Optical Grade / Material Encapsulants and Potting Compounds

Biocompatible, Spectrally Transparent Epoxy -- EPO-TEK® MED-301
from Epoxy Technology

EPO-TEK ® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries.  Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market... [See More]

  • Type: Optical
  • Chemical System: Epoxy
  • Form / Function: Liquid; Glob Top, Daub, Doming or Overfill
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Addition Cured Silicone is Optically Clear with Enhanced Low Temperature Serviceability -- MasterSil 157
from Master Bond, Inc.

MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]

  • Type: High Dielectric; Optical; Thermally Conductive
  • Chemical System: Silicone
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid
  • Composition: Unfilled
Epoxy Has Low Thermal Expansion Coefficient -- EP30LTE
from Master Bond, Inc.

Master Bond Polymer System EP30LTE is a recently developed epoxy resin system with uniquely low thermal expansion properties and unmatched dimensional stability for high performance bonding, coating, sealing and casting. This new two component epoxy resin compound cures readily at ambient or more... [See More]

  • Type: High Dielectric; Optical
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Composition: Filled
Epoxy Adhesive with Low Coefficient of Thermal Expansion -- EP42HT-2LTE
from Master Bond, Inc.

Featuring an exceedingly low coefficient of thermal expansion of 9-12 x 10-6 in/in/ °C, EP42HT-2LTE is a two component epoxy for bonding, sealing, coating and select casting applications. It has outstanding dimensional stability and will bond well to a wide variety of substrates, including... [See More]

  • Type: High Dielectric; Optical; Thermal Insulation
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket
  • Composition: Unfilled
Extremely Soft MasterSil 170 Gel Encapsulant Offers Removability and Optical Clarity -- MasterSil 170 Gel
from Master Bond, Inc.

MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]

  • Type: High Dielectric; Optical; Thermally Conductive
  • Chemical System: Silicone
  • Form / Function: Liquid
  • Composition: Unfilled
Fast Curing, Non-Yellowing Two Component Epoxy -- EP30-4
from Master Bond, Inc.

Master Bond Polymer Adhesive EP30-4 is a unique low viscosity, two component epoxy adhesive for bonding, coating, and sealing formulated to cure at room temperature or more rapidly at elevated temperatures, with a two (2) to one (1) mix ratio by weight. This adhesive is 100% reactive and does not... [See More]

  • Type: High Dielectric; Optical; Thermal Insulation
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Cure / Technology: Thermoset; Two Component  
Flexibilized, Abrasion Resistant Epoxy -- EP30D-7
from Master Bond, Inc.

Master Bond Polymer System EP30D-7 is a versatile two component flexibilized epoxy featuring superior strength, toughness and abrasion resistance for high performance bonding, sealing, coating, potting and encapsulation applications. It contains the recognized advantageous performance... [See More]

  • Type: High Dielectric; Optical
  • Chemical System: Epoxy; Polyurethane
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Cure / Technology: Thermoset; Two Component  
High Strength UV Curable Adhesive -- UV15
from Master Bond, Inc.

Master Bond UV15 is a new one component, high strength, low viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It is a 100% reactive and does not contain any solvents or other volatiles. When exposed to a source... [See More]

  • Type: High Dielectric; Optical; Thermal Insulation
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating; Impregnating Resin
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
High Strength, Chemically Resistant UV Curable System -- UV18S
from Master Bond, Inc.

Master Bond UV18S is a new one component, high strength UV curable system with superb chemical resistance & flexibility for coating, sealing and bonding. It is a 100% reactive, mobile liquid at ambient temperatures which does not contain any solvents or other volatiles. When exposed to a source... [See More]

  • Type: High Dielectric; Optical; Thermal Insulation
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating; Impregnating Resin
  • Features: Non-corrosive; Dissimilar Substrates
Low Viscosity Structural Epoxy Adhesive System -- EP112
from Master Bond, Inc.

Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronic/ structural applications. The two components are combined in a convenient noncritical mix... [See More]

  • Type: High Dielectric; Optical; Thermal Insulation
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating; Impregnating Resin
  • Composition: Unfilled
Low Viscosity, Electrically Insulating Epoxy Features Excellent Optical Clarity -- EP30LP-2
from Master Bond, Inc.

Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. [See More]

  • Type: High Dielectric; Optical; Thermally Conductive
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Composition: Unfilled
Nanosilica Filled Optically Clear Epoxy with High Abrasion Resistance -- EP30NS
from Master Bond, Inc.

Master Bond EP30NS is a nanosilica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically clear and meets NASA low outgassing specifications. [See More]

  • Type: High Dielectric; Optical; Thermally Conductive
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Composition: Filled
One Component, UV Curable Adhesive System -- UV10
from Master Bond, Inc.

Master Bond UV10 and UV10TK are one component UV curable modified epoxy compounds, ready for use as supplied, for high performance casting, coatings, sealing and bonding applications. UV10 is a low viscosity amber liquid at room temperature and UV10TK is a medium viscosity amber liquid at room... [See More]

  • Type: High Dielectric; Optical; Thermal Insulation
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating; Impregnating Resin
  • Features: Non-corrosive; Dissimilar Substrates
Optically Clear, Low Viscosity, Two Component Epoxy -- EP30
from Master Bond, Inc.

Master Bond Polymer System EP30 is a low viscosity, two component epoxy adhesive for general purpose bonding, coating, sealing and casting formulated to cure at room temperature or more rapidly at elevated temperatures with a four (4) to one (1) mix ratio by weight. This adhesive is 100% reactive... [See More]

  • Type: Optical; Thermal Insulation
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Cure / Technology: Thermoset; Two Component  
Optically Clear, Room Temperature Curing Epoxy Blocks UV Light Transmission -- EP30-2LB
from Master Bond, Inc.

Formulated to have special optical transmission properties, EP30-2LB is an optically clear epoxy that does not permit UV light transmission, but transmits well from 450-900 nm and above. It is a user friendly compound that has a non-critical ten to one mix ratio by weight. This system cures readily... [See More]

  • Type: High Dielectric; Optical; Thermally Conductive
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Composition: Unfilled
Thermally Stable Electrically Insulating Epoxy -- EP121CL
from Master Bond, Inc.

Master Bond EP121CL is a two component, high performance epoxy resin system featuring high thermal stability, superior electrical insulation properties and outstanding dimensional stability for casting, sealing, potting, encapsulation and impregnation for service up to 450-500 °F. It cures... [See More]

  • Type: High Dielectric; Optical; Thermal Insulation
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
  • Composition: Unfilled
Two Component, Room Temperature Curing Epoxy For Bonding, Coating, Sealing And Potting -- EP88FL
from Master Bond, Inc.

Master Bond EP88FL is a low viscosity, optically clear, two component epoxy system featuring good flexibility for high performance bonding, coating, sealing and potting. [See More]

  • Type: High Dielectric; Optical; Thermally Conductive
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket (optional feature); Liquid; Encapsulant or Conformal Coating
  • Composition: Unfilled
Two Part, Low Viscosity Epoxy Offers Long Working Life and High Elongation -- EP29LPHE
from Master Bond, Inc.

Optically clear EP29LPHE is a two component epoxy that has notable toughness along with high elongation, which imparts good impact and shock resistance. It bonds well to a wide variety of substrates including metals, ceramics, glass, optical fibers, graphite and many rubbers and plastics. Its... [See More]

  • Type: High Dielectric; Optical; Thermally Conductive
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Composition: Unfilled
Optically Transparent Epoxy -- 20-3302
from Epoxies Etc...

20-3302 is a two component, ultra clear epoxy system. It provides excellent optical transmission along with outstanding adhesion and electrical properties. This high purity grade polymer system is formulated with proprietary ultraviolet protectors to minimize yellowing of the cured epoxy. This... [See More]

  • Type: Optical
  • Chemical System: Epoxy
  • Form / Function: Liquid; Die Bonding Adhesives
  • Composition: Unfilled
TECHNOMELT PA 668 Clear
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Type: High Dielectric; Optical; Thermally Conductive
  • Chemical System: Polyamide
  • Form / Function: Pellets
  • Cure / Technology: Thermoplastic / Hot Melt
Silicone Elastomer Gel Encapsulant And Potting Compound -- SilGel® 612 A/B
from Wacker Chemical Corp.

WACKER SilGel ® 612 A/B is a pourable, additioncuring, RTV-2 silicone rubber that vulcanizes at room temperature to a very soft silicone gel. Special features. two-part, 1 : 1 mixing ratio. low viscosity. rapid heat cure. very low hardness (silicone gel). crystal clear. pronounced inherent tack. [See More]

  • Type: Optical
  • Chemical System: Silicone; Elastomeric
  • Form / Function: Liquid
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Encapsulants -- LOCTITE STYCAST 1269A
from Henkel Corporation - Industrial

LOCTITE STYCAST 1269A, Epoxy, Encapsulant. LOCTITE ® STYCAST 1269A is a two-component crystal clear, heat cured, tough, epoxy encapsulant. This material is resistant to discoloration even after exposure to elevated temperatures up to 120 ºC. Optical clarity. Good high temperature... [See More]

  • Type: Optical