Glob Top / Daub Encapsulants and Potting Compounds
from MacDermid Alpha Electronics Solutions
ALPHA HiTech Edgebond is a one component, heat curable material. It is an epoxy material to be dispensed on the corners or edges of the BGA. Upon deposition, minimal flow will take place beneath the BGA, to minimize contact with outer solder balls. The cured edgebond will help to strengthen the... [See More]
- Form / Function: Liquid; Glob Top, Daub, Doming or Overfill
- Cure / Technology: Single Component
- Chemical System: Epoxy
- Industry: Electronics; Semiconductors, IC's
from Epoxy Technology
EPO-TEK ® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries. Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market... [See More]
- Form / Function: Liquid; Glob Top, Daub, Doming or Overfill
- Chemical System: Epoxy
- Type: Optical
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
One part, nanosilica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]
- Form / Function: Liquid; Encapsulant or Conformal Coating; Glob Top, Daub, Doming or Overfill
- Chemical System: UV Curing
- Type: High Dielectric; Thermally Conductive
- Composition: Filled
from Master Bond, Inc.
Formulated for potting, encapsulation, bonding and sealing applications, Master Bond EP17HT-100 is a single part epoxy system that is designed to cure in 60-90 minutes at 200-220 °F. This low heat curing schedule is useful in bonding applications involving temperature sensitive substrates. It is... [See More]
- Form / Function: Gap Filler, Foam in Place Gasket; Glob Top, Daub, Doming or Overfill; Die Bonding Adhesives
- Chemical System: Epoxy
- Type: High Dielectric; Thermal Insulation
- Composition: Unfilled
from Master Bond, Inc.
Moderate viscosity EP3RR-80 is a one part epoxy that is particularly compatible for sealing, potting and encapsulation applications. It is a superior thermal conductor, while retaining first class electrical insulation properties. EP3RR-80 can cure in thicker sections up to and beyond a 1/2 inch... [See More]
- Form / Function: Gap Filler, Foam in Place Gasket; Glob Top, Daub, Doming or Overfill
- Chemical System: Epoxy
- Type: High Dielectric; Thermally Conductive
- Composition: Unfilled
from Master Bond, Inc.
Master Bond Polymer System UV15X-2GT is a new, easily processable, one component, UV curable glob top, featuring exceptional durability and chemical resistance. UV15X-2GT is a thixotropic paste that handles well when encapsulating selected components and chips on circuit boards. The cured UV15X-2GT... [See More]
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Glob Top, Daub, Doming or Overfill; Die Bonding Adhesives
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Type: High Dielectric; Optical; Thermal Insulation
- Features: Non-corrosive; Dissimilar Substrates
from Master Bond, Inc.
Well suited for glob top or die attach applications, Master Bond Supreme 3HTND-2GT is a one part epoxy system with limited flow for bonding and sealing. Combining outstanding thermal conductivity and electrical insulation values, this system offers superior protection to electronic components. [See More]
- Form / Function: Gap Filler, Foam in Place Gasket; Glob Top, Daub, Doming or Overfill; Die Bonding Adhesives
- Chemical System: Epoxy
- Type: High Dielectric; Thermally Conductive
- Composition: Unfilled
from Master Bond, Inc.
Supreme 3HTND-2DM is a rapid curing, toughened, one part epoxy system used for the dam-and-fill method for chip-on-board encapsulation. It passes ASTM E595 specifications for NASA low outgassing allowing it to be used in vacuum, aerospace, electro-optic and other related applications. Supreme... [See More]
- Form / Function: Gap Filler, Foam in Place Gasket; Glob Top, Daub, Doming or Overfill
- Chemical System: Epoxy
- Type: High Dielectric; Thermally Conductive
- Composition: Unfilled
from Master Bond, Inc.
Primarily used for chip coating, glob top and die attach applications, Supreme 3HTND-2CCM is a single component chemical resistant system with low shrinkage upon curing, good thermal conductivity and sound dimensional stability. Its inherent toughness allows it to withstand the most intense types of... [See More]
- Form / Function: Gap Filler, Foam in Place Gasket; Glob Top, Daub, Doming or Overfill; Die Bonding Adhesives
- Chemical System: Epoxy
- Type: High Dielectric; Thermally Conductive
- Composition: Unfilled
from Henkel Corporation - Industrial
LOCTITE ECCOBOND EN 3839, Acrylic, Encapsulant, Glob top LOCTITE ® ECCOBOND EN 3839 is specially designed for encapsulating components on PCB applications. When cured, this material provides physical protection, as well as, protection in temperature/humidity/bias testing. Provides physical and... [See More]
- Form / Function: Glob Top, Daub, Doming or Overfill
- Cure / Technology: UV or Radiation Cured
- Chemical System: Acrylic
- CTE: 60
from Henkel Corporation - Electronics
HYSOL EO1086 is a one-component heat cure encapsulant designed for use in Chip on Board applications requiring excellent handling properties. [See More]
- Form / Function: Glob Top, Daub, Doming or Overfill
- Industry: Electronics
from Protavic America, Inc.
A solvent-free, single component resin with low linear expansion and high ionic purity for protecting semi-conductor silicon crystals. [See More]
- Form / Function: Liquid; Glob Top, Daub, Doming or Overfill; Die Bonding Adhesives
- Chemical System: Epoxy
- Type: Electrically Conductive; Thermally Conductive
- Composition: Filled
from Novagard Solutions
Non-corrosive, single component alkoxy cure silicone sealant/adhesive [See More]
- Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Glob Top, Daub, Doming or Overfill; Die Bonding Adhesives
- Chemical System: Silicone; Elastomeric
- Type: High Dielectric
- Composition: Unfilled
from Henkel Corporation - Industrial
LOCTITE ECCOBOND FP4323, Epoxy, Encapsulant - glob top. LOCTITE ® ECCOBOND FP4323 is a high purity liquid epoxy encapsulant for chip on board (plastic substrate) and plastic PGA applications. It is designed with flow capabilities that allows encapsulation without flowing beyond the chip. Low... [See More]
- Form / Function: Glob Top, Daub, Doming or Overfill
- Viscosity: 220000
- CTE: 16
from Henkel Corporation - Industrial
LOCTITE ECCOBOND FP4460, Epoxy, Encapsulant - glob top. LOCTITE ® ECCOBOND FP4460 encapsulant is designed for protection of bare semiconductor devices. Pressure pot performance on live devices is up to 500 hours with no failures, depending on device and package type. High purity. Low stress. [See More]
- Form / Function: Glob Top, Daub, Doming or Overfill
- CTE: 11
- Use Temperature: 85 to 302
- Viscosity: ? to 425000
from Henkel Corporation - Industrial
Sicomet 100 is a fast curing medium-viscosity ethylcyanoacrylate for bonding a wide range of materials including plastics and rubbers.Features and Benefits: Versatile instant adhesive suitable for a wide range of applications. Available in low and medium viscosity and a gel formula. Henkel... [See More]
- Form / Function: Glob Top, Daub, Doming or Overfill