Unfilled Encapsulants and Potting Compounds

ELAN-Cast® -- P 300 S RTC
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Composition: Unfilled
  • Form / Function: Liquid; Impregnating Resin (optional feature)
  • Type: High Dielectric
  • Chemical System: Alkyd
Optical Epoxy -- EPO-TEK® 310M-1
from Epoxy Technology

We have served the optical market since 301 was introduced in 1969.   Our products encapsulate, coat, bond and seal plastics, crystals and glass together for optical components, such as prism, filters, and mirrors. EPO-TEK ® fabricated components are the building blocks of camera, laser,... [See More]

  • Composition: Unfilled
  • Form / Function: Liquid; Glob Top, Daub, Doming or Overfill
  • Type: Optical
  • Chemical System: Epoxy
Addition Cured Silicone is Optically Clear with Enhanced Low Temperature Serviceability -- MasterSil 157
from Master Bond, Inc.

MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]

  • Composition: Unfilled
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid
  • Type: High Dielectric; Optical; Thermally Conductive
  • Chemical System: Silicone
B-Staged Epoxy Meets Airbus Standards for Flame Retardancy & Toxicity -- EP36FR
from Master Bond, Inc.

EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]

  • Composition: Unfilled
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
Electrically Conductive Die Attach Adhesive Has Very High Thermal Conductivity -- EP3HTSDA-1
from Master Bond, Inc.

EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]

  • Composition: Unfilled
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
Epoxy Features Very Low Coefficient of Thermal Expansion -- EP30LTE-2
from Master Bond, Inc.

Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating. [See More]

  • Composition: Unfilled
  • Form / Function: Liquid; Encapsulant or Conformal Coating
  • Type: High Dielectric; Thermal Insulation
  • Chemical System: Epoxy
Epoxy Meets Airbus Standards for Flame Retardancy, Smoke and Gas Emissions -- EP93FRHT
from Master Bond, Inc.

EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]

  • Composition: Unfilled
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
Epoxy with High Elongation Passes ISO 10993-5 Certification for Cytotoxicity -- EP40Med
from Master Bond, Inc.

EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]

  • Composition: Unfilled
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
Extremely Soft MasterSil 170 Gel Encapsulant Offers Removability and Optical Clarity -- MasterSil 170 Gel
from Master Bond, Inc.

MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]

  • Composition: Unfilled
  • Form / Function: Liquid
  • Type: High Dielectric; Optical; Thermally Conductive
  • Chemical System: Silicone
Fast Curing, Optically Clear, Two Part Epoxy -- EP39-2
from Master Bond, Inc.

Master Bond Polymer System EP39-2 is a fast curing, low viscosity, optically clear two component epoxy system for high performance bonding, sealing, coating and casting. It is 100% reactive and does not contain any diluents, solvents or other volatiles. The mix ratio is a convenient 2 to 1 by... [See More]

  • Composition: Unfilled
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Die Bonding Adhesives
  • Cure / Technology: Thermoset; Two Component  
High Temperature Resistant Epoxy Compound -- EP45HT
from Master Bond, Inc.

Master Bond Polymer System EP45HT is a two component epoxy system for high performance structural bonding and casting. It is suitable for applications where long term exposure to temperatures from -80 °F to +500 °F is required. lt is 100% reactive and does not contain any solvents or... [See More]

  • Composition: Unfilled
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Die Bonding Adhesives
  • Cure / Technology: Thermoset; Two Component  
High Temperature Resistant, One Component Epoxy System -- EP13
from Master Bond, Inc.

Master Bond Polymer System EP13 is a one component heat curing epoxy featuring high shear strength and very high temperature resistance. This one component system is formulated to cure at temperatures from 300 °F to 350 °F for 60-90 minutes. Upon cure, EP13 readily attains tensile shear... [See More]

  • Composition: Unfilled
  • Form / Function: Encapsulant or Conformal Coating; Die Bonding Adhesives
  • Type: High Dielectric
  • Chemical System: Epoxy
High Temperature Resistant, Toughened Epoxy -- EP125
from Master Bond, Inc.

Master Bond Polymer System 125 is a two component toughened epoxy resin for prolonged service above 500 °F with truly outstanding chemical resistance. High strength bonds serviceable up to 600 °F can be obtained with this exceptionally thermally stable and chemically resistant epoxy resin... [See More]

  • Composition: Unfilled
  • Form / Function: Powder; Gap Filler, Foam in Place Gasket; Impregnating Resin; Die Bonding Adhesives
  • Type: High Dielectric; Thermal Insulation
  • Chemical System: Epoxy
Low Outgassing, Optically Clear Two Component Epoxy -- EP29LPSP
from Master Bond, Inc.

Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. Not only is EP29LPSP able to function as an adhesive, sealant and protective coating at temperatures as low as 4K, but it is... [See More]

  • Composition: Unfilled
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Type: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding
  • Chemical System: Epoxy
Low Viscosity Structural Epoxy Adhesive System -- EP112
from Master Bond, Inc.

Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronic/ structural applications. The two components are combined in a convenient noncritical mix... [See More]

  • Composition: Unfilled
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating; Impregnating Resin
  • Type: High Dielectric; Optical; Thermal Insulation
  • Chemical System: Epoxy
Low Viscosity, Electrically Insulating Epoxy Features Excellent Optical Clarity -- EP30LP-2
from Master Bond, Inc.

Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. [See More]

  • Composition: Unfilled
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Type: High Dielectric; Optical; Thermally Conductive
  • Chemical System: Epoxy
Low Viscosity, Fast Curing, Two Component Epoxy -- EP38
from Master Bond, Inc.

Master Bond Polymer System EP38 is a fast curing, low viscosity, optically clear two component epoxy system for high performance coating, bonding and sealing. It is 100% reactive and does not contain any volatiles. The mix ratio is a convenient 3 to 1 by weight. EP38 is very fast curing. Coatings as... [See More]

  • Composition: Unfilled
  • Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Die Bonding Adhesives
  • Type: High Dielectric
  • Chemical System: Epoxy
NASA Low Outgassing Rated Epoxy Features Enhanced Chemical Resistance -- EP42-2LV Black
from Master Bond, Inc.

EP42-2LV Black is a two component, room temperature curing epoxy compound featuring low viscosity and superior chemical resistance. It meets NASA low outgassing specifications, is black in color and optically opaque. [See More]

  • Composition: Unfilled
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
New Epoxy Offers Rapid Cures and Chemical Resistance -- EP41S-F
from Master Bond, Inc.

Offering impressive physical strength characteristics, EP41S-F is an electrically insulative two component epoxy that cures rapidly at ambient and elevated temperatures. Typically faster curing epoxies are somewhat less chemically resistant than other types of systems, but EP41S-F is one of the few... [See More]

  • Composition: Unfilled
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
One Component Toughened Epoxy System For Bonding And Sealing -- Supreme 17HT
from Master Bond, Inc.

Master Bond Supreme 17HT is a one component toughened epoxy for bonding and sealing. It has a moderate viscosity system with good flow properties. [See More]

  • Composition: Unfilled
  • Form / Function: Liquid
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
One Component, High Temperature Resistant Epoxy -- EP36
from Master Bond, Inc.

Master Bond Polymer System EP36 is a unique one component high performance toughened epoxy system for electrical potting, casting, encapsulation, baked coatings and adhesive applications. It features an outstanding combination of properties including high temperature stability up to 500 °F,... [See More]

  • Composition: Unfilled
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
  • Type: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding
  • Chemical System: Epoxy
One component, high temperature resistant epoxy system for bonding and sealing -- EP17HTDA-1
from Master Bond, Inc.

Formulated for die attach applications, Master Bond EP17HTDA-1 is a one component epoxy that can also be used for conventional bonding and sealing. This system features an excellent die shear strength of 24-27 kg-f and can be used in a typical die size ranging from 4-400 mm2. EP17HTDA-1 can also be... [See More]

  • Composition: Unfilled
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
One Component, Storage Stable Epoxy -- EP19HT
from Master Bond, Inc.

Master Bond Polymer System EP19HT is a storage stable one component liquid epoxy resin system for durable, high performance adhesive/sealants, impregnants and liners. It features remarkably long shelf life and excellent storage characteristics at ambient temperatures yet cures readily at elevated... [See More]

  • Composition: Unfilled
  • Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Impregnating Resin; Die Bonding Adhesives
  • Type: High Dielectric
  • Chemical System: Epoxy
Chemical Resistant Epoxy System -- 20-3004 HV
from Epoxies Etc...

20-3004 LV & HV are two component chemical resistance epoxy systems. They were developed for potting, coating, and adhesive applications requiring superior chemical resistance. They exhibit outstanding bonds to a variety of substrates. [See More]

  • Composition: Unfilled
  • Chemical System: Epoxy
  • Form / Function: Gel
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
5-Minute® Epoxy -- 14200 [14200 from ITW Devcon]
from Applied Industrial Technologies

15 oz Tube; A Rapid-Curing, General Purpose Adhesive/Encapsulant [See More]

  • Composition: Unfilled
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
  • Form / Function: Liquid
  • Industry: OEM or Industrial
Clear Non-Yellowing Silicone Encapsulant -- PNS-56225
from Protavic America, Inc.

PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]

  • Composition: Unfilled
  • Form / Function: Liquid; Encapsulant or Conformal Coating; Die Bonding Adhesives
  • Type: Electrically Conductive; Thermally Conductive
  • Chemical System: Silicone
Cement -- No. 31
from Sauereisen, Inc.

Sauereisen Cement No. 31 is a white, porcelain-like cement that is widely used throughout industry in a variety of applications. including assembling, sealing, insulating and cementing of ceramics, porcelain, metal, and glass. [See More]

  • Composition: Unfilled
  • Form / Function: Powder; Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Ceramic
Epoxy Adhesive & Potting Compound -- 10-3009
from Epoxies Etc...

10-3009 is a low viscosity epoxy adhesive and potting compound. It is easy to use and allows the end user to adjust the flexibility of the cured epoxy. This product offers a good combination of peel and tensile strength. 10-3009 provides electrical insulation and outstanding adhesion. [See More]

  • Composition: Unfilled
  • Form / Function: Liquid
  • Type: High Dielectric; Thermal Insulation
  • Chemical System: Epoxy
Epoxy Adhesive -- ANE-26144
from Protavic America, Inc.

Clear unfilled epoxy also available in a one-part system. Use life is over three days after mixing at room temperature. Excellent for ferrite and optical bonding applications. Requires heat assist to cure. [See More]

  • Composition: Unfilled
  • Form / Function: Liquid; Encapsulant or Conformal Coating; Die Bonding Adhesives
  • Type: High Dielectric
  • Chemical System: Epoxy
Conocrete - Fast Patch -- No. 149
from Sauereisen, Inc.

ConoCrete - Fast Patch No. 149 is a three-component, fast setting epoxy monolithic that is designed for patching cracks and holes. This material is ideal for use on highways, bridge decks,. docks, ramps, traffic aisles, industrial floors and airport runways. Fast Patch No. 149 produces extremely... [See More]

  • Composition: Unfilled
  • Chemical System: Epoxy
  • Form / Function: Powder
  • Cure / Technology: Thermoset; Two Component  
Flame Retardant Thermally Conductive -- 50-3150 FR
from Epoxies Etc...

50-3150 FR has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-3150 FR Black Epoxy with Catalyst 190 and Catalyst 105 are listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low shrinkage, and outstanding insulation... [See More]

  • Composition: Unfilled
  • Form / Function: Liquid
  • Type: Thermally Conductive
  • Chemical System: Epoxy
Filled Epoxy Cast -- PNE-30270
from Protavic America, Inc.

A solvent-free, single component resin with low linear expansion and high ionic purity for protecting semi-conductor silicon crystals. [See More]

  • Composition: Unfilled
  • Form / Function: Liquid; Encapsulant or Conformal Coating
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
Flexible UV Curable Compound -- UV 60-7016
from Epoxies Etc...

UV 60-7016 is a high performance Ultraviolet Curable Adhesive, Sealant, and Potting Compound. This new one component urethane acrylate system was specifically designed for the difficult bonding of glass to metal. UV 60-7016 has outstanding thermal shock and impact resistance, and is an excellent... [See More]

  • Composition: Unfilled
  • Chemical System: Elastomeric; Polyurethane
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
  • Cure / Technology: UV or Radiation Cured; Single Component
Optically Clear UV Adhesive -- ANA-97290
from Protavic America, Inc.

ANA-97290 is a clear Ultraviolet/ Visible light curing adhesive. It has very low shrinkage during cure for alignment sensitive parts. It is recommended for small electrical/electronic casting and encapsulating applications that require a unique combination of excellent wetting, flow, good thermal... [See More]

  • Composition: Unfilled
  • Form / Function: Liquid; Encapsulant or Conformal Coating; Gel (optional feature); Die Bonding Adhesives
  • Type: Electrically Conductive; Thermal Insulation
  • Cure / Technology: Thermoset; Two Component  ; UV or Radiation Cured
Polyurethane Potting & Encapsulant -- 20-2101
from Epoxies Etc...

This series of polyurethane systems is engineered for electronic potting, encapsulating, and casting applications. They are low in viscosity, low in toxicity and available in the popular TriggerBond ® dual barrel cartridge dispensing system. These elastomeric systems are suitable for a variety... [See More]

  • Composition: Unfilled
  • Chemical System: Polyurethane
  • Form / Function: Liquid
  • Cure / Technology: Thermoset; Two Component  
Polyurethane Adhesive -- PNU-56200
from Protavic America, Inc.

PNU-56200 ™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term circuit protection and... [See More]

  • Composition: Unfilled
  • Form / Function: Liquid; Encapsulant or Conformal Coating; Die Bonding Adhesives
  • Type: High Dielectric
  • Chemical System: Polyurethane
Reworkable Underfill Epoxy Resin -- ANA-10199R
from Protavic America, Inc.

Fast flow, fast cure capillary reworkable underfill. The rheology of the PROTAVIC ANA 10199 R in combination with its fineness make the product perfectly adapted to high reliability small gap underfill applications. It presents a good pot life at room temperature 20-22C and a high reactivity at... [See More]

  • Composition: Unfilled
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
  • Type: High Dielectric; Thermal Insulation
  • Cure / Technology: Thermoset; Single Component