Thermal / Heat Insulating Encapsulants and Potting Compounds Datasheets
from Epoxy Technology
EPO-TEK ® OD1001 is a thermally and electrically insulating epoxy designed for low stress semiconductor and electronics packaging. Low Tg, several weeks of pot life and low modulus are a few of it traits. It is particularly suitable for bonding, sealing and potting ferrite cores in power device... [See More]
- Type: High Dielectric; Optical; Thermal Insulation
- Chemical System: Epoxy
- Form / Function: Die Bonding Adhesives
- Cure / Technology: Thermoset; Single Component
from Master Bond, Inc.
Master Bond LED403Med is a very special, one part LED curable system that can be used as an adhesive, sealant, coating and encapsulation system. It requires no mixing and has excellent dimensional stability, electrical insulation and chemical resistance. LED403Med withstands sterilization, including... [See More]
- Type: High Dielectric; Optical; Thermal Insulation
- Composition: Unfilled
- Form / Function: Gap Filler, Foam in Place Gasket
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; Reactive or Moisture Cured
from Epoxies Etc...
10-3009 is a low viscosity epoxy adhesive and potting compound. It is easy to use and allows the end user to adjust the flexibility of the cured epoxy. This product offers a good combination of peel and tensile strength. 10-3009 provides electrical insulation and outstanding adhesion. [See More]
- Type: High Dielectric; Thermal Insulation
- Chemical System: Epoxy
- Form / Function: Liquid
- Composition: Unfilled
from Hernon Manufacturing, Inc.
Hernon ® Polycure 744 is a single component, 100% solid system formulated for use on printed circuit boards. This coating can be cured in seconds by high intensity UV light. Low heat (10 minutes at 250 ºF) can be used for curing the shaded area. The component may be removed for repair using... [See More]
- Type: High Dielectric; Optical; Thermal Insulation
- Chemical System: Acrylic
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
- Composition: Unfilled
from ITW Polymer Technologies - Insulcast Division
INSULCAST 985 FR is a semi-flexible flame retardant epoxy compound displaying the best thermal shock resistance currently available in an epoxy compound, as well as excellent electrical properties over a wide range of temperatures. INSULCAST 985 FR makes use of the latest polymer and filler... [See More]
- Type: High Dielectric; Thermal Insulation
- Chemical System: Epoxy
- Form / Function: Encapsulant or Conformal Coating
- Composition: Unfilled
from Protavic America, Inc.
PROTAVIC ® PNS 20100 is a low viscosity, optically clear silicon resin designed for LED potting, encapsulation and sealing. PROTAVIC ® PNS 20100 presents great heat resistance and non-yellowing. Its specific reactivity combines both latency at room temperature and fast curing cycle. [See More]
- Type: Thermal Insulation
- Chemical System: Silicone
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating; Die Bonding Adhesives
- Composition: Unfilled
