Flame Retardant / UL 94V-0 Rated Encapsulants and Potting Compounds
from ELANTAS North America LLC
ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]
- Type: High Dielectric
- Chemical System: Epoxy
- Form / Function: Liquid
- Composition: Filled
from Master Bond, Inc.
EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]
- Type: High Dielectric; Thermally Conductive
- Chemical System: Epoxy
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
- Composition: Unfilled
from Dymax
Conformal Coating with Secondary Moisture Cure. Dual-cure 9481-E-PZ conformal coating is chemically resistant and free of Trimethylbenzoyl Diphenylphosphine Oxide (TPO) and PIP 3:1. It is a UV/Visible light- and moisture-cure material that contains no added solvents. It is formulated to ensure... [See More]
- Form / Function: Liquid; Encapsulant or Conformal Coating
- Cure / Technology: UV or Radiation Cured; Reactive or Moisture Cured
- Chemical System: Acrylated Urethane
- Features: Flame Retardant; UL Rating
from TE Connectivity
Body Features. Primary Product Color : Brown. Electrical Characteristics. Voltage Class (KV) : ≤ 1. Industry Standards. UL Flammability Rating : UL 94V-0. Operation/Application. Mechanical Resistance : Mechanical Protection & Insulation. Packaging Features. [See More]
- Chemical System: Two-Component Hydrocarbon Resin
- Features: Flame Retardant
from MacDermid Alpha Electronics Solutions
Flame-retardant two-part epoxy potting and encapsulating compound, offering a cost-effective solution for various applications. Product Overview. ER2188 General Purpose Epoxy Potting Compound is a two-part epoxy resin designed for general use in the electronics industry. It offers a cost-effective... [See More]
- Type: Thermally Conductive
- Cure / Technology: Two Component
- Chemical System: Epoxy
- Features: Flame Retardant
from CHT USA Inc.
CHT ’s TufGel 336 is a 2-part, tough, black silicone gel designed for electronic potting applications to provide protection from moisture, vibration and thermal or mechanical shock. TufGel 336 can also function as a contrast enhancement material in LED applications. TufGel 336 is also flame... [See More]
- Form / Function: Gel
- Cure / Technology: Two Component ; Addition
- Chemical System: Silicone
- Features: Flame Retardant
from RS Components, Ltd.
UR5097 Black GP PU Resin Pack, 250g [See More]
- Type: Thermally Conductive
- Chemical System: Polyurethane; PUR
- Form / Function: Pack
- Features: Flame Retardant
from DigiKey
TRANSFER ADHESIVE FOR DISPLAY WI [See More]
- Features: Flame Retardant
from Master Bond, Inc.
EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]
- Type: High Dielectric; Thermally Conductive
- Chemical System: Epoxy
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
- Composition: Unfilled
from Dymax
High-Performance Conformal Coating with Secondary Moisture Cure. Dual-cure 9483-Z conformal coating is free of Trimethylbenzoyl Diphenylphosphine Oxide (TPO). It cures tack-free upon exposure to UV/Visible light and then with ambient moisture over time, on PCBs where shadow areas are present. The... [See More]
- Form / Function: Liquid; Encapsulant or Conformal Coating
- Cure / Technology: UV or Radiation Cured; Reactive or Moisture Cured
- Chemical System: Acrylated Urethane
- Features: Flame Retardant; UL Rating
from TE Connectivity
Body Features. Primary Product Color : Brown. Electrical Characteristics. Voltage Class (KV) : ≤ 1. Industry Standards. UL Flammability Rating : UL 94V-0. Operation/Application. Mechanical Resistance : Mechanical Protection & Insulation. Packaging Features. [See More]
- Chemical System: Polyurethane; Two-Part Polyurethane
- Features: Flame Retardant
from CHT USA Inc.
CHT's QSil 223 is a 2-part, platinum cure, optically clear silicone encapsulant and is designed for optical applications. It features a convenient 1:1 mix ratio by weight and its low viscosity profile enables excellent flow around components and is ideal for potting complex parts. The chemical... [See More]
- Type: High Dielectric; Optical
- Features: Flame Retardant; UL Rating
- Cure / Technology: Two Component ; Addition
- Industry: Automotive; Electronics; OEM or Industrial
from RS Components, Ltd.
Blk generalpurpose epoxy compound,1000gm [See More]
- Form / Function: Pack
- Features: Flame Retardant
- Chemical System: Epoxy; Epoxy
- Thermal Conductivity: 0.4500
from DigiKey
POTTING COMPOUND FLAME RETARDT [See More]
- Features: Flame Retardant
from Master Bond, Inc.
Featuring superb electrical insulation properties, MasterSil 156 is a two component, moderate viscosity silicone system for high performance potting, encapsulation and sealing. It combines high temperature resistance, flexibility, low shrinkage upon cure and thermal conductivity exceeding 8-9 BTU... [See More]
- Type: High Dielectric; Thermally Conductive
- Chemical System: Silicone
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid
- Composition: Unfilled
from CHT USA Inc.
CHT's QSil 563 is a 2-part, platinum cure, 100% silicone solids elastomer designed for electronic potting and encapsulation applications. QSil 562 offers a hard, low modulus material that is readily repairable. QSil 563 is thermally conductive to aid in efficient heat dissipation. This silicone... [See More]
- Type: Thermally Conductive
- Features: Flame Retardant; UL Rating
- Cure / Technology: Two Component ; Addition
- Industry: Automotive; Electronics
from RS Components, Ltd.
RS PRO Black Epoxy Potting Compound - 1K [See More]
- Form / Function: Pack
- Features: Flame Retardant
- Chemical System: Epoxy; Epoxy
- Use Temperature: 248
from DigiKey
FLAME RETARDENT EPOXY [See More]
- Features: Flame Retardant
from Master Bond, Inc.
Master Bond EP93AOFR is a two component flame retardant epoxy system for bonding, sealing, coating and potting. [See More]
- Type: High Dielectric; Thermally Conductive
- Chemical System: Epoxy
- Form / Function: Liquid; Encapsulant or Conformal Coating; Die Bonding Adhesives
- Composition: Unfilled
from CHT USA Inc.
CHT's SE3000 is a 2-part, platinum cure silicone elastomer designed for electronic potting and encapsulation applications. It offers good prtection against chemicals, environmental contamination, mechanical shock, vibration and impact damage. SE3000 can be used in applications where low flammability... [See More]
- Type: Thermally Conductive
- Features: Flame Retardant; UL Rating
- Cure / Technology: Two Component ; Addition
- Industry: Electronics
from RS Components, Ltd.
RS PRO Black Epoxy Potting Compound - 10 [See More]
- Form / Function: Pack
- Features: Flame Retardant
- Chemical System: Epoxy; Epoxy
- Thermal Conductivity: 0.4500
from DigiKey
STYCAST US 2350 50 ML CTG [See More]
- Features: Flame Retardant
from Master Bond, Inc.
Formulated for specialty aviation applications, EP90FR-V is a two component epoxy system meeting FAR standard 14 CFR 25.853(a) for flame retardancy. The most noteworthy applications include interior panels, door frame lining and floor/door assemblies. Since it is a superior electrical insulator, it... [See More]
- Type: High Dielectric; Thermal Insulation
- Chemical System: Epoxy
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid
- Composition: Unfilled
from CHT USA Inc.
CHT's QSil 553 is a 2-part, platinum cure, silicone potting compound and encapsulant designed to protect electronic components from harsh environmental conditions and shock and vibration. It features a low viscosity for convenient dispensing and will easily flow throughout components. Because of its... [See More]
- Type: Thermally Conductive
- Features: Flame Retardant; UL Rating
- Cure / Technology: Two Component ; Addition
- Industry: Automotive; Electronics; OEM or Industrial
from RS Components, Ltd.
RS PRO Black Epoxy Potting Compound - 25 [See More]
- Form / Function: Pack
- Features: Flame Retardant
- Chemical System: Epoxy; Epoxy
- Thermal Conductivity: 0.4500
from Master Bond, Inc.
Featuring a non-halogenated filler, EP21FRNS-2 is a two component, room temperature curing epoxy offering low smoke generation for potting, encapsulating and casting applications. As per the UL 94V-0 specification, this system is serviceable over the wide temperature range of -60 °F to 200... [See More]
- Type: High Dielectric; Thermal Insulation
- Chemical System: Epoxy
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid
- Composition: Filled
from RS Components, Ltd.
RS PRO Black Epoxy Potting Compound - 50 [See More]
- Form / Function: Pack
- Features: Flame Retardant
- Chemical System: Epoxy; Epoxy
- Thermal Conductivity: 0.4500
from Master Bond, Inc.
Master Bond EP21AC is a two part epoxy with a non-halogenated filler that is formulated for applications where arc resistance and flame retardancy are required. [See More]
- Type: High Dielectric
- Chemical System: Epoxy
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
- Composition: Filled
from RS Components, Ltd.
RS PRO Black Epoxy Potting Compound - 50 [See More]
- Form / Function: Pack
- Features: Flame Retardant
- Chemical System: Epoxy; Epoxy
- Thermal Conductivity: 0.4500
from Wacker Chemical Corp.
WACKER SilGel ® 612 A/B is a pourable, additioncuring, RTV-2 silicone rubber that vulcanizes at room temperature to a very soft silicone gel. Special features. two-part, 1 : 1 mixing ratio. low viscosity. rapid heat cure. very low hardness (silicone gel). crystal clear. pronounced inherent tack. [See More]
- Type: Optical
- Chemical System: Silicone; Elastomeric
- Form / Function: Liquid
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from ACCRAbond, Inc.
CONAPOXY ® FR-1610 with CONACURE ® EA-039 is a high performance flexible epoxy potting and encapsulating system. Flexibility has been built into the cured compound without degradation of electrical properties at elevated temperatures. It cures with minimum strain on potted components; and... [See More]
- Chemical System: Epoxy
- Features: Flame Retardant
- Cure / Technology: Two Component
from Techsil Limited
MG Chemicals 834ATH Flame Retardant Epoxy is a economical, electronic-grade, self-extinguishing, flame retardant epoxy that provides excellent physical, chemical and electrical protection with a degree of thermal conductivity. Designed for encapsulating and potting, this two-part epoxy protects... [See More]
- Chemical System: Epoxy
- Industry: Electronics
- Features: Flame Retardant
from Epoxies Etc...
20-3205 is a two part room temperature curing epoxy system. It provides a low mixed viscosity and excellent electrical insulation properties. [See More]
- Type: High Dielectric
- Chemical System: Epoxy
- Form / Function: Liquid
- Composition: Unfilled
from Hapco, Inc.
Flexible, 45, 65 and, 95 shore A hardness, potting and encapsulating systems. Flame retardant (FR), accelerated 3 minute (-3) gel time, and black or unpigmented versions are available. [See More]
- Type: High Dielectric
- Cure / Technology: Thermoset; Two Component
- Form / Function: Liquid
- Features: Flame Retardant
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Type: High Dielectric; Thermally Conductive
- Chemical System: Polyamide
- Form / Function: Pellets
- Cure / Technology: Thermoplastic / Hot Melt
from Protavic America, Inc.
The two component polyurethane compound described in this data sheet is specifically designed for the encapsulation by casting of completed circuit board. The cured material meets the flammability requirements of UL 94, V-O at thickness of 0.070 in. and greater (UL File Number E116296) and provides... [See More]
- Type: High Dielectric; Thermal Insulation
- Chemical System: Polyurethane
- Form / Function: Liquid; Encapsulant or Conformal Coating
- Composition: Filled
from Sauereisen, Inc.
Sauereisen Cement No. 31 is a white, porcelain-like cement that is widely used throughout industry in a variety of applications. including assembling, sealing, insulating and cementing of ceramics, porcelain, metal, and glass. [See More]
- Type: High Dielectric; Thermally Conductive
- Chemical System: Ceramic
- Form / Function: Powder; Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
- Composition: Unfilled
from Techsil Limited
MG 834FRB is a black, flame retardant potting and encapsulation compound that offers extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. Thanks to its low viscosity, MG 834 FRB is the ideal choice when applications require small gaps or... [See More]
- Chemical System: Epoxy
- Industry: Electronics
- Features: Flame Retardant
from Epoxies Etc...
The 50-2369FR Potting and Encapsulating Compound has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-2369 FR Urethane is listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low exotherm, and excellent electrical... [See More]
- Type: Thermally Conductive
- Chemical System: Polyurethane
- Form / Function: Gel
- Composition: Filled
from Hapco, Inc.
Flexible, high strength, 50 to 71 shore D hardness potting and encapsulating systems. Available in flame retardant (FR), 3 minute (-3) gel time, and in black or unpigmented. [See More]
- Type: High Dielectric
- Cure / Technology: Thermoset; Two Component
- Form / Function: Liquid
- Features: Flame Retardant
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Type: High Dielectric; Thermally Conductive
- Chemical System: Polyamide
- Form / Function: Pellets
- Cure / Technology: Thermoplastic / Hot Melt
from Protavic America, Inc.
PTS-46303 A/B ™ is a two-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include... [See More]
- Type: Electrically Conductive; Thermally Conductive
- Chemical System: Silicone
- Form / Function: Encapsulant or Conformal Coating; Gel; Die Bonding Adhesives
- Composition: Filled
from Techsil Limited
Techsil ® EP25485 is a low viscosity, thermally conductive flame retardant potting and encapsulating compound. The mixed system has a long usable life and may be hot or cold cured. The system exhibits a good surface finish, high electrical strength, high thermal conductivity and low cure... [See More]
- Type: Thermally Conductive
- Chemical System: Epoxy
- Form / Function: Liquid
- Cure / Technology: Two Component
from Epoxies Etc...
50-3150 FR has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-3150 FR Black Epoxy with Catalyst 190 and Catalyst 105 are listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low shrinkage, and outstanding insulation... [See More]
- Type: Thermally Conductive
- Chemical System: Epoxy
- Form / Function: Liquid
- Composition: Unfilled
from Hapco, Inc.
Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E products are flame... [See More]
- Type: High Dielectric; Thermally Conductive
- Cure / Technology: Thermoset; Two Component
- Form / Function: Liquid
- Features: Flame Retardant; UL Rating
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Type: High Dielectric; Thermally Conductive
- Chemical System: Polyamide
- Form / Function: Pellets
- Cure / Technology: Thermoplastic / Hot Melt
from Hapco, Inc.
DI-COAT R-4721 / DI-COAT R-4721 LV (lower viscosity). Shore 90 D, room temperature curing, medium to high thixotropic coating for dielectric insulating applications. DI-COAT R-4721 is ideal for use on vertical or sloping surfaces where flow or drain-off cannot be tolerated. DI-COAT R-4721 is easy to... [See More]
- Type: High Dielectric
- Cure / Technology: Thermoset; Two Component
- Form / Function: Liquid
- Features: Flame Retardant