Solvent Based (Volatile Organic) Encapsulants and Potting Compounds

Low Viscosity Structural Epoxy Adhesive System -- EP112
from Master Bond, Inc.

Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronic/ structural applications. The two components are combined in a convenient noncritical mix... [See More]

  • Type: High Dielectric; Optical; Thermal Insulation
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating; Impregnating Resin
  • Composition: Unfilled
Universal Block Filler -- No. 509
from Sauereisen, Inc.

Sauereisen Universal Block Filler No. 509 is a moist-cured urethane formulation specifically designed to fill small voids, irregularities, and air pockets in concrete. No. 509 provides a smooth surface prior to application of vinyl ester and urethane protective barriers. [See More]

  • Form / Function: Powder; Liquid
  • Composition: Unfilled
  • Chemical System: Elastomeric; Polyurethane
  • Cure / Technology: Two Component  
Conap™ Conformal Coating -- CONATHANE® CE-1155
from ACCRAbond, Inc.

CONATHANE ® CE-1155 is a two-component, solvent-based polyurethane printed circuit board coating designed for use in adverse environments. CE-1155 provides outstanding resistance to moisture and good abrasion resistance. [See More]

  • Form / Function: Encapsulant or Conformal Coating
  • Cure / Technology: Two Component  
  • Chemical System: Polyurethane
  • Features: Solvent Based