EMI / RFI Shielding Material Encapsulants and Potting Compounds

Highly Flexible Two Part Epoxy -- EP21TDC-7
from Master Bond, Inc.

Master Bond Polymer System EP21TDC-7 is a two component highly flexible epoxy resin system for high performance bonding, sealing, and coating. It is formulated to cure at ambient temperatures or more quickly at elevated temperatures with an easy to use one to seven mix ratio by weight. The cured... [See More]

  • Type: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding
  • Chemical System: Epoxy; Polyurethane
  • Form / Function: Optional Premixed and Frozen; Gap Filler, Foam in Place Gasket; Liquid
  • Composition: Filled
Low Outgassing, Optically Clear Two Component Epoxy -- EP29LPSP
from Master Bond, Inc.

Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. Not only is EP29LPSP able to function as an adhesive, sealant and protective coating at temperatures as low as 4K, but it is... [See More]

  • Type: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Composition: Unfilled
Low Viscosity Heat Resistant Epoxy System -- EP34CA
from Master Bond, Inc.

Master Bond EP34CA is a low viscosity, polyfunctional, heat resistant epoxy resin designed for use in high performance composite structures, potting and casting applications. When used in conjunction with various hardeners, EP34CA produces a low viscosity 100% reactive system which is particularly... [See More]

  • Type: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding
  • Chemical System: Epoxy
  • Form / Function: Die Bonding Adhesives
  • Composition: Unfilled
NASA Low Outgassing Approved, One Component Epoxy -- EP17HT-LO
from Master Bond, Inc.

Passing ASTM E595 testing for NASA low outgassing, EP17HT-LO is widely used in a variety of applications in the aerospace, oil/chemical processing, optical, opto-electronic and specialty OEM industries. This single component, thermally stable system has a glass transition temperature of 225 °C. [See More]

  • Type: High Dielectric; EMI/RFI Shielding; Optical; Thermal Insulation
  • Composition: Unfilled
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
Nickel Filled Electrically Conductive Epoxy System -- EP76M
from Master Bond, Inc.

Master Bond Polymer System EP76M is a two component, nickel filled, electrically conductive adhesive for high performance bonding, sealing, and coating formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part nickel conductive systems, EP76M... [See More]

  • Type: Anti-static, ESD; Electrically Conductive; EMI/RFI Shielding; Thermally Conductive
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Die Bonding Adhesives
  • Composition: Filled
One Component Liquid Epoxy Resin EP36CLV -- EP36CLV
from Master Bond, Inc.

Master Bond EP36CLV is a unique one component, high performance epoxy for bonding, sealing, potting and coating featuring electrical insulation, high temperature resistance and exceptionally low viscosity. It varies appreciably from other heat resistant epoxies in that it has far more toughness and... [See More]

  • Type: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding
  • Chemical System: Epoxy
  • Form / Function: Semi-Solid; Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Die Bonding Adhesives
  • Composition: Unfilled
One Component, High Temperature Resistant Epoxy -- EP36
from Master Bond, Inc.

Master Bond Polymer System EP36 is a unique one component high performance toughened epoxy system for electrical potting, casting, encapsulation, baked coatings and adhesive applications. It features an outstanding combination of properties including high temperature stability up to 500 °F,... [See More]

  • Type: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
  • Composition: Unfilled
Room Temperature Curing, Two Component Epoxy System -- EP34
from Master Bond, Inc.

Master Bond Polymer System EP34 is a unique room temperature curing two component epoxy compound for high temperature potting and encapsulating applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non critical mix ratio (part A/part B: 100/70). [See More]

  • Type: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding
  • Chemical System: Epoxy
  • Form / Function: Optional Premixed and Frozen; Gap Filler, Foam in Place Gasket; Die Bonding Adhesives
  • Composition: Unfilled
Conformal EMI Shielding Material -- LOCTITE ABLESTIK EMI 8660S
from Henkel Corporation - Electronics

With the increasing proliferation of wireless devices, designers are challenged with various electromagnetic waves from multiple sources radiating at the same spectrum of frequencies resulting in electromagnetic interference(EMI). Radio-frequency(RF) emitting devices require effective isolation to... [See More]

  • Type: Electrically Conductive; EMI/RFI Shielding
  • Cure / Technology: Single Component
  • Form / Function: Liquid; Encapsulant or Conformal Coating
  • Industry: Electronics