remarkably low thermal resistance. [See More]

  • Chemical System: Epoxy; Silver Filled
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid
  • Type: Electrically Conductive; Thermally Conductive
  • Composition: Filled
Potting Resin -- 973806-000
from TE Connectivity

Body Features. Color  : Opaque. Flexibility  : Elastic. Industry Standards. UL Rating  : No. Operation/Application. Application  : Potting. Halogen Free  : Yes. Isocyanate-Free  : No. Label-Free Acc REACH & CLP  : No. Marine-Offshore-Shipbuilding... [See More]

  • Chemical System: Polyurethane; Two-Component Polyurethane
428552
from RS Components, Ltd.

A transparent silicone coating designed to protect printed circuit boards, which can be easily removed with most common solvents. Package Size = 400 ml. Package Type = Aerosol. Application = PCBs. Material = Silicone Resin. Colour = Transparent. Maximum Operating Temperature = +125 °C. Minimum... [See More]

  • Chemical System: Silicone Resin
  • Use Temperature: -58 to 257
  • Form / Function: Aerosol; Liquid; Encapsulant or Conformal Coating
Potting Resin -- A47464-000
from TE Connectivity

Body Features. Color  : Beige. Electrical Characteristics. Potting Resin Voltage Rating  : ≤ 1. Industry Standards. CSA Certified  : No. Standards  : EN 50393, HD 631.1 S2. UL Rating  : No. Operation/Application. Application  : Low & Medium Voltage... [See More]

  • Chemical System: Polyurethane; Two-Part Polyurethane
494714
from RS Components, Ltd.

The RS Pro modified silicone conformal coating, specially formulated the protection of your electronic circuits. Once cured, it is resistant to a wide range of solvents, lubricants and cooling fluids putting your mind at ease. All models are highly reliable and excellent quality. Excellent... [See More]

  • Chemical System: Silicone Resin
  • Use Temperature: -94 to 392
  • Form / Function: Aerosol; Liquid; Encapsulant or Conformal Coating
Potting Resin -- C39212-000
from TE Connectivity

Body Features. Color  : Blue. Electrical Characteristics. Potting Resin Voltage Rating  : ≤ 7.2, ≤ 46, ≤ 35, ≤ 17.5, ≤ 25, ≤ 42, ≤ 24, ≤ 36, ≤ 15, ≤ 12. Industry Standards. CSA Certified  : No. Standards  : HD 629.1. UL Rating  : No. [See More]

  • Chemical System: Two-Part Hydrocarbon Resin
535525
from RS Components, Ltd.

A transparent silicone coating designed to protect printed circuit boards, which can be easily removed with most common solvents. Package Size = 15 ml. Package Type = Can. Application = Solvent Thinner. Material = Silicone Resin. Colour = Transparent. Maximum Operating Temperature = +125 °C. [See More]

  • Chemical System: Silicone Resin
  • Use Temperature: -58 to 257
  • Form / Function: Can; Encapsulant or Conformal Coating
Potting Resin -- CP6931-000
from TE Connectivity

Body Features. Color  : Transparent. Electrical Characteristics. Potting Resin Voltage Rating  : ≤ 1. Industry Standards. CSA Certified  : No. Standards  : IP68. UL Rating  : No. Operation/Application. Application  : Junction Boxes, Potting. Free of Lead,... [See More]

  • Chemical System: Two-Part Hydrocarbon Resin
7630768
from RS Components, Ltd.

Optically clear, flexible two part encapsulating compound. Ideal for use in the LED industry where optical clarity is vital. Suited for applications where thin films are required. Moisture cure nature. Low viscosity. Excellent electrical properties. Wide temperature range. Chemical and water... [See More]

  • Chemical System: Silicone Resin
  • Use Temperature: -76 to 392
  • Form / Function: Encapsulant or Conformal Coating
Potting Resin -- EE3378-000
from TE Connectivity

Body Features. Color  : Green. Electrical Characteristics. Potting Resin Voltage Rating  : ≤ 1. Industry Standards. CSA Certified  : No. Standards  : EN 50393, HD 631.1 S2. UL Rating  : No. Operation/Application. Application  : Low & Medium Voltage... [See More]

  • Chemical System: Two-Part Hydrocarbon Resin
831141
from RS Components, Ltd.

The RS Pro modified silicone conformal coating, specially formulated the protection of your electronic circuits. Once cured, it is resistant to a wide range of solvents, lubricants and cooling fluids putting your mind at ease. All models are highly reliable and excellent quality. Excellent... [See More]

  • Chemical System: Silicone Resin
  • Use Temperature: -94 to 392
  • Form / Function: Aerosol; Liquid; Encapsulant or Conformal Coating
Metal Repair and Patching Compound -- Hi-Temp Lab-metal
from Dampney Company, Inc.

Hi-Temp Lab-metal is ready-to-use right from the can. Developed for difficult repairs subject to excessive heat, Hi-Temp Lab-metal withstands temperatures as high as 1000ºF. [See More]

  • Chemical System: Aluminum-filled Compound
  • Cure / Technology: Thermoset
  • Composition: Filled
  • Industry: Automotive; Construction; Welding
Aremco-Seal™ -- 613
from Aremco Products, Inc.

Glass coating for producing hermetic seals [See More]

  • Chemical System: Ceramic; Glass
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Type: High Dielectric
  • Composition: Filled
TECHNOMELT AS 8998
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Chemical System: Polyolefin
  • Cure / Technology: Thermoplastic / Hot Melt
  • Form / Function: Pellets
  • Features: UL Rating
Polyurethane Polyols -- VORANOL™ 220-260
from Dow Polyurethanes

Dow provides a wide variety of VORANOL* polyether polyols. with an extensive selection of performance and processing attrib-. utes. Designed to meet your needs, this large family of polyols. is sure to provide the balance of properties needed within rigid. and molded foam and isocyanate product... [See More]

  • Chemical System: Polyurethane; Polyether Polyol
  • Cure / Technology: Thermoset; Two Component  
  • Form / Function: Gel
  • Features: Water Based 
Elastomeric potting & encapsulating compound -- 20-2125
from Epoxies Etc...

20-2125 is formulated for electronic potting, encapsulating and casting applications. The 20-2125 is a two-component, low viscosity, room temperature curing system. This is an easy to use product that does not contain TDI, MbOCA or Mercury. 20-2125 will cushion and protect sensitive electronic... [See More]

  • Chemical System: Polyol, Isocyanate
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
  • Type: High Dielectric; Thermally Conductive
  • Industry: Electronics
Insa-Lute Hi-Temp Cement -- No. 7
from Sauereisen, Inc.

Sauereisen Insa-Lute Hi Temp Cement No. 7 is a sodium silicate adhesive cement used by leading electrical manufacturers. The cement exhibits outstanding resistance to heat and electricity. Typical applications include instrumentation assembly, coating and embedding of resistance wires, and... [See More]

  • Chemical System: Ceramic; Sodium Silicate Adhesive Cement
  • Form / Function: Liquid; Encapsulant or Conformal Coating; Die Bonding Adhesives
  • Type: High Dielectric; Thermally Conductive
  • Composition: Unfilled
Optically Clear UV Adhesive -- ANA-97290
from Protavic America, Inc.

ANA-97290 is a clear Ultraviolet/ Visible light curing adhesive. It has very low shrinkage during cure for alignment sensitive parts. It is recommended for small electrical/electronic casting and encapsulating applications that require a unique combination of excellent wetting, flow, good thermal... [See More]

  • Chemical System:
  • Form / Function: Liquid; Encapsulant or Conformal Coating; Gel (optional feature); Die Bonding Adhesives
  • Type: Electrically Conductive; Thermal Insulation
  • Composition: Unfilled
Metal Repair Putty -- Lab-metal
from Dampney Company, Inc.

Ready-to-use metal repair putty, dent filler and patching compound. Durable metal filler for fast, permanent repairs. A unique, quality problem-solver! Lab-metal ready-to-use repair compound spreads like paste and hardens quickly into metal. [See More]

  • Chemical System: Aluminum-filled Compound
  • Industry: Marine; Automotive; Construction; OEM or Industrial
  • Composition: Filled
  • Use Temperature: -40 to 350
TECHNOMELT PA 5375
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Chemical System: Polyolefin
  • Form / Function: Pellets
  • Type: High Dielectric; Thermally Conductive
  • Cure / Technology: Thermoplastic / Hot Melt; Single Component
Underlayment -- No. F-120
from Sauereisen, Inc.

Sauereisen Underlayment No. F-120 is a fast-setting, high early strength, Portland based resurfacing material available in. three formulations - Trowelable, Castable or Gunite. Selection of material is dependent upon concrete condition and whether application is on vertical, horizontal or overhead... [See More]

  • Chemical System: Ceramic; Portland Based Cement
  • Composition: Unfilled
  • Form / Function: Powder
  • Cure / Technology: Single Component
Reworkable Underfill Epoxy Resin -- ANA-10199R
from Protavic America, Inc.

Fast flow, fast cure capillary reworkable underfill. The rheology of the PROTAVIC ANA 10199 R in combination with its fineness make the product perfectly adapted to high reliability small gap underfill applications. It presents a good pot life at room temperature 20-22C and a high reactivity at... [See More]

  • Chemical System:
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
  • Type: High Dielectric; Thermal Insulation
  • Composition: Unfilled