Thermal Compound / Thermally Conductive Encapsulants and Potting Compounds

Ripley™ -- E 468-2-7-55F
from ELANTAS PDG, Inc.

Mineral-filled VPI resin - semi-flexible for transformers with improved heat dissipation [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
  • Form / Function: Liquid; Impregnating Resin
  • Composition: Filled
Momentive TSE3331 Electronic Potting Silicone 2kg -- MOSI17151
from Techsil Limited

TSE3331 is a two part, heat curing silicone from Momentive Performance Materials designed for potting and encapsulation where flammability and/or thermal conductivity is of concern. It provides excellent flame retardant properties and very stable dielectric properties over a broad range of operating... [See More]

  • Type: Thermally Conductive
  • Industry: Electronics
  • Chemical System: Silicone; Elastomeric
  • Use Temperature: -55 to 200
Addition Cured Silicone is Optically Clear with Enhanced Low Temperature Serviceability -- MasterSil 157
from Master Bond, Inc.

MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]

  • Type: High Dielectric; Optical; Thermally Conductive
  • Chemical System: Silicone
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid
  • Composition: Unfilled
Dow SE 4445 CV Thermally Conductive Gel Gray 210 mL Cartridge -- SE 4445 CV KIT 210ML [4025973 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow SE 4445 CV Thermally Conductive Gel Gray is a two component, heat curing gel that is used for potting electronic modules, base material for thermally conductive gel sheet, and gap fill material between heat sinks and electronic heat sinks. It offers low viscosity, wide service temperature range,... [See More]

  • Type: Thermally Conductive
  • Thermal Conductivity: 1.26
  • Cure / Technology: Two Component  
  • Dielectric Strength: 127
Biocompatible, Thermally Conductive Epoxy -- EPO-TEK® MED-T905BN-3
from Epoxy Technology

EPO-TEK ® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries.  Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market... [See More]

  • Type: High Dielectric; Optical; Thermally Conductive
  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Epoxy
  • Industry: Sanitary; Electronics; Photonics
Techsil® EP25485 Black Flame Retardant Epoxy 5kg -- TESI19080
from Techsil Limited

Techsil ® EP25485 is a low viscosity, thermally conductive flame retardant potting and encapsulating compound. The mixed system has a long usable life and may be hot or cold cured. The system exhibits a good surface finish, high electrical strength, high thermal conductivity and low cure... [See More]

  • Type: Thermally Conductive
  • Chemical System: Epoxy
  • Form / Function: Liquid
  • Cure / Technology: Two Component  
B-Staged Epoxy Meets Airbus Standards for Flame Retardancy & Toxicity -- EP36FR
from Master Bond, Inc.

EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Composition: Unfilled
Dow SYLGARD™3-6605 Thermally Conductive Encapsulant Gray 13.6 kg Kit -- 3-6605 COND ELAST 13.6KG [3128571 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow SYLGARD ™3-6605 Thermally Conductive Elastomer Gray is a two component, heat curing, medium viscosity, silicone elastomer that is used to protect electrical components from extreme environments, moisture, and stress. It is flowable, has good dielectric properties and chemical stability. [See More]

  • Type: Thermally Conductive
  • Thermal Conductivity: 0.8500
  • Cure / Technology: Two Component  
  • Tensile (Break): 850
Techsil® Non Silicone Heat Transfer Compound 620gm -- TEOT04005
from Techsil Limited

Techsil ® HTC is a non-silicone heat transfer compound with a high thermal conductivity (0.9W/mK) designed for thermal coupling of electrical components. HTC is recommended where the efficient and reliable thermal coupling of electrical and electronic components is required or between any... [See More]

  • Type: Thermally Conductive
  • Use Temperature: -50 to 130
  • Industry: Electronics
Dual Curing, Thixotropic Adhesive -- UV22DC80-10F
from Master Bond, Inc.

One part, nanosilica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: UV Curing
  • Form / Function: Liquid; Encapsulant or Conformal Coating; Glob Top, Daub, Doming or Overfill
  • Composition: Filled
Henkel Loctite Ablestik 281 Thermally Conductive Encapsulant Black 1 qt Can -- 281 BLACK 2 LB. [1188106 from Henkel Corporation - Industrial]
from Ellsworth Adhesives

Henkel Loctite Ablestik 281 Epoxy Adhesive Black, formerly Emerson and Cuming ECCOBOND, is a one component, thixotropic paste that is used for bonding plastics, metal, and glass. It offers good chemical resistance, good electrical insulation properties, high thermal conductivity, and low coefficient... [See More]

  • Type: Thermally Conductive
  • Thermal Conductivity: 1.2
  • Cure / Technology: Single Component
Electrically and Thermally Conductive, Two Part Silicone Meets NASA Low Outgassing Specifications -- MasterSil 973S-LO
from Master Bond, Inc.

MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]

  • Type: Electrically Conductive; Thermally Conductive
  • Chemical System: Silicone
  • Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating
  • Composition: Filled
Henkel Loctite STYCAST 1495 K Thermally Conductive Encapsulant Black 1 gal Pail -- 1495K 14LB GALLON [1187986 from Henkel Corporation - Industrial]
from Ellsworth Adhesives

Henkel Loctite STYCAST 1495 K Black, formerly Emerson and Cuming, is an epoxy encapsulant that is used for electronic components that require good flowability and thermal conductivity. It offers low viscosity, versatility, high filler, excellent mechanical and electrical properties. 1 gal Pail. [See More]

  • Type: Thermally Conductive
  • Thermal Conductivity: 1 to 1.1
  • Cure / Technology: Two Component  
  • Tensile (Break): 6700 to 8500
Electrically Conductive Die Attach Adhesive Has Very High Thermal Conductivity -- EP3HTSDA-1
from Master Bond, Inc.

EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
  • Composition: Unfilled
Henkel Loctite STYCAST 2762 FT Thermally Conductive Encapsulant Black 1 qt Can -- 2762FT BLK 3LB RESIN ONLY [1188099 from Henkel Corporation - Industrial]
from Ellsworth Adhesives

Henkel Loctite STYCAST 2762 FT Black, formally Emerson and Cuming, is a two component, highly filled, epoxy encapsulant that is used for potting and casting electronic components. It offers low shrinkage, low coefficient of thermal expansion, and high thermal conductivity. It is resistant to... [See More]

  • Type: Thermally Conductive
  • Thermal Conductivity: 1.34
  • Cure / Technology: Two Component  
  • Dielectric Strength: 400
Electrically Conductive Die Attach Epoxy With High Glass Transition Temperature -- EP17HTS-DA
from Master Bond, Inc.

Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]

  • Type: Electrically Conductive; Thermally Conductive
  • Chemical System: Polyphenylene Sulfide; Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
  • Composition: Filled
Henkel Loctite STYCAST 2762 Thermally Conductive Encapsulant Black 1 qt Can -- 2762 BLK 3LB RESIN ONLY [1188097 from Henkel Corporation - Industrial]
from Ellsworth Adhesives

Henkel Loctite STYCAST 2762 Black is a two component, highly filled, epoxy encapsulant that is used for potting and casting electronic components. It offers low shrinkage, low coefficient of thermal expansion, and high thermal conductivity. It is resistant to chemicals and high temperatures. 1 qt... [See More]

  • Type: Thermally Conductive
  • Thermal Conductivity: 1.37
  • Cure / Technology: Two Component  
  • Dielectric Strength: 381
Epoxy Meets Airbus Standards for Flame Retardancy, Smoke and Gas Emissions -- EP93FRHT
from Master Bond, Inc.

EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Composition: Unfilled
Henkel Loctite STYCAST 2850FT Thermally Conductive Encapsulant Black 1 gal Pail -- 2850FT BLACK 18 LB. [1188119 from Henkel Corporation - Industrial]
from Ellsworth Adhesives

Henkel Loctite STYCAST 2850FT Black, formerly Emerson and Cuming, is a two component, room temperature curing, epoxy encapsulant that is used for components that are exposed to thermal shock and need heat dissipation. It offers a low coefficient of thermal expansion, electrical insulative and... [See More]

  • Type: Thermally Conductive
  • Thermal Conductivity: 1.02 to 1.28
  • Cure / Technology: Two Component  
  • Dielectric Strength: 366 to 381
Epoxy with High Elongation Passes ISO 10993-5 Certification for Cytotoxicity -- EP40Med
from Master Bond, Inc.

EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Composition: Unfilled
Henkel Loctite STYCAST 2850FT Thermally Conductive Encapsulant Black 22 kg Pail -- 2850FT BLACK 22KG [2056963 from Henkel Corporation - Industrial]
from Ellsworth Adhesives

Henkel Loctite STYCAST 2850FT Black, formerly Emerson and Cuming, is a two component, room temperature curing, epoxy encapsulant that is used for components that are exposed to thermal shock and need heat dissipation. It offers a low coefficient of thermal expansion, electrical insulative and... [See More]

  • Type: Thermally Conductive
  • Thermal Conductivity: 1.02 to 1.28
  • Cure / Technology: Two Component  
  • Dielectric Strength: 366 to 381
Extremely Soft MasterSil 170 Gel Encapsulant Offers Removability and Optical Clarity -- MasterSil 170 Gel
from Master Bond, Inc.

MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]

  • Type: High Dielectric; Optical; Thermally Conductive
  • Chemical System: Silicone
  • Form / Function: Liquid
  • Composition: Unfilled
Henkel Loctite STYCAST 2850FT Thermally Conductive Encapsulant Blue 1 gal Pail -- 2850FT BLUE 18 LB. [1188125 from Henkel Corporation - Industrial]
from Ellsworth Adhesives

Henkel Loctite STYCAST 2850FT Blue, formerly Emerson and Cuming, is a two component, room temperature curing, epoxy encapsulant that is used for components that are exposed to thermal shock and need heat dissipation. It offers a low coefficient of thermal expansion, electrical insulative and... [See More]

  • Type: Thermally Conductive
  • Thermal Conductivity: 1.02 to 1.28
  • Cure / Technology: Two Component  
  • Dielectric Strength: 366 to 381
Highly Flexible Addition Cured Silicone Offers Low Thermal Resistance -- MasterSil 151TC
from Master Bond, Inc.

MasterSil 151TC is a highly flexible, temperature resistant two component silicone adhesive offering low thermal resistance and outstanding thermal conductivity. It was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Silicone
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid
  • Composition: Filled
Henkel Loctite STYCAST 2850FT Thermally Conductive Encapsulant Blue 1 qt Can -- 2850FT BLU 3LB RESIN ONLY [1188124 from Henkel Corporation - Industrial]
from Ellsworth Adhesives

Henkel Loctite STYCAST 2850FT Blue, formerly Emerson and Cuming, is a two component, room temperature curing, epoxy encapsulant that is used for components that are exposed to thermal shock and need heat dissipation. It offers a low coefficient of thermal expansion, electrical insulative and... [See More]

  • Type: Thermally Conductive
  • Thermal Conductivity: 1.02 to 1.28
  • Cure / Technology: Two Component  
  • Dielectric Strength: 366 to 381
Low Viscosity, Electrically Insulating Epoxy Features Excellent Optical Clarity -- EP30LP-2
from Master Bond, Inc.

Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. [See More]

  • Type: High Dielectric; Optical; Thermally Conductive
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Composition: Unfilled
Henkel Loctite STYCAST 2850FT Thermally Conductive Encapsulant White 18 lb Pail -- 2850FT WHT 18LB [1188117 from Henkel Corporation - Industrial]
from Ellsworth Adhesives

Henkel Loctite STYCAST 2850FT White, formerly Emerson and Cuming, is a two component, thermally conductive, epoxy encapsulant that is used for encapsulating components that are exposed to thermal shock and need heat dissipation. It has a low coefficient of thermal expansion and excellent electrical... [See More]

  • Type: Thermally Conductive
  • Thermal Conductivity: 1.1 to 1.28
  • Cure / Technology: Two Component  
  • Dielectric Strength: 366 to 381
Moderate Viscosity Thermally Conductive Epoxy -- EP112AO
from Master Bond, Inc.

Master Bond Polymer System EP112AO is a solventless, moderate viscosity two component epoxy resin system which is specifically designed for high performance outdoor and indoor electrical and electronic applications where good thermal conductivity and electrial isolation is required. The two... [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid
  • Composition: Filled
Henkel Loctite STYCAST 2850GT Thermally Conductive Encapsulant Black 1 gal Pail -- 2850GT BLK 18LB [1188133 from Henkel Corporation - Industrial]
from Ellsworth Adhesives

Henkel Loctite STYCAST 2850GT Black, formerly Emerson and Cuming, is a two component, room temperature curing, epoxy encapsulant that is used for components that are exposed to thermal shock and need heat dissipation. It contains fillers that are hard and gritty. It offers a low coefficient of... [See More]

  • Type: Thermally Conductive
  • Thermal Conductivity: 1.12 to 1.36
  • Cure / Technology: Two Component  
  • Dielectric Strength: 371 to 389
Nanosilica Filled Optically Clear Epoxy with High Abrasion Resistance -- EP30NS
from Master Bond, Inc.

Master Bond EP30NS is a nanosilica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically clear and meets NASA low outgassing specifications. [See More]

  • Type: High Dielectric; Optical; Thermally Conductive
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Composition: Filled
Henkel Loctite STYCAST 2850KT Thermally Conductive Encapsulant Blue 1 gal Pail -- 2850KT BLUE 20 LB. [1188135 from Henkel Corporation - Industrial]
from Ellsworth Adhesives

Henkel Loctite STYCAST 2850KT Blue, formerly Emerson and Cuming, is a two component, room temperature curing, epoxy encapsulant that is used for high voltage components and replacing heat sinks. It contains a filler that is gritty. It offers a low coefficient of thermal expansion, reduce stress, and... [See More]

  • Type: Thermally Conductive
  • Industry: Electric Power
  • Cure / Technology: Two Component  
  • Thermal Conductivity: 2.29 to 2.78
Electrically Non-Conductive Adhesives -- LOCTITE ABLESTIK 813J01 BIPAX
from Henkel Corporation - Industrial

LOCTITE ABLESTIK 813J01 BIPAX, Silicone, Non-corrosive, Encapsulant LOCTITE ® ABLESTIK 813J01 BIPAX exhibits very low stress upon cure thus preventing component cracking and other stress-related problems. This adhesive can be cured at room temperature in thick or thin sections. It is... [See More]

  • Type: Thermally Conductive
  • Cure / Technology: Single Component
  • Chemical System: Silicone
  • Viscosity: 40000
High Temperature Cement -- OMEGABOND® Air Set Series
from OMEGA Engineering, Inc.

Air Set Cements set or cure through loss of moisture by evaporation. Atmospheric conditions therefore affect the drying rate. Air Set Cements are used mainly in thin film applications (applied in thicknesses less than 1/4")*. SELECTION CRITERIA FOR CEMENTS. 1. Type of Application Potting, sealing,... [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Ceramic
  • Form / Function: Powder (optional feature); Liquid (optional feature); Encapsulant or Conformal Coating
  • Cure / Technology: Two Component   (optional feature); Single Component (optional feature)
Flame Retardant Polyurethane -- 50-2369 FR
from Epoxies Etc...

The 50-2369FR Potting and Encapsulating Compound has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-2369 FR Urethane is listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low exotherm, and excellent electrical... [See More]

  • Type: Thermally Conductive
  • Chemical System: Polyurethane
  • Form / Function: Gel
  • Composition: Filled
Di-Pak™ Elastomeric Eletrical Insulating Compound -- E-4501
from Hapco, Inc.

Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E products are flame... [See More]

  • Type: High Dielectric; Thermally Conductive
  • Cure / Technology: Thermoset; Two Component  
  • Form / Function: Liquid
  • Features: Flame Retardant; UL Rating
Clear Non-Yellowing Silicone Encapsulant -- PNS-56225
from Protavic America, Inc.

PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]

  • Type: Electrically Conductive; Thermally Conductive
  • Chemical System: Silicone
  • Form / Function: Liquid; Encapsulant or Conformal Coating; Die Bonding Adhesives
  • Composition: Unfilled
Potting/Encapsulation Compound -- INSTAbond® 809FR
from ACCRAbond, Inc.

INSTAbond ® 809FR. INSTAbond ® 809 FR exhibits good thermal conductivity, excellent flow properties, and low exotherm characteristics in large masses. INSTAbond ® 809 FR meets the requirements for UL-94 V-0 rating for flame retardancy. [See More]

  • Type: Thermally Conductive
  • Cure / Technology: Two Component  
  • Chemical System: Epoxy
  • Features: Flame Retardant; UL Rating
Flowable, One-component Silicone Sealant -- CENUSIL® RT 760 CN A/B
from Wacker Chemical Corp.

WACKER ’s silicone adhesives and sealants are based on many years of experience, innovative research and comprehensive technological expertise. In a wide variety of industries, especially in lighting technology, flowable or non-sag silicone products offer decisive advantages in performance and... [See More]

  • Type: Thermally Conductive
  • Industry: Electronics
  • Chemical System: Silicone; Elastomeric
LOCTITE ECCOBOND FP5001 (Known as Hysol FP5001) -- 8799534219265
from Henkel Corporation - Electronics

Known as Hysol FP5001 ). LOCTITE ECCOBOND FP5001 is a one part, high purity, non-conductive paste (NCP) designed for thermal compression bonding process. When fully cured, the product provides excellent protection of integrated circuit electrical joints and provides resistance to thermal cycling. [See More]

  • Type: Thermally Conductive
  • Viscosity: 25000 to 75000
  • Industry: Electronics
Cement -- No. 31
from Sauereisen, Inc.

Sauereisen Cement No. 31 is a white, porcelain-like cement that is widely used throughout industry in a variety of applications. including assembling, sealing, insulating and cementing of ceramics, porcelain, metal, and glass. [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Ceramic
  • Form / Function: Powder; Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
  • Composition: Unfilled
Encapsulants -- LOCTITE PE 3164
from Henkel Corporation - Industrial

Clear epoxy resin hardener which is one part of a two part epoxy system designed for use with a variety of LOCTITE HYSOL resins. LOCTITE ® PE 3164 is a clear epoxy resin hardener which forms a black, fast gelling, low viscosity, room temperature cure potting compound with high thermal... [See More]

  • Type: Thermally Conductive
  • Chemical System: Epoxy
High Temperature Cement -- OMEGABOND® Chemical Set Series
from OMEGA Engineering, Inc.

Chemical Set Cements set or cure by an internal chemical action which does not require exposure to air. Chemical Set Cements can be used in thick applications (applied in thicknesses greater than 1/4")*. SELECTION CRITERIA FOR CEMENTS. 1. Type of Application Potting, sealing, encapsulating,... [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Ceramic
  • Form / Function: Powder (optional feature); Liquid (optional feature); Encapsulant or Conformal Coating
  • Cure / Technology: Two Component   (optional feature); Single Component (optional feature)
Flame Retardant Thermally Conductive -- 50-3150 FR
from Epoxies Etc...

50-3150 FR has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-3150 FR Black Epoxy with Catalyst 190 and Catalyst 105 are listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low shrinkage, and outstanding insulation... [See More]

  • Type: Thermally Conductive
  • Chemical System: Epoxy
  • Form / Function: Liquid
  • Composition: Unfilled
Di-Pak™ Rigid Eletrical Insulating Compound -- R-4528/7
from Hapco, Inc.

DI-COAT R-4721 / DI-COAT R-4721 LV (lower viscosity). Shore 90 D, room temperature curing, medium to high thixotropic coating for dielectric insulating applications. DI-COAT R-4721 is ideal for use on vertical or sloping surfaces where flow or drain-off cannot be tolerated. DI-COAT R-4721 is easy to... [See More]

  • Type: High Dielectric; Thermally Conductive
  • Cure / Technology: Thermoset; Two Component  
  • Form / Function: Liquid
  • Features: Flame Retardant; UL Rating
Epoxy Cast -- PTE-36977
from Protavic America, Inc.

PTE-36977 ™ is a two-component epoxy designed for encapsulation or casting of high voltage coils and transformers where high temperature, high voltage, and high thermal conductivity are required. PTE-36977 ™ is heat stable up to 150 °C. [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Gel
  • Composition: Filled
Pourable, Addition-Curing RTV-2 Silicone Rubber -- ELASTOSIL® RT675 A/B
from Wacker Chemical Corp.

ELASTOSIL ® RT 675 A/B is a pourable, addition-curing RTV-2 silicone rubber. [See More]

  • Type: Thermally Conductive
  • Chemical System: Silicone; Elastomeric
  • Form / Function: Liquid
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
TECHNOMELT PA 2384 -- 8807299842049
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Polyamide
  • Form / Function: Pellets
  • Cure / Technology: Thermoplastic / Hot Melt; Single Component
Encapsulants -- LOCTITE STYCAST 2762FT
from Henkel Corporation - Industrial

LOCTITE STYCAST 2762FT, Epoxy, High Temperature Resistance, High Thermal Conductivity, Potting, Encapsulant LOCTITE ® STYCAST 2762FT epoxy encapsulant is designed for potting electronic components exposed to harsh environments. This material is also ideal for large and complex castings that... [See More]

  • Type: Thermally Conductive
  • Cure / Technology: Two Component  
  • Chemical System: Epoxy
  • Viscosity: 25000
High Thermally Conductive Paste -- OMEGATHERM® OT-201 Series
from OMEGA Engineering, Inc.

OMEGATHERM thermal conducting paste is a high temperature and high thermally conductive paste product. They are specially formulated for permanent and temporary bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics,... [See More]

  • Type: High Dielectric; Thermally Conductive
  • Cure / Technology: Single Component
  • Chemical System: Silicone
  • Use Temperature: 392
Thermally Conductive PU Potting Compound -- 20-2366FR
from Epoxies Etc...

20-2366 FR is a new thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure. 20-2366 FR polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical... [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Elastomeric; Polyurethane
  • Form / Function: Liquid
  • Composition: Unfilled
TECHNOMELT PA 2692
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Polyamide
  • Form / Function: Pellets
  • Cure / Technology: Thermoplastic / Hot Melt
Encapsulants -- LOCTITE STYCAST 2850FTJ
from Henkel Corporation - Industrial

LOCTITE STYCAST 2850FTJ, Epoxy, Encapsulant. LOCTITE ® STYCAST 2850FTJ epoxy encapsulant is designed for use in high voltage applications where surface arcing or tracking is a concern. LOCTITE STYCAST 2850FTJ is recommended for encapsulation of components that require heat dissipation and... [See More]

  • Type: Thermally Conductive
  • Cure / Technology: Two Component  
  • Chemical System: Epoxy
  • Viscosity: 225000
Thermally Conductive Grease -- OT-201 Series
from OMEGA Engineering, Inc.

OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics, paper products. [See More]

  • Type: High Dielectric; Thermally Conductive
  • Cure / Technology: Single Component
  • Chemical System: Silicone
  • Use Temperature: 392
TECHNOMELT PA 341 -- 8802588327937
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Polyamide
  • Form / Function: Pellets
  • Cure / Technology: Thermoplastic / Hot Melt
Encapsulants -- LOCTITE STYCAST 2850KT CAT 24LV
from Henkel Corporation - Industrial

LOCTITE STYCAST 2850KT CAT 24LV, Epoxy, Encapsulant LOCTITE ® STYCAST 2850KT CAT 24LV epoxy encapsulant is designed for heat sink replacement in non-integrated electrical components and assemblies. It is also recommended for use in high voltage applications where surface arching or tracking is a... [See More]

  • Type: Thermally Conductive
  • Cure / Technology: Two Component  
  • Chemical System: Epoxy
  • Use Temperature: 85 to 221
TECHNOMELT PA 5375
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Polyolefin
  • Form / Function: Pellets
  • Cure / Technology: Thermoplastic / Hot Melt; Single Component
Encapsulants -- LOCTITE STYCAST 2851FT
from Henkel Corporation - Industrial

LOCTITE STYCAST 2851FT, Epoxy, Encapsulant LOCTITE ® STYCAST 2851FT is recommended for encapsulation of components that require heat dissipation and thermal shock properties . It has a low coefficient of thermal expansion and exhibits excellent resistance to a wide variety of industrial... [See More]

  • Type: Thermally Conductive
  • Cure / Technology: Single Component
  • Chemical System: Epoxy
  • Thermal Conductivity: 1.36
TECHNOMELT PA 6208 Black -- 8799566462977
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Polyamide
  • Form / Function: Pellets
  • Cure / Technology: Thermoplastic / Hot Melt; Single Component
Encapsulants -- LOCTITE STYCAST 5952-1
from Henkel Corporation - Industrial

LOCTITE STYCAST 5952-1, Silicone, Potting or Encapsulant. LOCTITE ® STYCAST 5952-1 is designed for encapsulation of heat generating devices. It is also recommended for applications requiring a non-corrosive casting and coating. Electrically non-conductive. Good elongation strength. Moderate tear... [See More]

  • Type: High Dielectric; Thermally Conductive
  • Cure / Technology: Two Component  
  • Chemical System: Silicone
  • Thermal Conductivity: 0.8000
TECHNOMELT PA 668 Clear
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Type: High Dielectric; Optical; Thermally Conductive
  • Chemical System: Polyamide
  • Form / Function: Pellets
  • Cure / Technology: Thermoplastic / Hot Melt
Encapsulants -- LOCTITE STYCAST E 2534 FR CAT 9
from Henkel Corporation - Industrial

LOCTITE STYCAST E 2534 FR CAT 9, Epoxy, Potting LOCTITE ® STYCAST E 2534 FR CAT 9 epoxy potting compound complies with recent demands on environmentally friendly products and does not contain brominated flame retardants. LOCTITE STYCAST E 2534 FR CAT 9 can be used with a variety of catalysts. [See More]

  • Type: Thermally Conductive
  • Cure / Technology: Two Component  
  • Chemical System: Epoxy
  • Use Temperature: 40 to 302
Encapsulants -- LOCTITE STYCAST EE 4215/HD 3561
from Henkel Corporation - Industrial

LOCTITE STYCAST EE 4215/HD 3561, Epoxy, Potting and Encapsulating. LOCTITE ® STYCAST EE 4215/HD 3561 is a filled system recommended for potting applications where rigid or flexible wire leads protrude directly from the encapsulation and where high impact strength is required. This system... [See More]

  • Type: Thermally Conductive
  • Cure / Technology: Two Component  
  • Chemical System: Epoxy
Encapsulants -- LOCTITE STYCAST US 0155
from Henkel Corporation - Industrial

LOCTITE STYCAST US 0155, Urethane, Potting and Encapsulating. LOCTITE ® STYCAST US 0155 is a low viscosity, flexible, flame retardant, castor oil/MDI based urethane potting/encapsulating compound. This material was designed for potting indoor and outdoor telephone connector blocks. It is... [See More]

  • Type: Thermally Conductive
  • Chemical System: Polyurethane
  • Form / Function: Liquid
  • Cure / Technology: Two Component  
Potting Compounds -- LOCTITE STYCAST 2850FT BL
from Henkel Corporation - Industrial

LOCTITE STYCAST 2850FT BL, Epoxy, Encapsulant. LOCTITE ® STYCAST 2850FT BL epoxy is designed for applications where electrical insulation and mechanical protection must be maintained while coping with heat transfer considerations. LOCTITE STYCAST 2850FT BL can be used with a variety of... [See More]

  • Type: Thermally Conductive
  • Cure / Technology: Two Component  
  • Chemical System: Epoxy
  • Thermal Conductivity: 1.38
Thermal Interface Materials -- BERGQUIST GAP PAD TGP 7000ULM
from Henkel Corporation - Industrial

BERGQUIST GAP PAD TGP 7000ULM, Thermally conductive soft gap filling material, For high performance applications. BERGQUIST GAP PAD TGP 7000ULM is an extremely soft gap filling material rated at a thermal conductivity of 7.0 W/m-K. It is specially formulated for high performance applications... [See More]

  • Type: Thermally Conductive
  • Chemical System: Silicone
  • Form / Function: Gap Filler, Foam in Place Gasket
  • Use Temperature: 140 to 392