UV / Radiation Cured (also EB, Light) Encapsulants and Potting Compounds

Biocompatible, UV Curing Epoxy -- EPO-TEK® MED-OG116-31
from Epoxy Technology

EPO-TEK ® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries.  Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market... [See More]

  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
  • Form / Function: Liquid
  • Type: Optical
  • Chemical System: Epoxy
Dual Curing, Thixotropic Adhesive -- UV22DC80-10F
from Master Bond, Inc.

One part, nanosilica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]

  • Cure / Technology: UV or Radiation Cured; Single Component; Dual Curing
  • Form / Function: Liquid; Encapsulant or Conformal Coating; Glob Top, Daub, Doming or Overfill
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: UV Curing
High Strength UV Curable Adhesive -- UV15
from Master Bond, Inc.

Master Bond UV15 is a new one component, high strength, low viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It is a 100% reactive and does not contain any solvents or other volatiles. When exposed to a source... [See More]

  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating; Impregnating Resin
  • Type: High Dielectric; Optical; Thermal Insulation
  • Chemical System: Epoxy
High Strength, Chemically Resistant UV Curable System -- UV18S
from Master Bond, Inc.

Master Bond UV18S is a new one component, high strength UV curable system with superb chemical resistance & flexibility for coating, sealing and bonding. It is a 100% reactive, mobile liquid at ambient temperatures which does not contain any solvents or other volatiles. When exposed to a source... [See More]

  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating; Impregnating Resin
  • Type: High Dielectric; Optical; Thermal Insulation
  • Features: Non-corrosive; Dissimilar Substrates
High Strength, Non-Yellowing UV Curable -- UV15-7NV
from Master Bond, Inc.

Master Bond Polymer system UV15-7NV is a new one component, optically clear, non yellowing UV curable polymer system for high performance bonding, sealing and coating. It is 100% reactive and does not contain any solvents or other volatiles. When exposed to a source of UV light of adequate wave... [See More]

  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Type: High Dielectric; Optical; Thermal Insulation
  • Features: Non-corrosive; Dissimilar Substrates
High Strength, UV Curable Epoxy System -- UV16
from Master Bond, Inc.

Master Bond UV16 is a new one component, high strength, low viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It is a 100% reactive and does not contain any solvents or other volatiles. When exposed to a source... [See More]

  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating; Impregnating Resin
  • Type: High Dielectric; Optical; Thermal Insulation
  • Chemical System: Epoxy
Non-Yellowing, Abrasion Resistant UV Curable Adhesive -- UV15X-6NM-2
from Master Bond, Inc.

UV15X-6NM-2 features vibrant flexibility, excellent toughness and superior abrasion resistance. This fast curing moderate viscosity compound can be used for bonding, sealing, coating and encapsulation. Its robust flexibility gives it the capacity to withstand severe thermal cycling as well as... [See More]

  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; Reactive or Moisture Cured
  • Form / Function: Gap Filler, Foam in Place Gasket
  • Type: Optical; Thermal Insulation
  • Chemical System: Polyurethane
One Component LED Curable Adhesive System -- LED401
from Master Bond, Inc.

LED401 is a unique single component compound that cures rapidly upon exposure to a 405 nm wavelength light source. This formulation has a good flow, high bond strength and superior electrical insulation properties. It is ideal for bonding heat sensitive substrates since limited heat is generated... [See More]

  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
  • Form / Function: Gap Filler, Foam in Place Gasket
  • Type: High Dielectric; Optical; Thermal Insulation
  • Composition: Unfilled
One Component Low Viscosity, Optically Clear UV Curable -- UV19
from Master Bond, Inc.

Master Bond Polymer System UV19 is a newly developed UV curable, low viscosity optically clear compound specifically designed for high performance laminating, sealing, bonding and coating. This remarkable acrylic based polymer composition can effectively replace conventional heat and/or solvent... [See More]

  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating; Impregnating Resin
  • Type: High Dielectric; Optical; Thermal Insulation
  • Chemical System: Elastomeric
One Component, UV Curable Adhesive System -- UV10
from Master Bond, Inc.

Master Bond UV10 and UV10TK are one component UV curable modified epoxy compounds, ready for use as supplied, for high performance casting, coatings, sealing and bonding applications. UV10 is a low viscosity amber liquid at room temperature and UV10TK is a medium viscosity amber liquid at room... [See More]

  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating; Impregnating Resin
  • Type: High Dielectric; Optical; Thermal Insulation
  • Features: Non-corrosive; Dissimilar Substrates
Flexible UV Curable Compound -- UV 60-7016
from Epoxies Etc...

UV 60-7016 is a high performance Ultraviolet Curable Adhesive, Sealant, and Potting Compound. This new one component urethane acrylate system was specifically designed for the difficult bonding of glass to metal. UV 60-7016 has outstanding thermal shock and impact resistance, and is an excellent... [See More]

  • Cure / Technology: UV or Radiation Cured; Single Component
  • Chemical System: Elastomeric; Polyurethane
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
  • Composition: Unfilled
Optically Clear UV Adhesive -- ANA-97290
from Protavic America, Inc.

ANA-97290 is a clear Ultraviolet/ Visible light curing adhesive. It has very low shrinkage during cure for alignment sensitive parts. It is recommended for small electrical/electronic casting and encapsulating applications that require a unique combination of excellent wetting, flow, good thermal... [See More]

  • Cure / Technology: Thermoset; Two Component  ; UV or Radiation Cured
  • Form / Function: Liquid; Encapsulant or Conformal Coating; Gel (optional feature); Die Bonding Adhesives
  • Type: Electrically Conductive; Thermal Insulation
  • Composition: Unfilled
LOCTITE 3323 (Known as LOCTITE 3323UV) -- 8802602188801
from Henkel Corporation - Electronics

Known as LOCTITE 3323UV ). LOCTITE 3323 has been developed for encapsulation of wire bonded dies, used for Smartcard IC modules. It is designed for use only with LOCTITE UV fill encapsulants, such as 3327 and 3329. Either combination of dam and fill will pass mechanical stress testing and high... [See More]

  • Cure / Technology: UV or Radiation Cured
  • CTE: 22
  • Industry: Electronics
  • Viscosity: 19000 to 46000
Light Cure Cyanoacrylate Instant Adhesive -- KU3064
from Chemence Inc.

Krylex KU3064 is a revolutionary odorless light curing cyanoacrylate adhesive. It is designed for bonding applications that require very rapid fixture, fillet cure or surface cure. The UV / visible light cure properties facilitate rapid curing of exposed surface areas while the moisture curing... [See More]

  • Cure / Technology: UV or Radiation Cured; Single Component; Reactive or Moisture Cured
  • Gap Fill: 0.0500
  • Form / Function: Liquid; Die Bonding Adhesives
  • Industry: Sanitary; Electronics; OEM or Industrial; Printing, Medical use and General Industrial Assembly
Epoxy Conformal Coating -- ELC 2900
from Electro-Lite Corporation

ELC-2900 is a flexible conformal coating for PCB's and provides a flexible, reworkable finish for components and various substrates. [See More]

  • Cure / Technology: UV or Radiation Cured
  • Form / Function: Liquid; Encapsulant or Conformal Coating
  • Type: Anti-static, ESD
  • Chemical System: Epoxy
Electrically Non-Conductive Adhesives -- LOCTITE ABLESTIK NCA 9300UV
from Henkel Corporation - Industrial

LOCTITE ABLESTIK NCA 9300UV, Acrylate, Non-conductive adhesive, Single component, Photocurable LOCTITE ® ABLESTIK NCA 9300UV single component, photocurable adhesive is designed for disk drive assembly applications such as conformal coating and component tracking. This product also contains a... [See More]

  • Cure / Technology: UV or Radiation Cured; Single Component
  • Viscosity: 70000
  • Type: High Dielectric
Dielectric Silicone Gel For Sealing Electronics -- SEMICOSIL® 912
from Wacker Chemical Corp.

SEMICOSIL ® 912 is a pourable, addition-curing, 2-part. silicone rubber that cures to a soft silicone gel when. mixed with ELASTOSIL ® CAT PT, ELASTOSIL ® CAT. PT-F or ELASTOSIL ® CAT UV. Special features. two-part, 10 : 1 mixing ratio. low viscosity. modular system allows flexible... [See More]

  • Cure / Technology: Two Component  ; UV or Radiation Cured
  • Form / Function: Liquid
  • Type: High Dielectric; Optical
  • Chemical System: Silicone; Elastomeric
UV Curable Low CTE Encapsulant -- 60-7106
from Epoxies Etc...

UV Cure 60-7106 is a one-component ultraviolet (UV) curable encapsulant, adhesive and coating. This is an electronic grade material designed for applications requiring a low Coefficient of Thermal Expansion (CTE). [See More]

  • Cure / Technology: UV or Radiation Cured; Single Component
  • Form / Function: Gel; Die Bonding Adhesives
  • Type: High Dielectric
  • Composition: Filled
Urethane Adhesive/Encapsulant -- PNU-46220
from Protavic America, Inc.

PNU 46220 ™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term circuit protection and... [See More]

  • Cure / Technology: Thermoset; Two Component  ; UV or Radiation Cured
  • Form / Function: Liquid; Encapsulant or Conformal Coating; Die Bonding Adhesives
  • Type: High Dielectric
  • Chemical System: Polyurethane
Electrically Non-Conductive Adhesives -- LOCTITE ABLESTIK UV300X
from Henkel Corporation - Industrial

LOCTITE ABLESTIK UV300X, Acrylate, Assembly, Single Component, Photocurable Adhesive LOCTITE ® ABLESTIK UV300X single component, photocurable adhesive is designed for disk drive assembly applications such as conformal coating and component tracking. This product also contains a secondary thermal... [See More]

  • Cure / Technology: UV or Radiation Cured; Single Component
  • Viscosity: 70000
Encapsulants -- LOCTITE ECCOBOND DS 3318BL
from Henkel Corporation - Industrial

LOCTITE ECCOBOND DS 3318BL, Acrylic, Coating and Sealant LOCTITE ® ECCOBOND DS 3318BL fast, UV curable material is specially formulated for use in applications requiring lower energy cure. It is designed for protection of COG (Chip-on-Glass) in LCD modules. Fast cure. Low energy cure. Good... [See More]

  • Cure / Technology: UV or Radiation Cured
  • Viscosity: 2250
  • Chemical System: Acrylic
Encapsulants -- LOCTITE ECCOBOND DS 3318BLX
from Henkel Corporation - Industrial

LOCTITE ECCOBOND DS 3318BLX, Acrylic, Sealant, Encapsulation LOCTITE ® ECCOBOND DS 3318BLX fast, UV curable material is specially formulated for use in applications requiring lower energy cure. It is designed for protection of COF (Chip-on-Film) in LCD modules. Flexibility is a key... [See More]

  • Cure / Technology: UV or Radiation Cured
  • Viscosity: 2050
  • Chemical System: Acrylic
Encapsulants -- LOCTITE ECCOBOND DS 3318LVT
from Henkel Corporation - Industrial

LOCTITE ECCOBOND DS 3318LVT, Acrylate, Coating and Sealant LOCTITE ® ECCOBOND DS 3318LVT fast, UV curable material is specially formulated for use in applications requiring lower energy cure. Its excellent moisture resistance is designed to provide protection in COG-LCD modules. Low energy... [See More]

  • Cure / Technology: UV or Radiation Cured
  • Viscosity: 142
Encapsulants -- LOCTITE ECCOBOND EN 3410
from Henkel Corporation - Industrial

LOCTITE ECCOBOND EN 3410, Acrylate, Encapsulant, Coating LOCTITE ® ECCOBOND EN 3410 encapsulant is designed for COG/COF of LCD module or micro patterned FPC substrate of OLED module assembly applications. It is designed to improve crack/fracture resistance and delamination for overall... [See More]

  • Cure / Technology: UV or Radiation Cured
  • Viscosity: 680
Encapsulants -- LOCTITE ECCOBOND EN 3839
from Henkel Corporation - Industrial

LOCTITE ECCOBOND EN 3839, Acrylic, Encapsulant, Glob top LOCTITE ® ECCOBOND EN 3839 is specially designed for encapsulating components on PCB applications. When cured, this material provides physical protection, as well as, protection in temperature/humidity/bias testing. Provides physical and... [See More]

  • Cure / Technology: UV or Radiation Cured
  • Chemical System: Acrylic
  • Form / Function: Glob Top, Daub, Doming or Overfill
  • CTE: 60
Encapsulants -- LOCTITE ECCOBOND LV4518-38
from Henkel Corporation - Industrial

LOCTITE ECCOBOND LV4518-38, Acrylate, Sealant, Thixotropic LOCTITE ® ECCOBOND LV4518-38 thixotropic, solvent resistant, UV curing sealant formulated for gold and plastic substrates such as polyester and polyetherimide. It may be syringe-dispensed to form a low profile sealant based at the... [See More]

  • Cure / Technology: UV or Radiation Cured
  • Viscosity: 42000
Encapsulants -- LOCTITE ECCOBOND UV 9061F
from Henkel Corporation - Industrial

LOCTITE ECCOBOND UV 9061F, Acrylate, Assembly LOCTITE ® ECCOBOND UV 9061F no flow, UV/moisture cure encapsulant is designed for local circuit board protection. This product is fluorescent when viewed with ultraviolet (black) light. Fast cure. Cures in shadowed areas. Easy dispensability without... [See More]

  • Cure / Technology: UV or Radiation Cured
  • CTE: 43