Epoxy (EP) Encapsulants and Potting Compounds

ELAN-Cast® -- E 2154 Black Resin / C 2154 Hardener
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Chemical System: Epoxy
  • Form / Function: Liquid
  • Type: High Dielectric
  • Composition: Filled
Capillary Underfill -- ALPHA® HiTech™ CU11-3127
from MacDermid Alpha Electronics Solutions

ALPHA ® HiTech ™ CU11-3127 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards. The high Tg, low CTE properties of ALPHA ® HiTech ™ CU11-3127 protects the solder joints from mechanical stresses such as drop... [See More]

  • Chemical System: Epoxy
  • Industry: Electronics; Semiconductors, IC's
  • Cure / Technology: Single Component
  • CTE: 16 to 111
3M Scotch-Weld DP270 Epoxy Potting Compound Black 48.5 mL Duo-Pak Cartridge -- DP270 BLACK 48.5ML [7100148745 from 3M]
from Ellsworth Adhesives

3M Scotch-Weld Epoxy Potting Compound/Adhesive DP270 Black is a two component, epoxy resin system that is used for sealing, encapsulating, and potting electronic and heat sensitive components. It offers low viscosity, long handling times, noncorrosive to copper, good electrical properties, and... [See More]

  • Chemical System: Epoxy
  • Thermal Conductivity: 0.1770
  • Cure / Technology: Two Component  
  • Dielectric Strength: 850
Biocompatible, Spectrally Transparent Epoxy -- EPO-TEK® MED-301
from Epoxy Technology

EPO-TEK ® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries.  Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market... [See More]

  • Chemical System: Epoxy
  • Form / Function: Liquid; Glob Top, Daub, Doming or Overfill
  • Type: Optical
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
MG Chemicals Black Encapsulating/Potting Epoxy Kit -- MGEP00009
from Techsil Limited

MG Chemicals 832B is a black electronic grade epoxy designed for encapsulating and potting. This compound is simple mix, easy to use and protects against static discharges, shocks, vibrations, and mechanical impacts. It insulates against heat and conductivity as well as being extremely resistant to... [See More]

  • Chemical System: Epoxy
  • Industry: Electronics
B-Staged Epoxy Meets Airbus Standards for Flame Retardancy & Toxicity -- EP36FR
from Master Bond, Inc.

EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]

  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Type: High Dielectric; Thermally Conductive
  • Composition: Unfilled
Edgebond -- ALPHA HiTech
from MacDermid Alpha Electronics Solutions

ALPHA HiTech Edgebond is a one component, heat curable material. It is an epoxy material to be dispensed on the corners or edges of the BGA. Upon deposition, minimal flow will take place beneath the BGA, to minimize contact with outer solder balls. The cured edgebond will help to strengthen the... [See More]

  • Chemical System: Epoxy
  • Cure / Technology: Single Component
  • Form / Function: Liquid; Glob Top, Daub, Doming or Overfill
  • Industry: Electronics; Semiconductors, IC's
3M Scotch-Weld DP270 Epoxy Potting Compound Clear 48.5 mL Duo-Pak Cartridge -- DP270 CLEAR 48.5ML [7100148730 from 3M]
from Ellsworth Adhesives

3M Scotch-Weld Epoxy Potting Compound/Adhesive DP270 Clear is a two component, epoxy resin system that is used for sealing, encapsulating, and potting electronic and heat sensitive components. It offers low viscosity, long handling times, noncorrosive to copper, good electrical properties, and... [See More]

  • Chemical System: Epoxy
  • Thermal Conductivity: 0.1770
  • Cure / Technology: Two Component  
  • Dielectric Strength: 850
MG Chemicals Flame Retardant Potting Epoxy 375ml -- MGEP00013
from Techsil Limited

MG Chemicals 834ATH Flame Retardant Epoxy is a economical, electronic-grade, self-extinguishing, flame retardant epoxy that provides excellent physical, chemical and electrical protection with a degree of thermal conductivity. Designed for encapsulating and potting, this two-part epoxy protects... [See More]

  • Chemical System: Epoxy
  • Industry: Electronics
  • Features: Flame Retardant
Electrically Conductive Die Attach Adhesive Has Very High Thermal Conductivity -- EP3HTSDA-1
from Master Bond, Inc.

EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]

  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
  • Type: High Dielectric; Thermally Conductive
  • Composition: Unfilled
Underfills -- ALPHA HiTech
from MacDermid Alpha Electronics Solutions

ALPHA HiTech Underfills are dispensed along edges of BGA, CSP, or flip chip devices, flowing to perfectly fill the device footprint. The one-component, halogen-free epoxies provide superior drop-shock, impact bend, and thermal cycle test performance for the most demanding component designs.Through... [See More]

  • Chemical System: Epoxy
  • Cure / Technology: Single Component
  • Form / Function: Liquid
  • Industry: Electronics; Semiconductors, IC's
ELANTAS PDG CONACURE EA-028 Epoxy Encapsulant Catalyst 1 gal Jug -- EA-028 GAL [NULL from ELANTAS PDG, Inc.]
from Ellsworth Adhesives

ELANTAS PDG CONACURE EA-028 Curative Clear Amber cures at room temperature, has a 30 minute handling time, little flexibility, and low viscosity. It offers low exotherm, electrical properties, low shrinkage, and thermal shock resistance. 1 gal Jug. [See More]

  • Chemical System: Epoxy
MG Chemicals FR Low Viscosity Potting Epoxy 375ml -- MGEP00016
from Techsil Limited

MG 834FRB is a black, flame retardant potting and encapsulation compound that offers extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. Thanks to its low viscosity, MG 834 FRB is the ideal choice when applications require small gaps or... [See More]

  • Chemical System: Epoxy
  • Industry: Electronics
  • Features: Flame Retardant
Electrically Conductive Die Attach Epoxy With High Glass Transition Temperature -- EP17HTS-DA
from Master Bond, Inc.

Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]

  • Chemical System: Polyphenylene Sulfide; Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
  • Type: Electrically Conductive; Thermally Conductive
  • Composition: Filled
ELANTAS PDG CONACURE EA-87 Epoxy Encapsulant Catalyst 1 gal Jug -- EA-87 GAL [124939 from ELANTAS PDG, Inc.]
from Ellsworth Adhesives

ELANTAS PDG CONACURE EA-87 Curative Light Amber is heating curing, has a 90 minute handling time, little flexibility, and low viscosity. It offers low exotherm, electrical properties, low shrinkage, and is more cost efficient than EA-87. 1 gal Jug. [See More]

  • Chemical System: Epoxy
MG Chemicals Thermally Conductive Epoxy 450ml -- MGEP00012
from Techsil Limited

MG Chemicals 832TC is a thermally conductive encapsulating and potting epoxy compound designed for use with electronics. It uses a high-purity aluminum oxide to provide excellent thermal conductivity at reasonable costs. This black, two-part epoxy provides superior shock insulation and impact... [See More]

  • Chemical System: Epoxy
  • Industry: Electronics
Epoxy Features Very Low Coefficient of Thermal Expansion -- EP30LTE-2
from Master Bond, Inc.

Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating. [See More]

  • Chemical System: Epoxy
  • Form / Function: Liquid; Encapsulant or Conformal Coating
  • Type: High Dielectric; Thermal Insulation
  • Composition: Unfilled
ELANTAS PDG CONACURE EA-87 Epoxy Encapsulant Catalyst 5 gal Pail -- EA-87 5-GAL [NULL from ELANTAS PDG, Inc.]
from Ellsworth Adhesives

ELANTAS PDG CONACURE EA-87 Curative Light Amber is heating curing, has a 90 minute handling time, little flexibility, and low viscosity. It offers low exotherm, electrical properties, low shrinkage, and is more cost efficient than EA-87. 5 gal Pail. [See More]

  • Chemical System: Epoxy
MG Chemicals Translucent Potting Epoxy 450ml -- MGEP00015
from Techsil Limited

MG Chemicals 832C is a translucent electronic grade epoxy designed for encapsulating and potting. This compound is simple mix, easy to use and protects against static discharges, shocks, vibrations, and mechanical impacts. It insulates against heat and conductivity as well as being extremely... [See More]

  • Chemical System: Epoxy
  • Industry: Electronics
Epoxy Meets Airbus Standards for Flame Retardancy, Smoke and Gas Emissions -- EP93FRHT
from Master Bond, Inc.

EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]

  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Type: High Dielectric; Thermally Conductive
  • Composition: Unfilled
ELANTAS PDG CONAPOXY FR-1047 Epoxy Encapsulant Black 5 gal Pail -- FR-1047 BLACK 5-GAL [125525 from ELANTAS PDG, Inc.]
from Ellsworth Adhesives

ELANTAS PDG CONAPOXY FR-1047 Epoxy Black is a potting and casting system that has good electric properties, low exotherm, and thermal shock resistance. It is non-abrasives, cost efficient, and a flame retardant. 5 gal Pail. [See More]

  • Chemical System: Epoxy
  • Thermal Conductivity: 0.0015 to 0.0018
  • Cure / Technology: Two Component  
  • Tensile (Break): 5800 to 7600
MG Chemicals Translucent Potting Epoxy Kit 375ml -- MGEP00010
from Techsil Limited

MG Chemicals 832C is a translucent electronic grade epoxy designed for encapsulating and potting. This compound is simple mix, easy to use and protects against static discharges, shocks, vibrations, and mechanical impacts. It insulates against heat and conductivity as well as being extremely... [See More]

  • Chemical System: Epoxy
  • Industry: Electronics
Epoxy with High Elongation Passes ISO 10993-5 Certification for Cytotoxicity -- EP40Med
from Master Bond, Inc.

EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]

  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Type: High Dielectric; Thermally Conductive
  • Composition: Unfilled
ELANTAS PDG CONAPOXY FR-1080 Epoxy Encapsulant 1 gal Kit -- FR-1080 GAL KIT [NULL from ELANTAS PDG, Inc.]
from Ellsworth Adhesives

ELANTAS PDG CONAPOXY FR-1080 Epoxy is a two component, potting system that meets Class H (180 °C) requirements. 1 gal Kit. [See More]

  • Chemical System: Epoxy
  • Tensile (Break): 8200
  • Cure / Technology: Two Component  
  • Dielectric Strength: 0.0152
MG Chemicals Water Clear Epoxy 375ml -- MGEP00017
from Techsil Limited

MG 832WC is a general purpose, water clear potting and encapsulation compound which offers extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. This product is designed for applications where high clarity is required; it will not yellow when... [See More]

  • Chemical System: Epoxy
  • Industry: Electronics
Fast Curing, Optically Clear, Two Part Epoxy -- EP39-2
from Master Bond, Inc.

Master Bond Polymer System EP39-2 is a fast curing, low viscosity, optically clear two component epoxy system for high performance bonding, sealing, coating and casting. It is 100% reactive and does not contain any diluents, solvents or other volatiles. The mix ratio is a convenient 2 to 1 by... [See More]

  • Chemical System: Epoxy
  • Composition: Unfilled
  • Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Die Bonding Adhesives
  • Cure / Technology: Thermoset; Two Component  
ELANTAS PDG CONAPOXY FR-1810 Epoxy Encapsulant Black 1 gal Kit -- FR-1810 GAL KIT [NULL from ELANTAS PDG, Inc.]
from Ellsworth Adhesives

ELANTAS PDG CONAPOXY FR-1810 Epoxy is a two component, potting and casting system that is used as a non-abrasive filler for machine equipment. It has flexibility, low exotherm, long pot life, and is a flame retardant. 1 gal Kit. [See More]

  • Chemical System: Epoxy
  • Thermal Conductivity: 0.7025
  • Cure / Technology: Two Component  
  • Tensile (Break): 1325
Techsil® EP25485 Black Flame Retardant Epoxy 5kg -- TESI19080
from Techsil Limited

Techsil ® EP25485 is a low viscosity, thermally conductive flame retardant potting and encapsulating compound. The mixed system has a long usable life and may be hot or cold cured. The system exhibits a good surface finish, high electrical strength, high thermal conductivity and low cure... [See More]

  • Chemical System: Epoxy
  • Form / Function: Liquid
  • Type: Thermally Conductive
  • Cure / Technology: Two Component  
High Temperature Resistant Epoxy Compound -- EP45HT
from Master Bond, Inc.

Master Bond Polymer System EP45HT is a two component epoxy system for high performance structural bonding and casting. It is suitable for applications where long term exposure to temperatures from -80 °F to +500 °F is required. lt is 100% reactive and does not contain any solvents or... [See More]

  • Chemical System: Epoxy
  • Composition: Unfilled
  • Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Die Bonding Adhesives
  • Cure / Technology: Thermoset; Two Component  
ELANTAS PDG CONAPOXY RN-1000 Epoxy Encapsulant Resin 1 gal Can -- RN-1000 GL [NULL from ELANTAS PDG, Inc.]
from Ellsworth Adhesives

ELANTAS PDG CONAPOXY RN-1000 Epoxy Resin is a potting and casting resin that when paired with CONACURE EA-02, EA-028, or EA-87 offers excellent electrical properties, thermal shock resistance, low exotherm, and low shrinkage. 1 gal Can. [See More]

  • Chemical System: Epoxy
  • Thermal Conductivity: 4.50E-4
  • Cure / Technology: Two Component  
  • Tensile (Break): 4000 to 10000
ThreeBond TB2210 Black Electrical Epoxy Resin 1kg -- TBSI19014
from Techsil Limited

ThreeBond TB2210 is a black epoxy resin which cures to a tough 92 Shore D Hardness. The fast curing nature of this epoxy resin allows for considerable energy savings and facilitates the automation of assembly works thus enabling an integration of On-Line manufacturing process without requiring... [See More]

  • Chemical System: Epoxy
  • Cure / Technology: Thermoset
High Temperature Resistant, One Component Epoxy System -- EP13
from Master Bond, Inc.

Master Bond Polymer System EP13 is a one component heat curing epoxy featuring high shear strength and very high temperature resistance. This one component system is formulated to cure at temperatures from 300 °F to 350 °F for 60-90 minutes. Upon cure, EP13 readily attains tensile shear... [See More]

  • Chemical System: Epoxy
  • Form / Function: Encapsulant or Conformal Coating; Die Bonding Adhesives
  • Type: High Dielectric
  • Composition: Unfilled
Henkel Loctite EA E-60NC Epoxy Potting Compound Black 200 mL Cartridge -- 237114 [NULL from Henkel Corporation - Industrial]
from Ellsworth Adhesives

Henkel Loctite EA E-60NC is a low viscosity, electrically non-corrosive epoxy adhesive potting compound. Once cured it provides excellent environmental and chemical resistance, and acts as an electrical insulator. 200 mL Cartridge. [See More]

  • Chemical System: Epoxy
  • Tensile (Break): 6800
  • Cure / Technology: Two Component  
  • Elongation: 8.0
High Temperature Resistant, Toughened Epoxy -- EP125
from Master Bond, Inc.

Master Bond Polymer System 125 is a two component toughened epoxy resin for prolonged service above 500 °F with truly outstanding chemical resistance. High strength bonds serviceable up to 600 °F can be obtained with this exceptionally thermally stable and chemically resistant epoxy resin... [See More]

  • Chemical System: Epoxy
  • Form / Function: Powder; Gap Filler, Foam in Place Gasket; Impregnating Resin; Die Bonding Adhesives
  • Type: High Dielectric; Thermal Insulation
  • Composition: Unfilled
Henkel Loctite EA E-60NC Epoxy Potting Compound Black 400 mL Cartridge -- 237115 [NULL from Henkel Corporation - Industrial]
from Ellsworth Adhesives

Henkel Loctite EA E-60NC is a low viscosity, electrically non-corrosive epoxy adhesive potting compound. Once cured it provides excellent environmental and chemical resistance, and acts as an electrical insulator. 400 mL Cartridge. [See More]

  • Chemical System: Epoxy
  • Tensile (Break): 6800
  • Cure / Technology: Two Component  
  • Elongation: 8.0
Low Outgassing, Optically Clear Two Component Epoxy -- EP29LPSP
from Master Bond, Inc.

Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. Not only is EP29LPSP able to function as an adhesive, sealant and protective coating at temperatures as low as 4K, but it is... [See More]

  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Type: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding
  • Composition: Unfilled
Henkel Loctite EA E-60NC Epoxy Potting Compound Black 50 mL Cartridge -- 237113 [NULL from Henkel Corporation - Industrial]
from Ellsworth Adhesives

Henkel Loctite EA E-60NC is a low viscosity, electrically non-corrosive epoxy adhesive potting compound. Once cured it provides excellent environmental and chemical resistance, and acts as an electrical insulator. 50 mL Cartridge. [See More]

  • Chemical System: Epoxy
  • Tensile (Break): 6800
  • Cure / Technology: Two Component  
  • Elongation: 8.0
Low Viscosity Structural Epoxy Adhesive System -- EP112
from Master Bond, Inc.

Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronic/ structural applications. The two components are combined in a convenient noncritical mix... [See More]

  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating; Impregnating Resin
  • Type: High Dielectric; Optical; Thermal Insulation
  • Composition: Unfilled
Henkel Loctite EC 210 Epoxy Conformal Coating Part A Black 1 gal Pail -- EC-210 PART A GALLON [1188744 from Henkel Corporation - Industrial]
from Ellsworth Adhesives

Henkel Loctite EC 210 Black is a two component, formerly Emerson and Cuming ECCOCOAT, oxide filled, epoxy adhesive liquid that is used for coating electrical components, plastics, metal, brick, concrete, and wood. It offers outstanding resistance to moisture, chemical attack, and weathering. It can... [See More]

  • Chemical System: Epoxy
  • Cure / Technology: Two Component  
  • Form / Function: Encapsulant or Conformal Coating
  • Dielectric Strength: 420
Low Viscosity, Electrically Insulating Epoxy Features Excellent Optical Clarity -- EP30LP-2
from Master Bond, Inc.

Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. [See More]

  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Type: High Dielectric; Optical; Thermally Conductive
  • Composition: Unfilled
Henkel Loctite EC 210 Epoxy Conformal Coating Part B Clear 1 gal Pail -- EC-210 PART B GALLON [NULL from Henkel Corporation - Industrial]
from Ellsworth Adhesives

Henkel Loctite EC 210 Clear is a two component, formerly Emerson and Cuming ECCOCOAT, is a two component, oxide filled, epoxy adhesive liquid that is used for coating electrical components, plastics, metal, brick, concrete, and wood. It offers outstanding resistance to moisture, chemical attack, and... [See More]

  • Chemical System: Epoxy
  • Cure / Technology: Two Component  
  • Form / Function: Encapsulant or Conformal Coating
  • Dielectric Strength: 420
Low Viscosity, Fast Curing, Two Component Epoxy -- EP38
from Master Bond, Inc.

Master Bond Polymer System EP38 is a fast curing, low viscosity, optically clear two component epoxy system for high performance coating, bonding and sealing. It is 100% reactive and does not contain any volatiles. The mix ratio is a convenient 3 to 1 by weight. EP38 is very fast curing. Coatings as... [See More]

  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Die Bonding Adhesives
  • Type: High Dielectric
  • Composition: Unfilled
Henkel Loctite ECCOBOND E 1216M Epoxy Encapsulant Black 30 cc Syringe -- E1216M 30CC [1636425 from Henkel Corporation - Industrial]
from Ellsworth Adhesives

Henkel Loctite ECCOBOND E 1216M is an epoxy, fast-flowing capillary underfill encapsulant that is used for high volume assemblies. It fully cures in a single reflow cycle and provides excellent stability, adhesion, and strength. 30 cc Syringe. [See More]

  • Chemical System: Epoxy
  • Thermal Conductivity: 0.4200
  • Cure / Technology: Single Component
  • Dielectric Strength: 1067
Moderate Viscosity Thermally Conductive Epoxy -- EP112AO
from Master Bond, Inc.

Master Bond Polymer System EP112AO is a solventless, moderate viscosity two component epoxy resin system which is specifically designed for high performance outdoor and indoor electrical and electronic applications where good thermal conductivity and electrial isolation is required. The two... [See More]

  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid
  • Type: High Dielectric; Thermally Conductive
  • Composition: Filled
Henkel Loctite OXY-CAST 6850 FTLV Epoxy Casting System Resin Black 1 gal Pail -- 90-001341 [2009440 from Henkel Corporation - Industrial]
from Ellsworth Adhesives

Henkel Loctite OXY-CAST 6850FT-LV Epoxy with HARDENER RT-7LC is a two component, low viscosity, epoxy casting system that is used for electrical casting, encapsulating, and high voltage applications. It offers high thermal conductivity, electrical, flow, and wetting properties. It is resistant to... [See More]

  • Chemical System: Epoxy
  • Industry: Electric Power
  • Cure / Technology: Two Component  
  • Thermal Conductivity: 10.1
Nanosilica Filled Optically Clear Epoxy with High Abrasion Resistance -- EP30NS
from Master Bond, Inc.

Master Bond EP30NS is a nanosilica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically clear and meets NASA low outgassing specifications. [See More]

  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Type: High Dielectric; Optical; Thermally Conductive
  • Composition: Filled
Henkel Loctite STYCAST 1090 Epoxy Black 5 lb Pail -- 1090 STYCAST 5 LB. [1187951 from Henkel Corporation - Industrial]
from Ellsworth Adhesives

Henkel Loctite STYCAST 1090 Epoxy Encapsulant Black, formerly Emerson and Cuming, is used for potting and encapsulating electronic components and aerospace applications that need low weight. It is a syntactic foam that offers low density, low dielectric constant, and low coefficient of thermal... [See More]

  • Chemical System: Epoxy
  • Industry: Aerospace
  • Cure / Technology: Two Component  
  • Thermal Conductivity: 0.1900
NASA Low Outgassing Rated Epoxy Features Enhanced Chemical Resistance -- EP42-2LV Black
from Master Bond, Inc.

EP42-2LV Black is a two component, room temperature curing epoxy compound featuring low viscosity and superior chemical resistance. It meets NASA low outgassing specifications, is black in color and optically opaque. [See More]

  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Type: High Dielectric; Thermally Conductive
  • Composition: Unfilled
Henkel Loctite STYCAST 1090SI Epoxy Black 1 gal Pail -- 1090SI STYCAST 5 LB. [1187954 from Henkel Corporation - Industrial]
from Ellsworth Adhesives

Henkel Loctite STYCAST 1090SI Black, formerly Emerson and Cuming, is a two component, room temperature curing epoxy that is used for encapsulating components that are exposed to high compressive stress. It offers low density, low dielectric constant, and high compressive strength. Can be used with a... [See More]

  • Chemical System: Epoxy
  • Industry: Aerospace
  • Cure / Technology: Two Component  
  • Thermal Conductivity: 0.1700
New Epoxy Offers Rapid Cures and Chemical Resistance -- EP41S-F
from Master Bond, Inc.

Offering impressive physical strength characteristics, EP41S-F is an electrically insulative two component epoxy that cures rapidly at ambient and elevated temperatures. Typically faster curing epoxies are somewhat less chemically resistant than other types of systems, but EP41S-F is one of the few... [See More]

  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Type: High Dielectric; Thermally Conductive
  • Composition: Unfilled
Henkel Loctite STYCAST 1264 Epoxy Part A Clear 1 gal Pail -- 1264 PTA CLR 9LB [1187965 from Henkel Corporation - Industrial]
from Ellsworth Adhesives

Henkel Loctite STYCAST 1264 Clear, formerly Emerson and Cuming, is a two component, room temperature curing, epoxy that is used as a laminate on glass for implosion safety shields. It offers low viscosity, low exotherm, excellent impact strength and thermal shock resistance. Part A, 1 gal Pail. [See More]

  • Chemical System: Epoxy
  • Tensile (Break): 9500
  • Cure / Technology: Two Component  
  • Viscosity: 600 to 8500
Nickel Filled Electrically Conductive Epoxy System -- EP76M
from Master Bond, Inc.

Master Bond Polymer System EP76M is a two component, nickel filled, electrically conductive adhesive for high performance bonding, sealing, and coating formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part nickel conductive systems, EP76M... [See More]

  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Die Bonding Adhesives
  • Type: Anti-static, ESD; Electrically Conductive; EMI/RFI Shielding; Thermally Conductive
  • Composition: Filled
Henkel Loctite STYCAST 1264 Epoxy Part B Yellow 1 gal Pail -- 1264 PTB 4LB [1187966 from Henkel Corporation - Industrial]
from Ellsworth Adhesives

Henkel Loctite STYCAST 1264 Clear, formerly Emerson and Cuming, is a two component, room temperature curing, epoxy that is used as a laminate on glass for implosion safety shields. It offers low viscosity, low exotherm, excellent impact strength and thermal shock resistance. Part B, 1 gal Pail. [See More]

  • Chemical System: Epoxy
  • Tensile (Break): 9500
  • Cure / Technology: Two Component  
  • Viscosity: 35 to 600
One Component Toughened Epoxy System For Bonding And Sealing -- Supreme 17HT
from Master Bond, Inc.

Master Bond Supreme 17HT is a one component toughened epoxy for bonding and sealing. It has a moderate viscosity system with good flow properties. [See More]

  • Chemical System: Epoxy
  • Form / Function: Liquid
  • Type: High Dielectric; Thermally Conductive
  • Composition: Unfilled
Henkel Loctite STYCAST 1265 Epoxy Part A Clear 1 gal Pail -- 1265 PTA CLR 4LB [1187971 from Henkel Corporation - Industrial]
from Ellsworth Adhesives

Henkel Loctite STYCAST 1265 Clear, formerly Emerson and Cuming, is a two component, flexible epoxy gel that is used for bonding, replacing, and repairing stress sensitive components. It offers low exotherm, long pot life, and easy application. Part A, 1 gal Pail. [See More]

  • Chemical System: Epoxy
  • Viscosity: 600 to 10000
  • Cure / Technology: Two Component  
One Component, High Temperature Resistant Epoxy -- EP36
from Master Bond, Inc.

Master Bond Polymer System EP36 is a unique one component high performance toughened epoxy system for electrical potting, casting, encapsulation, baked coatings and adhesive applications. It features an outstanding combination of properties including high temperature stability up to 500 °F,... [See More]

  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
  • Type: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding
  • Composition: Unfilled
Henkel Loctite STYCAST 1265 Epoxy Part A Clear 40 lb Pail -- 1265 PTA CLR 40LB [1187973 from Henkel Corporation - Industrial]
from Ellsworth Adhesives

Henkel Loctite STYCAST 1265 Clear, formerly Emerson and Cuming, is a two component, flexible epoxy gel that is used for bonding, replacing, and repairing stress sensitive components. It offers low exotherm, long pot life, and easy application. Part A, 40 lb Pail. [See More]

  • Chemical System: Epoxy
  • Viscosity: 600 to 10000
  • Cure / Technology: Two Component  
One component, high temperature resistant epoxy system for bonding and sealing -- EP17HTDA-1
from Master Bond, Inc.

Formulated for die attach applications, Master Bond EP17HTDA-1 is a one component epoxy that can also be used for conventional bonding and sealing. This system features an excellent die shear strength of 24-27 kg-f and can be used in a typical die size ranging from 4-400 mm2. EP17HTDA-1 can also be... [See More]

  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
  • Type: High Dielectric; Thermally Conductive
  • Composition: Unfilled
Henkel Loctite STYCAST 1265 Epoxy Part B Clear 1 gal Pail -- 1265 PTB CLR 4LB [1187972 from Henkel Corporation - Industrial]
from Ellsworth Adhesives

Henkel Loctite STYCAST 1265 Clear, formerly Emerson and Cuming, is a two component, flexible epoxy gel that is used for bonding, replacing, and repairing stress sensitive components. It offers low exotherm, long pot life, and easy application. Part B, 1 gal Pail. [See More]

  • Chemical System: Epoxy
  • Viscosity: 230 to 600
  • Cure / Technology: Two Component  
One Component, Storage Stable Epoxy -- EP19HT
from Master Bond, Inc.

Master Bond Polymer System EP19HT is a storage stable one component liquid epoxy resin system for durable, high performance adhesive/sealants, impregnants and liners. It features remarkably long shelf life and excellent storage characteristics at ambient temperatures yet cures readily at elevated... [See More]

  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Impregnating Resin; Die Bonding Adhesives
  • Type: High Dielectric
  • Composition: Unfilled
Henkel Loctite STYCAST 1265 Epoxy Part B Clear 40 lb Pail -- 1265 PTB CLR 40LB [1187974 from Henkel Corporation - Industrial]
from Ellsworth Adhesives

Henkel Loctite STYCAST 1265 Clear, formerly Emerson and Cuming, is a two component, flexible epoxy gel that is used for bonding, replacing, and repairing stress sensitive components. It offers low exotherm, long pot life, and easy application. Part B, 40 lb Pail. [See More]

  • Chemical System: Epoxy
  • Viscosity: 230 to 600
  • Cure / Technology: Two Component  
One Part, Toughened Epoxy for Specialty Dam-and-Fill Encapsulation -- Supreme 3HTND-2DM
from Master Bond, Inc.

Supreme 3HTND-2DM is a rapid curing, toughened, one part epoxy system used for the dam-and-fill method for chip-on-board encapsulation. It passes ASTM E595 specifications for NASA low outgassing allowing it to be used in vacuum, aerospace, electro-optic and other related applications. Supreme... [See More]

  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Glob Top, Daub, Doming or Overfill
  • Type: High Dielectric; Thermally Conductive
  • Composition: Unfilled
Henkel Loctite STYCAST 1266 Epoxy Part A Clear 1 gal Pail -- 1266 PTA CLR 7LB [1187977 from Henkel Corporation - Industrial]
from Ellsworth Adhesives

Henkel Loctite STYCAST 1266 Clear, formerly Emerson and Cuming, is a two component, room temperature curing, epoxy encapsulant that is used for bonding lenses, glass, plastics, metal, and display embedments. It offers low viscosity and good visibility, electrical properties, impact strength, and... [See More]

  • Chemical System: Epoxy
  • Tensile (Break): 5801 to 7977
  • Cure / Technology: Two Component  
  • Dielectric Strength: 401
Optically Clear, Low Viscosity, Two Component Epoxy -- EP30
from Master Bond, Inc.

Master Bond Polymer System EP30 is a low viscosity, two component epoxy adhesive for general purpose bonding, coating, sealing and casting formulated to cure at room temperature or more rapidly at elevated temperatures with a four (4) to one (1) mix ratio by weight. This adhesive is 100% reactive... [See More]

  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Type: Optical; Thermal Insulation
  • Cure / Technology: Thermoset; Two Component  
Conocrete - Fast Patch -- No. 149
from Sauereisen, Inc.

ConoCrete - Fast Patch No. 149 is a three-component, fast setting epoxy monolithic that is designed for patching cracks and holes. This material is ideal for use on highways, bridge decks,. docks, ramps, traffic aisles, industrial floors and airport runways. Fast Patch No. 149 produces extremely... [See More]

  • Chemical System: Epoxy
  • Composition: Unfilled
  • Form / Function: Powder
  • Cure / Technology: Thermoset; Two Component  
Chemical Resistant Epoxy System -- 20-3004 HV
from Epoxies Etc...

20-3004 LV & HV are two component chemical resistance epoxy systems. They were developed for potting, coating, and adhesive applications requiring superior chemical resistance. They exhibit outstanding bonds to a variety of substrates. [See More]

  • Chemical System: Epoxy
  • Composition: Unfilled
  • Form / Function: Gel
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Epoxy Adhesive -- ANE-26144
from Protavic America, Inc.

Clear unfilled epoxy also available in a one-part system. Use life is over three days after mixing at room temperature. Excellent for ferrite and optical bonding applications. Requires heat assist to cure. [See More]

  • Chemical System: Epoxy
  • Form / Function: Liquid; Encapsulant or Conformal Coating; Die Bonding Adhesives
  • Type: High Dielectric
  • Composition: Unfilled
Hysol EO1088 -- 8799542214657
from Henkel Corporation - Electronics

One component encapsulants potting epoxy. [See More]

  • Chemical System: Epoxy
  • Cure / Technology: Single Component
  • Form / Function: Glob Top, Daub, Doming or Overfill
  • Industry: Electronics
Electrically Conductive Adhesives -- LOCTITE ABLESTIK XCE 3104XL
from Henkel Corporation - Industrial

LOCTITE ABLESTIK XCE 3104XL, Epoxy, Assembly LOCTITE ® ABLESTIK XCE 3104XL is an electrically conductive adhesive with tin compatibility for fine stencil and screen print applications. It uses a unique blend of fillers with tightly controlled particle sizes to provide fine pitch printing... [See More]

  • Chemical System: Epoxy
  • Viscosity: 54000
  • Cure / Technology: Single Component
Conap™ Epoxy Potting & Casting Compound -- CONATHANE® UF-3
from ACCRAbond, Inc.

CONATHANE ® UF-3 is a unique polyurethane foam characterized by low vapor pressure. UF-3 is unaffected by grease, oils, and most solvents. Also, it is ozone resistant, has excellent insulation characteristics, is dimensionally stable and will not rot or mildew. [See More]

  • Chemical System: Epoxy
Electrical Encapsulation System -- VORATRON®
from Dow Polyurethanes

Energy has always had a special bond with Dow. Over 110 years ago, our company was founded when Herbert Dow used electricity to create bromine and chlorine from salt – a process still in use. Today, we ’re one of the largest suppliers of solutions that protect, conserve and manage energy... [See More]

  • Chemical System: Epoxy; Polyurethane
  • Industry: Electric Power; Power Equipment, Power Transmission and Distribution Equipment
Loctite Hysol 1511184 Black Base & Accelerator (B/A) Epoxy Potting Compound - 50 ml Dual Cartridge - E-40EXP -- 079340-00086 [1511184 from Loctite UK]
from R. S. Hughes Company, Inc.

Loctite Hysol 1511184 black epoxy potting compound is compatible with ceramic, metal and plastic materials with a 24 hr cure time. Provides a 40 min working time. Works in a mix ratio of 2:1. Delivers great performance with a shear strength of 3000 psi. [See More]

  • Chemical System: Epoxy
  • Dielectric Strength: 965
  • Thermal Conductivity: 0.2500
Epoxy Conformal Coating -- ELC 2900
from Electro-Lite Corporation

ELC-2900 is a flexible conformal coating for PCB's and provides a flexible, reworkable finish for components and various substrates. [See More]

  • Chemical System: Epoxy
  • Form / Function: Liquid; Encapsulant or Conformal Coating
  • Type: Anti-static, ESD
  • Cure / Technology: UV or Radiation Cured
Adhesive; Epoxy Potting Compound; Black -- 70113956 [DP-270-BLACK from 3M Electronics and Energy Business]
from Allied Electronics, Inc.

Silver Print, 27 °C Flash Point, 1.6 Specific Gravity. The Scotch-Weld EPX Applicator System is a fast, convenient way to simultaneously meter, mix and apply two-component adhesives and potting compounds. The system features handy Duo-Pak cartridges that snap quickly into the durable,... [See More]

  • Chemical System: Epoxy
  • Form / Function: Liquid; Die Bonding Adhesives
Epoxy Adhesive & Potting Compound -- 10-3009
from Epoxies Etc...

10-3009 is a low viscosity epoxy adhesive and potting compound. It is easy to use and allows the end user to adjust the flexibility of the cured epoxy. This product offers a good combination of peel and tensile strength. 10-3009 provides electrical insulation and outstanding adhesion. [See More]

  • Chemical System: Epoxy
  • Form / Function: Liquid
  • Type: High Dielectric; Thermal Insulation
  • Composition: Unfilled
Epoxy Adhesive -- PNE-30270
from Protavic America, Inc.

A solvent-free, single component resin with low linear expansion and high ionic purity for protecting semi-conductor silicon crystals. [See More]

  • Chemical System: Epoxy
  • Form / Function: Liquid; Glob Top, Daub, Doming or Overfill; Die Bonding Adhesives
  • Type: Electrically Conductive; Thermally Conductive
  • Composition: Filled
Electrically Non-Conductive Adhesives -- LOCTITE ABLESTIK 8387BM
from Henkel Corporation - Industrial

LOCTITE ABLESTIK 8387BM, Epoxy, Encapsulant LOCTITE ® ABLESTIK 8387BM single component adhesive is designed for high throughput encapsulation applications. Non-conductive. Black pigmentation for blocking stray light [See More]

  • Chemical System: Epoxy
  • Cure / Technology: Single Component
  • Type: High Dielectric
  • Viscosity: 9200
Loctite Stycast HD 3561 Gray Two-Part Base & Accelerator (B/A) Potting & Encapsulating Compound - 1 qt - Formerly Known as Loctite Hysol EE1117-HD3561 Epoxy System -- LOCTITE 397720 [397720 from Loctite UK]
from R. S. Hughes Company, Inc.

Loctite Stycast HD 3561 gray two-part potting & encapsulating compound with a 3 hr cure time. Works in a mix ratio of 100:10. Formerly known as Loctite Hysol EE1117-HD3561 Epoxy System. [See More]

  • Chemical System: Epoxy
Adhesive; Epoxy Potting Compound; Black -- 70113974 [DP270-BLACK-200ML from 3M Electronics and Energy Business]
from Allied Electronics, Inc.

Silver Print, 27 °C Flash Point, 1.6 Specific Gravity. The Scotch-Weld EPX Applicator System is a fast, convenient way to simultaneously meter, mix and apply two-component adhesives and potting compounds. The system features handy Duo-Pak cartridges that snap quickly into the durable,... [See More]

  • Chemical System: Epoxy
  • Form / Function: Liquid; Die Bonding Adhesives
Flame Retardant Thermally Conductive -- 50-3150 FR
from Epoxies Etc...

50-3150 FR has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-3150 FR Black Epoxy with Catalyst 190 and Catalyst 105 are listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low shrinkage, and outstanding insulation... [See More]

  • Chemical System: Epoxy
  • Form / Function: Liquid
  • Type: Thermally Conductive
  • Composition: Unfilled
Epoxy Cast -- PTE-36977
from Protavic America, Inc.

PTE-36977 ™ is a two-component epoxy designed for encapsulation or casting of high voltage coils and transformers where high temperature, high voltage, and high thermal conductivity are required. PTE-36977 ™ is heat stable up to 150 °C. [See More]

  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Gel
  • Type: High Dielectric; Thermally Conductive
  • Composition: Filled
Electrically Non-Conductive Adhesives -- LOCTITE ABLESTIK 933-1
from Henkel Corporation - Industrial

LOCTITE ABLESTIK 933-1, Long work life, Low CTE, Low Moisture Sensitivity, Epoxy, Encapsulant LOCTITE ® ABLESTIK 933-1 epoxy encapsulant is designed for encapsulating microelectronic chips. The low coefficient of thermal expansion minimizes stress effects on components and wiring during thermal... [See More]

  • Chemical System: Epoxy
  • Viscosity: 360500
  • Cure / Technology: Single Component
Adhesive; Epoxy Potting Compound; Clear -- 70113955 [DP-270-CLEAR from 3M Electronics and Energy Business]
from Allied Electronics, Inc.

Silver Print, 27 °C Flash Point, 1.6 Specific Gravity. The Scotch-Weld EPX Applicator System is a fast, convenient way to simultaneously meter, mix and apply two-component adhesives and potting compounds. The system features handy Duo-Pak cartridges that snap quickly into the durable,... [See More]

  • Chemical System: Epoxy
  • Form / Function: Liquid; Die Bonding Adhesives
UV Curable Compound -- UV-Cure 60-7155
from Epoxies Etc...

UV Cure 60-7155 is a one- component epoxy that cures with low intensity black light or high intensity UV lamps. UV 60-7155 is water clear and is designed to be used as an adhesive, coating, or encapsulant. This system is moisture and chemical resistant. [See More]

  • Chemical System: Epoxy
  • Composition: Unfilled
  • Form / Function: Liquid; Die Bonding Adhesives
  • Cure / Technology: UV or Radiation Cured; Single Component
Electrically Non-Conductive Adhesives -- LOCTITE ABLESTIK ME 990
from Henkel Corporation - Industrial

LOCTITE ABLESTIK ME 990, Epoxy, Encapsulant LOCTITE ® ABLESTIK ME 990 is designed for die bonding and other assembly applications where electrical conductivity is not required. One component. Oxide filled. Low levels of ionic contaminants [See More]

  • Chemical System: Epoxy
  • Use Temperature: 40 to 257
  • Cure / Technology: Single Component
  • Viscosity: 50000
EPOXY - OPTICALLY CLEAR ENCAPSULATING &POTTING COMPOUND, 320 mL Liquid -- 70125741 [8321C-320ML from MG Chemicals]
from Allied Electronics, Inc.

Ideal for potting LED lights or other optics. Can be cured with or without heating. It is tough, water and chemical resistant, an electrical insulator, and has excellent maching properties. Features. Water Clear Potting. Non-Porous, Water and Chemical Resistant [See More]

  • Chemical System: Epoxy
  • Viscosity: 900
  • Form / Function: Liquid; Die Bonding Adhesives
Electrically Non-Conductive Adhesives -- LOCTITE STYCAST 3103 BIPAX
from Henkel Corporation - Industrial

LOCTITE STYCAST 3103 BIPAX, Epoxy, Potting, Encapsulant LOCTITE ® STYCAST 3103 BIPAX epoxy casting compound is designed for use in applications where a combination of good mechanical, thermal and electrical insulating properties are required. LOCTITE STYCAST 3103 BIPAX passes cytotoxicity... [See More]

  • Chemical System: Epoxy
  • Cure / Technology: Two Component  
Epoxy Compound; for potting and encapsulating; 2 part; black; .8 gal liquid -- 70125817 [832B-3L from MG Chemicals]
from Allied Electronics, Inc.

Instant Adhesives, Cyanoacrylate Chemical Component. Provides excellent protection from impact, shock, conductivity, moisture, abuse, chemicals and analysis. Provides technology security. Excellent for explosion proof components. Encapsulating epoxy kit, reaction product of epichlorohydrin and... [See More]

  • Chemical System: Epoxy
  • Form / Function: Liquid; Die Bonding Adhesives
Encapsulants -- LOCTITE ECCOBOND EN 1350
from Henkel Corporation - Industrial

LOCTITE ECCOBOND EN 1350, Epoxy, Encapsulant. LOCTITE ® ECCOBOND EN 1350 encapsulant is designed for thermal sensor assembly applications. Non-conductive. Fast cure at low temperatures. Low temperature cure. High temperature resistance. Water resistant [See More]

  • Chemical System: Epoxy
  • Cure / Technology: Two Component  
  • Type: High Dielectric
  • CTE: 15
Epoxy Compound; for potting and encapsulating; 2 part; black; 12 oz liquid -- 70125812 [832B-375ML from MG Chemicals]
from Allied Electronics, Inc.

Instant Adhesives, Cyanoacrylate Chemical Component. Provides excellent protection from impact, shock, conductivity, moisture, abuse, chemicals and analysis. Provides technology security. Excellent for explosion proof components. Encapsulating epoxy kit, reaction product of epichlorohydrin and... [See More]

  • Chemical System: Epoxy
  • Form / Function: Liquid; Die Bonding Adhesives
Encapsulants -- LOCTITE ECCOBOND FP0087
from Henkel Corporation - Industrial

LOCTITE ECCOBOND FP0087, Epoxy, Encapsulation. LOCTITE ® ECCOBOND FP0087 yields best results when used to encapsulate a device enclosed in a cavity or potting ring, which restricts the flow of the material. The unique combination of low stress and excellent resistance to moisture and process... [See More]

  • Chemical System: Epoxy
  • CTE: 10
  • Cure / Technology: Single Component
  • Viscosity: 20000
Epoxy Compound; for potting and encapsulating; 2 part; clear; .8 gal liquid -- 70125827 [832C-3L from MG Chemicals]
from Allied Electronics, Inc.

Instant Adhesives, Cyanoacrylate Chemical Component. Provides excellent protection from impact, shock, conductivity, moisture, abuse, chemicals and analysis. Provides technology security. Excellent for explosion proof components. Encapsulating epoxy kit, reaction product of epichlorohydrin and... [See More]

  • Chemical System: Epoxy
  • Form / Function: Liquid; Die Bonding Adhesives
Encapsulants -- LOCTITE ECCOBOND FP4530SF
from Henkel Corporation - Industrial

LOCTITE ECCOBOND FP4530SF, Snap curable, Silane-free, Epoxy, Underfill LOCTITE ® ECCOBOND FP4530SF underfill is designed for flip chip on flex applications with a 25 micron gap. This material is formulated to change color from blue to green during the cure process to indicate the cure status. [See More]

  • Chemical System: Epoxy
  • Viscosity: 3300
  • CTE: 25
Epoxy Compound; for potting and encapsulating; 2 part; clear; 12 oz liquid -- 70125822 [832C-375ML from MG Chemicals]
from Allied Electronics, Inc.

Instant Adhesives, Cyanoacrylate Chemical Component. Provides excellent protection from impact, shock, conductivity, moisture, abuse, chemicals and analysis. Provides technology security. Excellent for explosion proof components. Encapsulating epoxy kit, reaction product of epichlorohydrin and... [See More]

  • Chemical System: Epoxy
  • Form / Function: Liquid; Die Bonding Adhesives
Encapsulants -- LOCTITE ECCOBOND UF 3513HF
from Henkel Corporation - Industrial

LOCTITE ECCOBOND UF 3513HF, Halogen-free, Fast cure, Mechanical and Moisture resistant, Epoxy Underfill, Encapsulant LOCTITE ® ECCOBOND UF 3513HF epoxy underfill encapsulant is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other... [See More]

  • Chemical System: Epoxy
  • Viscosity: 3300
  • CTE: 34
Epoxy; Flame Retardant Epoxy Encapsulating & Potting Compound; Black; 0.8 Gal. -- 70125732 [833FRB-3L from MG Chemicals]
from Allied Electronics, Inc.

A two component self extinguishing epoxy compound. Provides insulation and protects sensitive components and circuits from: static discharge, impact, heat, shock, conductivity, abuse, vibration, moisture, fresh and salt water, chemicals and analysis. [See More]

  • Chemical System: Epoxy
  • Features: Flame Retardant
  • Form / Function: Die Bonding Adhesives
  • Use Temperature: 437
Encapsulants -- LOCTITE ECCOBOND UF 3912
from Henkel Corporation - Industrial

LOCTITE ECCOBOND UF 3912, Halogen-free, Epoxy, Underfill, Encapsulant LOCTITE ® ECCOBOND UF 3912 underfill is specially designed for flip chip device applications. One component. Halogen free. Snap curable. Fast flow. High Tg. Easy rework. High fracture toughness. Excellent thermal cycle... [See More]

  • Chemical System: Epoxy
  • Viscosity: 3500
  • CTE: 16
Epoxy; Flame Retardant Epoxy Encapsulating & Potting Compound; Black; 12 Oz. -- 70125731 [833FRB-375ML from MG Chemicals]
from Allied Electronics, Inc.

A two component self extinguishing epoxy compound. Provides insulation and protects sensitive components and circuits from: static discharge, impact, heat, shock, conductivity, abuse, vibration, moisture, fresh and salt water, chemicals and analysis. Copper Electroplating Solution and is ready to... [See More]

  • Chemical System: Epoxy
  • Features: Flame Retardant
  • Form / Function: Die Bonding Adhesives
  • Use Temperature: 437
Encapsulants -- LOCTITE PE 3141
from Henkel Corporation - Industrial

LOCTITE ® 3141 Hysol Epoxy Resin, High Temperature is one part of a two part epoxy system to be used with a variety of LOCTITE Hysol hardeners. The system is formulated for high temperature potting and encapsulating applications. [See More]

  • Chemical System: Epoxy
POTTING EPOXY 8 OZ -- 70159833 [19-823 from GC Electronics]
from Allied Electronics, Inc.

3M Scotch-Weld ™ Epoxy Potting Compound-Adhesives. Black opaque highly filled epoxy used for potting and encapsulating electronic circuits. Use to environmentally protect or conceal circuits. This product is excellent when used with GC Chassis Boxes. Working Time (Pott Life): 1 hour. Mix... [See More]

  • Chemical System: Epoxy
  • Use Temperature: -40 to 300
  • Form / Function: Liquid; Die Bonding Adhesives
Encapsulants -- LOCTITE PE 3163
from Henkel Corporation - Industrial

LOCTITE ® 3163 Hysol Epoxy Hardener, Excellent Adhesion is one part of a two part epoxy system to be used with a variety of LOCTITE Hysol resins. The system is formulated for high adhesion potting and encapsulating applications. [See More]

  • Chemical System: Epoxy
Scotch-Weld Epoxy Potting Compound Black, 400 mL -- 70113003 [DP270-BLACK-400ML from 3M Electronics and Energy Business]
from Allied Electronics, Inc.

Scotch-Weld Epoxy Potting Compound Black, 400 mL [See More]

  • Chemical System: Epoxy
  • Form / Function: Die Bonding Adhesives
Encapsulants -- LOCTITE PE 3164
from Henkel Corporation - Industrial

Clear epoxy resin hardener which is one part of a two part epoxy system designed for use with a variety of LOCTITE HYSOL resins. LOCTITE ® PE 3164 is a clear epoxy resin hardener which forms a black, fast gelling, low viscosity, room temperature cure potting compound with high thermal... [See More]

  • Chemical System: Epoxy
  • Type: Thermally Conductive
Encapsulants -- LOCTITE PE 3165
from Henkel Corporation - Industrial

LOCTITE ® 3165 Hysol Epoxy Hardener, Low Shrinkage is one part of a two part epoxy system to be used with a variety of LOCTITE Hysol resins. LOCTITE 3145/3165 and 3145/3162 Hysol Epoxy Systems meet UL 94V-O Flammability Rating. [See More]

  • Chemical System: Epoxy
Encapsulants -- LOCTITE STYCAST 1264J
from Henkel Corporation - Industrial

LOCTITE STYCAST 1264J, Epoxy, Slightly Flexible, Virtually Stress Free, Encapsulant, Potting. LOCTITE ® STYCAST 1264J Parts AB cures slightly flexible and virtually stress free. Some darkening of the cured material will occur after long exposure to temperatures above 65 ºC or after... [See More]

  • Chemical System: Epoxy
  • Cure / Technology: Two Component  
  • Form / Function: Liquid
  • Use Temperature: 248
Encapsulants -- LOCTITE STYCAST 1265J
from Henkel Corporation - Industrial

LOCTITE STYCAST 1265J, Epoxy, Encapsulant. LOCTITE ® STYCAST 1265J Parts AB is designed for embedding stress sensitive components or where inspections and repairs are desired. It can be cut easily for repairing and replacing components. Fresh material can be poured and then cured to form a... [See More]

  • Chemical System: Epoxy
  • Cure / Technology: Two Component  
  • Type: High Dielectric
  • Use Temperature: 40 to 149
Encapsulants -- LOCTITE STYCAST 2651
from Henkel Corporation - Industrial

LOCTITE STYCAST 2651, Dielectric Grade, Epoxy, Encapsulant LOCTITE ® STYCAST 2651 is a dielectric grade epoxy encapsulant designed for general purpose applications and has excellent adhesion to a wide variety of substrates. LOCTITE STYCAST 2651 can be used with a variety of catalysts. For more... [See More]

  • Chemical System: Epoxy
  • CTE: 68
  • Cure / Technology: Two Component  
  • Viscosity: 225000
Encapsulants -- LOCTITE STYCAST 2651-40 W1
from Henkel Corporation - Industrial

LOCTITE STYCAST 2651-40 W1, Epoxy, Potting, Encapsulant LOCTITE ® STYCAST 2651-40 W1 epoxy encapsulant is designed for general purpose applications and has excellent adhesion to a wide variety of substrates. When fully cured, the material is readily machined with carbide tools. LOCTITE STYCAST... [See More]

  • Chemical System: Epoxy
  • Viscosity: 33000
  • Cure / Technology: Two Component  
Encapsulants -- LOCTITE STYCAST 2741
from Henkel Corporation - Industrial

LOCTITE STYCAST 2741, Epoxy, Encapsulant. LOCTITE ® STYCAST 2741 is designed for electronic embedment and in sealing or cementing of metals, ceramics and plastics. The hardness can be adjusted by varying the amount of LOCTITE CAT 15 used. The technical information shown on this page reflects the... [See More]

  • Chemical System: Epoxy
  • Use Temperature: 67 to 176
  • Cure / Technology: Two Component  
  • Thermal Conductivity: 0.3500
Encapsulants -- LOCTITE STYCAST 2762FT
from Henkel Corporation - Industrial

LOCTITE STYCAST 2762FT, Epoxy, High Temperature Resistance, High Thermal Conductivity, Potting, Encapsulant LOCTITE ® STYCAST 2762FT epoxy encapsulant is designed for potting electronic components exposed to harsh environments. This material is also ideal for large and complex castings that... [See More]

  • Chemical System: Epoxy
  • Cure / Technology: Two Component  
  • Type: Thermally Conductive
  • Viscosity: 25000
Encapsulants -- LOCTITE STYCAST 2850FTJ
from Henkel Corporation - Industrial

LOCTITE STYCAST 2850FTJ, Epoxy, Encapsulant. LOCTITE ® STYCAST 2850FTJ epoxy encapsulant is designed for use in high voltage applications where surface arcing or tracking is a concern. LOCTITE STYCAST 2850FTJ is recommended for encapsulation of components that require heat dissipation and... [See More]

  • Chemical System: Epoxy
  • Cure / Technology: Two Component  
  • Type: Thermally Conductive
  • Viscosity: 225000
Encapsulants -- LOCTITE STYCAST 2850KT CAT 24LV
from Henkel Corporation - Industrial

LOCTITE STYCAST 2850KT CAT 24LV, Epoxy, Encapsulant LOCTITE ® STYCAST 2850KT CAT 24LV epoxy encapsulant is designed for heat sink replacement in non-integrated electrical components and assemblies. It is also recommended for use in high voltage applications where surface arching or tracking is a... [See More]

  • Chemical System: Epoxy
  • Cure / Technology: Two Component  
  • Type: Thermally Conductive
  • Use Temperature: 85 to 221
Encapsulants -- LOCTITE STYCAST 2851FT
from Henkel Corporation - Industrial

LOCTITE STYCAST 2851FT, Epoxy, Encapsulant LOCTITE ® STYCAST 2851FT is recommended for encapsulation of components that require heat dissipation and thermal shock properties . It has a low coefficient of thermal expansion and exhibits excellent resistance to a wide variety of industrial... [See More]

  • Chemical System: Epoxy
  • Cure / Technology: Single Component
  • Type: Thermally Conductive
  • Thermal Conductivity: 1.36
Encapsulants -- LOCTITE STYCAST E 2517
from Henkel Corporation - Industrial

LOCTITE STYCAST E 2517, Epoxy, Encapsulant LOCTITE ® STYCAST E 2517 epoxy encapsulant is formulated for use on bare chip protection in a variety of advanced packages where ease of flow and high thermal stability are required. One component. Low CTE. Low stress. Low viscosity. High temperature... [See More]

  • Chemical System: Epoxy
  • Thermal Conductivity: 1.5
  • Cure / Technology: Single Component
  • Viscosity: 22500
Encapsulants -- LOCTITE STYCAST E 2534 FR CAT 9
from Henkel Corporation - Industrial

LOCTITE STYCAST E 2534 FR CAT 9, Epoxy, Potting LOCTITE ® STYCAST E 2534 FR CAT 9 epoxy potting compound complies with recent demands on environmentally friendly products and does not contain brominated flame retardants. LOCTITE STYCAST E 2534 FR CAT 9 can be used with a variety of catalysts. [See More]

  • Chemical System: Epoxy
  • Cure / Technology: Two Component  
  • Type: Thermally Conductive
  • Use Temperature: 40 to 302