Reactive / Moisture Cured Encapsulants and Potting Compounds

ELAN-Cast® -- P 300 S RTC
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Cure / Technology: Thermoset; Two Component  ; Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing
  • Form / Function: Liquid; Impregnating Resin (optional feature)
  • Type: High Dielectric
  • Chemical System: Alkyd
High Temperature Resistant, One Component Epoxy Adhesive -- EP17HT-100
from Master Bond, Inc.

Formulated for potting, encapsulation, bonding and sealing applications, Master Bond EP17HT-100 is a single part epoxy system that is designed to cure in 60-90 minutes at 200-220 °F. This low heat curing schedule is useful in bonding applications involving temperature sensitive substrates. It is... [See More]

  • Cure / Technology: Thermoset; Single Component; Reactive or Moisture Cured
  • Form / Function: Gap Filler, Foam in Place Gasket; Glob Top, Daub, Doming or Overfill; Die Bonding Adhesives
  • Type: High Dielectric; Thermal Insulation
  • Chemical System: Epoxy
No Mix, Thermally Conductive Epoxy Adhesive -- EP3RR-80
from Master Bond, Inc.

Moderate viscosity EP3RR-80 is a one part epoxy that is particularly compatible for sealing, potting and encapsulation applications. It is a superior thermal conductor, while retaining first class electrical insulation properties. EP3RR-80 can cure in thicker sections up to and beyond a 1/2 inch... [See More]

  • Cure / Technology: Thermoset; Single Component; Reactive or Moisture Cured
  • Form / Function: Gap Filler, Foam in Place Gasket; Glob Top, Daub, Doming or Overfill
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
Non-Yellowing, Abrasion Resistant UV Curable Adhesive -- UV15X-6NM-2
from Master Bond, Inc.

UV15X-6NM-2 features vibrant flexibility, excellent toughness and superior abrasion resistance. This fast curing moderate viscosity compound can be used for bonding, sealing, coating and encapsulation. Its robust flexibility gives it the capacity to withstand severe thermal cycling as well as... [See More]

  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; Reactive or Moisture Cured
  • Form / Function: Gap Filler, Foam in Place Gasket
  • Type: Optical; Thermal Insulation
  • Chemical System: Polyurethane
One Part Epoxy Adhesive for Underfill Applications -- EP3UF
from Master Bond, Inc.

Master Bond EP3UF is a one component, low viscosity epoxy for bonding and underfill applications. It has good flow properties and is easily cured at elevated temperatures as low as 250 °F. It is not premixed and frozen and has unlimited working life at room temperatures. Curing is simple and... [See More]

  • Cure / Technology: Thermoset; Single Component; Reactive or Moisture Cured
  • Form / Function: Gap Filler, Foam in Place Gasket
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
Heat Curing Electronic Coating Silicone Compound -- Bluesil™ V-207
from Bluestar Silicones USA Corp.

Clear, Two-Component, Addition Cure, Heat Curing Electronic coating Silicone Compound. Properties. Viscosity 6000. Hardness Sha 30. Description. BLUESIL V-207 is a clear, two component, addition cure, heat curing silicone rubber compound. It is designed as a primerless coating and encapsulating... [See More]

  • Cure / Technology: Thermoset; Two Component  ; Reactive or Moisture Cured
  • Chemical System: Silicone
  • Form / Function: Liquid; Encapsulant or Conformal Coating
  • Industry: Electronics
Silicone Sealant -- RTV 200-107
from Novagard Solutions

Non-corrosive, single component silicone sealant, self-leveling liquid [See More]

  • Cure / Technology: Thermoset; Single Component; Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Type: High Dielectric
  • Chemical System: Silicone; Elastomeric
GENIOSIL® XT SILANE TERMINATED POLYMER -- GENIOSIL® XT 50
from Wacker Chemical Corp.

GENIOSIL® XT 50 is a silicone-modified polyetherbasedsilane-terminated polymer suitable as a binderin moisture curing formulations. It is a clear liquid witha slight but characteristic odor and differs toconventional silylated polymers due to its highreactivity. This is a direct consequence of the... [See More]

  • Cure / Technology: Two Component   (optional feature); Single Component; Reactive or Moisture Cured
  • Chemical System: Silicone
  • Form / Function: Liquid
  • Industry: Construction
Light Cure Cyanoacrylate Instant Adhesive -- KU3064
from Chemence Inc.

Krylex KU3064 is a revolutionary odorless light curing cyanoacrylate adhesive. It is designed for bonding applications that require very rapid fixture, fillet cure or surface cure. The UV / visible light cure properties facilitate rapid curing of exposed surface areas while the moisture curing... [See More]

  • Cure / Technology: UV or Radiation Cured; Single Component; Reactive or Moisture Cured
  • Gap Fill: 0.0500
  • Form / Function: Liquid; Die Bonding Adhesives
  • Industry: Sanitary; Electronics; OEM or Industrial; Printing, Medical use and General Industrial Assembly
Pourable, Condensation-curing, Two-component Silicone Rubber -- ELASTOSIL® RTK
from Wacker Chemical Corp.

ELASTOSIL ® RT K is a pourable, condensationcuring, two-component silicone rubber that vulcanizes at room temperature. Special features. excellent flowability and good self-deaeration. medium Shore A hardness (approx. 45). good dielectric properties. outstanding resistance to casting resins,... [See More]

  • Cure / Technology: Thermoset; Two Component  ; Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing
  • Chemical System: Silicone; Elastomeric
  • Form / Function: Liquid
  • Industry: Electronics