Electronics (PCB / SMT Assembly) Encapsulants and Potting Compounds

109 Results
2-Part Silicone Potting Compounds and Encapsulants -- QSil-12
from CHT USA Inc.

CHT's QSil 12 is a 2-part, condensation cure, transparent, low viscosity, liquid silicone elastomer which cures at room temperature. QSil 12 is primarily intended for electronic and lighting potting applications. This material is typically mixed at a ratio of 100:5. Once mixed, the material is... [See More]

  • Industry: Automotive; Electronics
  • Use Temperature: -67 to 399
  • Cure / Technology: Two Component  ; Condensation
  • Thermal Conductivity: 0.1800
ELAN-Cast® -- P 300 S RTC
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Industry: Electronics; Electric Power; Construction (optional feature); OEM or Industrial; Sand-filled transformers
  • Form / Function: Liquid; Impregnating Resin (optional feature)
  • Type: High Dielectric
  • Chemical System: Alkyd
Dow 3-4237 Dielectric Firm Gel Transparent Green 36.2 kg Kit -- 3-4237 36.2KG KIT [4001943 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow 3-4237 Dielectric Firm Gel Clear-Green is a two component, room temperature curing, silicone gel that is used for potting, sealing, encapsulating, and protecting electrical components from contaminants, moisture, and stress. It is durable, flexible, self healing, and offers long working times. [See More]

  • Industry: Electronics
  • Chemical System: Silicone
  • Type: High Dielectric
  • Cure / Technology: Two Component  
Capillary Underfill -- ALPHA® HiTech™ CU11-3127
from MacDermid Alpha Electronics Solutions

ALPHA ® HiTech ™ CU11-3127 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards. The high Tg, low CTE properties of ALPHA ® HiTech ™ CU11-3127 protects the solder joints from mechanical stresses such as drop... [See More]

  • Industry: Electronics; Semiconductors, IC's
  • Cure / Technology: Single Component
  • Chemical System: Epoxy
  • CTE: 16 to 111
Addition Cured Silicone is Optically Clear with Enhanced Low Temperature Serviceability -- MasterSil 157
from Master Bond, Inc.

MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]

  • Industry: Marine; Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid
  • Type: High Dielectric; Optical; Thermally Conductive
  • Chemical System: Silicone
2-Part Silicone Potting Compounds and Encapsulants -- QSil-58
from CHT USA Inc.

CHT's QSil 58 is a 2-part, condensation cure, high temperature, self-leveling, silicone elastomer primarily used for electronic potting applications to provide protection from moisture, debris, vibration and shock. The two applicable catalysts are 0.5% DBT by weight and 10% Deep Section Catalyst by... [See More]

  • Industry: Automotive; Electronics
  • Use Temperature: -65 to 500
  • Cure / Technology: Two Component  ; Condensation
  • Thermal Conductivity: 0.3100
Dow DOWSIL™ 3-4207 Dielectric Tough Gel Green 36.2 kg Kit -- 3-4207 TOUGH GEL 36.2KG KT [3127621 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow DOWSIL ™ 3-4207 Dielectric Tough Gel Clear-Green is a two component, room temperature curing, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. It is durable, fast curing, requires no primer, and has good... [See More]

  • Industry: Electronics
  • Chemical System: Silicone
  • Type: High Dielectric
  • Cure / Technology: Two Component  
Edgebond -- ALPHA HiTech
from MacDermid Alpha Electronics Solutions

ALPHA HiTech Edgebond is a one component, heat curable material. It is an epoxy material to be dispensed on the corners or edges of the BGA. Upon deposition, minimal flow will take place beneath the BGA, to minimize contact with outer solder balls. The cured edgebond will help to strengthen the... [See More]

  • Industry: Electronics; Semiconductors, IC's
  • Chemical System: Epoxy
  • Form / Function: Liquid; Glob Top, Daub, Doming or Overfill
  • Cure / Technology: Single Component
B-Staged Epoxy Meets Airbus Standards for Flame Retardancy & Toxicity -- EP36FR
from Master Bond, Inc.

EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's; Aerospace
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
2-Part, Firm, Black Silicone Gel and Encapsulant -- TufGel-336
from CHT USA Inc.

CHT ’s TufGel 336 is a 2-part, tough, black silicone gel designed for electronic potting applications to provide protection from moisture, vibration and thermal or mechanical shock. TufGel 336 can also function as a contrast enhancement material in LED applications. TufGel 336 is also flame... [See More]

  • Industry: Automotive; Electronics; OEM or Industrial
  • Chemical System: Silicone
  • Form / Function: Gel
  • Cure / Technology: Two Component  ; Addition
Dow DOWSIL™ 3-4207 Dielectric Tough Gel Green 7.2 kg Kit -- 3-4207 TOUGH GEL 7.2KG KIT [3127613 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow DOWSIL ™ 3-4207 Dielectric Tough Gel Clear-Green is a two component, room temperature curing, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. It is durable, fast curing, requires no primer, and has good... [See More]

  • Industry: Electronics
  • Chemical System: Silicone
  • Type: High Dielectric
  • Cure / Technology: Two Component  
Underfills -- ALPHA HiTech
from MacDermid Alpha Electronics Solutions

ALPHA HiTech Underfills are dispensed along edges of BGA, CSP, or flip chip devices, flowing to perfectly fill the device footprint. The one-component, halogen-free epoxies provide superior drop-shock, impact bend, and thermal cycle test performance for the most demanding component designs.Through... [See More]

  • Industry: Electronics; Semiconductors, IC's
  • Chemical System: Epoxy
  • Form / Function: Liquid
  • Cure / Technology: Single Component
Dual Curing, Thixotropic Adhesive -- UV22DC80-10F
from Master Bond, Inc.

One part, nanosilica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]

  • Industry: Marine; Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
  • Form / Function: Liquid; Encapsulant or Conformal Coating; Glob Top, Daub, Doming or Overfill
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: UV Curing
2-Part, Firm, Opticially Clear Silicone Gel & Encapsulant -- TufGel-330
from CHT USA Inc.

CHT's TufGel 330 is a 2-part, clear, tough, moderately cross-linked silicone gel. It has good room temperature cure adhesion to many substrates. TufGel 330 is used to provide protection from vibration and thermal or mechanical shock and will also provide excellent moisture protection. [See More]

  • Industry: Automotive; Electronics; OEM or Industrial
  • Cure / Technology: Two Component  ; Addition
  • Form / Function: Gel
  • Use Temperature: -67 to 399
Dow DOWSIL™ 3-4222 Dielectric Firm Gel Transparent Green 36 kg Kit -- 3-4222 DIELECT GEL 36KG [4022215 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow DOWSIL ™ 3-4222 Dielectric Firm Gel Clear-Green is a two component, room temperature curing, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. It is durable, fast curing, requires no primer, and has excellent... [See More]

  • Industry: Electronics
  • Chemical System: Silicone
  • Type: High Dielectric
  • Cure / Technology: Two Component  
Electrically and Thermally Conductive, Two Part Silicone Meets NASA Low Outgassing Specifications -- MasterSil 973S-LO
from Master Bond, Inc.

MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]

  • Industry: Marine; Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial; Semiconductors, IC's
  • Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating
  • Type: Electrically Conductive; Thermally Conductive
  • Chemical System: Silicone
2-Part, Optically Clear Silicone Potting Compounds and Encapsulants -- QSil 216
from CHT USA Inc.

CHT's QSil 216 is a 2-part, platinum cure, optically clear silicone encapsulant designed for optical applications. QSil 216 features a 10:1 mix ratio by weight and its low viscosity profile enables excellent flow around components and is excellent for potting complex parts. The chemical composition... [See More]

  • Industry: Automotive; Electronics; OEM or Industrial
  • Cure / Technology: Two Component  ; Addition
  • Type: High Dielectric; Optical
  • Use Temperature: -67 to 399
Dow DOWSIL™ 3-4241 Dielectric Tough Gel Green 7.2 kg Kit -- 3-4241 DIELECT TGH 7.2KG [4015093 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow DOWSIL ™ 3-4241 Dielectric Tough Gel Clear-Green is a two component, heat curing, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. It is durable, fast curing, requires no primer, flame resistant, long working... [See More]

  • Industry: Electronics
  • Chemical System: Silicone
  • Type: High Dielectric
  • Cure / Technology: Two Component  
Electrically Conductive Die Attach Adhesive Has Very High Thermal Conductivity -- EP3HTSDA-1
from Master Bond, Inc.

EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]

  • Industry: Marine; Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
2-Part, Silicone Gel and Encapsulant with UV Tracer -- QGel-311UV
from CHT USA Inc.

CHT's QGEl 311UV is a 2-part, platinum cure, special purpose silicone gel. It is designed with convenient 1:1 mix ratio, and low viscosity for easy dispensing. QGel 311UV is soft, but resilient and is amoderately cross-linked silicone polymer. QGel 311UV is clear but contains a UV tracer for easy QC... [See More]

  • Industry: Automotive; Electronics; OEM or Industrial
  • Cure / Technology: Two Component  ; Addition
  • Form / Function: Gel
  • Use Temperature: -67 to 399
Dow DOWSIL™ 3-6635 Dielectric Gel Clear 18.1 kg Pail -- 3-6635 DIELECT GEL 18.1KG [2187850 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow DOWSIL ™ 3-6635 Dielectric Gel Clear is a one component, heat curing, low temperature gel that is used to protect electrical components from extreme environments, moisture, and stress. It is flowable, low viscosity, durable, and self healing. 18.1 kg Pail. [See More]

  • Industry: Electronics
  • Chemical System: Silicone
  • Type: High Dielectric
  • Cure / Technology: Single Component
Electrically Conductive Die Attach Epoxy With High Glass Transition Temperature -- EP17HTS-DA
from Master Bond, Inc.

Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]

  • Industry: Marine; Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
  • Type: Electrically Conductive; Thermally Conductive
  • Chemical System: Polyphenylene Sulfide; Epoxy
2-Part, Silicone Potting Compound and Encapsulant, UL Listed -- QSil-563
from CHT USA Inc.

CHT's QSil 563 is a 2-part, platinum cure, 100% silicone solids elastomer designed for electronic potting and encapsulation applications. QSil 562 offers a hard, low modulus material that is readily repairable. QSil 563 is thermally conductive to aid in efficient heat dissipation. This silicone... [See More]

  • Industry: Automotive; Electronics
  • Cure / Technology: Two Component  ; Addition
  • Type: Thermally Conductive
  • Features: Flame Retardant; UL Rating
Dow DOWSIL™ EE-3200 Silicone Encapsulant Part A Off-White 0.5 kg Jar -- EE-3200 PART A .5KG [4121014 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow DOWSIL ™ EE-3200 Low Stress Silicone Encapsulant is a two component, low viscosity encapsulant with a 1:1 mix ratio, good heat dissipation, and good thermal conductivity. Once thoroughly mixed, the mixture will cure to a flexible elastomer for the protection of electronic and electrical... [See More]

  • Industry: Automotive; Electronics
  • Cure / Technology: Two Component  
  • Chemical System: Silicone
  • Thermal Conductivity: 0.5000
Epoxy Features Very Low Coefficient of Thermal Expansion -- EP30LTE-2
from Master Bond, Inc.

Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating. [See More]

  • Industry: Marine; Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
  • Form / Function: Liquid; Encapsulant or Conformal Coating
  • Type: High Dielectric; Thermal Insulation
  • Chemical System: Epoxy
2-Part, Thermally Conductive Silicone Encapsulants, UL Listed -- SE3000
from CHT USA Inc.

CHT's SE3000 is a 2-part, platinum cure silicone elastomer designed for electronic potting and encapsulation applications. It offers good prtection against chemicals, environmental contamination, mechanical shock, vibration and impact damage. SE3000 can be used in applications where low flammability... [See More]

  • Industry: Electronics
  • Cure / Technology: Two Component  ; Addition
  • Type: Thermally Conductive
  • Features: Flame Retardant; UL Rating
Dow DOWSIL™ EE-3200 Silicone Encapsulant Part B Black 0.5 kg Jar -- EE-3200 PART B .5KG [4121013 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow DOWSIL ™ EE-3200 Low Stress Silicone Encapsulant is a two component, low viscosity encapsulant with a 1:1 mix ratio, good heat dissipation, and good thermal conductivity. Once thoroughly mixed, the mixture will cure to a flexible elastomer for the protection of electronic and electrical... [See More]

  • Industry: Automotive; Electronics
  • Cure / Technology: Two Component  
  • Chemical System: Silicone
  • Thermal Conductivity: 0.5000
Epoxy Meets Airbus Standards for Flame Retardancy, Smoke and Gas Emissions -- EP93FRHT
from Master Bond, Inc.

EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]

  • Industry: Marine; Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
2-Part, Thermally Conductive Silicone Potting Compound and Encapsulant, UL Listed -- QSil-553
from CHT USA Inc.

CHT's QSil 553 is a 2-part, platinum cure, silicone potting compound and encapsulant designed to protect electronic components from harsh environmental conditions and shock and vibration. It features a low viscosity for convenient dispensing and will easily flow throughout components. Because of its... [See More]

  • Industry: Automotive; Electronics; OEM or Industrial
  • Cure / Technology: Two Component  ; Addition
  • Type: Thermally Conductive
  • Features: Flame Retardant; UL Rating
Dow DOWSIL™ EG-3810 Dielectric Gel Encapsulant Clear 18 kg Pail -- EG-3810 DIELECTRIC GEL 18KG PAIL [4116483 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow DOWSIL ™ EG-3810 Dielectric Gel is a one component, clear, heat curing silicone gel that is used for potting, sealing, encapsulating, and protecting a variety of materials in the electronics industry. It offers a wide range of operating temperatures ranging from -60 °C to 200 °C,... [See More]

  • Industry: Electronics; Semiconductors, IC's
  • Chemical System: Silicone
  • Type: High Dielectric
  • Cure / Technology: Single Component
Epoxy with High Elongation Passes ISO 10993-5 Certification for Cytotoxicity -- EP40Med
from Master Bond, Inc.

EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]

  • Industry: Sanitary; Electronics; OEM or Industrial
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
Silicone Conformal Coating, UL Listed -- ACC15
from CHT USA Inc.

CHT's ACC15 is a low viscosity, 1-part, condensation curing silicone coating. The uncured product can be applied by pouring or brushing and is readily cured to a tough, transparent rubber. ACC15 can be used to coat printed circuit boards to prevent ingress of water an environmental contaminants. It... [See More]

  • Industry: Automotive; Electronics
  • Cure / Technology: Alkoxy
  • Form / Function: Encapsulant or Conformal Coating
  • Features: UL Rating
Dow SYLGARD™ 527 Silicone Dielectric Gel Clear 0.9 kg Kit -- 527 SIL DIELECT GEL .9KG [1696742 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow SYLGARD ™ 527 Silicone Dielectric Gel is a two component, room temperature and heat curing gel that is used for coating, encapsulating, potting, and sealing electronic devices. It provides flexibility, good flow, and low viscosity. 1:1 mix ratio. 0.9 kg Kit. [See More]

  • Industry: Electronics
  • Chemical System: Silicone
  • Type: High Dielectric
  • Cure / Technology: Two Component  
Extremely Soft MasterSil 170 Gel Encapsulant Offers Removability and Optical Clarity -- MasterSil 170 Gel
from Master Bond, Inc.

MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]

  • Industry: Aerospace; Electronics; Photonics; OEM or Industrial; Semiconductors, IC's
  • Form / Function: Liquid
  • Type: High Dielectric; Optical; Thermally Conductive
  • Chemical System: Silicone
Dow SYLGARD™ 527 Silicone Dielectric Gel Clear 36.3 kg Kit -- 527 SIL DIELECT GEL 36.3KG [2068001 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow SYLGARD ™ 527 Silicone Dielectric Gel is a two component, room temperature and heat curing gel that is used for coating, encapsulating, potting, and sealing electronic devices. It provides flexibility, good flow, and low viscosity. 1:1 mix ratio. 36.3 kg Kit. [See More]

  • Industry: Electronics
  • Chemical System: Silicone
  • Type: High Dielectric
  • Cure / Technology: Two Component  
Fast Curing, Optically Clear, Two Part Epoxy -- EP39-2
from Master Bond, Inc.

Master Bond Polymer System EP39-2 is a fast curing, low viscosity, optically clear two component epoxy system for high performance bonding, sealing, coating and casting. It is 100% reactive and does not contain any diluents, solvents or other volatiles. The mix ratio is a convenient 2 to 1 by... [See More]

  • Industry: Marine; Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Die Bonding Adhesives
  • Composition: Unfilled
Dow SYLGARD™ 527 Silicone Dielectric Gel Clear 7.2 kg Kit -- 527 SIL DIELECT GEL 7.2KG [2115387 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow SYLGARD ™ 527 Silicone Dielectric Gel is a two component, room temperature and heat curing gel that is used for coating, encapsulating, potting, and sealing electronic devices. It provides flexibility, good flow, and low viscosity. 1:1 mix ratio. 7.2 kg Kit. [See More]

  • Industry: Electronics
  • Chemical System: Silicone
  • Type: High Dielectric
  • Cure / Technology: Two Component  
High Glass Transition Temperature Epoxy System -- EP62-1
from Master Bond, Inc.

Master Bond EP62-1 is a two component heat cured and chemically resistant epoxy resin system featuring a long pot life at ambient temperatures and efficient cures at moderately elevated temperatures. The reccommended mix ratio is 100 parts of component A to 10 parts of component B. The pot life of... [See More]

  • Industry: Marine; Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial; Semiconductors, IC's
  • Cure / Technology: Thermoset; Two Component  
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Use Temperature: -60 to 400
Dow SYLGARD™ 527 Silicone Dielectric Gel Part B Clear 18.1 kg Pail -- 527 DIELECT PT B 18.1KG [2333040 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow SYLGARD ™ 527 Silicone Dielectric Gel is a two component, room temperature and heat curing gel that is used for coating, encapsulating, potting, and sealing electronic devices. It provides flexibility, good flow, and low viscosity. 1:1 mix ratio. Part B, 18.1 kg Pail. [See More]

  • Industry: Electronics
  • Chemical System: Silicone
  • Type: High Dielectric
  • Cure / Technology: Two Component  
High Temperature Resistant Epoxy Compound -- EP45HT
from Master Bond, Inc.

Master Bond Polymer System EP45HT is a two component epoxy system for high performance structural bonding and casting. It is suitable for applications where long term exposure to temperatures from -80 °F to +500 °F is required. lt is 100% reactive and does not contain any solvents or... [See More]

  • Industry: Marine; Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial; Semiconductors, IC's
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Die Bonding Adhesives
  • Composition: Unfilled
Henkel Loctite STYCAST 2662 High Temp Epoxy Encapsulant Black 1 gal Pail -- 2662 BLACK 11LB [1188082 from Henkel Corporation - Industrial]
from Ellsworth Adhesives

Henkel Loctite STYCAST 2662 Black, formerly Emerson and Cuming, is a two component, filled, epoxy encapsulant that is used for sealing and potting components that are exposed to high temperatures. It is resistant to chemicals, moisture, and high temperature. 1 gal Pail. [See More]

  • Industry: Electronics
  • Cure / Technology: Two Component  
  • Chemical System: Epoxy
  • Thermal Conductivity: 0.5300
High Temperature Resistant, One Component Epoxy System -- EP13
from Master Bond, Inc.

Master Bond Polymer System EP13 is a one component heat curing epoxy featuring high shear strength and very high temperature resistance. This one component system is formulated to cure at temperatures from 300 °F to 350 °F for 60-90 minutes. Upon cure, EP13 readily attains tensile shear... [See More]

  • Industry: Marine; Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Semiconductors, IC's
  • Form / Function: Encapsulant or Conformal Coating; Die Bonding Adhesives
  • Type: High Dielectric
  • Chemical System: Epoxy
Henkel Loctite STYCAST 2662 High Temp Epoxy Encapsulant Black 1 qt Can -- 2662 BLK 2LB RESIN ONLY [1188081 from Henkel Corporation - Industrial]
from Ellsworth Adhesives

Henkel Loctite STYCAST 2662 Black, formerly Emerson and Cuming, is a two component, filled, epoxy encapsulant that is used for bonding, sealing, and potting electronic components that are exposed to high temperatures. It offers excellent electrical and physical properties; it is resistant to... [See More]

  • Industry: Electronics
  • Cure / Technology: Two Component  
  • Chemical System: Epoxy
  • Thermal Conductivity: 0.5300
High Temperature Resistant, Toughened Epoxy -- EP125
from Master Bond, Inc.

Master Bond Polymer System 125 is a two component toughened epoxy resin for prolonged service above 500 °F with truly outstanding chemical resistance. High strength bonds serviceable up to 600 °F can be obtained with this exceptionally thermally stable and chemically resistant epoxy resin... [See More]

  • Industry: Marine; Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
  • Form / Function: Powder; Gap Filler, Foam in Place Gasket; Impregnating Resin; Die Bonding Adhesives
  • Type: High Dielectric; Thermal Insulation
  • Chemical System: Epoxy
Highly Flexible Addition Cured Silicone Offers Low Thermal Resistance -- MasterSil 151TC
from Master Bond, Inc.

MasterSil 151TC is a highly flexible, temperature resistant two component silicone adhesive offering low thermal resistance and outstanding thermal conductivity. It was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. [See More]

  • Industry: Marine; Sanitary; Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Silicone
Low Outgassing, Optically Clear Two Component Epoxy -- EP29LPSP
from Master Bond, Inc.

Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. Not only is EP29LPSP able to function as an adhesive, sealant and protective coating at temperatures as low as 4K, but it is... [See More]

  • Industry: Marine; Aerospace; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Type: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding
  • Chemical System: Epoxy
Low Viscosity Structural Epoxy Adhesive System -- EP112
from Master Bond, Inc.

Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronic/ structural applications. The two components are combined in a convenient noncritical mix... [See More]

  • Industry: Marine; Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating; Impregnating Resin
  • Type: High Dielectric; Optical; Thermal Insulation
  • Chemical System: Epoxy
Low Viscosity, Electrically Insulating Epoxy Features Excellent Optical Clarity -- EP30LP-2
from Master Bond, Inc.

Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. [See More]

  • Industry: Marine; Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Type: High Dielectric; Optical; Thermally Conductive
  • Chemical System: Epoxy
Low Viscosity, Fast Curing, Two Component Epoxy -- EP38
from Master Bond, Inc.

Master Bond Polymer System EP38 is a fast curing, low viscosity, optically clear two component epoxy system for high performance coating, bonding and sealing. It is 100% reactive and does not contain any volatiles. The mix ratio is a convenient 3 to 1 by weight. EP38 is very fast curing. Coatings as... [See More]

  • Industry: Marine; Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Die Bonding Adhesives
  • Type: High Dielectric
  • Chemical System: Epoxy
Moderate Viscosity Thermally Conductive Epoxy -- EP112AO
from Master Bond, Inc.

Master Bond Polymer System EP112AO is a solventless, moderate viscosity two component epoxy resin system which is specifically designed for high performance outdoor and indoor electrical and electronic applications where good thermal conductivity and electrial isolation is required. The two... [See More]

  • Industry: Marine; Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
Chemical Resistant Epoxy System -- 20-3004 HV
from Epoxies Etc...

20-3004 LV & HV are two component chemical resistance epoxy systems. They were developed for potting, coating, and adhesive applications requiring superior chemical resistance. They exhibit outstanding bonds to a variety of substrates. [See More]

  • Industry: Electronics
  • Chemical System: Epoxy
  • Form / Function: Gel
  • Composition: Unfilled
All Polyimide High Temperature Bonding Film -- Pyralux® HT
from DuPont Electronics & Imaging

DuPont ™ Pyralux ® HT bonding film can be used in conjunction with Pyralux ® AP to create a complete all-polyimide flex laminate system that includes a double-sided, copper-clad laminate and a unique all-polyimide coverfilm or bonding material that becomes a flexible coverlay after... [See More]

  • Industry: Electronics; OEM or Industrial
  • Features: UL Rating
  • Chemical System: Polyimide
  • Use Temperature: 437
Di-Pak™ E-4000 Series Elastomeric Eletrical Insulating Compound -- E-4021
from Hapco, Inc.

Flexible, colorless, potting and encapsulating systems. Available in 5 minute (-5), 16 minute, and 20 minute gel times, and in shore hardness ’s from 20 A to 80 A . [See More]

  • Industry: Electronics
  • Form / Function: Liquid
  • Type: High Dielectric
  • Cure / Technology: Thermoset; Two Component  
Light Cure Cyanoacrylate Instant Adhesive -- KU3064
from Chemence Inc.

Krylex KU3064 is a revolutionary odorless light curing cyanoacrylate adhesive. It is designed for bonding applications that require very rapid fixture, fillet cure or surface cure. The UV / visible light cure properties facilitate rapid curing of exposed surface areas while the moisture curing... [See More]

  • Industry: Sanitary; Electronics; OEM or Industrial; Printing, Medical use and General Industrial Assembly
  • Cure / Technology: UV or Radiation Cured; Single Component; Reactive or Moisture Cured
  • Form / Function: Liquid; Die Bonding Adhesives
  • Gap Fill: 0.0500
Heat Curing Electronic Coating Silicone Compound -- Bluesil™ V-207
from Bluestar Silicones USA Corp.

Clear, Two-Component, Addition Cure, Heat Curing Electronic coating Silicone Compound. Properties. Viscosity 6000. Hardness Sha 30. Description. BLUESIL V-207 is a clear, two component, addition cure, heat curing silicone rubber compound. It is designed as a primerless coating and encapsulating... [See More]

  • Industry: Electronics
  • Chemical System: Silicone
  • Form / Function: Liquid; Encapsulant or Conformal Coating
  • Cure / Technology: Thermoset; Two Component  ; Reactive or Moisture Cured
?utomotive Pastes
from Monocrystal, Inc.

AGH – series. Application: High conductive low firing silver paste for fine line screen printing. Silver conductor is specially designed to form the conductive coating and bond area to the glass and ceramic substrate by screen printing method. Composition variations: AGH-A-60 – 60%... [See More]

  • Industry: Electronics
  • Type: Electrically Conductive
Cement -- No. 31
from Sauereisen, Inc.

Sauereisen Cement No. 31 is a white, porcelain-like cement that is widely used throughout industry in a variety of applications. including assembling, sealing, insulating and cementing of ceramics, porcelain, metal, and glass. [See More]

  • Industry: Electronics; Electric Power
  • Form / Function: Powder; Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Ceramic
Conformal EMI Shielding Material -- LOCTITE ABLESTIK EMI 8660S
from Henkel Corporation - Electronics

With the increasing proliferation of wireless devices, designers are challenged with various electromagnetic waves from multiple sources radiating at the same spectrum of frequencies resulting in electromagnetic interference(EMI). Radio-frequency(RF) emitting devices require effective isolation to... [See More]

  • Industry: Electronics
  • Form / Function: Liquid; Encapsulant or Conformal Coating
  • Type: Electrically Conductive; EMI/RFI Shielding
  • Cure / Technology: Single Component
Epoxy Conformal Coating -- ELC 2900
from Electro-Lite Corporation

ELC-2900 is a flexible conformal coating for PCB's and provides a flexible, reworkable finish for components and various substrates. [See More]

  • Industry: Electronics; OEM or Industrial
  • Form / Function: Liquid; Encapsulant or Conformal Coating
  • Type: Anti-static, ESD
  • Chemical System: Epoxy
Flowable, One-component Silicone Sealant -- CENUSIL® RT 760 CN A/B
from Wacker Chemical Corp.

WACKER ’s silicone adhesives and sealants are based on many years of experience, innovative research and comprehensive technological expertise. In a wide variety of industries, especially in lighting technology, flowable or non-sag silicone products offer decisive advantages in performance and... [See More]

  • Industry: Electronics
  • Chemical System: Silicone; Elastomeric
  • Type: Thermally Conductive
MG Chemicals 419c Acrylic Conformal Coating 1lt -- MGCC00007
from Techsil Limited

MG Chemicals 419c Acrylic Conformal Coating is an IPC-CC-830B and UL 94-VO certified, fast drying, one part coating product which provides an excellent finish. It is easy to use and does not require any special or costly equipment's to apply. Ideal for high moisture environments and protects... [See More]

  • Industry: Electronics
  • Form / Function: Encapsulant or Conformal Coating
Sil-Bond™ -- 905
from Aremco Products, Inc.

Aremco offers an expansive range of ceramic-based materials used for the assembly of high temperature, high power electrical devices, and high temperature fixtures, molds and tooling. These materials, based on aluminum oxide, aluminum nitride, magnesium oxide, silicon dioxide, silicon carbide,... [See More]

  • Industry: Electronics
  • Composition: Filled
  • Chemical System: Ceramic; Silicone
  • Use Temperature: 900
Biocompatible, Thermally Conductive Epoxy -- EPO-TEK® MED-T905BN-3
from Epoxy Technology

EPO-TEK ® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries.  Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market... [See More]

  • Industry: Sanitary; Electronics; Photonics
  • Chemical System: Epoxy
  • Type: High Dielectric; Optical; Thermally Conductive
  • Cure / Technology: Thermoset; Two Component  
Clear Non-Yellowing Silicone Encapsulant -- PNS-56225
from Protavic America, Inc.

PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]

  • Industry: Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Form / Function: Liquid; Encapsulant or Conformal Coating; Die Bonding Adhesives
  • Type: Electrically Conductive; Thermally Conductive
  • Chemical System: Silicone
Epoxy Adhesive & Potting Compound -- 10-3009
from Epoxies Etc...

10-3009 is a low viscosity epoxy adhesive and potting compound. It is easy to use and allows the end user to adjust the flexibility of the cured epoxy. This product offers a good combination of peel and tensile strength. 10-3009 provides electrical insulation and outstanding adhesion. [See More]

  • Industry: Electronics; OEM or Industrial
  • Form / Function: Liquid
  • Type: High Dielectric; Thermal Insulation
  • Chemical System: Epoxy
Di-Pak™ E-4500 Elastomeric Eletrical Insulating Compound -- E-4540
from Hapco, Inc.

Flexible, 45, 65 and, 95 shore A hardness, potting and encapsulating systems. Flame retardant (FR), accelerated 3 minute (-3) gel time, and black or unpigmented versions are available. [See More]

  • Industry: Electronics
  • Form / Function: Liquid
  • Type: High Dielectric
  • Cure / Technology: Thermoset; Two Component  
Two Component Thermally Conductive Silicone - High Viscosity -- KSC1202
from Chemence Inc.

KSC1202 is a high performance, high viscosity thermally conductive gap filling material. It is formulated to develop a soft, 'form in place' elastomer ideal for coupling hot PC board components to heat sinks. KSC1202 is supplied as a two part, 1:1 mix ratio silicone that when mixed will cure at room... [See More]

  • Industry: Electronics
  • Chemical System: Silicone
  • Form / Function: Die Bonding Adhesives
  • Cure / Technology: Single Component
Hysol 3329 -- 8802594848769
from Henkel Corporation - Electronics

Developed for encapsulation of wire bonded dies, used for Smartcard IC modules. It is designed for use only with Hysol ® UV dam encapsulants, such as Hysol 3323. This combination of dam and fill will pass mechanical stress testing and high reliability tests; typically thermal shock cycling -55... [See More]

  • Industry: Electronics
  • Viscosity: 8000
  • CTE: 25
Silicone Elastomer Gel Encapsulant And Potting Compound -- SilGel® 612 A/B
from Wacker Chemical Corp.

WACKER SilGel ® 612 A/B is a pourable, additioncuring, RTV-2 silicone rubber that vulcanizes at room temperature to a very soft silicone gel. Special features. two-part, 1 : 1 mixing ratio. low viscosity. rapid heat cure. very low hardness (silicone gel). crystal clear. pronounced inherent tack. [See More]

  • Industry: Automotive; Electronics; Electric Power
  • Form / Function: Liquid
  • Type: Optical
  • Chemical System: Silicone; Elastomeric
MG Chemicals 419c Conformal Coating Aerosol 340gm -- MGCC00006
from Techsil Limited

MG Chemicals 419c Acrylic Conformal Coating is an IPC-CC-830B and UL 94-VO certified, fast drying, one part coating product which provides an excellent finish. It is easy to use and does not require any special or costly equipment's to apply. Ideal for high moisture environments and protects... [See More]

  • Industry: Electronics
  • Form / Function: Encapsulant or Conformal Coating
Clear Urethane Cast/Adhesive -- PNU-46201
from Protavic America, Inc.

The two component polyurethane compound described in this data sheet is specifically designed for the encapsulation by casting of completed circuit board. The cured material meets the flammability requirements of UL 94, V-O at thickness of 0.070 in. and greater (UL File Number E116296) and provides... [See More]

  • Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Form / Function: Liquid; Encapsulant or Conformal Coating
  • Type: High Dielectric; Thermal Insulation
  • Chemical System: Polyurethane
Flame Retardant Polyurethane -- 50-2369 FR
from Epoxies Etc...

The 50-2369FR Potting and Encapsulating Compound has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-2369 FR Urethane is listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low exotherm, and excellent electrical... [See More]

  • Industry: Electronics; OEM or Industrial; Semiconductors, IC's; Surface Mount Components
  • Form / Function: Gel
  • Type: Thermally Conductive
  • Chemical System: Polyurethane
Di-Pak™ E-4600 Elastomeric Eletrical Insulating Compound -- E-4650
from Hapco, Inc.

Flexible, high strength, 50 to 71 shore D hardness potting and encapsulating systems. Available in flame retardant (FR), 3 minute (-3) gel time, and in black or unpigmented. [See More]

  • Industry: Electronics
  • Form / Function: Liquid
  • Type: High Dielectric
  • Cure / Technology: Thermoset; Two Component  
TECHNOMELT AS 8998
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Industry: Electronics
  • Chemical System: Polyolefin
  • Form / Function: Pellets
  • Cure / Technology: Thermoplastic / Hot Melt
MG Chemicals 419D Premium Conformal Coating 1lt -- MGCC00008
from Techsil Limited

MG Chemicals 419D Premium Acrylic Conformal Coating is an IPC-CC-830B and UL 94-VO certified, fast drying, one part coating product which is easy to use. It serves to protect electric circuits against moisture, dirt, dust, thermal shocks and scratches whilst also insulating against high-voltage... [See More]

  • Industry: Electronics
  • Form / Function: Encapsulant or Conformal Coating
Epoxy Adhesive -- ANE-26144
from Protavic America, Inc.

Clear unfilled epoxy also available in a one-part system. Use life is over three days after mixing at room temperature. Excellent for ferrite and optical bonding applications. Requires heat assist to cure. [See More]

  • Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Form / Function: Liquid; Encapsulant or Conformal Coating; Die Bonding Adhesives
  • Type: High Dielectric
  • Chemical System: Epoxy
Flame Retardant Thermally Conductive -- 50-3150 FR
from Epoxies Etc...

50-3150 FR has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-3150 FR Black Epoxy with Catalyst 190 and Catalyst 105 are listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low shrinkage, and outstanding insulation... [See More]

  • Industry: Electronics; Electric Power
  • Form / Function: Liquid
  • Type: Thermally Conductive
  • Chemical System: Epoxy
Di-Pak™ Elastomeric Eletrical Insulating Compound -- E-4501
from Hapco, Inc.

Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E products are flame... [See More]

  • Industry: Electronics
  • Form / Function: Liquid
  • Type: High Dielectric; Thermally Conductive
  • Cure / Technology: Thermoset; Two Component  
TECHNOMELT PA 2384 -- 8807299842049
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Industry: Electronics
  • Form / Function: Pellets
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Polyamide
MG Chemicals 4223 Urethane Conformal Coating 55ml -- MGCC00009
from Techsil Limited

MG Chemicals 4223 Urethane Conformal Coating offers a highly chemical-resistant finish that meets UL standards for indoor conformal coatings. This PU protects electric circuits against corrosive chemicals, moisture, dirt, dust, thermal shocks and scratches, alongside is also insulates against... [See More]

  • Industry: Electronics
  • Chemical System: Polyurethane
  • Form / Function: Encapsulant or Conformal Coating
Optically Clear UV Adhesive -- ANA-97290
from Protavic America, Inc.

ANA-97290 is a clear Ultraviolet/ Visible light curing adhesive. It has very low shrinkage during cure for alignment sensitive parts. It is recommended for small electrical/electronic casting and encapsulating applications that require a unique combination of excellent wetting, flow, good thermal... [See More]

  • Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Form / Function: Liquid; Encapsulant or Conformal Coating; Gel (optional feature); Die Bonding Adhesives
  • Type: Electrically Conductive; Thermal Insulation
  • Composition: Unfilled
Flexible UV Curable Compound -- UV 60-7016
from Epoxies Etc...

UV 60-7016 is a high performance Ultraviolet Curable Adhesive, Sealant, and Potting Compound. This new one component urethane acrylate system was specifically designed for the difficult bonding of glass to metal. UV 60-7016 has outstanding thermal shock and impact resistance, and is an excellent... [See More]

  • Industry: Electronics; OEM or Industrial
  • Chemical System: Elastomeric; Polyurethane
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
  • Composition: Unfilled
Di-Pak™ Elastomeric Eletrical Insulating Compound -- E-4888
from Hapco, Inc.

High performance, flexible potting systems designed to be in constant water immersion while maintaining electrical and physical properties. DI-PAK E-4888 & E-4889 were designed to meet Naval underwater applications. [See More]

  • Industry: Electronics
  • Form / Function: Liquid
  • Type: High Dielectric
  • Cure / Technology: Thermoset; Two Component  
TECHNOMELT PA 2692
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Industry: Electronics
  • Form / Function: Pellets
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Polyamide
MG Chemicals 422B Silicone Conformal Coating 1lt -- MGCC00015
from Techsil Limited

MG Chemicals 422B is a silicone modified conformal coating which is a clear and flexible coating, ideal for protecting electronic circuits in high temperature environments or applications requiring extreme flexibility. It protects against moisture, dirt, dust, and other particulates thus avoiding... [See More]

  • Industry: Electronics
  • Chemical System: Silicone; Elastomeric
  • Form / Function: Encapsulant or Conformal Coating
Polyurethane Adhesive -- PNU-56200
from Protavic America, Inc.

PNU-56200 ™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term circuit protection and... [See More]

  • Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Form / Function: Liquid; Encapsulant or Conformal Coating; Die Bonding Adhesives
  • Type: High Dielectric
  • Chemical System: Polyurethane
Di-Pak™ Elastomeric Eletrical Insulating Compound -- E-4901-2
from Hapco, Inc.

Low cost, easy to use, potting compounds with fast cycle times. Available in 3 speeds. [See More]

  • Industry: Electronics
  • Form / Function: Liquid
  • Type: High Dielectric
  • Cure / Technology: Thermoset; Two Component  
TECHNOMELT PA 341 -- 8802588327937
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Industry: Electronics; Electric Power
  • Form / Function: Pellets
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Polyamide
MG Chemicals 422B Silicone Conformal Coating 340gm -- MGCC00013
from Techsil Limited

MG Chemicals 422B Silicone Conformal Coating is a clear and flexible aerosol coating that is ideal for protecting electronic circuits in high temperature environments or applications requiring extreme flexibility. It protects against moisture, dirt, dust, and other particulates thus avoiding... [See More]

  • Industry: Electronics
  • Chemical System: Silicone; Elastomeric
  • Form / Function: Encapsulant or Conformal Coating
Reworkable Underfill Epoxy Resin -- ANA-10199R
from Protavic America, Inc.

Fast flow, fast cure capillary reworkable underfill. The rheology of the PROTAVIC ANA 10199 R in combination with its fineness make the product perfectly adapted to high reliability small gap underfill applications. It presents a good pot life at room temperature 20-22C and a high reactivity at... [See More]

  • Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
  • Type: High Dielectric; Thermal Insulation
  • Composition: Unfilled
Di-Pak™ Rigid Eletrical Insulating Compound -- R-4200
from Hapco, Inc.

DI-COAT R-4721 / DI-COAT R-4721 LV (lower viscosity). Shore 90 D, room temperature curing, medium to high thixotropic coating for dielectric insulating applications. DI-COAT R-4721 is ideal for use on vertical or sloping surfaces where flow or drain-off cannot be tolerated. DI-COAT R-4721 is easy to... [See More]

  • Industry: Electronics
  • Form / Function: Liquid
  • Type: High Dielectric
  • Cure / Technology: Thermoset; Two Component  
TECHNOMELT PA 5375
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Industry: Electronics
  • Form / Function: Pellets
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Polyolefin
MG Chemicals 422B Silicone Conformal Coating 55ml -- MGCC00018
from Techsil Limited

MG Chemicals 422B is a silicone modified conformal coating which is a clear and flexible coating, ideal for protecting electronic circuits in high temperature environments or applications requiring extreme flexibility. It protects against moisture, dirt, dust, and other particulates thus avoiding... [See More]

  • Industry: Electronics
  • Chemical System: Silicone; Elastomeric
  • Form / Function: Encapsulant or Conformal Coating
TECHNOMELT PA 6208 Black -- 8799566462977
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Industry: Electronics
  • Form / Function: Pellets
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Polyamide
MG Chemicals Black Encapsulating/Potting Epoxy Kit -- MGEP00009
from Techsil Limited

MG Chemicals 832B is a black electronic grade epoxy designed for encapsulating and potting. This compound is simple mix, easy to use and protects against static discharges, shocks, vibrations, and mechanical impacts. It insulates against heat and conductivity as well as being extremely resistant to... [See More]

  • Industry: Electronics
  • Chemical System: Epoxy
TECHNOMELT PA 668 Clear
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Industry: Electronics
  • Form / Function: Pellets
  • Type: High Dielectric; Optical; Thermally Conductive
  • Chemical System: Polyamide
MG Chemicals Flame Retardant Potting Epoxy 375ml -- MGEP00013
from Techsil Limited

MG Chemicals 834ATH Flame Retardant Epoxy is a economical, electronic-grade, self-extinguishing, flame retardant epoxy that provides excellent physical, chemical and electrical protection with a degree of thermal conductivity. Designed for encapsulating and potting, this two-part epoxy protects... [See More]

  • Industry: Electronics
  • Features: Flame Retardant
  • Chemical System: Epoxy
MG Chemicals FR Low Viscosity Potting Epoxy 375ml -- MGEP00016
from Techsil Limited

MG 834FRB is a black, flame retardant potting and encapsulation compound that offers extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. Thanks to its low viscosity, MG 834 FRB is the ideal choice when applications require small gaps or... [See More]

  • Industry: Electronics
  • Features: Flame Retardant
  • Chemical System: Epoxy
MG Chemicals Thermally Conductive Epoxy 450ml -- MGEP00012
from Techsil Limited

MG Chemicals 832TC is a thermally conductive encapsulating and potting epoxy compound designed for use with electronics. It uses a high-purity aluminum oxide to provide excellent thermal conductivity at reasonable costs. This black, two-part epoxy provides superior shock insulation and impact... [See More]

  • Industry: Electronics
  • Chemical System: Epoxy
MG Chemicals Translucent Potting Epoxy 450ml -- MGEP00015
from Techsil Limited

MG Chemicals 832C is a translucent electronic grade epoxy designed for encapsulating and potting. This compound is simple mix, easy to use and protects against static discharges, shocks, vibrations, and mechanical impacts. It insulates against heat and conductivity as well as being extremely... [See More]

  • Industry: Electronics
  • Chemical System: Epoxy
MG Chemicals Translucent Potting Epoxy Kit 375ml -- MGEP00010
from Techsil Limited

MG Chemicals 832C is a translucent electronic grade epoxy designed for encapsulating and potting. This compound is simple mix, easy to use and protects against static discharges, shocks, vibrations, and mechanical impacts. It insulates against heat and conductivity as well as being extremely... [See More]

  • Industry: Electronics
  • Chemical System: Epoxy
MG Chemicals Water Clear Epoxy 375ml -- MGEP00017
from Techsil Limited

MG 832WC is a general purpose, water clear potting and encapsulation compound which offers extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. This product is designed for applications where high clarity is required; it will not yellow when... [See More]

  • Industry: Electronics
  • Chemical System: Epoxy
Momentive RTV12A Clear Potting Compound 4.54kg -- MOSI02057
from Techsil Limited

RTV12 A is a clear, two component, low viscosity potting compound that cures at room temperature to a soft pliable rubber. It will cure in deep section without additional heating or moisture. RTV12 A is the base compound and requires a curing agent to be mixed with. For a clear product which allows... [See More]

  • Industry: Electronics
  • Chemical System: Silicone; Elastomeric
Momentive RTV12A Clear Potting Compound 454gm -- MOSI02055
from Techsil Limited

RTV12 A is a clear, two component, low viscosity potting compound that cures at room temperature to a soft pliable rubber. It will cure in deep sections without additional heating or moisture. RTV12 A is the base compound and requires a curing agent to be mixed with. For a clear product which allows... [See More]

  • Industry: Electronics
  • Chemical System: Silicone; Elastomeric
Momentive RTV12A Clear Potting Compound 907gm -- MOSI02056
from Techsil Limited

RTV12 A is a clear, two component, low viscosity potting compound that cures at room temperature to a soft pliable rubber. It will cure in deep section without additional heating or moisture. RTV12 A is the base compound and requires a curing agent to be mixed with. For a clear product which allows... [See More]

  • Industry: Electronics
  • Chemical System: Silicone; Elastomeric
Momentive RTV31 High Temp Potting Silicone+DBT 1lb -- MOSI02075
from Techsil Limited

Momentive RTV31 is a high temperature silicone rubber potting compound suitable for a range of applications. It is widely used for the potting and encapsulation of electric motors and transformers, casting moulds for low-melting point metals and for the fabrication of rubber parts. Also suitable for... [See More]

  • Industry: Electronics
  • Use Temperature: -54 to 260
  • Chemical System: Silicone; Elastomeric
Momentive RTV31 High Temp Potting Silicone+DBT 2lb -- MOSI02076
from Techsil Limited

Momentive RTV31 is a high temperature silicone rubber potting compound suitable for a range of applications. It is widely used for the potting and encapsulation of electric motors and transformers, casting moulds for low-melting point metals and for the fabrication of rubber parts. Also suitable for... [See More]

  • Industry: Electronics
  • Use Temperature: -54 to 260
  • Chemical System: Silicone; Elastomeric
Momentive RTV560 Red Electronic Silicone +DBT 12lb -- MOSI02088
from Techsil Limited

RTV560 is a silicone rubber compound from Momentive Performance Materials. It offers excellent release properties and also good adhesion capabilities with the use of a primer. This grade with cure at room temperature and retains its elastomeric properties across a wide temperature range. RTV560 is... [See More]

  • Industry: Electronics
  • Use Temperature: -115 to 260
  • Chemical System: Silicone; Elastomeric
Momentive RTV560 Red Electronic Silicone +DBT 1lb -- MOSI02087
from Techsil Limited

RTV560 is a silicone rubber compound from Momentive Performance Materials. It offers excellent release properties and also good adhesion capabilities with the use of a primer. This grade with cure at room temperature and retains its elastomeric properties across a wide temperature range. RTV560 is... [See More]

  • Industry: Electronics
  • Use Temperature: -115 to 260
  • Chemical System: Silicone; Elastomeric