Impregnating Varnish (Dip, Trickle, Vacuum) Encapsulants and Potting Compounds

Pedigree® -- 70 VT RTC - MEKP-9
from ELANTAS PDG, Inc.

Room temperature cure resin for impregnation and potting of sand-filled transformers [See More]

  • Form / Function: Liquid; Impregnating Resin
  • Chemical System: Alkyd
  • Type: High Dielectric
  • Composition: Unfilled
High Temperature Resistant, Toughened Epoxy -- EP125
from Master Bond, Inc.

Master Bond Polymer System 125 is a two component toughened epoxy resin for prolonged service above 500 °F with truly outstanding chemical resistance. High strength bonds serviceable up to 600 °F can be obtained with this exceptionally thermally stable and chemically resistant epoxy resin... [See More]

  • Form / Function: Powder; Gap Filler, Foam in Place Gasket; Impregnating Resin; Die Bonding Adhesives
  • Chemical System: Epoxy
  • Type: High Dielectric; Thermal Insulation
  • Composition: Unfilled
Low Viscosity Structural Epoxy Adhesive System -- EP112
from Master Bond, Inc.

Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronic/ structural applications. The two components are combined in a convenient noncritical mix... [See More]

  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating; Impregnating Resin
  • Chemical System: Epoxy
  • Type: High Dielectric; Optical; Thermal Insulation
  • Composition: Unfilled
One Component, Storage Stable Epoxy -- EP19HT
from Master Bond, Inc.

Master Bond Polymer System EP19HT is a storage stable one component liquid epoxy resin system for durable, high performance adhesive/sealants, impregnants and liners. It features remarkably long shelf life and excellent storage characteristics at ambient temperatures yet cures readily at elevated... [See More]

  • Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Impregnating Resin; Die Bonding Adhesives
  • Chemical System: Epoxy
  • Type: High Dielectric
  • Composition: Unfilled
One Component, UV Curable Adhesive System -- UV10
from Master Bond, Inc.

Master Bond UV10 and UV10TK are one component UV curable modified epoxy compounds, ready for use as supplied, for high performance casting, coatings, sealing and bonding applications. UV10 is a low viscosity amber liquid at room temperature and UV10TK is a medium viscosity amber liquid at room... [See More]

  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating; Impregnating Resin
  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
  • Type: High Dielectric; Optical; Thermal Insulation
  • Features: Non-corrosive; Dissimilar Substrates
Solvent Resistant Adhesive Withstands Methylene Cholride, Alcohols and Fuels -- EP41S-5
from Master Bond, Inc.

EP41S-5 is chemically resistant and withstands acids, bases, alcohols, fuels and many solvents. This two part epoxy is widely used for bonding, sealing, coating, and encapsulating. It provides high physical strength properties and electrical insulation values. EP41S-5 offers convenient handling with... [See More]

  • Form / Function: Liquid; Encapsulant or Conformal Coating; Impregnating Resin
  • Chemical System: Epoxy
  • Type: High Dielectric; Thermally Conductive
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Two component, thermally conductive, electrically insulative, room temperature curing epoxy resin system -- EP39MAOHT
from Master Bond, Inc.

Master Bond EP39MAOHT is a two component, thermally conductive, electrically insulative epoxy for bonding, sealing, coating, potting and encapsulation. Its low exotherm makes it well suited for large castings and potting applications. It withstands rigorous thermal cycling, vibration and shock. [See More]

  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating; Impregnating Resin
  • Chemical System: Epoxy
  • Type: High Dielectric; Thermally Conductive
  • Composition: Unfilled
Two Part Epoxy For Bonding, Sealing, Potting And Impregnation -- Supreme 112
from Master Bond, Inc.

Master Bond Supreme 112 is a two part epoxy for bonding, sealing, potting, and impregnation applications with a high glass transition temperature of 190-195°C and very low viscosity. [See More]

  • Form / Function: Liquid; Impregnating Resin
  • Chemical System: Epoxy
  • Type: High Dielectric; Thermally Conductive
  • Composition: Unfilled
Ultra Low Viscosity Biocompatible Epoxy for Medical Electronic Applications -- EP62-1LPSPMed
from Master Bond, Inc.

Formulated for medical electronic applications, Master Bond EP62-1LPSPMed is a biocompatible two part epoxy that has a an ultra low viscosity. This makes it makes it ideal for use in underfill, impregnation and porosity sealing applications, while it also performs well in bonding, coating or... [See More]

  • Form / Function: Liquid; Encapsulant or Conformal Coating; Impregnating Resin
  • Chemical System: Epoxy
  • Type: High Dielectric; Thermally Conductive
  • Composition: Unfilled
Electric Resistor Cement -- Nos.78 and P-78
from Sauereisen, Inc.

Sauereisen Electric Resistor Cement No. 78 is an ideal electrical refractory cement for coating resistors, coils, electric heating elements, furnaces, and embedding resistance wire. It replaces. insulating varnish, enamel, mica, etc. The cement is also available in powder form known as Sauereisen... [See More]

  • Form / Function: Powder (optional feature); Liquid (optional feature); Encapsulant or Conformal Coating; Impregnating Resin; Die Bonding Adhesives
  • Chemical System: Ceramic
  • Type: High Dielectric; Thermally Conductive
  • Composition: Unfilled