UL Approved Encapsulants and Potting Compounds

28 Results
2-Part, Optically Clear Silicone Potting Compounds and Encapsulants, UL Listed -- QSil 223
from CHT USA Inc.

CHT's QSil 223 is a 2-part, platinum cure, optically clear silicone encapsulant and is designed for optical applications. It features a convenient 1:1 mix ratio by weight and its low viscosity profile enables excellent flow around components and is ideal for potting complex parts. The chemical... [See More]

  • Type: High Dielectric; Optical
  • Features: Flame Retardant; UL Rating
  • Cure / Technology: Two Component  ; Addition
  • Industry: Automotive; Electronics; OEM or Industrial
ELAN-Cast® -- P 300 S RTC
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Type: High Dielectric
  • Chemical System: Alkyd
  • Form / Function: Liquid; Impregnating Resin (optional feature)
  • Composition: Unfilled
Thermally Conductive Flame Retardant Silicone -- MasterSil 156
from Master Bond, Inc.

Featuring superb electrical insulation properties, MasterSil 156 is a two component, moderate viscosity silicone system for high performance potting, encapsulation and sealing. It combines high temperature resistance, flexibility, low shrinkage upon cure and thermal conductivity exceeding 8-9 BTU... [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Silicone
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid
  • Composition: Unfilled
2-Part, Silicone Potting Compound and Encapsulant, UL Listed -- QSil-563
from CHT USA Inc.

CHT's QSil 563 is a 2-part, platinum cure, 100% silicone solids elastomer designed for electronic potting and encapsulation applications. QSil 562 offers a hard, low modulus material that is readily repairable. QSil 563 is thermally conductive to aid in efficient heat dissipation. This silicone... [See More]

  • Type: Thermally Conductive
  • Features: Flame Retardant; UL Rating
  • Cure / Technology: Two Component  ; Addition
  • Industry: Automotive; Electronics
Two Component Room Temperature Curing Epoxy -- EP21FRNS-2
from Master Bond, Inc.

Featuring a non-halogenated filler, EP21FRNS-2 is a two component, room temperature curing epoxy offering low smoke generation for potting, encapsulating and casting applications. As per the UL 94V-0 specification, this system is serviceable over the wide temperature range of -60 °F to 200... [See More]

  • Type: High Dielectric; Thermal Insulation
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid
  • Composition: Filled
2-Part, Thermally Conductive Silicone Encapsulants, UL Listed -- SE3000
from CHT USA Inc.

CHT's SE3000 is a 2-part, platinum cure silicone elastomer designed for electronic potting and encapsulation applications. It offers good prtection against chemicals, environmental contamination, mechanical shock, vibration and impact damage. SE3000 can be used in applications where low flammability... [See More]

  • Type: Thermally Conductive
  • Features: Flame Retardant; UL Rating
  • Cure / Technology: Two Component  ; Addition
  • Industry: Electronics
2-Part, Thermally Conductive Silicone Potting Compound and Encapsulant, UL Listed -- QSil-553
from CHT USA Inc.

CHT's QSil 553 is a 2-part, platinum cure, silicone potting compound and encapsulant designed to protect electronic components from harsh environmental conditions and shock and vibration. It features a low viscosity for convenient dispensing and will easily flow throughout components. Because of its... [See More]

  • Type: Thermally Conductive
  • Features: Flame Retardant; UL Rating
  • Cure / Technology: Two Component  ; Addition
  • Industry: Automotive; Electronics; OEM or Industrial
Silicone Conformal Coating, UL Listed -- ACC15
from CHT USA Inc.

CHT's ACC15 is a low viscosity, 1-part, condensation curing silicone coating. The uncured product can be applied by pouring or brushing and is readily cured to a tough, transparent rubber. ACC15 can be used to coat printed circuit boards to prevent ingress of water an environmental contaminants. It... [See More]

  • Form / Function: Encapsulant or Conformal Coating
  • Features: UL Rating
  • Cure / Technology: Alkoxy
  • Industry: Automotive; Electronics
Di-Pak™ Elastomeric Eletrical Insulating Compound -- E-4501
from Hapco, Inc.

Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E products are flame... [See More]

  • Type: High Dielectric; Thermally Conductive
  • Cure / Technology: Thermoset; Two Component  
  • Form / Function: Liquid
  • Features: Flame Retardant; UL Rating
Encapsulants -- LOCTITE STYCAST ES 2510
from Henkel Corporation - Industrial

LOCTITE STYCAST ES 2510, Epoxy, Dielectric Grade, Encapsulant and Potting. LOCTITE ® STYCAST ES 2510 is a dielectric grade epoxy encapsulant designed for general purpose applications. It is suitable for potting and encapsulating electrical devices that require flame retardancy. LOCTITE STYCAST... [See More]

  • Form / Function: Liquid
  • Cure / Technology: Two Component  
  • Chemical System: Epoxy
  • Features: UL Rating
Flame Retardant Polyurethane -- 50-2369 FR
from Epoxies Etc...

The 50-2369FR Potting and Encapsulating Compound has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-2369 FR Urethane is listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low exotherm, and excellent electrical... [See More]

  • Type: Thermally Conductive
  • Chemical System: Polyurethane
  • Form / Function: Gel
  • Composition: Filled
Potting/Encapsulation Compound -- INSTAbond® 809FR
from ACCRAbond, Inc.

INSTAbond ® 809FR. INSTAbond ® 809 FR exhibits good thermal conductivity, excellent flow properties, and low exotherm characteristics in large masses. INSTAbond ® 809 FR meets the requirements for UL-94 V-0 rating for flame retardancy. [See More]

  • Type: Thermally Conductive
  • Cure / Technology: Two Component  
  • Chemical System: Epoxy
  • Features: Flame Retardant; UL Rating
Chemical,Conformal Coating,Konform Acrylic Resin,11.5 Oz Aerosol Can -- 70206141
from Allied Electronics, Inc.

Relaxed Retraction Coil Cords, 4 mm Stud Size, Black Color. Compliant to IPC-CC-830A. Designed to provide effective insulation against electrical shorts and harsh environments. Provides excellent acid resistance. Easily repairable. Meets MIL-I-46058C Type AR. UL Recognized. Acrylic Coating Stable... [See More]

  • Form / Function: Liquid; Encapsulant or Conformal Coating
  • Features: UL Rating
  • Chemical System: Acrylic
  • Use Temperature: -74 to 270
Clear Urethane Cast/Adhesive -- PNU-46201
from Protavic America, Inc.

The two component polyurethane compound described in this data sheet is specifically designed for the encapsulation by casting of completed circuit board. The cured material meets the flammability requirements of UL 94, V-O at thickness of 0.070 in. and greater (UL File Number E116296) and provides... [See More]

  • Type: High Dielectric; Thermal Insulation
  • Chemical System: Polyurethane
  • Form / Function: Liquid; Encapsulant or Conformal Coating
  • Composition: Filled
TECHNOMELT AS 8998
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Form / Function: Pellets
  • Cure / Technology: Thermoplastic / Hot Melt
  • Chemical System: Polyolefin
  • Features: UL Rating
All Polyimide High Temperature Bonding Film -- Pyralux® HT
from DuPont Electronics & Imaging

DuPont ™ Pyralux ® HT bonding film can be used in conjunction with Pyralux ® AP to create a complete all-polyimide flex laminate system that includes a double-sided, copper-clad laminate and a unique all-polyimide coverfilm or bonding material that becomes a flexible coverlay after... [See More]

  • Chemical System: Polyimide
  • Industry: Electronics; OEM or Industrial
  • Features: UL Rating
  • Use Temperature: 437
Di-Pak™ Rigid Eletrical Insulating Compound -- R-4528/7
from Hapco, Inc.

DI-COAT R-4721 / DI-COAT R-4721 LV (lower viscosity). Shore 90 D, room temperature curing, medium to high thixotropic coating for dielectric insulating applications. DI-COAT R-4721 is ideal for use on vertical or sloping surfaces where flow or drain-off cannot be tolerated. DI-COAT R-4721 is easy to... [See More]

  • Type: High Dielectric; Thermally Conductive
  • Cure / Technology: Thermoset; Two Component  
  • Form / Function: Liquid
  • Features: Flame Retardant; UL Rating
Encapsulants -- LOCTITE STYCAST US 0138
from Henkel Corporation - Industrial

LOCTITE STYCAST US 0138, Urethane, Potting and Encapsulating, Extended polybutadiene/MDI base Sealant. LOCTITE ® STYCAST US 0138 is an extended polybutadiene/MDI base encapsulant/sealant formulated for potting electronics or devices for protection against environmental hazards. It exhibits very... [See More]

  • Form / Function: Liquid
  • Cure / Technology: Two Component  
  • Chemical System: Polyurethane
  • Features: UL Rating
Flame Retardant Thermally Conductive -- 50-3150 FR
from Epoxies Etc...

50-3150 FR has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-3150 FR Black Epoxy with Catalyst 190 and Catalyst 105 are listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low shrinkage, and outstanding insulation... [See More]

  • Type: Thermally Conductive
  • Chemical System: Epoxy
  • Form / Function: Liquid
  • Composition: Unfilled
Chemical,Silicone Conformal Coating,10 Oz,Aerosol Can -- 70206148
from Allied Electronics, Inc.

Relaxed Retraction Coil Cords, 4 mm Stud Size, Black Color. The silicone coating engineered for maximum flexibility and protection from extreme temperatures and vibration damage. Safe for most plastics. Flammable and ozone safe, CFC/HCFC free. Meets MILI-46058C, Type SR. UL Recognized. Silicone... [See More]

  • Form / Function: Liquid; Encapsulant or Conformal Coating
  • Features: UL Rating
  • Chemical System: Silicone
  • Use Temperature: -83 to 392
Silicone Adhesive -- PTS-46303
from Protavic America, Inc.

PTS-46303 A/B ™ is a two-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include... [See More]

  • Type: Electrically Conductive; Thermally Conductive
  • Chemical System: Silicone
  • Form / Function: Encapsulant or Conformal Coating; Gel; Die Bonding Adhesives
  • Composition: Filled
TECHNOMELT PA 2384 -- 8807299842049
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Polyamide
  • Form / Function: Pellets
  • Cure / Technology: Thermoplastic / Hot Melt; Single Component
Flexible, Flame Retardant Urethane -- 20-2100FR
from Epoxies Etc...

20-2100 FR is a two component, room temperature curing, low viscosity polyurethane system for potting, casting, encapsulating and sealing electronic components and assemblies. 20-2100 FR is a flame retardant self extinguishing system. It meets the stringent requirements of UL 94-VO. Designed for... [See More]

  • Type: High Dielectric
  • Chemical System: Elastomeric; Polyurethane
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid
  • Composition: Unfilled
Silicone; hi temp; encapsulating & sealing; red paste; 3 oz cartridge -- 70125880 [RTV106-85ML from MG Chemicals]
from Allied Electronics, Inc.

Specific Gravity 1.07, Red, RTV Silicone Adhesive Sealant. Offering higher performance qualities over conventional RTV silicones. MG Chemicals sealants will bond to many clean surfaces without the aid of primers. Many of these one-part RTV silicone adhesive sealants are suitable for assembly... [See More]

  • Chemical System: Silicone
  • Use Temperature: -76 to 500
  • Features: UL Rating
  • Thermal Conductivity: 0.2092
TECHNOMELT PA 2692
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Polyamide
  • Form / Function: Pellets
  • Cure / Technology: Thermoplastic / Hot Melt
TECHNOMELT PA 341 -- 8802588327937
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Polyamide
  • Form / Function: Pellets
  • Cure / Technology: Thermoplastic / Hot Melt
TECHNOMELT PA 5375
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Polyolefin
  • Form / Function: Pellets
  • Cure / Technology: Thermoplastic / Hot Melt; Single Component
TECHNOMELT PA 6208 Black -- 8799566462977
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Polyamide
  • Form / Function: Pellets
  • Cure / Technology: Thermoplastic / Hot Melt; Single Component