Flame Retardant / UL 94V-0 Rated Encapsulants and Potting Compounds

ELAN-Cast® -- E 023 FR Black Resin / C 023 FR Hardener
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Type: High Dielectric
  • Chemical System: Epoxy
  • Form / Function: Liquid
  • Composition: Filled
B-Staged Epoxy Meets Airbus Standards for Flame Retardancy & Toxicity -- EP36FR
from Master Bond, Inc.

EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Composition: Unfilled
MG Chemicals Flame Retardant Potting Epoxy 375ml -- MGEP00013
from Techsil Limited

MG Chemicals 834ATH Flame Retardant Epoxy is a economical, electronic-grade, self-extinguishing, flame retardant epoxy that provides excellent physical, chemical and electrical protection with a degree of thermal conductivity. Designed for encapsulating and potting, this two-part epoxy protects... [See More]

  • Chemical System: Epoxy
  • Industry: Electronics
  • Features: Flame Retardant
Epoxy Meets Airbus Standards for Flame Retardancy, Smoke and Gas Emissions -- EP93FRHT
from Master Bond, Inc.

EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Composition: Unfilled
MG Chemicals FR Low Viscosity Potting Epoxy 375ml -- MGEP00016
from Techsil Limited

MG 834FRB is a black, flame retardant potting and encapsulation compound that offers extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. Thanks to its low viscosity, MG 834 FRB is the ideal choice when applications require small gaps or... [See More]

  • Chemical System: Epoxy
  • Industry: Electronics
  • Features: Flame Retardant
Thermally Conductive Flame Retardant Silicone -- MasterSil 156
from Master Bond, Inc.

Featuring superb electrical insulation properties, MasterSil 156 is a two component, moderate viscosity silicone system for high performance potting, encapsulation and sealing. It combines high temperature resistance, flexibility, low shrinkage upon cure and thermal conductivity exceeding 8-9 BTU... [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Silicone
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid
  • Composition: Unfilled
Techsil® EP25485 Black Flame Retardant Epoxy 5kg -- TESI19080
from Techsil Limited

Techsil ® EP25485 is a low viscosity, thermally conductive flame retardant potting and encapsulating compound. The mixed system has a long usable life and may be hot or cold cured. The system exhibits a good surface finish, high electrical strength, high thermal conductivity and low cure... [See More]

  • Type: Thermally Conductive
  • Chemical System: Epoxy
  • Form / Function: Liquid
  • Cure / Technology: Two Component  
Thermally Conductive, Flame Retardant Encapsulant Passes FAR 25.853(a) Test -- EP93AOFR
from Master Bond, Inc.

Master Bond EP93AOFR is a two component flame retardant epoxy system for bonding, sealing, coating and potting. [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
  • Form / Function: Liquid; Encapsulant or Conformal Coating; Die Bonding Adhesives
  • Composition: Unfilled
Two Component Flame Retardant FAR Approved Epoxy Adhesive -- EP90FR-V
from Master Bond, Inc.

Formulated for specialty aviation applications, EP90FR-V is a two component epoxy system meeting FAR standard 14 CFR 25.853(a) for flame retardancy. The most noteworthy applications include interior panels, door frame lining and floor/door assemblies. Since it is a superior electrical insulator, it... [See More]

  • Type: High Dielectric; Thermal Insulation
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid
  • Composition: Unfilled
Two Component Room Temperature Curing Epoxy -- EP21FRNS-2
from Master Bond, Inc.

Featuring a non-halogenated filler, EP21FRNS-2 is a two component, room temperature curing epoxy offering low smoke generation for potting, encapsulating and casting applications. As per the UL 94V-0 specification, this system is serviceable over the wide temperature range of -60 °F to 200... [See More]

  • Type: High Dielectric; Thermal Insulation
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid
  • Composition: Filled
Di-Pak™ E-4500 Elastomeric Eletrical Insulating Compound -- E-4540
from Hapco, Inc.

Flexible, 45, 65 and, 95 shore A hardness, potting and encapsulating systems. Flame retardant (FR), accelerated 3 minute (-3) gel time, and black or unpigmented versions are available. [See More]

  • Type: High Dielectric
  • Cure / Technology: Thermoset; Two Component  
  • Form / Function: Liquid
  • Features: Flame Retardant
TECHNOMELT PA 638 -- 8802586492929
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Polyamide
  • Form / Function: Pellets
  • Cure / Technology: Thermoplastic / Hot Melt
Epoxy; Flame Retardant Epoxy Encapsulating & Potting Compound; Black; 0.8 Gal. -- 70125732 [833FRB-3L from MG Chemicals]
from Allied Electronics, Inc.

A two component self extinguishing epoxy compound. Provides insulation and protects sensitive components and circuits from: static discharge, impact, heat, shock, conductivity, abuse, vibration, moisture, fresh and salt water, chemicals and analysis. [See More]

  • Form / Function: Die Bonding Adhesives
  • Features: Flame Retardant
  • Chemical System: Epoxy
  • Use Temperature: 437
Conap™ Epoxy Potting & Casting Compound -- CONAPOXY® FR-1610
from ACCRAbond, Inc.

CONAPOXY ® FR-1610 with CONACURE ® EA-039 is a high performance flexible epoxy potting and encapsulating system. Flexibility has been built into the cured compound without degradation of electrical properties at elevated temperatures. It cures with minimum strain on potted components; and... [See More]

  • Chemical System: Epoxy
  • Features: Flame Retardant
  • Cure / Technology: Two Component  
Clear Urethane Cast/Adhesive -- PNU-46201
from Protavic America, Inc.

The two component polyurethane compound described in this data sheet is specifically designed for the encapsulation by casting of completed circuit board. The cured material meets the flammability requirements of UL 94, V-O at thickness of 0.070 in. and greater (UL File Number E116296) and provides... [See More]

  • Type: High Dielectric; Thermal Insulation
  • Chemical System: Polyurethane
  • Form / Function: Liquid; Encapsulant or Conformal Coating
  • Composition: Filled
Epoxy Potting Compound -- 20-3205
from Epoxies Etc...

20-3205 is a two part room temperature curing epoxy system. It provides a low mixed viscosity and excellent electrical insulation properties. [See More]

  • Type: High Dielectric
  • Chemical System: Epoxy
  • Form / Function: Liquid
  • Composition: Unfilled
Silicone Elastomer Gel Encapsulant And Potting Compound -- SilGel® 612 A/B
from Wacker Chemical Corp.

WACKER SilGel ® 612 A/B is a pourable, additioncuring, RTV-2 silicone rubber that vulcanizes at room temperature to a very soft silicone gel. Special features. two-part, 1 : 1 mixing ratio. low viscosity. rapid heat cure. very low hardness (silicone gel). crystal clear. pronounced inherent tack. [See More]

  • Type: Optical
  • Chemical System: Silicone; Elastomeric
  • Form / Function: Liquid
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Cement -- No. 31
from Sauereisen, Inc.

Sauereisen Cement No. 31 is a white, porcelain-like cement that is widely used throughout industry in a variety of applications. including assembling, sealing, insulating and cementing of ceramics, porcelain, metal, and glass. [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Ceramic
  • Form / Function: Powder; Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
  • Composition: Unfilled
Di-Pak™ E-4600 Elastomeric Eletrical Insulating Compound -- E-4650
from Hapco, Inc.

Flexible, high strength, 50 to 71 shore D hardness potting and encapsulating systems. Available in flame retardant (FR), 3 minute (-3) gel time, and in black or unpigmented. [See More]

  • Type: High Dielectric
  • Cure / Technology: Thermoset; Two Component  
  • Form / Function: Liquid
  • Features: Flame Retardant
TECHNOMELT PA 652 -- 8799377391617
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Polyamide
  • Form / Function: Pellets
  • Cure / Technology: Thermoplastic / Hot Melt
Epoxy; Flame Retardant Epoxy Encapsulating & Potting Compound; Black; 12 Oz. -- 70125731 [833FRB-375ML from MG Chemicals]
from Allied Electronics, Inc.

A two component self extinguishing epoxy compound. Provides insulation and protects sensitive components and circuits from: static discharge, impact, heat, shock, conductivity, abuse, vibration, moisture, fresh and salt water, chemicals and analysis. Copper Electroplating Solution and is ready to... [See More]

  • Form / Function: Die Bonding Adhesives
  • Features: Flame Retardant
  • Chemical System: Epoxy
  • Use Temperature: 437
Silicone Adhesive -- PTS-46303
from Protavic America, Inc.

PTS-46303 A/B ™ is a two-component silicone encapsulant designed for encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, thermal conductivity, and high temperature resistance are required. Possible applications include... [See More]

  • Type: Electrically Conductive; Thermally Conductive
  • Chemical System: Silicone
  • Form / Function: Encapsulant or Conformal Coating; Gel; Die Bonding Adhesives
  • Composition: Filled
Flame Retardant Polyurethane -- 50-2369 FR
from Epoxies Etc...

The 50-2369FR Potting and Encapsulating Compound has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-2369 FR Urethane is listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low exotherm, and excellent electrical... [See More]

  • Type: Thermally Conductive
  • Chemical System: Polyurethane
  • Form / Function: Gel
  • Composition: Filled
Di-Pak™ Elastomeric Eletrical Insulating Compound -- E-4501
from Hapco, Inc.

Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E products are flame... [See More]

  • Type: High Dielectric; Thermally Conductive
  • Cure / Technology: Thermoset; Two Component  
  • Form / Function: Liquid
  • Features: Flame Retardant; UL Rating
TECHNOMELT PA 668 -- 8805825445889
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Polyamide
  • Form / Function: Pellets
  • Cure / Technology: Thermoplastic / Hot Melt
Silicone; Potting and Encapsulating; White; 333 ml Cartridge -- 70125538 [TSE3941-333ML from MG Chemicals]
from Allied Electronics, Inc.

MG Chemicals offers a comprehensive portfolio of silicone solutions to help meet a broad array of handling and performance needs in electronic components and assemblies. Selection of the appropriate type of RTV depends upon the required manufacturing process, handling requirements, curing... [See More]

  • Chemical System: Silicone
  • Use Temperature: -67 to 392
  • Features: Flame Retardant
  • Thermal Conductivity: 0.8300
Flame Retardant Thermally Conductive -- 50-3150 FR
from Epoxies Etc...

50-3150 FR has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-3150 FR Black Epoxy with Catalyst 190 and Catalyst 105 are listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low shrinkage, and outstanding insulation... [See More]

  • Type: Thermally Conductive
  • Chemical System: Epoxy
  • Form / Function: Liquid
  • Composition: Unfilled
Di-Pak™ Rigid Eletrical Insulating Compound -- R-4242/4243
from Hapco, Inc.

DI-COAT R-4721 / DI-COAT R-4721 LV (lower viscosity). Shore 90 D, room temperature curing, medium to high thixotropic coating for dielectric insulating applications. DI-COAT R-4721 is ideal for use on vertical or sloping surfaces where flow or drain-off cannot be tolerated. DI-COAT R-4721 is easy to... [See More]

  • Type: High Dielectric
  • Cure / Technology: Thermoset; Two Component  
  • Form / Function: Liquid
  • Features: Flame Retardant