UL Approved Encapsulants and Potting Compounds
from ELANTAS North America LLC
ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]
- Type: High Dielectric
- Chemical System: Alkyd
- Form / Function: Liquid; Impregnating Resin (optional feature)
- Composition: Unfilled
from CHT USA Inc.
CHT's QSil 223 is a 2-part, platinum cure, optically clear silicone encapsulant and is designed for optical applications. It features a convenient 1:1 mix ratio by weight and its low viscosity profile enables excellent flow around components and is ideal for potting complex parts. The chemical... [See More]
- Type: High Dielectric; Optical
- Features: Flame Retardant; UL Rating
- Cure / Technology: Two Component ; Addition
- Industry: Automotive; Electronics; OEM or Industrial
from Master Bond, Inc.
Featuring superb electrical insulation properties, MasterSil 156 is a two component, moderate viscosity silicone system for high performance potting, encapsulation and sealing. It combines high temperature resistance, flexibility, low shrinkage upon cure and thermal conductivity exceeding 8-9 BTU... [See More]
- Type: High Dielectric; Thermally Conductive
- Chemical System: Silicone
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid
- Composition: Unfilled
from Dymax
Conformal Coating with Secondary Moisture Cure. Dual-cure 9481-E-PZ conformal coating is chemically resistant and free of Trimethylbenzoyl Diphenylphosphine Oxide (TPO) and PIP 3:1. It is a UV/Visible light- and moisture-cure material that contains no added solvents. It is formulated to ensure... [See More]
- Form / Function: Liquid; Encapsulant or Conformal Coating
- Cure / Technology: UV or Radiation Cured; Reactive or Moisture Cured
- Chemical System: Acrylated Urethane
- Features: Flame Retardant; UL Rating
from CHT USA Inc.
CHT's QSil 563 is a 2-part, platinum cure, 100% silicone solids elastomer designed for electronic potting and encapsulation applications. QSil 562 offers a hard, low modulus material that is readily repairable. QSil 563 is thermally conductive to aid in efficient heat dissipation. This silicone... [See More]
- Type: Thermally Conductive
- Features: Flame Retardant; UL Rating
- Cure / Technology: Two Component ; Addition
- Industry: Automotive; Electronics
from Master Bond, Inc.
Featuring a non-halogenated filler, EP21FRNS-2 is a two component, room temperature curing epoxy offering low smoke generation for potting, encapsulating and casting applications. As per the UL 94V-0 specification, this system is serviceable over the wide temperature range of -60 °F to 200... [See More]
- Type: High Dielectric; Thermal Insulation
- Chemical System: Epoxy
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid
- Composition: Filled
from Dymax
High-Performance Conformal Coating with Secondary Moisture Cure. Dual-cure 9483-Z conformal coating is free of Trimethylbenzoyl Diphenylphosphine Oxide (TPO). It cures tack-free upon exposure to UV/Visible light and then with ambient moisture over time, on PCBs where shadow areas are present. The... [See More]
- Form / Function: Liquid; Encapsulant or Conformal Coating
- Cure / Technology: UV or Radiation Cured; Reactive or Moisture Cured
- Chemical System: Acrylated Urethane
- Features: Flame Retardant; UL Rating
from CHT USA Inc.
CHT's SE3000 is a 2-part, platinum cure silicone elastomer designed for electronic potting and encapsulation applications. It offers good prtection against chemicals, environmental contamination, mechanical shock, vibration and impact damage. SE3000 can be used in applications where low flammability... [See More]
- Type: Thermally Conductive
- Features: Flame Retardant; UL Rating
- Cure / Technology: Two Component ; Addition
- Industry: Electronics
from CHT USA Inc.
CHT's QSil 553 is a 2-part, platinum cure, silicone potting compound and encapsulant designed to protect electronic components from harsh environmental conditions and shock and vibration. It features a low viscosity for convenient dispensing and will easily flow throughout components. Because of its... [See More]
- Type: Thermally Conductive
- Features: Flame Retardant; UL Rating
- Cure / Technology: Two Component ; Addition
- Industry: Automotive; Electronics; OEM or Industrial
from CHT USA Inc.
CHT's ACC15 is a low viscosity, 1-part, condensation curing silicone coating. The uncured product can be applied by pouring or brushing and is readily cured to a tough, transparent rubber. ACC15 can be used to coat printed circuit boards to prevent ingress of water an environmental contaminants. It... [See More]
- Form / Function: Encapsulant or Conformal Coating
- Features: UL Rating
- Cure / Technology: Alkoxy
- Industry: Automotive; Electronics
from ACCRAbond, Inc.
INSTAbond ® 809FR. INSTAbond ® 809 FR exhibits good thermal conductivity, excellent flow properties, and low exotherm characteristics in large masses. INSTAbond ® 809 FR meets the requirements for UL-94 V-0 rating for flame retardancy. [See More]
- Type: Thermally Conductive
- Cure / Technology: Two Component
- Chemical System: Epoxy
- Features: Flame Retardant; UL Rating
from Protavic America, Inc.
The two component polyurethane compound described in this data sheet is specifically designed for the encapsulation by casting of completed circuit board. The cured material meets the flammability requirements of UL 94, V-O at thickness of 0.070 in. and greater (UL File Number E116296) and provides... [See More]
- Type: High Dielectric; Thermal Insulation
- Chemical System: Polyurethane
- Form / Function: Liquid; Encapsulant or Conformal Coating
- Composition: Filled
from Epoxies Etc...
The 50-2369FR Potting and Encapsulating Compound has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-2369 FR Urethane is listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low exotherm, and excellent electrical... [See More]
- Type: Thermally Conductive
- Chemical System: Polyurethane
- Form / Function: Gel
- Composition: Filled
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Form / Function: Pellets
- Cure / Technology: Thermoplastic / Hot Melt
- Chemical System: Polyolefin
- Features: UL Rating
from Henkel Corporation - Industrial
LOCTITE STYCAST ES 2510, Epoxy, Dielectric Grade, Encapsulant and Potting. LOCTITE ® STYCAST ES 2510 is a dielectric grade epoxy encapsulant designed for general purpose applications. It is suitable for potting and encapsulating electrical devices that require flame retardancy. LOCTITE STYCAST... [See More]
- Form / Function: Liquid
- Cure / Technology: Two Component
- Chemical System: Epoxy
- Features: UL Rating
from Hapco, Inc.
Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E products are flame... [See More]
- Type: High Dielectric; Thermally Conductive
- Cure / Technology: Thermoset; Two Component
- Form / Function: Liquid
- Features: Flame Retardant; UL Rating
from DuPont Electronics & Imaging
DuPont ™ Pyralux ® HT bonding film can be used in conjunction with Pyralux ® AP to create a complete all-polyimide flex laminate system that includes a double-sided, copper-clad laminate and a unique all-polyimide coverfilm or bonding material that becomes a flexible coverlay after... [See More]
- Chemical System: Polyimide
- Industry: Electronics; OEM or Industrial
- Features: UL Rating
- Use Temperature: 437
from Protavic America, Inc.
PTS-46303 A/B ™ is a two-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include... [See More]
- Type: Electrically Conductive; Thermally Conductive
- Chemical System: Silicone
- Form / Function: Encapsulant or Conformal Coating; Gel; Die Bonding Adhesives
- Composition: Filled
from Epoxies Etc...
50-3150 FR has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-3150 FR Black Epoxy with Catalyst 190 and Catalyst 105 are listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low shrinkage, and outstanding insulation... [See More]
- Type: Thermally Conductive
- Chemical System: Epoxy
- Form / Function: Liquid
- Composition: Unfilled
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Type: High Dielectric; Thermally Conductive
- Chemical System: Polyamide
- Form / Function: Pellets
- Cure / Technology: Thermoplastic / Hot Melt; Single Component
from Henkel Corporation - Industrial
LOCTITE STYCAST US 0138, Urethane, Potting and Encapsulating, Extended polybutadiene/MDI base Sealant. LOCTITE ® STYCAST US 0138 is an extended polybutadiene/MDI base encapsulant/sealant formulated for potting electronics or devices for protection against environmental hazards. It exhibits very... [See More]
- Form / Function: Liquid
- Cure / Technology: Two Component
- Chemical System: Polyurethane
- Features: UL Rating
from Hapco, Inc.
DI-COAT R-4721 / DI-COAT R-4721 LV (lower viscosity). Shore 90 D, room temperature curing, medium to high thixotropic coating for dielectric insulating applications. DI-COAT R-4721 is ideal for use on vertical or sloping surfaces where flow or drain-off cannot be tolerated. DI-COAT R-4721 is easy to... [See More]
- Type: High Dielectric; Thermally Conductive
- Cure / Technology: Thermoset; Two Component
- Form / Function: Liquid
- Features: Flame Retardant; UL Rating
from Epoxies Etc...
20-2100 FR is a two component, room temperature curing, low viscosity polyurethane system for potting, casting, encapsulating and sealing electronic components and assemblies. 20-2100 FR is a flame retardant self extinguishing system. It meets the stringent requirements of UL 94-VO. Designed for... [See More]
- Type: High Dielectric
- Chemical System: Elastomeric; Polyurethane
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid
- Composition: Unfilled
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Type: High Dielectric; Thermally Conductive
- Chemical System: Polyamide
- Form / Function: Pellets
- Cure / Technology: Thermoplastic / Hot Melt
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Type: High Dielectric; Thermally Conductive
- Chemical System: Polyamide
- Form / Function: Pellets
- Cure / Technology: Thermoplastic / Hot Melt
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Type: High Dielectric; Thermally Conductive
- Chemical System: Polyolefin
- Form / Function: Pellets
- Cure / Technology: Thermoplastic / Hot Melt; Single Component
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Type: High Dielectric; Thermally Conductive
- Chemical System: Polyamide
- Form / Function: Pellets
- Cure / Technology: Thermoplastic / Hot Melt; Single Component