Solvent Based (Volatile Organic) Encapsulants and Potting Compounds
from Master Bond, Inc.
Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronicc/ structural applications. The two components are combined in a convenient noncritical mix... [See More]
- Type: High Dielectric; Optical; Thermal Insulation
- Chemical System: Epoxy
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating; Impregnating Resin
- Composition: Unfilled
from Sauereisen, Inc.
Sauereisen Universal Block Filler No. 509 is a moist-cured urethane formulation specifically designed to fill small voids, irregularities, and air pockets in concrete. No. 509 provides a smooth surface prior to application of vinyl ester and urethane protective barriers. [See More]
- Form / Function: Powder; Liquid
- Composition: Unfilled
- Chemical System: Elastomeric; Polyurethane
- Cure / Technology: Two Component
from ACCRAbond, Inc.
CONATHANE ® CE-1155 is a two-component, solvent-based polyurethane printed circuit board coating designed for use in adverse environments. CE-1155 provides outstanding resistance to moisture and good abrasion resistance. [See More]
- Form / Function: Encapsulant or Conformal Coating
- Cure / Technology: Two Component
- Chemical System: Polyurethane
- Features: Solvent Based