Gap Filling Compound Encapsulants and Potting Compounds
from Ellsworth Adhesives
Sauereisen Low Expansion Cement Liquid No. 29 Off-White is an inorganic cement that is used for aerospace applications, insulating thermocouples, embedding heating elements, mechanically sealing parts, and coating resistors and coils. It bonds well with metal, glass, ceramics, and porcelain. It... [See More]
- Form / Function: Gap Filler, Foam in Place Gasket
- Cure / Technology: Two Component
- Chemical System: Ceramic
- Tensile (Break): 425
from Master Bond, Inc.
MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid
- Chemical System: Silicone
- Type: High Dielectric; Optical; Thermally Conductive
- Composition: Unfilled
from Ellsworth Adhesives
Sauereisen Low Expansion Cement Liquid No. 29 Tan is an inorganic cement that is used for aerospace applications, insulating thermocouples, embedding heating elements, mechanically sealing parts, and coating resistors and coils. It bonds well with metal, glass, ceramics, and porcelain. It insulates... [See More]
- Form / Function: Gap Filler, Foam in Place Gasket
- Cure / Technology: Two Component
- Chemical System: Ceramic
- Tensile (Break): 425
from Master Bond, Inc.
EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
- Chemical System: Epoxy
- Type: High Dielectric; Thermally Conductive
- Composition: Unfilled
from Ellsworth Adhesives
Sauereisen Low Expansion Cement Powder No. 29 Off-White is an inorganic cement that is used for aerospace applications, insulating thermocouples, embedding heating elements, mechanically sealing parts, and coating resistors and coils. It bonds well with metal, glass, ceramics, and porcelain. It... [See More]
- Form / Function: Gap Filler, Foam in Place Gasket
- Cure / Technology: Two Component
- Chemical System: Ceramic
- Tensile (Break): 425
from Master Bond, Inc.
MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]
- Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating
- Chemical System: Silicone
- Type: Electrically Conductive; Thermally Conductive
- Composition: Filled
from Ellsworth Adhesives
Sauereisen Low Expansion Cement Powder No. 29 Tan is an inorganic cement that is used for aerospace applications, insulating thermocouples, embedding heating elements, mechanically sealing parts, and coating resistors and coils. It bonds well with metal, glass, ceramics, and porcelain. It insulates... [See More]
- Form / Function: Gap Filler, Foam in Place Gasket
- Cure / Technology: Two Component
- Chemical System: Ceramic
- Tensile (Break): 425
from Master Bond, Inc.
EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
- Chemical System: Epoxy
- Type: High Dielectric; Thermally Conductive
- Composition: Unfilled
from Master Bond, Inc.
Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
- Chemical System: Polyphenylene Sulfide; Epoxy
- Type: Electrically Conductive; Thermally Conductive
- Composition: Filled
from Master Bond, Inc.
EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
- Chemical System: Epoxy
- Type: High Dielectric; Thermally Conductive
- Composition: Unfilled
from Master Bond, Inc.
EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
- Chemical System: Epoxy
- Type: High Dielectric; Thermally Conductive
- Composition: Unfilled
from Master Bond, Inc.
Master Bond Polymer System EP39-2 is a fast curing, low viscosity, optically clear two component epoxy system for high performance bonding, sealing, coating and casting. It is 100% reactive and does not contain any diluents, solvents or other volatiles. The mix ratio is a convenient 2 to 1 by... [See More]
- Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Die Bonding Adhesives
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond EP62-1 is a two component heat cured and chemically resistant epoxy resin system featuring a long pot life at ambient temperatures and efficient cures at moderately elevated temperatures. The recommended mix ratio is 100 parts of component A to 10 parts of component B. The pot life of... [See More]
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
- Industry: Marine; Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial; Semiconductors, IC's
- Cure / Technology: Thermoset; Two Component
- Use Temperature: -60 to 400
from Master Bond, Inc.
Master Bond Polymer System EP45HT is a two component epoxy system for high performance structural bonding and casting. It is suitable for applications where long term exposure to temperatures from -80 °F to +500 °F is required. lt is 100% reactive and does not contain any solvents or... [See More]
- Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Die Bonding Adhesives
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component
from Master Bond, Inc.
Master Bond Polymer System 125 is a two component toughened epoxy resin for prolonged service above 500 °F with truly outstanding chemical resistance. High strength bonds serviceable up to 600 °F can be obtained with this exceptionally thermally stable and chemically resistant epoxy resin... [See More]
- Form / Function: Powder; Gap Filler, Foam in Place Gasket; Impregnating Resin; Die Bonding Adhesives
- Chemical System: Epoxy
- Type: High Dielectric; Thermal Insulation
- Composition: Unfilled
from Master Bond, Inc.
MasterSil 151TC is a highly flexible, temperature resistant two component silicone adhesive offering low thermal resistance and outstanding thermal conductivity. It was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. [See More]
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid
- Chemical System: Silicone
- Type: High Dielectric; Thermally Conductive
- Composition: Filled
from Master Bond, Inc.
Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. Not only is EP29LPSP able to function as an adhesive, sealant and protective coating at temperatures as low as 4K, but it is... [See More]
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
- Chemical System: Epoxy
- Type: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding
- Composition: Unfilled
from Master Bond, Inc.
Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronicc/ structural applications. The two components are combined in a convenient noncritical mix... [See More]
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating; Impregnating Resin
- Chemical System: Epoxy
- Type: High Dielectric; Optical; Thermal Insulation
- Composition: Unfilled
from Master Bond, Inc.
Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. [See More]
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
- Chemical System: Epoxy
- Type: High Dielectric; Optical; Thermally Conductive
- Composition: Unfilled
from Master Bond, Inc.
Master Bond Polymer System EP38 is a fast curing, low viscosity, optically clear two component epoxy system for high performance coating, bonding and sealing. It is 100% reactive and does not contain any volatiles. The mix ratio is a convenient 3 to 1 by weight. EP38 is very fast curing. Coatings as... [See More]
- Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Die Bonding Adhesives
- Chemical System: Epoxy
- Type: High Dielectric
- Composition: Unfilled
from Master Bond, Inc.
Master Bond EP30NS is a nano silica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically clear and meets NASA low outgassing specifications. [See More]
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
- Chemical System: Epoxy
- Type: High Dielectric; Optical; Thermally Conductive
- Composition: Filled
from Master Bond, Inc.
EP42-2LV Black is a two component, room temperature curing epoxy compound featuring low viscosity and superior chemical resistance. It meets NASA low outgassing specifications, is black in color and optically opaque. [See More]
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
- Chemical System: Epoxy
- Type: High Dielectric; Thermally Conductive
- Composition: Unfilled
from Protavic America, Inc.
PTE-36977 ™ is a two-component epoxy designed for encapsulation or casting of high voltage coils and transformers where high temperature, high voltage, and high thermal conductivity are required. PTE-36977 ™ is heat stable up to 150 °C. [See More]
- Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Gel
- Chemical System: Epoxy
- Type: High Dielectric; Thermally Conductive
- Composition: Filled
from Shiu Li Technology Co., Ltd
LiPOLY's TPS series is a low-density, potting material. Its low density and lightweight properties enhance product performance, reduce production costs. The product has a thermal conductivity of 0.55-1.50 W/m*K and can cure at room temperature or high temperatures. [See More]
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid
- Chemical System: Silicone
- Type: Thermally Conductive
- Cure / Technology: Room Temperature Vulcanizing or Curing
from Henkel Corporation - Industrial
Acrylated urethane acrylic structural adhesive primarily designed for bonding rigid and flexible PVC to polycarbonate. LOCTITE ® 3703 is a bone white to beige, translucent, acrylated urethane acrylic structural adhesive primarily designed for bonding rigid and flexible PVC to polycarbonate... [See More]
- Form / Function: Paste; Gap Filler, Foam in Place Gasket
- Cure / Technology: UV or Radiation Cured; Single Component
- Chemical System: Acrylic
- Viscosity: ? to 35000
from Chemence Inc.
KSC1802 is a low viscosity, high performance, thermally conductive, liquid gap filling material. It is formulated to develop a soft, 'form in place' elastomer ideal for coupling hot PC board components to heat sinks. KSC1802 is supplied as a two part, 1:1 mix ratio silicone that when mixed will cure... [See More]
- Form / Function: Gap Filler, Foam in Place Gasket; Die Bonding Adhesives
- Cure / Technology: Single Component
- Chemical System: Silicone
- Industry: Electronics
from Sauereisen, Inc.
Sauereisen Cement No. 31 is a white, porcelain-like cement that is widely used throughout industry in a variety of applications. including assembling, sealing, insulating and cementing of ceramics, porcelain, metal, and glass. [See More]
- Form / Function: Powder; Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
- Chemical System: Ceramic
- Type: High Dielectric; Thermally Conductive
- Composition: Unfilled
from Henkel Corporation - Electronics
DC0114 epoxy underfill is suitable for high reliability applications due to its combination of properties. It can be applied to ceramic or organic substrates, including solder masks and polyimide. [See More]
- Form / Function: Gap Filler, Foam in Place Gasket
- CTE: 39
- Industry: Electronics
- Viscosity: 20000
from Epoxies Etc...
UV 60-7016 is a high performance Ultraviolet Curable Adhesive, Sealant, and Potting Compound. This new one component urethane acrylate system was specifically designed for the difficult bonding of glass to metal. UV 60-7016 has outstanding thermal shock and impact resistance, and is an excellent... [See More]
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
- Composition: Unfilled
- Chemical System: Elastomeric; Polyurethane
- Cure / Technology: UV or Radiation Cured; Single Component
from Aremco Products, Inc.
Hi-temp, prevents dusting of fibrous insulation materials [See More]
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid
- Chemical System: Silicone
- Type: High Dielectric
- Composition: Filled
from Protavic America, Inc.
Fast flow, fast cure capillary reworkable underfill. The rheology of the PROTAVIC ANA 10199 R in combination with its fineness make the product perfectly adapted to high reliability small gap underfill applications. It presents a good pot life at room temperature 20-22C and a high reactivity at... [See More]
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
- Composition: Unfilled
- Type: High Dielectric; Thermal Insulation
- Cure / Technology: Thermoset; Single Component
from Henkel Corporation - Industrial
BERGQUIST GAP PAD TGP 7000ULM, Thermally conductive soft gap filling material, For high performance applications. BERGQUIST GAP PAD TGP 7000ULM is an extremely soft gap filling material rated at a thermal conductivity of 7.0 W/m-K. It is specially formulated for high performance applications... [See More]
- Form / Function: Gap Filler, Foam in Place Gasket
- Chemical System: Silicone
- Type: Thermally Conductive
- Use Temperature: 140 to 392
from Epoxies Etc...
20-2100 FR is a two component, room temperature curing, low viscosity polyurethane system for potting, casting, encapsulating and sealing electronic components and assemblies. 20-2100 FR is a flame retardant self extinguishing system. It meets the stringent requirements of UL 94-VO. Designed for... [See More]
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid
- Chemical System: Elastomeric; Polyurethane
- Type: High Dielectric
- Composition: Unfilled