Optical Grade / Material Encapsulants and Potting Compounds
from CHT USA Inc.
CHT's QSil 216 is a 2-part, platinum cure, optically clear silicone encapsulant designed for optical applications. QSil 216 features a 10:1 mix ratio by weight and its low viscosity profile enables excellent flow around components and is excellent for potting complex parts. The chemical composition... [See More]
- Type: High Dielectric; Optical
- Industry: Automotive; Electronics; OEM or Industrial
- Cure / Technology: Two Component ; Addition
- Use Temperature: -67 to 399
from MacDermid Alpha Electronics Solutions
An optically clear acrylic conformal coating ideal for LED applications and those demanding clarity and UV resistance. Product Overview. AFA optically clear acrylic conformal coating is ideally suited for use as an LED coating or in other commercial applications to protect the PCB from the... [See More]
- Type: Optical
- Chemical System: Acrylic
- Form / Function: Encapsulant or Conformal Coating
- Industry: Electronics; Semiconductors, IC's
from RS Components, Ltd.
RS PRO ERUR5640RP250G Potting Compound [See More]
- Type:
- Chemical System: Polyurethane; Pur
- Form / Function: Pack; Liquid
from Master Bond, Inc.
MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]
- Type: High Dielectric; Optical; Thermally Conductive
- Chemical System: Silicone
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid
- Composition: Unfilled
from Master Bond, Inc.
MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]
- Type: High Dielectric; Optical; Thermally Conductive
- Chemical System: Silicone
- Form / Function: Liquid
- Composition: Unfilled
from Master Bond, Inc.
Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronicc/ structural applications. The two components are combined in a convenient noncritical mix... [See More]
- Type: High Dielectric; Optical; Thermal Insulation
- Chemical System: Epoxy
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating; Impregnating Resin
- Composition: Unfilled
from Master Bond, Inc.
Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. [See More]
- Type: High Dielectric; Optical; Thermally Conductive
- Chemical System: Epoxy
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
- Composition: Unfilled
from Master Bond, Inc.
Master Bond EP30NS is a nano silica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically clear and meets NASA low outgassing specifications. [See More]
- Type: High Dielectric; Optical; Thermally Conductive
- Chemical System: Epoxy
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
- Composition: Filled
from Master Bond, Inc.
Master Bond UV10 and UV10TK are one component UV curable modified epoxy compounds, ready for use as supplied, for high performance casting, coatings, sealing and bonding applications. UV10 is a low viscosity amber liquid at room temperature and UV10TK is a medium viscosity amber liquid at room... [See More]
- Type: High Dielectric; Optical; Thermal Insulation
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating; Impregnating Resin
- Features: Non-corrosive; Dissimilar Substrates
from Master Bond, Inc.
Master Bond Polymer System EP30 is a low viscosity, two component epoxy adhesive for general purpose bonding, coating, sealing and casting formulated to cure at room temperature or more rapidly at elevated temperatures with a four (4) to one (1) mix ratio by weight. This adhesive is 100% reactive... [See More]
- Type: Optical; Thermal Insulation
- Chemical System: Epoxy
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Formulated to have special optical transmission properties, EP30-2LB is an optically clear epoxy that does not permit UV light transmission, but transmits well from 450-900 nm and above. It is a user friendly compound that has a non-critical ten to one mix ratio by weight. This system cures readily... [See More]
- Type: High Dielectric; Optical; Thermally Conductive
- Chemical System: Epoxy
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
- Composition: Unfilled
from Master Bond, Inc.
Master Bond EP121CL is a two component, high performance epoxy resin system featuring high thermal stability, superior electrical insulation properties and outstanding dimensional stability for casting, sealing, potting, encapsulation and impregnation for service up to 450-500 °F. It cures... [See More]
- Type: High Dielectric; Optical; Thermal Insulation
- Chemical System: Epoxy
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
- Composition: Unfilled
from Master Bond, Inc.
Master Bond EP88FL is a low viscosity, optically clear, two component epoxy system featuring good flexibility for high performance bonding, coating, sealing and potting. [See More]
- Type: High Dielectric; Optical; Thermally Conductive
- Chemical System: Epoxy
- Form / Function: Gap Filler, Foam in Place Gasket (optional feature); Liquid; Encapsulant or Conformal Coating
- Composition: Unfilled
from Master Bond, Inc.
Key Features. Free flowing viscosity. High temperature resistance. Exceptionally long open time. Passes NASA low outgassing. Product Description. Master Bond Supreme 121AO is a thermally conductive epoxy for bonding, sealing and encapsulation. The mix ratio is 100:80 by weight. This system has a... [See More]
- Type: High Dielectric; Optical; Thermally Conductive
- Chemical System: Epoxy
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Optically clear EP29LPHE is a two component epoxy that has notable toughness along with high elongation, which imparts good impact and shock resistance. It bonds well to a wide variety of substrates including metals, ceramics, glass, optical fibers, graphite and many rubbers and plastics. Its... [See More]
- Type: High Dielectric; Optical; Thermally Conductive
- Chemical System: Epoxy
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
- Composition: Unfilled
from Wacker Chemical Corp.
WACKER SilGel ® 612 A/B is a pourable, additioncuring, RTV-2 silicone rubber that vulcanizes at room temperature to a very soft silicone gel. Special features. two-part, 1 : 1 mixing ratio. low viscosity. rapid heat cure. very low hardness (silicone gel). crystal clear. pronounced inherent tack. [See More]
- Type: Optical
- Chemical System: Silicone; Elastomeric
- Form / Function: Liquid
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Epoxy Technology
EPO-TEK ® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries. Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market... [See More]
- Type: Optical
- Chemical System: Epoxy
- Form / Function: Liquid; Glob Top, Daub, Doming or Overfill
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Henkel Corporation - Industrial
LOCTITE STYCAST 1269A, Epoxy, Encapsulant. LOCTITE ® STYCAST 1269A is a two-component crystal clear, heat cured, tough, epoxy encapsulant. This material is resistant to discoloration even after exposure to elevated temperatures up to 120 ºC. Optical clarity. Good high temperature... [See More]
- Type: Optical
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Type: High Dielectric; Optical; Thermally Conductive
- Chemical System: Polyamide
- Form / Function: Pellets
- Cure / Technology: Thermoplastic / Hot Melt
from Epoxies Etc...
20-3302 is a two component, ultra clear epoxy system. It provides excellent optical transmission along with outstanding adhesion and electrical properties. This high purity grade polymer system is formulated with proprietary ultraviolet protectors to minimize yellowing of the cured epoxy. This... [See More]
- Type: Optical
- Chemical System: Epoxy
- Form / Function: Liquid; Die Bonding Adhesives
- Composition: Unfilled