Electronics (PCB / SMT Assembly) Encapsulants and Potting Compounds
from ELANTAS North America LLC
ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]
- Industry: Electronics; Electric Power; Construction (optional feature); OEM or Industrial; Sand-filled transformers
- Form / Function: Liquid; Impregnating Resin (optional feature)
- Type: High Dielectric
- Chemical System: Alkyd
from Master Bond, Inc.
MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]
- Industry: Marine; Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid
- Type: High Dielectric; Optical; Thermally Conductive
- Chemical System: Silicone
from Dymax
Conformal Coating with Secondary Moisture Cure. Dual-cure 9481-E-PZ conformal coating is chemically resistant and free of Trimethylbenzoyl Diphenylphosphine Oxide (TPO) and PIP 3:1. It is a UV/Visible light- and moisture-cure material that contains no added solvents. It is formulated to ensure... [See More]
- Industry: Electronics
- Chemical System: Acrylated Urethane
- Form / Function: Liquid; Encapsulant or Conformal Coating
- Cure / Technology: UV or Radiation Cured; Reactive or Moisture Cured
from MacDermid Alpha Electronics Solutions
A one-component, low-temperature cure epoxy system, designed for bonding heat-sensitive devices and camera module applications. Product Overview. ALPHA HiTech AD13-9692B exhibits high adhesion strength between LCP and magnet surfaces, resulting in excellent drop impact performance when tested on... [See More]
- Industry: Electronics; Semiconductors, IC's
from Hernon Manufacturing, Inc.
Tuffbond ® 302 is a modified epoxy adhesive that provides a very fast room temperature cure. Tuffbond ® 302 exhibits very good moisture chemical and heat resistance. This very fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loud speakers. Tuffbond ® 302... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Chemical System: Ceramic; Epoxy
- Form / Function: 50 ml (two component)
from CHT USA Inc.
CHT's QSil 12 is a 2-part, condensation cure, transparent, low viscosity, liquid silicone elastomer which cures at room temperature. QSil 12 is primarily intended for electronic and lighting potting applications. This material is typically mixed at a ratio of 100:5. Once mixed, the material is... [See More]
- Industry: Automotive; Electronics
- Use Temperature: -67 to 399
- Cure / Technology: Two Component ; Condensation
- Thermal Conductivity: 0.1800
from RS Components, Ltd.
Protective conformal coating 400ml [See More]
- Industry: Electronics; Electronics, PCBs
- Chemical System: Acrylic; Acrylic Resin
- Form / Function: Aerosol; Liquid; Encapsulant or Conformal Coating
- Use Temperature: -94 to 248
from Ellsworth Adhesives
actnano Titan Series ANG T0 is a gel-state conformal coating used on a wide variety of surfaces for a one step manufacturing process. It offers protection from environmental conditions including humidity, salt, and water, and allows for electrical conductivity at the connection points after... [See More]
- Industry: Electronics
- Chemical System: Acrylic
- Form / Function: Encapsulant or Conformal Coating
- Viscosity: 4 to 6
from Master Bond, Inc.
EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's; Aerospace
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
- Type: High Dielectric; Thermally Conductive
- Chemical System: Epoxy
from Dymax
High-Performance Conformal Coating with Secondary Moisture Cure. Dual-cure 9483-Z conformal coating is free of Trimethylbenzoyl Diphenylphosphine Oxide (TPO). It cures tack-free upon exposure to UV/Visible light and then with ambient moisture over time, on PCBs where shadow areas are present. The... [See More]
- Industry: Electronics
- Chemical System: Acrylated Urethane
- Form / Function: Liquid; Encapsulant or Conformal Coating
- Cure / Technology: UV or Radiation Cured; Reactive or Moisture Cured
from Hernon Manufacturing, Inc.
Tuffbond ® 304 is a modified epoxy adhesive that provides a very fast room temperature cure. Tuffbond ® 304 exhibits very good moisture chemical and heat resistance. This very fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loudy speakers. Tuffbond ® 304... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Chemical System: Ceramic; Epoxy
- Form / Function: 20 gm
from CHT USA Inc.
CHT's QSil 58 is a 2-part, condensation cure, high temperature, self-leveling, silicone elastomer primarily used for electronic potting applications to provide protection from moisture, debris, vibration and shock. The two applicable catalysts are 0.5% DBT by weight and 10% Deep Section Catalyst by... [See More]
- Industry: Automotive; Electronics
- Use Temperature: -65 to 500
- Cure / Technology: Two Component ; Condensation
- Thermal Conductivity: 0.3100
from RS Components, Ltd.
MG Silicone Conformal coating 340g [See More]
- Industry: Aerospace; Electronics; OEM or Industrial; Aerospace, Air Bag Controllers, Automobile, Aviation, Communication, Consumer Electronics Industries, Electric Generators, Industrial Control Equip
- Chemical System: Silicone; Silicone
- Form / Function: Bottle; Encapsulant or Conformal Coating
- Use Temperature: -40 to 392
from Ellsworth Adhesives
actnano Titan Series ANG T0 is a gel-state conformal coating used on a wide variety of surfaces for a one step manufacturing process. It offers protection from environmental conditions including humidity, salt, and water, and allows for electrical conductivity at the connection points after... [See More]
- Industry: Electronics
- Chemical System: Acrylic
- Form / Function: Encapsulant or Conformal Coating
- Viscosity: 4 to 6
from Master Bond, Inc.
One part, nano silica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]
- Industry: Marine; Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
- Form / Function: Liquid; Encapsulant or Conformal Coating; Glob Top, Daub, Doming or Overfill
- Type: High Dielectric; Thermally Conductive
- Chemical System: UV Curing
from Hernon Manufacturing, Inc.
Tuffbond ® 305 is a modified epoxy adhesive that provides a very fast room temperature cure. Tuffbond ® 305 exhibits very good moisture chemical and heat resistance. This very fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loud speakers. Tuffbond ® 305... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Chemical System: Ceramic; Epoxy
- Form / Function: 50 ml (two component)
from CHT USA Inc.
CHT ’s TufGel 336 is a 2-part, tough, black silicone gel designed for electronic potting applications to provide protection from moisture, vibration and thermal or mechanical shock. TufGel 336 can also function as a contrast enhancement material in LED applications. TufGel 336 is also flame... [See More]
- Industry: Automotive; Electronics; OEM or Industrial
- Chemical System: Silicone
- Form / Function: Gel
- Cure / Technology: Two Component ; Addition
from RS Components, Ltd.
ESD Safe Coating Paint for Plastics [See More]
- Industry: Electronics; Electronics, Glazed Surfaces, Metal, Multi-purpose, Plastic
- Chemical System: Acrylic; Acrylic
- Form / Function: Can; Encapsulant or Conformal Coating
- Use Temperature: -40 to 248
from Ellsworth Adhesives
Dow 3-4237 Dielectric Firm Gel Clear-Green is a two component, room temperature curing, silicone gel that is used for potting, sealing, encapsulating, and protecting electrical components from contaminants, moisture, and stress. It is durable, flexible, self healing, and offers long working times. [See More]
- Industry: Electronics
- Chemical System: Silicone
- Type: High Dielectric
- Cure / Technology: Two Component
from Master Bond, Inc.
MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]
- Industry: Marine; Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial; Semiconductors, IC's
- Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating
- Type: Electrically Conductive; Thermally Conductive
- Chemical System: Silicone
from Hernon Manufacturing, Inc.
Tuffbond ® 313 adhesive/sealant is a two component, 100% solid system, one to one ratio, room temperature cure system. Tuffbond ® 313 is recommended for bonding metals, wood, ceramics, etc., and can be used for potting and encapsulation of electrical and electronic components. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Chemical System: Ceramic
- Form / Function: 50 ml (two component)
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
from CHT USA Inc.
CHT's TufGel 330 is a 2-part, clear, tough, moderately cross-linked silicone gel. It has good room temperature cure adhesion to many substrates. TufGel 330 is used to provide protection from vibration and thermal or mechanical shock and will also provide excellent moisture protection. [See More]
- Industry: Automotive; Electronics; OEM or Industrial
- Cure / Technology: Two Component ; Addition
- Form / Function: Gel
- Use Temperature: -67 to 399
from RS Components, Ltd.
Ambersil Acrylic Conformal Coating 400ml [See More]
- Industry: Electronics; Electronics, PCBs
- Chemical System: Acrylic; Acrylic Resin
- Form / Function: Aerosol; Liquid; Encapsulant or Conformal Coating
- Use Temperature: -40 to 140
from Ellsworth Adhesives
Dow DOWSIL ™ 3-4207 Dielectric Tough Gel Clear-Green is a two component, room temperature curing, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. It is durable, fast curing, requires no primer, and has good... [See More]
- Industry: Electronics
- Chemical System: Silicone
- Type: High Dielectric
- Cure / Technology: Two Component
from Master Bond, Inc.
EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]
- Industry: Marine; Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
- Type: High Dielectric; Thermally Conductive
- Chemical System: Epoxy
from Hernon Manufacturing, Inc.
Tuffbond ® 315 is a modified epoxy adhesive that provides a fast room temperature cure. Tuffbond ® 315 exhibits very good moisture chemical and heat resistance. This fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loudy speakers. Tuffbond ® 315 is also... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Chemical System: Ceramic; Epoxy
- Form / Function: 50 ml (two component)
from CHT USA Inc.
CHT's QSil 216 is a 2-part, platinum cure, optically clear silicone encapsulant designed for optical applications. QSil 216 features a 10:1 mix ratio by weight and its low viscosity profile enables excellent flow around components and is excellent for potting complex parts. The chemical composition... [See More]
- Industry: Automotive; Electronics; OEM or Industrial
- Cure / Technology: Two Component ; Addition
- Type: High Dielectric; Optical
- Use Temperature: -67 to 399
from RS Components, Ltd.
MG prem acrylic conformal coating 419D [See More]
- Industry: Marine; Aerospace; Electronics; OEM or Industrial; Aerospace, Automobile, Aviation, Communication, Consumer Electronics Industry, Electrical, Electronic Components, Industrial, Instrumentation, Marine
- Chemical System: Acrylic; Acrylic
- Form / Function: Tin; Encapsulant or Conformal Coating
- Use Temperature: -85 to 257
from Ellsworth Adhesives
Dow DOWSIL ™ 3-4207 Dielectric Tough Gel Clear-Green is a two component, room temperature curing, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. It is durable, fast curing, requires no primer, and has good... [See More]
- Industry: Electronics
- Chemical System: Silicone
- Type: High Dielectric
- Cure / Technology: Two Component
from Master Bond, Inc.
Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]
- Industry: Marine; Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
- Type: Electrically Conductive; Thermally Conductive
- Chemical System: Polyphenylene Sulfide; Epoxy
from Hernon Manufacturing, Inc.
Tuffbond ® 316 is a two component, room temperature cure system. By changing the ratio of resin and hardener, the cured adhesive can change from a tough and flexible to a hard and rigid system. Tuffbond ® 316 is recommended for bonding metal, glass, wood, concrete, and rubber, and can be... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Chemical System: Elastomeric
- Form / Function: 50 ml (two component)
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
from CHT USA Inc.
CHT's QGEl 311UV is a 2-part, platinum cure, special purpose silicone gel. It is designed with convenient 1:1 mix ratio, and low viscosity for easy dispensing. QGel 311UV is soft, but resilient and is amoderately cross-linked silicone polymer. QGel 311UV is clear but contains a UV tracer for easy QC... [See More]
- Industry: Automotive; Electronics; OEM or Industrial
- Cure / Technology: Two Component ; Addition
- Form / Function: Gel
- Use Temperature: -67 to 399
from RS Components, Ltd.
MG Chemicals thinner 2 4352 - 1L [See More]
- Industry: Electronics; Electronics
- Chemical System: Acrylic; Epoxy; Thermoplastic Polyester (PET, PBT, etc.); Acrylic, Alkyd, Cellulose Acetate Butyrate, Epoxy, Nitrocellulose, Polyester Resin
- Form / Function: Tin; Encapsulant or Conformal Coating
from Ellsworth Adhesives
Dow DOWSIL ™ 3-4222 Dielectric Firm Gel Clear-Green is a two component, room temperature curing, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. It is durable, fast curing, requires no primer, and has excellent... [See More]
- Industry: Electronics
- Chemical System: Silicone
- Type: High Dielectric
- Cure / Technology: Two Component
from Master Bond, Inc.
Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating. [See More]
- Industry: Marine; Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
- Form / Function: Liquid; Encapsulant or Conformal Coating
- Type: High Dielectric; Thermal Insulation
- Chemical System: Epoxy
from Hernon Manufacturing, Inc.
Tuffbond ® 317 is a two component, room temperature cure system. By changing the ratio of resin and hardener, the cured adhesive can change from a tough and flexible to a hard and rigid system. The resin offers a unique combination of hardness and flexibility with high chemical and solvent... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Chemical System: Elastomeric
- Form / Function: 50 ml (two component)
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
from CHT USA Inc.
CHT's QSil 563 is a 2-part, platinum cure, 100% silicone solids elastomer designed for electronic potting and encapsulation applications. QSil 562 offers a hard, low modulus material that is readily repairable. QSil 563 is thermally conductive to aid in efficient heat dissipation. This silicone... [See More]
- Industry: Automotive; Electronics
- Cure / Technology: Two Component ; Addition
- Type: Thermally Conductive
- Features: Flame Retardant; UL Rating
from RS Components, Ltd.
MG Chemicals thinner 4 4354 - 1L [See More]
- Industry: Electronics; Electronics
- Chemical System: Acrylic; Polyurethane; Acrylic, Urethane
- Form / Function: Tin; Encapsulant or Conformal Coating
from Ellsworth Adhesives
Dow DOWSIL ™ 3-4222 Dielectric Firm Gel Clear-Green is a two component, room temperature curing, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. It is durable, fast curing, requires no primer, and has excellent... [See More]
- Industry: Electronics
- Chemical System: Silicone
- Type: High Dielectric
- Cure / Technology: Two Component
from Master Bond, Inc.
EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]
- Industry: Marine; Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
- Type: High Dielectric; Thermally Conductive
- Chemical System: Epoxy
from Hernon Manufacturing, Inc.
Tuffbond ® 42121 is a thixotropic and modified epoxy adhesive that provides a very fast room temperature cure. Tuffbond ® 42121 exhibits very good moisture chemical and heat resistance. This very fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loud-speakers. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Chemical System: Ceramic; Epoxy
- Form / Function: 50 ml (two component)
from CHT USA Inc.
CHT's SE3000 is a 2-part, platinum cure silicone elastomer designed for electronic potting and encapsulation applications. It offers good prtection against chemicals, environmental contamination, mechanical shock, vibration and impact damage. SE3000 can be used in applications where low flammability... [See More]
- Industry: Electronics
- Cure / Technology: Two Component ; Addition
- Type: Thermally Conductive
- Features: Flame Retardant; UL Rating
from Ellsworth Adhesives
Dow DOWSIL ™ 3-4241 Dielectric Tough Gel Clear-Green is a two component, heat curing, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. It is durable, fast curing, requires no primer, flame resistant, long working... [See More]
- Industry: Electronics
- Chemical System: Silicone
- Type: High Dielectric
- Cure / Technology: Two Component
from Master Bond, Inc.
EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]
- Industry: Sanitary; Electronics; OEM or Industrial
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
- Type: High Dielectric; Thermally Conductive
- Chemical System: Epoxy
from Hernon Manufacturing, Inc.
Tuffbond ® 65891 is a two-component, room temperature cure system. Tuffbond ® 65891 is recommended for bonding metal, glass, wood, concrete, and rubber, and can be used for potting and encapsulation of electrical and electronic components. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Chemical System: Elastomeric
- Form / Function: 50 ml (two component)
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
from CHT USA Inc.
CHT's QSil 553 is a 2-part, platinum cure, silicone potting compound and encapsulant designed to protect electronic components from harsh environmental conditions and shock and vibration. It features a low viscosity for convenient dispensing and will easily flow throughout components. Because of its... [See More]
- Industry: Automotive; Electronics; OEM or Industrial
- Cure / Technology: Two Component ; Addition
- Type: Thermally Conductive
- Features: Flame Retardant; UL Rating
from Ellsworth Adhesives
Dow DOWSIL ™ 3-6635 Dielectric Gel Clear is a one component, heat curing, low temperature gel that is used to protect electrical components from extreme environments, moisture, and stress. It is flowable, low viscosity, durable, and self healing. 18.1 kg Pail. [See More]
- Industry: Electronics
- Chemical System: Silicone
- Type: High Dielectric
- Cure / Technology: Single Component
from Master Bond, Inc.
MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]
- Industry: Aerospace; Electronics; Photonics; OEM or Industrial; Semiconductors, IC's
- Form / Function: Liquid
- Type: High Dielectric; Optical; Thermally Conductive
- Chemical System: Silicone
from Hernon Manufacturing, Inc.
Hernon 397 is a single component, high temperature resistant, heat activated epoxy. It cures to a high-performance thermoset system with excellent adhesion properties to a wide variety of substrates. Tuffbond 397 will change from amber-yellow to a reddish brown upon cure. Product... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Thermoset; Single Component
- Chemical System: Epoxy
from CHT USA Inc.
CHT's ACC15 is a low viscosity, 1-part, condensation curing silicone coating. The uncured product can be applied by pouring or brushing and is readily cured to a tough, transparent rubber. ACC15 can be used to coat printed circuit boards to prevent ingress of water an environmental contaminants. It... [See More]
- Industry: Automotive; Electronics
- Cure / Technology: Alkoxy
- Form / Function: Encapsulant or Conformal Coating
- Features: UL Rating
from Ellsworth Adhesives
Dow DOWSIL ™ EE-3200 Low Stress Silicone Encapsulant is a two component, low viscosity encapsulant with a 1:1 mix ratio, good heat dissipation, and good thermal conductivity. Once thoroughly mixed, the mixture will cure to a flexible elastomer for the protection of electronic and electrical... [See More]
- Industry: Automotive; Electronics
- Cure / Technology: Two Component
- Chemical System: Silicone
- Thermal Conductivity: 0.5000
from Master Bond, Inc.
Master Bond Polymer System EP39-2 is a fast curing, low viscosity, optically clear two component epoxy system for high performance bonding, sealing, coating and casting. It is 100% reactive and does not contain any diluents, solvents or other volatiles. The mix ratio is a convenient 2 to 1 by... [See More]
- Industry: Marine; Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
- Chemical System: Epoxy
- Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Die Bonding Adhesives
- Composition: Unfilled
from Ellsworth Adhesives
Dow DOWSIL ™ EE-3200 Low Stress Silicone Encapsulant is a two component, low viscosity encapsulant with a 1:1 mix ratio, good heat dissipation, and good thermal conductivity. Once thoroughly mixed, the mixture will cure to a flexible elastomer for the protection of electronic and electrical... [See More]
- Industry: Automotive; Electronics
- Cure / Technology: Two Component
- Chemical System: Silicone
- Thermal Conductivity: 0.5000
from Master Bond, Inc.
Master Bond EP62-1 is a two component heat cured and chemically resistant epoxy resin system featuring a long pot life at ambient temperatures and efficient cures at moderately elevated temperatures. The recommended mix ratio is 100 parts of component A to 10 parts of component B. The pot life of... [See More]
- Industry: Marine; Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial; Semiconductors, IC's
- Cure / Technology: Thermoset; Two Component
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
- Use Temperature: -60 to 400
from Ellsworth Adhesives
Dow DOWSIL ™ EG-3810 Dielectric Gel is a one component, clear, heat curing silicone gel that is used for potting, sealing, encapsulating, and protecting a variety of materials in the electronics industry. It offers a wide range of operating temperatures ranging from -60 °C to 200 °C,... [See More]
- Industry: Electronics; Semiconductors, IC's
- Chemical System: Silicone
- Type: High Dielectric
- Cure / Technology: Single Component
from Master Bond, Inc.
Master Bond Polymer System EP45HT is a two component epoxy system for high performance structural bonding and casting. It is suitable for applications where long term exposure to temperatures from -80 °F to +500 °F is required. lt is 100% reactive and does not contain any solvents or... [See More]
- Industry: Marine; Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial; Semiconductors, IC's
- Chemical System: Epoxy
- Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Die Bonding Adhesives
- Composition: Unfilled
from Ellsworth Adhesives
Dow SYLGARD ™ 527 Silicone Dielectric Gel is a two component, room temperature and heat curing gel that is used for coating, encapsulating, potting, and sealing electronic devices. It provides flexibility, good flow, and low viscosity. 1:1 mix ratio. 0.9 kg Kit. [See More]
- Industry: Electronics
- Chemical System: Silicone
- Type: High Dielectric
- Cure / Technology: Two Component
from Master Bond, Inc.
Master Bond Polymer System EP13 is a one component heat curing epoxy featuring high shear strength and very high temperature resistance. This one component system is formulated to cure at temperatures from 300 °F to 350 °F for 60-90 minutes. Upon cure, EP13 readily attains tensile shear... [See More]
- Industry: Marine; Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Semiconductors, IC's
- Form / Function: Encapsulant or Conformal Coating; Die Bonding Adhesives
- Type: High Dielectric
- Chemical System: Epoxy
from Ellsworth Adhesives
Dow SYLGARD ™ 527 Silicone Dielectric Gel is a two component, room temperature and heat curing gel that is used for coating, encapsulating, potting, and sealing electronic devices. It provides flexibility, good flow, and low viscosity. 1:1 mix ratio. 36.3 kg Kit. [See More]
- Industry: Electronics
- Chemical System: Silicone
- Type: High Dielectric
- Cure / Technology: Two Component
from Master Bond, Inc.
Master Bond Polymer System 125 is a two component toughened epoxy resin for prolonged service above 500 °F with truly outstanding chemical resistance. High strength bonds serviceable up to 600 °F can be obtained with this exceptionally thermally stable and chemically resistant epoxy resin... [See More]
- Industry: Marine; Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
- Form / Function: Powder; Gap Filler, Foam in Place Gasket; Impregnating Resin; Die Bonding Adhesives
- Type: High Dielectric; Thermal Insulation
- Chemical System: Epoxy
from Ellsworth Adhesives
Dow SYLGARD ™ 527 Silicone Dielectric Gel is a two component, room temperature and heat curing gel that is used for coating, encapsulating, potting, and sealing electronic devices. It provides flexibility, good flow, and low viscosity. 1:1 mix ratio. 7.2 kg Kit. [See More]
- Industry: Electronics
- Chemical System: Silicone
- Type: High Dielectric
- Cure / Technology: Two Component
from Master Bond, Inc.
MasterSil 151TC is a highly flexible, temperature resistant two component silicone adhesive offering low thermal resistance and outstanding thermal conductivity. It was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. [See More]
- Industry: Marine; Sanitary; Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid
- Type: High Dielectric; Thermally Conductive
- Chemical System: Silicone
from Ellsworth Adhesives
Dow SYLGARD ™ 527 Silicone Dielectric Gel is a two component, room temperature and heat curing gel that is used for coating, encapsulating, potting, and sealing electronic devices. It provides flexibility, good flow, and low viscosity. 1:1 mix ratio. Part B, 18.1 kg Pail. [See More]
- Industry: Electronics
- Chemical System: Silicone
- Type: High Dielectric
- Cure / Technology: Two Component
from Master Bond, Inc.
Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. Not only is EP29LPSP able to function as an adhesive, sealant and protective coating at temperatures as low as 4K, but it is... [See More]
- Industry: Marine; Aerospace; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
- Type: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding
- Chemical System: Epoxy
from Ellsworth Adhesives
Henkel Loctite STYCAST 2662 Black, formerly Emerson and Cuming, is a two component, filled, epoxy encapsulant that is used for sealing and potting components that are exposed to high temperatures. It is resistant to chemicals, moisture, and high temperature. 1 gal Pail. [See More]
- Industry: Electronics
- Cure / Technology: Two Component
- Chemical System: Epoxy
- Thermal Conductivity: 0.5300
from Techsil Limited
MG Chemicals 419c Acrylic Conformal Coating is an IPC-CC-830B and UL 94-VO certified, fast drying, one part coating product which provides an excellent finish. It is easy to use and does not require any special or costly equipment's to apply. Ideal for high moisture environments and protects... [See More]
- Industry: Electronics
- Form / Function: Encapsulant or Conformal Coating
from Monocrystal, Inc.
AGH – series. Application: High conductive low firing silver paste for fine line screen printing. Silver conductor is specially designed to form the conductive coating and bond area to the glass and ceramic substrate by screen printing method. Composition variations: AGH-A-60 – 60%... [See More]
- Industry: Electronics
- Type: Electrically Conductive
from Wacker Chemical Corp.
WACKER ’s silicone adhesives and sealants are based on many years of experience, innovative research and comprehensive technological expertise. In a wide variety of industries, especially in lighting technology, flowable or non-sag silicone products offer decisive advantages in performance and... [See More]
- Industry: Electronics
- Chemical System: Silicone; Elastomeric
- Type: Thermally Conductive
from Sauereisen, Inc.
Sauereisen Cement No. 31 is a white, porcelain-like cement that is widely used throughout industry in a variety of applications. including assembling, sealing, insulating and cementing of ceramics, porcelain, metal, and glass. [See More]
- Industry: Electronics; Electric Power
- Form / Function: Powder; Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
- Type: High Dielectric; Thermally Conductive
- Chemical System: Ceramic
from Hapco, Inc.
Flexible, colorless, potting and encapsulating systems. Available in 5 minute (-5), 16 minute, and 20 minute gel times, and in shore hardness ’s from 20 A to 80 A . [See More]
- Industry: Electronics
- Form / Function: Liquid
- Type: High Dielectric
- Cure / Technology: Thermoset; Two Component
from Electro-Lite Corporation
ELC-2900 is a flexible conformal coating for PCB's and provides a flexible, reworkable finish for components and various substrates. [See More]
- Industry: Electronics; OEM or Industrial
- Form / Function: Liquid; Encapsulant or Conformal Coating
- Type: Anti-static, ESD
- Chemical System: Epoxy
from Epoxy Technology
EPO-TEK ® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries. Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market... [See More]
- Industry: Sanitary; Electronics; Photonics
- Chemical System: Epoxy
- Type: High Dielectric; Optical; Thermally Conductive
- Cure / Technology: Thermoset; Two Component
from Henkel Corporation - Electronics
With the increasing proliferation of wireless devices, designers are challenged with various electromagnetic waves from multiple sources radiating at the same spectrum of frequencies resulting in electromagnetic interference(EMI). Radio-frequency(RF) emitting devices require effective isolation to... [See More]
- Industry: Electronics
- Form / Function: Liquid; Encapsulant or Conformal Coating
- Type: Electrically Conductive; EMI/RFI Shielding
- Cure / Technology: Single Component
from Bluestar Silicones USA Corp.
Clear, Two-Component, Addition Cure, Heat Curing Electronic coating Silicone Compound. Properties. Viscosity 6000. Hardness Sha 30. Description. BLUESIL V-207 is a clear, two component, addition cure, heat curing silicone rubber compound. It is designed as a primerless coating and encapsulating... [See More]
- Industry: Electronics
- Chemical System: Silicone
- Form / Function: Liquid; Encapsulant or Conformal Coating
- Cure / Technology: Thermoset; Two Component ; Reactive or Moisture Cured
from Shiu Li Technology Co., Ltd
LiPOLY's TPS series is a low-density, potting material. Its low density and lightweight properties enhance product performance, reduce production costs. The product has a thermal conductivity of 0.55-1.50 W/m*K and can cure at room temperature or high temperatures. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid
- Type: Thermally Conductive
- Chemical System: Silicone
from Aremco Products, Inc.
Aremco offers an expansive range of ceramic-based materials used for the assembly of high temperature, high power electrical devices, and high temperature fixtures, molds and tooling. These materials, based on aluminum oxide, aluminum nitride, magnesium oxide, silicon dioxide, silicon carbide,... [See More]
- Industry: Electronics
- Composition: Filled
- Chemical System: Ceramic; Silicone
- Use Temperature: 900
from Epoxies Etc...
20-3004 LV & HV are two component chemical resistance epoxy systems. They were developed for potting, coating, and adhesive applications requiring superior chemical resistance. They exhibit outstanding bonds to a variety of substrates. [See More]
- Industry: Electronics
- Chemical System: Epoxy
- Form / Function: Gel
- Composition: Unfilled
from Chemence Inc.
Krylex KU3064 is a revolutionary odorless light curing cyanoacrylate adhesive. It is designed for bonding applications that require very rapid fixture, fillet cure or surface cure. The UV / visible light cure properties facilitate rapid curing of exposed surface areas while the moisture curing... [See More]
- Industry: Sanitary; Electronics; OEM or Industrial; Printing, Medical use and General Industrial Assembly
- Cure / Technology: UV or Radiation Cured; Single Component; Reactive or Moisture Cured
- Form / Function: Liquid; Die Bonding Adhesives
- Gap Fill: 0.0500
from DuPont Electronics & Imaging
DuPont ™ Pyralux ® HT bonding film can be used in conjunction with Pyralux ® AP to create a complete all-polyimide flex laminate system that includes a double-sided, copper-clad laminate and a unique all-polyimide coverfilm or bonding material that becomes a flexible coverlay after... [See More]
- Industry: Electronics; OEM or Industrial
- Features: UL Rating
- Chemical System: Polyimide
- Use Temperature: 437
from Shenzhen DeepMaterial Technologies Co., Ltd
It is a fast curing, fast flowing liquid epoxy resin designed for capillary flow filling chip size packages, is to improve the process speed in production and design its rheological design, let it penetrate 25µm clearance, minimize induced stress, improve temperature cycling performance, with... [See More]
- Industry: Electronics
- Cure / Technology: Heat Curing
- Chemical System: Epoxy
- Viscosity: 3500 to 7000
from Protavic America, Inc.
PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]
- Industry: Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Form / Function: Liquid; Encapsulant or Conformal Coating; Die Bonding Adhesives
- Type: Electrically Conductive; Thermally Conductive
- Chemical System: Silicone
from Techsil Limited
MG Chemicals 419c Acrylic Conformal Coating is an IPC-CC-830B and UL 94-VO certified, fast drying, one part coating product which provides an excellent finish. It is easy to use and does not require any special or costly equipment's to apply. Ideal for high moisture environments and protects... [See More]
- Industry: Electronics
- Form / Function: Encapsulant or Conformal Coating
from Wacker Chemical Corp.
WACKER SilGel ® 612 A/B is a pourable, additioncuring, RTV-2 silicone rubber that vulcanizes at room temperature to a very soft silicone gel. Special features. two-part, 1 : 1 mixing ratio. low viscosity. rapid heat cure. very low hardness (silicone gel). crystal clear. pronounced inherent tack. [See More]
- Industry: Automotive; Electronics; Electric Power
- Form / Function: Liquid
- Type: Optical
- Chemical System: Silicone; Elastomeric
from Hapco, Inc.
Flexible, 45, 65 and, 95 shore A hardness, potting and encapsulating systems. Flame retardant (FR), accelerated 3 minute (-3) gel time, and black or unpigmented versions are available. [See More]
- Industry: Electronics
- Form / Function: Liquid
- Type: High Dielectric
- Cure / Technology: Thermoset; Two Component
from Henkel Corporation - Electronics
Developed for encapsulation of wire bonded dies, used for Smartcard IC modules. It is designed for use only with Hysol ® UV dam encapsulants, such as Hysol 3323. This combination of dam and fill will pass mechanical stress testing and high reliability tests; typically thermal shock cycling -55... [See More]
- Industry: Electronics
- Viscosity: 8000
- CTE: 25
from Epoxies Etc...
10-3009 is a low viscosity epoxy adhesive and potting compound. It is easy to use and allows the end user to adjust the flexibility of the cured epoxy. This product offers a good combination of peel and tensile strength. 10-3009 provides electrical insulation and outstanding adhesion. [See More]
- Industry: Electronics; OEM or Industrial
- Form / Function: Liquid
- Type: High Dielectric; Thermal Insulation
- Chemical System: Epoxy
from Chemence Inc.
KSC1202 is a high performance, high viscosity thermally conductive gap filling material. It is formulated to develop a soft, 'form in place' elastomer ideal for coupling hot PC board components to heat sinks. KSC1202 is supplied as a two part, 1:1 mix ratio silicone that when mixed will cure at room... [See More]
- Industry: Electronics
- Chemical System: Silicone
- Form / Function: Die Bonding Adhesives
- Cure / Technology: Single Component
from Shenzhen DeepMaterial Technologies Co., Ltd
It is a conformal coating designed to provide strong protection from moisture and harsh chemicals. Compatible with industry standard solder masks, no-clean fluxes, metallization, components and substrate materials. [See More]
- Industry: Electronics
- Chemical System: Acrylic
- Form / Function: Encapsulant or Conformal Coating
- Cure / Technology: UV or Radiation Cured; Reactive or Moisture Cured
from Protavic America, Inc.
The two component polyurethane compound described in this data sheet is specifically designed for the encapsulation by casting of completed circuit board. The cured material meets the flammability requirements of UL 94, V-O at thickness of 0.070 in. and greater (UL File Number E116296) and provides... [See More]
- Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Form / Function: Liquid; Encapsulant or Conformal Coating
- Type: High Dielectric; Thermal Insulation
- Chemical System: Polyurethane
from Techsil Limited
MG Chemicals 419D Premium Acrylic Conformal Coating is an IPC-CC-830B and UL 94-VO certified, fast drying, one part coating product which is easy to use. It serves to protect electric circuits against moisture, dirt, dust, thermal shocks and scratches whilst also insulating against high-voltage... [See More]
- Industry: Electronics
- Form / Function: Encapsulant or Conformal Coating
from Hapco, Inc.
Flexible, high strength, 50 to 71 shore D hardness potting and encapsulating systems. Available in flame retardant (FR), 3 minute (-3) gel time, and in black or unpigmented. [See More]
- Industry: Electronics
- Form / Function: Liquid
- Type: High Dielectric
- Cure / Technology: Thermoset; Two Component
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Industry: Electronics
- Chemical System: Polyolefin
- Form / Function: Pellets
- Cure / Technology: Thermoplastic / Hot Melt
from Epoxies Etc...
The 50-2369FR Potting and Encapsulating Compound has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-2369 FR Urethane is listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low exotherm, and excellent electrical... [See More]
- Industry: Electronics; OEM or Industrial; Semiconductors, IC's; Surface Mount Components
- Form / Function: Gel
- Type: Thermally Conductive
- Chemical System: Polyurethane
from Protavic America, Inc.
Clear unfilled epoxy also available in a one-part system. Use life is over three days after mixing at room temperature. Excellent for ferrite and optical bonding applications. Requires heat assist to cure. [See More]
- Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Form / Function: Liquid; Encapsulant or Conformal Coating; Die Bonding Adhesives
- Type: High Dielectric
- Chemical System: Epoxy
from Techsil Limited
MG Chemicals 4223 Urethane Conformal Coating offers a highly chemical-resistant finish that meets UL standards for indoor conformal coatings. This PU protects electric circuits against corrosive chemicals, moisture, dirt, dust, thermal shocks and scratches, alongside is also insulates against... [See More]
- Industry: Electronics
- Chemical System: Polyurethane
- Form / Function: Encapsulant or Conformal Coating
from Hapco, Inc.
Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E products are flame... [See More]
- Industry: Electronics
- Form / Function: Liquid
- Type: High Dielectric; Thermally Conductive
- Cure / Technology: Thermoset; Two Component
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Industry: Electronics
- Form / Function: Pellets
- Type: High Dielectric; Thermally Conductive
- Chemical System: Polyamide
from Epoxies Etc...
50-3150 FR has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-3150 FR Black Epoxy with Catalyst 190 and Catalyst 105 are listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low shrinkage, and outstanding insulation... [See More]
- Industry: Electronics; Electric Power
- Form / Function: Liquid
- Type: Thermally Conductive
- Chemical System: Epoxy
from Protavic America, Inc.
ANA-97290 is a clear Ultraviolet/ Visible light curing adhesive. It has very low shrinkage during cure for alignment sensitive parts. It is recommended for small electrical/electronic casting and encapsulating applications that require a unique combination of excellent wetting, flow, good thermal... [See More]
- Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Form / Function: Liquid; Encapsulant or Conformal Coating; Gel (optional feature); Die Bonding Adhesives
- Type: Electrically Conductive; Thermal Insulation
- Composition: Unfilled
from Techsil Limited
MG Chemicals 422B is a silicone modified conformal coating which is a clear and flexible coating, ideal for protecting electronic circuits in high temperature environments or applications requiring extreme flexibility. It protects against moisture, dirt, dust, and other particulates thus avoiding... [See More]
- Industry: Electronics
- Chemical System: Silicone; Elastomeric
- Form / Function: Encapsulant or Conformal Coating
from Hapco, Inc.
High performance, flexible potting systems designed to be in constant water immersion while maintaining electrical and physical properties. DI-PAK E-4888 & E-4889 were designed to meet Naval underwater applications. [See More]
- Industry: Electronics
- Form / Function: Liquid
- Type: High Dielectric
- Cure / Technology: Thermoset; Two Component
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Industry: Electronics
- Form / Function: Pellets
- Type: High Dielectric; Thermally Conductive
- Chemical System: Polyamide
from Epoxies Etc...
UV 60-7016 is a high performance Ultraviolet Curable Adhesive, Sealant, and Potting Compound. This new one component urethane acrylate system was specifically designed for the difficult bonding of glass to metal. UV 60-7016 has outstanding thermal shock and impact resistance, and is an excellent... [See More]
- Industry: Electronics; OEM or Industrial
- Chemical System: Elastomeric; Polyurethane
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
- Composition: Unfilled
from Protavic America, Inc.
PNU-56200 ™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term circuit protection and... [See More]
- Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Form / Function: Liquid; Encapsulant or Conformal Coating; Die Bonding Adhesives
- Type: High Dielectric
- Chemical System: Polyurethane
from Techsil Limited
MG Chemicals 422B Silicone Conformal Coating is a clear and flexible aerosol coating that is ideal for protecting electronic circuits in high temperature environments or applications requiring extreme flexibility. It protects against moisture, dirt, dust, and other particulates thus avoiding... [See More]
- Industry: Electronics
- Chemical System: Silicone; Elastomeric
- Form / Function: Encapsulant or Conformal Coating
from Hapco, Inc.
Low cost, easy to use, potting compounds with fast cycle times. Available in 3 speeds. [See More]
- Industry: Electronics
- Form / Function: Liquid
- Type: High Dielectric
- Cure / Technology: Thermoset; Two Component
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Industry: Electronics; Electric Power
- Form / Function: Pellets
- Type: High Dielectric; Thermally Conductive
- Chemical System: Polyamide
from Protavic America, Inc.
Fast flow, fast cure capillary reworkable underfill. The rheology of the PROTAVIC ANA 10199 R in combination with its fineness make the product perfectly adapted to high reliability small gap underfill applications. It presents a good pot life at room temperature 20-22C and a high reactivity at... [See More]
- Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
- Type: High Dielectric; Thermal Insulation
- Composition: Unfilled
from Techsil Limited
MG Chemicals 422B is a silicone modified conformal coating which is a clear and flexible coating, ideal for protecting electronic circuits in high temperature environments or applications requiring extreme flexibility. It protects against moisture, dirt, dust, and other particulates thus avoiding... [See More]
- Industry: Electronics
- Chemical System: Silicone; Elastomeric
- Form / Function: Encapsulant or Conformal Coating
from Hapco, Inc.
DI-COAT R-4721 / DI-COAT R-4721 LV (lower viscosity). Shore 90 D, room temperature curing, medium to high thixotropic coating for dielectric insulating applications. DI-COAT R-4721 is ideal for use on vertical or sloping surfaces where flow or drain-off cannot be tolerated. DI-COAT R-4721 is easy to... [See More]
- Industry: Electronics
- Form / Function: Liquid
- Type: High Dielectric
- Cure / Technology: Thermoset; Two Component
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Industry: Electronics
- Form / Function: Pellets
- Type: High Dielectric; Thermally Conductive
- Chemical System: Polyolefin
from Techsil Limited
MG Chemicals 832B is a black electronic grade epoxy designed for encapsulating and potting. This compound is simple mix, easy to use and protects against static discharges, shocks, vibrations, and mechanical impacts. It insulates against heat and conductivity as well as being extremely resistant to... [See More]
- Industry: Electronics
- Chemical System: Epoxy
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Industry: Electronics
- Form / Function: Pellets
- Type: High Dielectric; Thermally Conductive
- Chemical System: Polyamide
from Techsil Limited
MG Chemicals 834ATH Flame Retardant Epoxy is a economical, electronic-grade, self-extinguishing, flame retardant epoxy that provides excellent physical, chemical and electrical protection with a degree of thermal conductivity. Designed for encapsulating and potting, this two-part epoxy protects... [See More]
- Industry: Electronics
- Features: Flame Retardant
- Chemical System: Epoxy
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Industry: Electronics
- Form / Function: Pellets
- Type: High Dielectric; Optical; Thermally Conductive
- Chemical System: Polyamide
from Techsil Limited
MG 834FRB is a black, flame retardant potting and encapsulation compound that offers extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. Thanks to its low viscosity, MG 834 FRB is the ideal choice when applications require small gaps or... [See More]
- Industry: Electronics
- Features: Flame Retardant
- Chemical System: Epoxy
from Techsil Limited
MG Chemicals 832TC is a thermally conductive encapsulating and potting epoxy compound designed for use with electronics. It uses a high-purity aluminum oxide to provide excellent thermal conductivity at reasonable costs. This black, two-part epoxy provides superior shock insulation and impact... [See More]
- Industry: Electronics
- Chemical System: Epoxy
from Techsil Limited
MG Chemicals 832C is a translucent electronic grade epoxy designed for encapsulating and potting. This compound is simple mix, easy to use and protects against static discharges, shocks, vibrations, and mechanical impacts. It insulates against heat and conductivity as well as being extremely... [See More]
- Industry: Electronics
- Chemical System: Epoxy
from Techsil Limited
MG Chemicals 832C is a translucent electronic grade epoxy designed for encapsulating and potting. This compound is simple mix, easy to use and protects against static discharges, shocks, vibrations, and mechanical impacts. It insulates against heat and conductivity as well as being extremely... [See More]
- Industry: Electronics
- Chemical System: Epoxy
from Techsil Limited
MG 832WC is a general purpose, water clear potting and encapsulation compound which offers extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. This product is designed for applications where high clarity is required; it will not yellow when... [See More]
- Industry: Electronics
- Chemical System: Epoxy
from Techsil Limited
RTV12 A is a clear, two component, low viscosity potting compound that cures at room temperature to a soft pliable rubber. It will cure in deep section without additional heating or moisture. RTV12 A is the base compound and requires a curing agent to be mixed with. For a clear product which allows... [See More]
- Industry: Electronics
- Chemical System: Silicone; Elastomeric
from Techsil Limited
RTV12 A is a clear, two component, low viscosity potting compound that cures at room temperature to a soft pliable rubber. It will cure in deep sections without additional heating or moisture. RTV12 A is the base compound and requires a curing agent to be mixed with. For a clear product which allows... [See More]
- Industry: Electronics
- Chemical System: Silicone; Elastomeric
from Techsil Limited
RTV12 A is a clear, two component, low viscosity potting compound that cures at room temperature to a soft pliable rubber. It will cure in deep section without additional heating or moisture. RTV12 A is the base compound and requires a curing agent to be mixed with. For a clear product which allows... [See More]
- Industry: Electronics
- Chemical System: Silicone; Elastomeric