UV / Radiation Cured (also EB, Light) Encapsulants and Potting Compounds
from MacDermid Alpha Electronics Solutions
One-component UV cure system designed for fast curing and bonding in various applications, including coating and component fixing. Product Overview. ALPHA HiTech UP44-5566T is particularly suitable for mobile wireless charger chip coating. It is halogen-free and complies with the RoHS Directive... [See More]
- Cure / Technology: UV or Radiation Cured
- Industry: Electronics; Semiconductors, IC's
from Dymax
Conformal Coating with Secondary Moisture Cure. Dual-cure 9481-E-PZ conformal coating is chemically resistant and free of Trimethylbenzoyl Diphenylphosphine Oxide (TPO) and PIP 3:1. It is a UV/Visible light- and moisture-cure material that contains no added solvents. It is formulated to ensure... [See More]
- Cure / Technology: UV or Radiation Cured; Reactive or Moisture Cured
- Chemical System: Acrylated Urethane
- Form / Function: Liquid; Encapsulant or Conformal Coating
- Features: Flame Retardant; UL Rating
from Master Bond, Inc.
One part, nano silica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]
- Cure / Technology: UV or Radiation Cured; Single Component; Dual Curing
- Form / Function: Liquid; Encapsulant or Conformal Coating; Glob Top, Daub, Doming or Overfill
- Type: High Dielectric; Thermally Conductive
- Chemical System: UV Curing
from Dymax
High-Performance Conformal Coating with Secondary Moisture Cure. Dual-cure 9483-Z conformal coating is free of Trimethylbenzoyl Diphenylphosphine Oxide (TPO). It cures tack-free upon exposure to UV/Visible light and then with ambient moisture over time, on PCBs where shadow areas are present. The... [See More]
- Cure / Technology: UV or Radiation Cured; Reactive or Moisture Cured
- Chemical System: Acrylated Urethane
- Form / Function: Liquid; Encapsulant or Conformal Coating
- Features: Flame Retardant; UL Rating
from Master Bond, Inc.
Master Bond UV23FLDC-80TK is a moderate viscosity, cationic type system that offers both UV light and heat curing mechanisms. It is toughened and flexible, allowing it to withstand rigorous thermal cycling. [See More]
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Form / Function: Gap Filler, Foam in Place Gasket; Glob Top, Daub, Doming or Overfill
- Type: High Dielectric; Optical
- Chemical System: Epoxy; UV curing
from Dymax
Dymax Multi-Cure ® 984-LVUF conformal coating is a fluorescing, single-component material formulated with no solvents added for rapid room-temperature cure when exposed to UV light. This coating has a secondary heat-cure capability which allows it to cure in areas shadowed from light. The... [See More]
- Cure / Technology: UV or Radiation Cured
- Industry: coating applications where chemical as well as abrasion resistance is critical.
- Form / Function: Encapsulant or Conformal Coating
- Viscosity: 160
from Master Bond, Inc.
Master Bond UV15 is a new one component, high strength, low viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It is a 100% reactive and does not contain any solvents or other volatiles. When exposed to a source... [See More]
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating; Impregnating Resin
- Type: High Dielectric; Optical; Thermal Insulation
- Chemical System: Epoxy
from Dymax
Multi-Cure ® 9001-E-V3.0 is a performance grade with improved moisture and thermal cycle resistance and adhesion to various component substrates. Curing completely in as little as 5 seconds upon exposure to LED, longwave UV, and visible light, this material is environmentally resistant with... [See More]
- Cure / Technology: UV or Radiation Cured
- Viscosity: 400
from Master Bond, Inc.
Master Bond UV16 is a new one component, high strength, low viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It is a 100% reactive and does not contain any solvents or other volatiles. When exposed to a source... [See More]
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating; Impregnating Resin
- Type: High Dielectric; Optical; Thermal Insulation
- Chemical System: Epoxy
from Dymax
Dual-cure 9014 encapsulant is formulated to cure primarily with UV light and includes a secondary moisture curing function for applications where shadow areas exist on printed circuit boards. Curing in seconds upon exposure to UV light energy, the product increases manufacturing efficiency because... [See More]
- Cure / Technology: UV or Radiation Cured
- Industry: electric vehicle battery management systems
- Form / Function: Gel
- Viscosity: 18000
from Master Bond, Inc.
UV15X-6NM-2 features vibrant flexibility, excellent toughness and superior abrasion resistance. This fast curing moderate viscosity compound can be used for bonding, sealing, coating and encapsulation. Its robust flexibility gives it the capacity to withstand severe thermal cycling as well as... [See More]
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; Reactive or Moisture Cured
- Form / Function: Gap Filler, Foam in Place Gasket
- Type: Optical; Thermal Insulation
- Chemical System: Polyurethane
from Dymax
Multi-Cure ® 9037-F is a resilient chip encapsulant designed for applications where a thixotropic, high-viscosity encapsulant or a damming material is required. This is often the case for conventional glob top encapsulation applications – for chip on glass, chip on board, or chip on flex... [See More]
- Cure / Technology: UV or Radiation Cured
- Viscosity: 55000
from Master Bond, Inc.
LED401 is a unique single component compound that cures rapidly upon exposure to a 405 nm wavelength light source. This formulation has a good flow, high bond strength and superior electrical insulation properties. It is ideal for bonding heat sensitive substrates since limited heat is generated... [See More]
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Form / Function: Gap Filler, Foam in Place Gasket
- Type: High Dielectric; Optical; Thermal Insulation
- Composition: Unfilled
from Dymax
UV Light + moisture cure 9201-W electronic encapsulant is a next-generation product formulated without materials of concern such as IBOA (isobornyl acrylate), a known skin sensitizer. This encapsulant utilizes low-sensitizing ingredients, making it optimal for assembling end-user consumer wearable... [See More]
- Cure / Technology: UV or Radiation Cured
- Industry: encapsulating wire bonds, chip-on-board, or chip-on-flex circuits
- Form / Function: Gel
- Elongation: 178.0
from Master Bond, Inc.
Master Bond Polymer System UV19 is a newly developed UV curable, low viscosity optically clear compound specifically designed for high performance laminating, sealing, bonding and coating. This remarkable acrylic based polymer composition can effectively replace conventional heat and/or solvent... [See More]
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating; Impregnating Resin
- Type: High Dielectric; Optical; Thermal Insulation
- Chemical System: Elastomeric
from Dymax
Dual-cure 9210-W electronic encapsulant is designed for FPC reinforcement, selective coating, and component encapsulation applications in consumer wearable devices. The product cures with light energy first and then ambient moisture for parts where shadow areas are present. 9210-W is IBOA-free and... [See More]
- Cure / Technology: UV or Radiation Cured
- Elongation: 28.2
- Industry: consumer wearable devices.
- Viscosity: 29000
from Master Bond, Inc.
Master Bond UV10 and UV10TK are one component UV curable modified epoxy compounds, ready for use as supplied, for high performance casting, coatings, sealing and bonding applications. UV10 is a low viscosity amber liquid at room temperature and UV10TK is a medium viscosity amber liquid at room... [See More]
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating; Impregnating Resin
- Type: High Dielectric; Optical; Thermal Insulation
- Features: Non-corrosive; Dissimilar Substrates
from Wacker Chemical Corp.
SEMICOSIL ® 912 is a pourable, addition-curing, 2-part. silicone rubber that cures to a soft silicone gel when. mixed with ELASTOSIL ® CAT PT, ELASTOSIL ® CAT. PT-F or ELASTOSIL ® CAT UV. Special features. two-part, 10 : 1 mixing ratio. low viscosity. modular system allows flexible... [See More]
- Cure / Technology: Two Component ; UV or Radiation Cured
- Form / Function: Liquid
- Type: High Dielectric; Optical
- Chemical System: Silicone; Elastomeric
from Chemence Inc.
Krylex KU3064 is a revolutionary odorless light curing cyanoacrylate adhesive. It is designed for bonding applications that require very rapid fixture, fillet cure or surface cure. The UV / visible light cure properties facilitate rapid curing of exposed surface areas while the moisture curing... [See More]
- Cure / Technology: UV or Radiation Cured; Single Component; Reactive or Moisture Cured
- Gap Fill: 0.0500
- Form / Function: Liquid; Die Bonding Adhesives
- Industry: Sanitary; Electronics; OEM or Industrial; Printing, Medical use and General Industrial Assembly
from Henkel Corporation - Electronics
Known as LOCTITE 3323UV ). LOCTITE 3323 has been developed for encapsulation of wire bonded dies, used for Smartcard IC modules. It is designed for use only with LOCTITE UV fill encapsulants, such as 3327 and 3329. Either combination of dam and fill will pass mechanical stress testing and high... [See More]
- Cure / Technology: UV or Radiation Cured
- CTE: 22
- Industry: Electronics
- Viscosity: 19000 to 46000
from Henkel Corporation - Industrial
LOCTITE ABLESTIK NCA 9300UV, Acrylate, Non-conductive adhesive, Single component, Photocurable LOCTITE ® ABLESTIK NCA 9300UV single component, photocurable adhesive is designed for disk drive assembly applications such as conformal coating and component tracking. This product also contains a... [See More]
- Cure / Technology: UV or Radiation Cured; Single Component
- Viscosity: 70000
- Type: High Dielectric
from Epoxy Technology
EPO-TEK ® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries. Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market... [See More]
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Form / Function: Liquid
- Type: Optical
- Chemical System: Epoxy
from Shenzhen DeepMaterial Technologies Co., Ltd
It is a conformal coating designed to provide strong protection from moisture and harsh chemicals. Compatible with industry standard solder masks, no-clean fluxes, metallization, components and substrate materials. [See More]
- Cure / Technology: UV or Radiation Cured; Reactive or Moisture Cured
- Chemical System: Acrylic
- Form / Function: Encapsulant or Conformal Coating
- Industry: Electronics
from Electro-Lite Corporation
ELC-2900 is a flexible conformal coating for PCB's and provides a flexible, reworkable finish for components and various substrates. [See More]
- Cure / Technology: UV or Radiation Cured
- Form / Function: Liquid; Encapsulant or Conformal Coating
- Type: Anti-static, ESD
- Chemical System: Epoxy
from Epoxies Etc...
UV 60-7016 is a high performance Ultraviolet Curable Adhesive, Sealant, and Potting Compound. This new one component urethane acrylate system was specifically designed for the difficult bonding of glass to metal. UV 60-7016 has outstanding thermal shock and impact resistance, and is an excellent... [See More]
- Cure / Technology: UV or Radiation Cured; Single Component
- Chemical System: Elastomeric; Polyurethane
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
- Composition: Unfilled
from Protavic America, Inc.
ANA-97290 is a clear Ultraviolet/ Visible light curing adhesive. It has very low shrinkage during cure for alignment sensitive parts. It is recommended for small electrical/electronic casting and encapsulating applications that require a unique combination of excellent wetting, flow, good thermal... [See More]
- Cure / Technology: Thermoset; Two Component ; UV or Radiation Cured
- Form / Function: Liquid; Encapsulant or Conformal Coating; Gel (optional feature); Die Bonding Adhesives
- Type: Electrically Conductive; Thermal Insulation
- Composition: Unfilled
from Henkel Corporation - Industrial
LOCTITE ABLESTIK UV300X, Acrylate, Assembly, Single Component, Photocurable Adhesive LOCTITE ® ABLESTIK UV300X single component, photocurable adhesive is designed for disk drive assembly applications such as conformal coating and component tracking. This product also contains a secondary thermal... [See More]
- Cure / Technology: UV or Radiation Cured; Single Component
- Viscosity: 70000
from Epoxies Etc...
UV Cure 60-7106 is a one-component ultraviolet (UV) curable encapsulant, adhesive and coating. This is an electronic grade material designed for applications requiring a low Coefficient of Thermal Expansion (CTE). [See More]
- Cure / Technology: UV or Radiation Cured; Single Component
- Form / Function: Gel; Die Bonding Adhesives
- Type: High Dielectric
- Composition: Filled
from Protavic America, Inc.
PNU 46220 ™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term circuit protection and... [See More]
- Cure / Technology: Thermoset; Two Component ; UV or Radiation Cured
- Form / Function: Liquid; Encapsulant or Conformal Coating; Die Bonding Adhesives
- Type: High Dielectric
- Chemical System: Polyurethane
from Henkel Corporation - Industrial
LOCTITE ECCOBOND DS 3318BL, Acrylic, Coating and Sealant LOCTITE ® ECCOBOND DS 3318BL fast, UV curable material is specially formulated for use in applications requiring lower energy cure. It is designed for protection of COG (Chip-on-Glass) in LCD modules. Fast cure. Low energy cure. Good... [See More]
- Cure / Technology: UV or Radiation Cured
- Viscosity: 2250
- Chemical System: Acrylic
from Henkel Corporation - Industrial
LOCTITE ECCOBOND DS 3318BLX, Acrylic, Sealant, Encapsulation LOCTITE ® ECCOBOND DS 3318BLX fast, UV curable material is specially formulated for use in applications requiring lower energy cure. It is designed for protection of COF (Chip-on-Film) in LCD modules. Flexibility is a key... [See More]
- Cure / Technology: UV or Radiation Cured
- Viscosity: 2050
- Chemical System: Acrylic
from Henkel Corporation - Industrial
LOCTITE ECCOBOND DS 3318LVT, Acrylate, Coating and Sealant LOCTITE ® ECCOBOND DS 3318LVT fast, UV curable material is specially formulated for use in applications requiring lower energy cure. Its excellent moisture resistance is designed to provide protection in COG-LCD modules. Low energy... [See More]
- Cure / Technology: UV or Radiation Cured
- Viscosity: 142
from Henkel Corporation - Industrial
LOCTITE ECCOBOND EN 3410, Acrylate, Encapsulant, Coating LOCTITE ® ECCOBOND EN 3410 encapsulant is designed for COG/COF of LCD module or micro patterned FPC substrate of OLED module assembly applications. It is designed to improve crack/fracture resistance and delamination for overall... [See More]
- Cure / Technology: UV or Radiation Cured
- Viscosity: 680
from Henkel Corporation - Industrial
LOCTITE ECCOBOND EN 3839, Acrylic, Encapsulant, Glob top LOCTITE ® ECCOBOND EN 3839 is specially designed for encapsulating components on PCB applications. When cured, this material provides physical protection, as well as, protection in temperature/humidity/bias testing. Provides physical and... [See More]
- Cure / Technology: UV or Radiation Cured
- Chemical System: Acrylic
- Form / Function: Glob Top, Daub, Doming or Overfill
- CTE: 60
from Henkel Corporation - Industrial
LOCTITE ECCOBOND LV4518-38, Acrylate, Sealant, Thixotropic LOCTITE ® ECCOBOND LV4518-38 thixotropic, solvent resistant, UV curing sealant formulated for gold and plastic substrates such as polyester and polyetherimide. It may be syringe-dispensed to form a low profile sealant based at the... [See More]
- Cure / Technology: UV or Radiation Cured
- Viscosity: 42000