Flexible / Dampening Encapsulants and Potting Compounds

ELAN-Cast® -- P 300 S RTC
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Type: High Dielectric
  • Chemical System: Alkyd
  • Form / Function: Liquid; Impregnating Resin (optional feature)
  • Composition: Unfilled
Acid Resistant, Two Component Epoxy -- EP21AR
from Master Bond, Inc.

Master Bond Polymer System EP21AR is a two component epoxy resin compound for durable, high performance, coating liner and adhesive/sealants with outstanding acid as well as excellent overall chemical resistance. The EP21AR compound which is formulated to cure at room temperature or more rapidly at... [See More]

  • Form / Function: Optional Premixed and Frozen; Gap Filler, Foam in Place Gasket; Liquid
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
Optically Clear, Flexible Epoxy Adhesive -- EPO-TEK® 310M-2
from Epoxy Technology

We have served the optical market since 301 was introduced in 1969.   Our products encapsulate, coat, bond and seal plastics, crystals and glass together for optical components, such as prism, filters, and mirrors. EPO-TEK ® fabricated components are the building blocks of camera, laser,... [See More]

  • Type: Optical
  • Chemical System: Epoxy
  • Form / Function: Liquid; Glob Top, Daub, Doming or Overfill
  • Composition: Unfilled
Addition Cured Silicone is Optically Clear with Enhanced Low Temperature Serviceability -- MasterSil 157
from Master Bond, Inc.

MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]

  • Type: High Dielectric; Optical; Thermally Conductive
  • Chemical System: Silicone
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid
  • Composition: Unfilled
B-Staged Epoxy Meets Airbus Standards for Flame Retardancy & Toxicity -- EP36FR
from Master Bond, Inc.

EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Composition: Unfilled
Cryogenically Serviceable Epoxy Urethane System -- EP30DP-NV
from Master Bond, Inc.

Master Bond Polymer System EP30DP is a versatile, two component, epoxy-urethane elastomeric compound, featuring superior strength, toughness, and abrasion resistance for high performance bonding, sealing, casting and encapsulation. It combines the performance characteristics of epoxy resins such as... [See More]

  • Type: High Dielectric
  • Chemical System: Epoxy; Polyurethane
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Cure / Technology: Thermoset; Two Component  
Electrically and Thermally Conductive, Two Part Silicone Meets NASA Low Outgassing Specifications -- MasterSil 973S-LO
from Master Bond, Inc.

MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]

  • Type: Electrically Conductive; Thermally Conductive
  • Chemical System: Silicone
  • Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating
  • Composition: Filled
Electrically Insulative, Two Component Epoxy System -- EP30M3LV-NV
from Master Bond, Inc.

Master Bond Polymer System EP30M3LV is a low viscosity, two component epoxy compound for high performance, chemical resistant casting and potting applications, formulated to cure at ambient temperatures or more rapidly at elevated temperatures, with a convenient two (2) to one (1) mix ratio. This... [See More]

  • Type: High Dielectric
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Cure / Technology: Thermoset; Two Component  
Epoxy with High Elongation Passes ISO 10993-5 Certification for Cytotoxicity -- EP40Med
from Master Bond, Inc.

EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Composition: Unfilled
Extremely Soft MasterSil 170 Gel Encapsulant Offers Removability and Optical Clarity -- MasterSil 170 Gel
from Master Bond, Inc.

MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]

  • Type: High Dielectric; Optical; Thermally Conductive
  • Chemical System: Silicone
  • Form / Function: Liquid
  • Composition: Unfilled
Highly Flexible Addition Cured Silicone Offers Low Thermal Resistance -- MasterSil 151TC
from Master Bond, Inc.

MasterSil 151TC is a highly flexible, temperature resistant two component silicone adhesive offering low thermal resistance and outstanding thermal conductivity. It was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Silicone
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid
  • Composition: Filled
Low Outgassing, Optically Clear Two Component Epoxy -- EP29LPSP
from Master Bond, Inc.

Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. Not only is EP29LPSP able to function as an adhesive, sealant and protective coating at temperatures as low as 4K, but it is... [See More]

  • Type: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Composition: Unfilled
One Component Toughened Epoxy System For Bonding And Sealing -- Supreme 17HT
from Master Bond, Inc.

Master Bond Supreme 17HT is a one component toughened epoxy for bonding and sealing. It has a moderate viscosity system with good flow properties. [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
  • Form / Function: Liquid
  • Composition: Unfilled
One Component, High Temperature Resistant Epoxy -- EP36
from Master Bond, Inc.

Master Bond Polymer System EP36 is a unique one component high performance toughened epoxy system for electrical potting, casting, encapsulation, baked coatings and adhesive applications. It features an outstanding combination of properties including high temperature stability up to 500 °F,... [See More]

  • Type: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
  • Composition: Unfilled
Optically Clear, Low Viscosity, Two Component Epoxy -- EP30
from Master Bond, Inc.

Master Bond Polymer System EP30 is a low viscosity, two component epoxy adhesive for general purpose bonding, coating, sealing and casting formulated to cure at room temperature or more rapidly at elevated temperatures with a four (4) to one (1) mix ratio by weight. This adhesive is 100% reactive... [See More]

  • Type: Optical; Thermal Insulation
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Cure / Technology: Thermoset; Two Component  
Room Temperature Curing, Two Component Epoxy System -- EP34
from Master Bond, Inc.

Master Bond Polymer System EP34 is a unique room temperature curing two component epoxy compound for high temperature potting and encapsulating applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non critical mix ratio (part A/part B: 100/70). [See More]

  • Type: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding
  • Chemical System: Epoxy
  • Form / Function: Optional Premixed and Frozen; Gap Filler, Foam in Place Gasket; Die Bonding Adhesives
  • Composition: Unfilled
Tough Epoxy Polysulfide Adhesive Resists High Temperatures -- EP21TPHT
from Master Bond, Inc.

Master Bond EP21TPHT is an epoxy polysulfide compound that withstands temperatures up to 350°F which gives it a higher resistance to elevated temperatures than most polysulfide systems. [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Polyphenylene Sulfide; Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Composition: Unfilled
Two Component, Room Temperature Curing Epoxy For Bonding, Coating, Sealing And Potting -- EP88FL
from Master Bond, Inc.

Master Bond EP88FL is a low viscosity, optically clear, two component epoxy system featuring good flexibility for high performance bonding, coating, sealing and potting. [See More]

  • Type: High Dielectric; Optical; Thermally Conductive
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket (optional feature); Liquid; Encapsulant or Conformal Coating
  • Composition: Unfilled
Filter-bond™ Elastomeric Casting and Potting Compound -- E-3264
from Hapco, Inc.

Filter-bond ™ is a series of casting and potting compounds ideally suited for potting, sealing, and bonding filtration and ultrafiltration products. The Filter-bond ™ E-Series is manufactured to ultra-high quality standards and has been used by customers to pass FDA approval. Filter-bond... [See More]

  • Form / Function: Liquid
  • Cure / Technology: Two Component  
  • Chemical System: Elastomeric; Polyurethane
  • Features: Flexible
Clear Non-Yellowing Silicone Encapsulant -- PNS-56225
from Protavic America, Inc.

PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]

  • Type: Electrically Conductive; Thermally Conductive
  • Chemical System: Silicone
  • Form / Function: Liquid; Encapsulant or Conformal Coating; Die Bonding Adhesives
  • Composition: Unfilled
Silicone Elastomer Gel Encapsulant And Potting Compound -- SilGel® 612 A/B
from Wacker Chemical Corp.

WACKER SilGel ® 612 A/B is a pourable, additioncuring, RTV-2 silicone rubber that vulcanizes at room temperature to a very soft silicone gel. Special features. two-part, 1 : 1 mixing ratio. low viscosity. rapid heat cure. very low hardness (silicone gel). crystal clear. pronounced inherent tack. [See More]

  • Type: Optical
  • Chemical System: Silicone; Elastomeric
  • Form / Function: Liquid
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Clear Flexible Epoxy -- 20-3237
from Epoxies Etc...

20-3237 is a new 1:1 ratio, low viscosity Epoxy Rubber System designed for potting delicate electronic components requiring inspection. 20-3237 is an ideal candidate for applications requiring testing and/or repairs of embedded components. Cured material can be cut away to replace components and... [See More]

  • Form / Function: Liquid
  • Composition: Unfilled
  • Chemical System: Epoxy; Elastomeric
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Clear Urethane Cast/Adhesive -- PNU-46201
from Protavic America, Inc.

The two component polyurethane compound described in this data sheet is specifically designed for the encapsulation by casting of completed circuit board. The cured material meets the flammability requirements of UL 94, V-O at thickness of 0.070 in. and greater (UL File Number E116296) and provides... [See More]

  • Type: High Dielectric; Thermal Insulation
  • Chemical System: Polyurethane
  • Form / Function: Liquid; Encapsulant or Conformal Coating
  • Composition: Filled
Flame retardant thermally conductive polyurethane -- 50-2150FR
from Epoxies Etc...

The 50-2150FR Potting and Encapsulating Compound has been formulated to meet the stringent non-burning requirements of UL94 V-O. This system offers excellent heat transfer, low exotherm, and excellent electrical properties. 50-2150 is a two part, non-mercury, flexible polyurethane potting system. [See More]

  • Type: High Dielectric; Thermally Conductive
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Chemical System: Polyurethane
  • Features: Flame Retardant; Flexible
Epoxy Adhesive -- ANE-46505
from Protavic America, Inc.

Amber epoxy system . Excellent for use in high heat (steam) and chemical environments. 2 hour gel time.Bonds well to metal, plastics and wood. High thermal shock resistance. Available in colors and higher or lower viscosities. Passes NASA outgassingrequirements. [See More]

  • Type: High Dielectric
  • Chemical System: Epoxy
  • Form / Function: Liquid; Die Bonding Adhesives
  • Composition: Unfilled
Flexible UV Curable Compound -- UV 60-7016
from Epoxies Etc...

UV 60-7016 is a high performance Ultraviolet Curable Adhesive, Sealant, and Potting Compound. This new one component urethane acrylate system was specifically designed for the difficult bonding of glass to metal. UV 60-7016 has outstanding thermal shock and impact resistance, and is an excellent... [See More]

  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
  • Composition: Unfilled
  • Chemical System: Elastomeric; Polyurethane
  • Cure / Technology: UV or Radiation Cured; Single Component