Encapsulant / Potting Compound Encapsulants and Potting Compounds

1213877
from RS Components, Ltd.

The Raytech Isaac 4 and Isaac 4MP are pre-filled junction box for sealing and protecting your electrical connections. The gel box line has been designed to bring the inside connectors outdoors by having dimensions that are suitable for the most commonly used connectors. Package Type = Blister. [See More]

  • Form / Function: Blister
  • Use Temperature: 194
Biocompatible, Spectrally Transparent Epoxy -- EPO-TEK® MED-301
from Epoxy Technology

EPO-TEK ® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries.  Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market... [See More]

  • Type: Optical
  • Chemical System: Epoxy
  • Form / Function: Liquid; Glob Top, Daub, Doming or Overfill
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
ELAN-Cast® -- E 2154 Black Resin / C 2154 Hardener
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Type: High Dielectric
  • Chemical System: Epoxy
  • Form / Function: Liquid
  • Composition: Filled
Potting Resin -- 588122-000
from TE Connectivity

Body Features. Color  : Blue. Electrical Characteristics. Potting Resin Voltage Rating  : ≤ 1, ≤ 7.2. Industry Standards. CSA Certified  : No. Standards  : EN 50393, HD 631.1 S2. UL Rating  : No. Operation/Application. Application  : Potting, Low &... [See More]

  • Chemical System: Polyurethane; Two-Part Polyurethane
BJB TC5120 20 Shore A Silicone Rubber 16lb -- BJPU14792
from Techsil Limited

TC-5120 from BJB is a room temperature, 20 Shore A, addition/platinum curing silicone rubber designed for part making or mould making. Can be easily pigmented, encapsulating products, making flexible moulds and creating parts and skins. Product Specifications. 20 Shore A. 40 Minute Work Time. 24... [See More]

Addition Cured Silicone is Optically Clear with Enhanced Low Temperature Serviceability -- MasterSil 157
from Master Bond, Inc.

MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]

  • Type: High Dielectric; Optical; Thermally Conductive
  • Chemical System: Silicone
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid
  • Composition: Unfilled
Carbon Fiber Encapsulation -- Wraptite®
from Arnold Magnetic Technologies

Arnold Magnetic Technologies offers composite and metallic encapsulation solutions for a wide range of permanent magnet systems and applications. While metallic sleeved magnet containment solutions are used extensively for magnet containment, Wraptite composite sleeves offer a superior design... [See More]

  • Chemical System: Include Carbon Fiber, Zylon Fiber And Glass Fiber Composites
  • Industry: Aerospace; Automotive; OEM or Industrial; Oil and Gas
  • Cure / Technology: Wound in place or pressed on sleeve
  • Use Temperature: 338
3M Scotch-Weld DP270 Epoxy Potting Compound Black 48.5 mL Duo-Pak Cartridge -- DP270 BLACK 48.5ML [7100148745 from 3M]
from Ellsworth Adhesives

3M Scotch-Weld Epoxy Potting Compound/Adhesive DP270 Black is a two component, epoxy resin system that is used for sealing, encapsulating, and potting electronic and heat sensitive components. It offers low viscosity, long handling times, noncorrosive to copper, good electrical properties, and... [See More]

  • Chemical System: Epoxy
  • Thermal Conductivity: 0.1770
  • Cure / Technology: Two Component  
  • Dielectric Strength: 850
Solder Joint Strengthening Encapsulant -- ALPHA® HiTech™ EN21-4210
from MacDermid Alpha Electronics Solutions

ALPHA ® HiTech ™ EN21-4210 Series of products are one-component epoxy systems designed to encapsulate the chip component thus protecting the device and strengthening the solder joints. These encapsulants prevent chip and IC devices from dropping out. In addition, these protect the chip/die... [See More]

  • Chemical System: Epoxy
  • Industry: Electronics; Semiconductors, IC's
  • Cure / Technology: Single Component; Cure at 150°C and Hold for a Minimum of 10 Minutes (Convection Oven)
  • CTE: 36 to 117
All Polyimide High Temperature Bonding Film -- Pyralux® HT
from DuPont Electronics & Imaging

DuPont ™ Pyralux ® HT bonding film can be used in conjunction with Pyralux ® AP to create a complete all-polyimide flex laminate system that includes a double-sided, copper-clad laminate and a unique all-polyimide coverfilm or bonding material that becomes a flexible coverlay after... [See More]

  • Chemical System: Polyimide
  • Industry: Electronics; OEM or Industrial
  • Features: UL Rating
  • Use Temperature: 437
1213878
from RS Components, Ltd.

The Raytech Pascal 6 and Pascal 6mp gel box lines are pre-filled junction box for sealing and protecting your electrical connections. The gel box line has been designed to bring the inside connectors outdoors by having dimensions that are suitable for the most commonly used connectors. The gel box... [See More]

  • Form / Function: Blister
  • Use Temperature: 194
Potting Resin -- 759934-000
from TE Connectivity

Body Features. Color  : Black. Industry Standards. UL Rating  : No. Operation/Application. Application  : Potting. Halogen Free  : Yes. Isocyanate-Free  : No. Label-Free Acc REACH & CLP  : No. Marine-Offshore-Shipbuilding Certified  : No. [See More]

  • Chemical System: Polyurethane; Two-Component Polyurethane
LOCTITE® SI 595 Clear RTV Silicone 100ml -- HESI00005
from Techsil Limited

LOCTITE ® 595 is for superior bonding and sealing properties to most surfaces (although not recommended for use on concrete). This product resists aging weathering and thermal cycling without having adverse reactions such as hardening, shrinking or cracking. The thixotropic nature of LOCTITE... [See More]

  • Chemical System: Silicone; Elastomeric
B-Staged Epoxy Meets Airbus Standards for Flame Retardancy & Toxicity -- EP36FR
from Master Bond, Inc.

EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Composition: Unfilled
3M Scotch-Weld DP270 Epoxy Potting Compound Clear 48.5 mL Duo-Pak Cartridge -- DP270 CLEAR 48.5ML [7100148730 from 3M]
from Ellsworth Adhesives

3M Scotch-Weld Epoxy Potting Compound/Adhesive DP270 Clear is a two component, epoxy resin system that is used for sealing, encapsulating, and potting electronic and heat sensitive components. It offers low viscosity, long handling times, noncorrosive to copper, good electrical properties, and... [See More]

  • Chemical System: Epoxy
  • Thermal Conductivity: 0.1770
  • Cure / Technology: Two Component  
  • Dielectric Strength: 850
1213879
from RS Components, Ltd.

The Raytech Watt and Watt MP gel box lines are pre-filled junction box for sealing and protecting your electrical connections. The gel box line has been designed to bring the inside connectors outdoors by having dimensions that are suitable for the most commonly used connectors. The gel box is... [See More]

  • Form / Function: Blister
  • Use Temperature: 194
Potting Resin -- 973806-000
from TE Connectivity

Body Features. Color  : Opaque. Flexibility  : Elastic. Industry Standards. UL Rating  : No. Operation/Application. Application  : Potting. Halogen Free  : Yes. Isocyanate-Free  : No. Label-Free Acc REACH & CLP  : No. Marine-Offshore-Shipbuilding... [See More]

  • Chemical System: Polyurethane; Two-Component Polyurethane
MG Chemicals Black Encapsulating/Potting Epoxy Kit -- MGEP00009
from Techsil Limited

MG Chemicals 832B is a black electronic grade epoxy designed for encapsulating and potting. This compound is simple mix, easy to use and protects against static discharges, shocks, vibrations, and mechanical impacts. It insulates against heat and conductivity as well as being extremely resistant to... [See More]

  • Chemical System: Epoxy
  • Industry: Electronics
Dual Curing, Thixotropic Adhesive -- UV22DC80-10F
from Master Bond, Inc.

One part, nanosilica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: UV Curing
  • Form / Function: Liquid; Encapsulant or Conformal Coating; Glob Top, Daub, Doming or Overfill
  • Composition: Filled
Dow DOWSIL™3-4150 Dielectric Gel Encapsulant Green 36.2 kg Kit -- 3-4150 DIELECT GEL 36.2KG [3127460 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow DOWSIL ™3-4150 Dielectric Gel Clear-Green is a two component, fast room temperature curing, silicone gel that is used for potting, sealing, encapsulating, and protecting a variety of materials in the electronics industry. It offers flexibility, stress relief, and offers excellent... [See More]

  • Type: High Dielectric
  • Cure / Technology: Two Component  
  • Chemical System: Silicone
  • Dielectric Strength: 381
1213880
from RS Components, Ltd.

The Raytech kelvin and kelvin mp gel box line are pre-filled junction box for sealing and protecting your electrical connections. The gel box line has been designed to bring the inside connectors outdoors by having dimensions that are suitable for the most commonly used connectors. Package Type =... [See More]

  • Form / Function: Blister
  • Use Temperature: 194
Potting Resin -- A47464-000
from TE Connectivity

Body Features. Color  : Beige. Electrical Characteristics. Potting Resin Voltage Rating  : ≤ 1. Industry Standards. CSA Certified  : No. Standards  : EN 50393, HD 631.1 S2. UL Rating  : No. Operation/Application. Application  : Low & Medium Voltage... [See More]

  • Chemical System: Polyurethane; Two-Part Polyurethane
MG Chemicals Flame Retardant Potting Epoxy 375ml -- MGEP00013
from Techsil Limited

MG Chemicals 834ATH Flame Retardant Epoxy is a economical, electronic-grade, self-extinguishing, flame retardant epoxy that provides excellent physical, chemical and electrical protection with a degree of thermal conductivity. Designed for encapsulating and potting, this two-part epoxy protects... [See More]

  • Chemical System: Epoxy
  • Industry: Electronics
  • Features: Flame Retardant
Electrically and Thermally Conductive, Two Part Silicone Meets NASA Low Outgassing Specifications -- MasterSil 973S-LO
from Master Bond, Inc.

MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]

  • Type: Electrically Conductive; Thermally Conductive
  • Chemical System: Silicone
  • Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating
  • Composition: Filled
Dow DOWSIL™3-6371 UV Silicone Encapsulant Clear 175 mL Cartridge -- 3-6371 UV GEL 175ML CART [4026370 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow DOWSIL ™3-6371 UV Gel Clear is a one component, UV and moisture curing silicone that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. It is durable, fast curing, flexible, and self healing. 175 mL Cartridge. [See More]

  • Chemical System: Silicone
  • Dielectric Strength: 305
  • Cure / Technology: Single Component
  • Viscosity: 900
1213881
from RS Components, Ltd.

The Raytech Isaac 4 and Isaac 4MP are pre-filled junction box for sealing and protecting your electrical connections. The gel box line has been designed to bring the inside connectors outdoors by having dimensions that are suitable for the most commonly used connectors. Package Type = Pack. Package... [See More]

  • Form / Function: Pack
  • Use Temperature: 194
Potting Resin -- C39212-000
from TE Connectivity

Body Features. Color  : Blue. Electrical Characteristics. Potting Resin Voltage Rating  : ≤ 7.2, ≤ 46, ≤ 35, ≤ 17.5, ≤ 25, ≤ 42, ≤ 24, ≤ 36, ≤ 15, ≤ 12. Industry Standards. CSA Certified  : No. Standards  : HD 629.1. UL Rating  : No. [See More]

  • Chemical System: Two-Part Hydrocarbon Resin
MG Chemicals FR Low Viscosity Potting Epoxy 375ml -- MGEP00016
from Techsil Limited

MG 834FRB is a black, flame retardant potting and encapsulation compound that offers extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. Thanks to its low viscosity, MG 834 FRB is the ideal choice when applications require small gaps or... [See More]

  • Chemical System: Epoxy
  • Industry: Electronics
  • Features: Flame Retardant
Electrically Conductive Die Attach Adhesive Has Very High Thermal Conductivity -- EP3HTSDA-1
from Master Bond, Inc.

EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
  • Composition: Unfilled
Dow DOWSIL™93-500 Space Grade Encapsulant Clear 110 g Kit -- 93-500 SPACE GR ENCAP 110G [1091450 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow DOWSIL ™93-500 Space Grade Encapsulant and 93-500 Thixotropic Space Grade Encapsulant Clear are two component, silicone elastomers that are used for aerospace applications such as sealing optical sensors, encapsulating/potting electronic components, and bonding solar cells to substrates,... [See More]

  • Chemical System: Silicone
  • Thermal Conductivity: 0.2000
  • Cure / Technology: Two Component  
  • Tensile (Break): 975
1213882
from RS Components, Ltd.

The Raytech Pascal 6 and Pascal 6mp gel box lines are pre-filled junction box for sealing and protecting your electrical connections. The gel box line has been designed to bring the inside connectors outdoors by having dimensions that are suitable for the most commonly used connectors. The gel box... [See More]

  • Form / Function: Pack
  • Use Temperature: 194
Potting Resin -- CP6931-000
from TE Connectivity

Body Features. Color  : Transparent. Electrical Characteristics. Potting Resin Voltage Rating  : ≤ 1. Industry Standards. CSA Certified  : No. Standards  : IP68. UL Rating  : No. Operation/Application. Application  : Junction Boxes, Potting. Free of Lead,... [See More]

  • Chemical System: Two-Part Hydrocarbon Resin
MG Chemicals Translucent Potting Epoxy 450ml -- MGEP00015
from Techsil Limited

MG Chemicals 832C is a translucent electronic grade epoxy designed for encapsulating and potting. This compound is simple mix, easy to use and protects against static discharges, shocks, vibrations, and mechanical impacts. It insulates against heat and conductivity as well as being extremely... [See More]

  • Chemical System: Epoxy
  • Industry: Electronics
Electrically Conductive Die Attach Epoxy With High Glass Transition Temperature -- EP17HTS-DA
from Master Bond, Inc.

Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]

  • Type: Electrically Conductive; Thermally Conductive
  • Chemical System: Polyphenylene Sulfide; Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
  • Composition: Filled
Dow DOWSIL™93-500 Thixotropic Space Grade Encapsulant Clear 115 g Kit -- 93-500 THIXOTROPIC 115G [2410613 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow DOWSIL ™93-500 Thixotropic Space Grade Encapsulant and 93-500 Space Grade Encapsulant Clear are two component, silicone elastomers that are used for aerospace applications such as sealing optical sensors, encapsulating/potting electronic components, and bonding solar cells to substrates,... [See More]

  • Chemical System: Silicone
  • Thermal Conductivity: 0.2000
  • Cure / Technology: Two Component  
  • Tensile (Break): 1225
1213883
from RS Components, Ltd.

The Raytech Watt and Watt MP gel box lines are pre-filled junction box for sealing and protecting your electrical connections. The gel box line has been designed to bring the inside connectors outdoors by having dimensions that are suitable for the most commonly used connectors. The gel box is... [See More]

  • Form / Function: Pack
  • Use Temperature: 194
Potting Resin -- EE3378-000
from TE Connectivity

Body Features. Color  : Green. Electrical Characteristics. Potting Resin Voltage Rating  : ≤ 1. Industry Standards. CSA Certified  : No. Standards  : EN 50393, HD 631.1 S2. UL Rating  : No. Operation/Application. Application  : Low & Medium Voltage... [See More]

  • Chemical System: Two-Part Hydrocarbon Resin
MG Chemicals Translucent Potting Epoxy Kit 375ml -- MGEP00010
from Techsil Limited

MG Chemicals 832C is a translucent electronic grade epoxy designed for encapsulating and potting. This compound is simple mix, easy to use and protects against static discharges, shocks, vibrations, and mechanical impacts. It insulates against heat and conductivity as well as being extremely... [See More]

  • Chemical System: Epoxy
  • Industry: Electronics
Epoxy Features Very Low Coefficient of Thermal Expansion -- EP30LTE-2
from Master Bond, Inc.

Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating. [See More]

  • Type: High Dielectric; Thermal Insulation
  • Chemical System: Epoxy
  • Form / Function: Liquid; Encapsulant or Conformal Coating
  • Composition: Unfilled
Dow DOWSIL™CY 52-276 Silicone Encapsulant Part A Clear 1 kg Bottle -- CY 52-276 PART A 1KG [2624028 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow DOWSIL ™CY 52-276 Kit Clear is a two component, low volatility silicone gel that is used for protecting and sealing electronic devices from thermal shock, vibration, fuels, and solvents. with addition cure, It offers flexibility and a low temperature cure. 1:1 mix ratio. Part A, 1 kg... [See More]

  • Chemical System: Silicone
  • Dielectric Strength: 356
  • Cure / Technology: Two Component  
  • Viscosity: 900 to 1200
1213884
from RS Components, Ltd.

The Raytech kelvin and kelvin mp gel box line are pre-filled junction box for sealing and protecting your electrical connections. The gel box line has been designed to bring the inside connectors outdoors by having dimensions that are suitable for the most commonly used connectors. Package Type =... [See More]

  • Form / Function: Pack
  • Use Temperature: 194
Potting Resin -- EL5258-000
from TE Connectivity

Body Features. Color  : Milky-Translucent. Electrical Characteristics. Potting Resin Voltage Rating  : ≤ 36. Industry Standards. CSA Certified  : No. Standards  : HD 629.1. UL Rating  : No. Operation/Application. Application  : Potting. Free of Lead,... [See More]

  • Form / Function: Liquid
  • Chemical System: Silicone; Fluid Silicone
Momentive RTV11 White FDA Silicone Rubber +DBT 1lb -- MOSI02047
from Techsil Limited

Momentive RTV11 is a general purpose silicone rubber potting compound suitable for a range of applications. It is widely used for the potting and encapsulation of electrical coils and connectors, alongside making cast-in-place gaskets and moulds. RTV11 is supplied ready-to-use with DBT as the... [See More]

  • Chemical System: Silicone; Elastomeric
  • Use Temperature: -54 to 204
  • Industry: Sanitary
Epoxy Meets Airbus Standards for Flame Retardancy, Smoke and Gas Emissions -- EP93FRHT
from Master Bond, Inc.

EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Composition: Unfilled
Dow DOWSIL™CY 52-276 Silicone Encapsulant Part B Clear 1 kg Bottle -- CY 52-276 PART B 1KG [2624052 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow DOWSIL ™CY 52-276 Kit Clear is a two component, low volatility silicone gel that is used for protecting and sealing electronic devices from thermal shock, vibration, fuels, and solvents. with addition cure, It offers flexibility and a low temperature cure. 1:1 mix ratio. Part B, 1 kg... [See More]

  • Chemical System: Silicone
  • Dielectric Strength: 356
  • Cure / Technology: Two Component  
  • Viscosity: 900
1462865
from RS Components, Ltd.

MG Epoxy potting compound 25ml 1:1 - Adhesives & Glues - Potting Compounds [See More]

  • Form / Function: Dual Cartridge
  • Thermal Conductivity: 0.2700
  • Use Temperature: -40 to 302
Momentive RTV11 White FDA Silicone Rubber +DBT 2lb -- MOSI02048
from Techsil Limited

Momentive RTV11 is a general purpose silicone rubber potting compound suitable for a range of applications. It is widely used for the potting and encapsulation of electrical coils and connectors, alongside making cast-in-place gaskets and moulds. RTV11 is supplied ready-to-use with DBT as the... [See More]

  • Chemical System: Silicone; Elastomeric
  • Use Temperature: -54 to 204
  • Industry: Sanitary
Epoxy with High Elongation Passes ISO 10993-5 Certification for Cytotoxicity -- EP40Med
from Master Bond, Inc.

EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Composition: Unfilled
Dow DOWSIL™EE-1010 Low Viscosity Encapsulant 36.2 kg Kit -- EE-1010 SIL ELAST 36.2KG [4101626 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow DOWSIL ™EE-1010 Low Viscosity Encapsulant is a two component, 1:1 mix ratio silicone elastomer for the electronics industry. Benefits include a room temperature cure that can be accelerated with heat, and a long working time. Part A and Part B are different colors for easy identification... [See More]

  • Chemical System: Silicone
  • Thermal Conductivity: 0.6000
  • Cure / Technology: Two Component  
  • Dielectric Strength: 450
1462866
from RS Components, Ltd.

MG Epoxy potting compound 50ml 1:1 - Adhesives & Glues - Potting Compounds [See More]

  • Form / Function: Dual Cartridge
  • Thermal Conductivity: 0.2700
  • Use Temperature: -40 to 302
Momentive RTV11 White FDA Silicone Rubber+DBT 12lb -- MOSI02050
from Techsil Limited

Momentive RTV11 is a general purpose silicone rubber potting compound suitable for a range of applications. It is widely used for the potting and encapsulation of electrical coils and connectors, alongside making cast-in-place gaskets and moulds. RTV11 is supplied ready-to-use with DBT as the... [See More]

  • Chemical System: Silicone; Elastomeric
  • Use Temperature: -54 to 204
  • Industry: Sanitary
Extremely Soft MasterSil 170 Gel Encapsulant Offers Removability and Optical Clarity -- MasterSil 170 Gel
from Master Bond, Inc.

MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]

  • Type: High Dielectric; Optical; Thermally Conductive
  • Chemical System: Silicone
  • Form / Function: Liquid
  • Composition: Unfilled
Dow DOWSIL™EE-3200 Silicone Encapsulant Part A Off-White 0.5 kg Jar -- EE-3200 PART A .5KG [4121014 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow DOWSIL ™EE-3200 Low Stress Silicone Encapsulant is a two component, low viscosity encapsulant with a 1:1 mix ratio, good heat dissipation, and good thermal conductivity. Once thoroughly mixed, the mixture will cure to a flexible elastomer for the protection of electronic and electrical... [See More]

  • Chemical System: Silicone
  • Industry: Automotive; Electronics
  • Cure / Technology: Two Component  
  • Thermal Conductivity: 0.5000
1462867
from RS Components, Ltd.

MG Epoxy potting compound 500ml 1:1 - Adhesives & Glues - Potting Compounds [See More]

  • Form / Function: Dual Cartridge
  • Thermal Conductivity: 0.2700
  • Use Temperature: -40 to 302
Momentive RTV12A Clear Potting Compound 454gm -- MOSI02055
from Techsil Limited

RTV12 A is a clear, two component, low viscosity potting compound that cures at room temperature to a soft pliable rubber. It will cure in deep sections without additional heating or moisture. RTV12 A is the base compound and requires a curing agent to be mixed with. For a clear product which allows... [See More]

  • Chemical System: Silicone; Elastomeric
  • Industry: Electronics
High Glass Transition Temperature Epoxy System -- EP62-1
from Master Bond, Inc.

Master Bond EP62-1 is a two component heat cured and chemically resistant epoxy resin system featuring a long pot life at ambient temperatures and efficient cures at moderately elevated temperatures. The reccommended mix ratio is 100 parts of component A to 10 parts of component B. The pot life of... [See More]

  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Industry: Marine; Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial; Semiconductors, IC's
  • Cure / Technology: Thermoset; Two Component  
  • Use Temperature: -60 to 400
Dow DOWSIL™EE-3200 Silicone Encapsulant Part B Black 0.5 kg Jar -- EE-3200 PART B .5KG [4121013 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow DOWSIL ™EE-3200 Low Stress Silicone Encapsulant is a two component, low viscosity encapsulant with a 1:1 mix ratio, good heat dissipation, and good thermal conductivity. Once thoroughly mixed, the mixture will cure to a flexible elastomer for the protection of electronic and electrical... [See More]

  • Chemical System: Silicone
  • Industry: Automotive; Electronics
  • Cure / Technology: Two Component  
  • Thermal Conductivity: 0.5000
1462868
from RS Components, Ltd.

MG Black flexible epoxy 832FX 450ml - Adhesives & Glues - Potting Compounds [See More]

  • Form / Function: Bottle
  • Thermal Conductivity: 0.2600
  • Use Temperature: -40 to 284
Momentive RTV12A Clear Potting Compound 907gm -- MOSI02056
from Techsil Limited

RTV12 A is a clear, two component, low viscosity potting compound that cures at room temperature to a soft pliable rubber. It will cure in deep section without additional heating or moisture. RTV12 A is the base compound and requires a curing agent to be mixed with. For a clear product which allows... [See More]

  • Chemical System: Silicone; Elastomeric
  • Industry: Electronics
Highly Flexible Addition Cured Silicone Offers Low Thermal Resistance -- MasterSil 151TC
from Master Bond, Inc.

MasterSil 151TC is a highly flexible, temperature resistant two component silicone adhesive offering low thermal resistance and outstanding thermal conductivity. It was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Silicone
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid
  • Composition: Filled
Dow DOWSIL™EG-3810 Dielectric Gel Encapsulant Clear 18 kg Pail -- EG-3810 DIELECTRIC GEL 18KG PAIL [4116483 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow DOWSIL ™EG-3810 Dielectric Gel is a one component, clear, heat curing silicone gel that is used for potting, sealing, encapsulating, and protecting a variety of materials in the electronics industry. It offers a wide range of operating temperatures ranging from -60 °C to 200 °C,... [See More]

  • Type: High Dielectric
  • Cure / Technology: Single Component
  • Chemical System: Silicone
  • Industry: Electronics; Semiconductors, IC's
1462869
from RS Components, Ltd.

MG Black flexible epoxy 832FX 1.7L - Adhesives & Glues - Potting Compounds [See More]

  • Form / Function: Can
  • Thermal Conductivity: 0.2600
  • Use Temperature: -40 to 284
Momentive RTV31 High Temp Potting Silicone+DBT 1lb -- MOSI02075
from Techsil Limited

Momentive RTV31 is a high temperature silicone rubber potting compound suitable for a range of applications. It is widely used for the potting and encapsulation of electric motors and transformers, casting moulds for low-melting point metals and for the fabrication of rubber parts. Also suitable for... [See More]

  • Chemical System: Silicone; Elastomeric
  • Use Temperature: -54 to 260
  • Industry: Electronics
Low Viscosity Structural Epoxy Adhesive System -- EP112
from Master Bond, Inc.

Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronic/ structural applications. The two components are combined in a convenient noncritical mix... [See More]

  • Type: High Dielectric; Optical; Thermal Insulation
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating; Impregnating Resin
  • Composition: Unfilled
Dow DOWSIL™EI-1184 Optical Encapsulant Clear 36 kg Kit -- EI-1184 OPTIC ENCAP 36KG KIT [4124807 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow DOWSIL ™EI-1184 Optical Encapsulant is a two component, silicone that is used for encapsulating circuit boards, electrical and LED Lighting applications. It offers high transparency and rapid, heat and room temperature cure. 36 kg Kit. [See More]

  • Cure / Technology: Two Component  
  • Elongation: 55.0
  • Tensile (Break): 1375
  • Dielectric Strength: 483
1462870
from RS Components, Ltd.

MG Clear epoxy cartridge 832C 450ml - Adhesives & Glues - Potting Compounds [See More]

  • Form / Function: Cartridge
  • Thermal Conductivity: 0.3090
  • Use Temperature: -22 to 284
Momentive RTV31 High Temp Potting Silicone+DBT 2lb -- MOSI02076
from Techsil Limited

Momentive RTV31 is a high temperature silicone rubber potting compound suitable for a range of applications. It is widely used for the potting and encapsulation of electric motors and transformers, casting moulds for low-melting point metals and for the fabrication of rubber parts. Also suitable for... [See More]

  • Chemical System: Silicone; Elastomeric
  • Use Temperature: -54 to 260
  • Industry: Electronics
Low Viscosity, Electrically Insulating Epoxy Features Excellent Optical Clarity -- EP30LP-2
from Master Bond, Inc.

Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. [See More]

  • Type: High Dielectric; Optical; Thermally Conductive
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Composition: Unfilled
Dow DOWSIL™Q2-3067 Optical Couplant 113 g Jar -- Q2-3067 OPT COUPLANT 113G [3127061 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow DOWSIL ™Q2-3067 Optical Couplant is a grease-like material that is used to improve sensitivity of optical devices, prevent loss of intensity during light transmission, and for optical coupling. It provides good shear stability, low temperature bonding, and high clarity. 113 g Bottle. [See More]

  • Cure / Technology: Single Component
  • Elongation: 110.0
  • Industry: Photonics
Heat Curing Electronic Coating Silicone Compound -- Bluesil™ V-207
from Bluestar Silicones USA Corp.

Clear, Two-Component, Addition Cure, Heat Curing Electronic coating Silicone Compound. Properties. Viscosity 6000. Hardness Sha 30. Description. BLUESIL V-207 is a clear, two component, addition cure, heat curing silicone rubber compound. It is designed as a primerless coating and encapsulating... [See More]

  • Form / Function: Liquid; Encapsulant or Conformal Coating
  • Cure / Technology: Thermoset; Two Component  ; Reactive or Moisture Cured
  • Chemical System: Silicone
  • Industry: Electronics
Hysol 3329 -- 8802594848769
from Henkel Corporation - Electronics

Developed for encapsulation of wire bonded dies, used for Smartcard IC modules. It is designed for use only with Hysol ® UV dam encapsulants, such as Hysol 3323. This combination of dam and fill will pass mechanical stress testing and high reliability tests; typically thermal shock cycling -55... [See More]

  • Industry: Electronics
  • Viscosity: 8000
  • CTE: 25
Adhesive; Epoxy Potting Compound; Black -- 70113956 [DP-270-BLACK from 3M Electronics and Energy Business]
from Allied Electronics, Inc.

Silver Print, 27 °C Flash Point, 1.6 Specific Gravity. The Scotch-Weld EPX Applicator System is a fast, convenient way to simultaneously meter, mix and apply two-component adhesives and potting compounds. The system features handy Duo-Pak cartridges that snap quickly into the durable,... [See More]

  • Form / Function: Liquid; Die Bonding Adhesives
  • Chemical System: Epoxy
Sil-Bond™ -- 905
from Aremco Products, Inc.

Aremco offers an expansive range of ceramic-based materials used for the assembly of high temperature, high power electrical devices, and high temperature fixtures, molds and tooling. These materials, based on aluminum oxide, aluminum nitride, magnesium oxide, silicon dioxide, silicon carbide,... [See More]

  • Chemical System: Ceramic; Silicone
  • Industry: Electronics
  • Composition: Filled
  • Use Temperature: 900
High Temperature Cement -- OMEGABOND® Air Set Series
from OMEGA Engineering, Inc.

Air Set Cements set or cure through loss of moisture by evaporation. Atmospheric conditions therefore affect the drying rate. Air Set Cements are used mainly in thin film applications (applied in thicknesses less than 1/4")*. SELECTION CRITERIA FOR CEMENTS. 1. Type of Application Potting, sealing,... [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Ceramic
  • Form / Function: Powder (optional feature); Liquid (optional feature); Encapsulant or Conformal Coating
  • Cure / Technology: Two Component   (optional feature); Single Component (optional feature)
Electrical Encapsulation System -- VORATRON®
from Dow Polyurethanes

Energy has always had a special bond with Dow. Over 110 years ago, our company was founded when Herbert Dow used electricity to create bromine and chlorine from salt – a process still in use. Today, we ’re one of the largest suppliers of solutions that protect, conserve and manage energy... [See More]

  • Chemical System: Epoxy; Polyurethane
  • Industry: Electric Power; Power Equipment, Power Transmission and Distribution Equipment
Light Cure Cyanoacrylate Instant Adhesive -- KU3064
from Chemence Inc.

Krylex KU3064 is a revolutionary odorless light curing cyanoacrylate adhesive. It is designed for bonding applications that require very rapid fixture, fillet cure or surface cure. The UV / visible light cure properties facilitate rapid curing of exposed surface areas while the moisture curing... [See More]

  • Form / Function: Liquid; Die Bonding Adhesives
  • Gap Fill: 0.0500
  • Cure / Technology: UV or Radiation Cured; Single Component; Reactive or Moisture Cured
  • Industry: Sanitary; Electronics; OEM or Industrial; Printing, Medical use and General Industrial Assembly
Clear Non-Yellowing Silicone Encapsulant -- PNS-56225
from Protavic America, Inc.

PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]

  • Type: Electrically Conductive; Thermally Conductive
  • Chemical System: Silicone
  • Form / Function: Liquid; Encapsulant or Conformal Coating; Die Bonding Adhesives
  • Composition: Unfilled
Chemical Resistant Epoxy System -- 20-3004 HV
from Epoxies Etc...

20-3004 LV & HV are two component chemical resistance epoxy systems. They were developed for potting, coating, and adhesive applications requiring superior chemical resistance. They exhibit outstanding bonds to a variety of substrates. [See More]

  • Form / Function: Gel
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Conap™ Epoxy Potting & Casting Compound -- CONATHANE® UF-3
from ACCRAbond, Inc.

CONATHANE ® UF-3 is a unique polyurethane foam characterized by low vapor pressure. UF-3 is unaffected by grease, oils, and most solvents. Also, it is ozone resistant, has excellent insulation characteristics, is dimensionally stable and will not rot or mildew. [See More]

  • Chemical System: Epoxy
Cement -- No. 31
from Sauereisen, Inc.

Sauereisen Cement No. 31 is a white, porcelain-like cement that is widely used throughout industry in a variety of applications. including assembling, sealing, insulating and cementing of ceramics, porcelain, metal, and glass. [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Ceramic
  • Form / Function: Powder; Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
  • Composition: Unfilled
3110 RTV Silicone Rubber -- 3110 453G [3110 453G from Dow Corning Oil & Gas Solutions]
from Applied Industrial Technologies

453 g Tub; Use As A Flexible Potting & Encapsulating Material [See More]

  • Chemical System: Silicone; Elastomeric
  • Industry: General Purpose
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing; Cure By Methanol
  • Use Temperature: -65 to 390
Flowable, One-component Silicone Sealant -- CENUSIL® RT 760 CN A/B
from Wacker Chemical Corp.

WACKER ’s silicone adhesives and sealants are based on many years of experience, innovative research and comprehensive technological expertise. In a wide variety of industries, especially in lighting technology, flowable or non-sag silicone products offer decisive advantages in performance and... [See More]

  • Type: Thermally Conductive
  • Industry: Electronics
  • Chemical System: Silicone; Elastomeric
Epoxy Conformal Coating -- ELC 2900
from Electro-Lite Corporation

ELC-2900 is a flexible conformal coating for PCB's and provides a flexible, reworkable finish for components and various substrates. [See More]

  • Type: Anti-static, ESD
  • Chemical System: Epoxy
  • Form / Function: Liquid; Encapsulant or Conformal Coating
  • Cure / Technology: UV or Radiation Cured
Di-Pak™ E-4000 Series Elastomeric Eletrical Insulating Compound -- E-4021
from Hapco, Inc.

Flexible, colorless, potting and encapsulating systems. Available in 5 minute (-5), 16 minute, and 20 minute gel times, and in shore hardness ’s from 20 A to 80 A . [See More]

  • Type: High Dielectric
  • Cure / Technology: Thermoset; Two Component  
  • Form / Function: Liquid
  • Industry: Electronics
Electrically Non-Conductive Adhesives -- LOCTITE ABLESTIK NCA 9300UV
from Henkel Corporation - Industrial

LOCTITE ABLESTIK NCA 9300UV, Acrylate, Non-conductive adhesive, Single component, Photocurable LOCTITE ® ABLESTIK NCA 9300UV single component, photocurable adhesive is designed for disk drive assembly applications such as conformal coating and component tracking. This product also contains a... [See More]

  • Type: High Dielectric
  • Viscosity: 70000
  • Cure / Technology: UV or Radiation Cured; Single Component
OLED Encapsulant
from LG Chemical of America Inc.

OLED Encapsulant. LG Chem developed the OLED Encapsulant that is superior to the existing packing material. LG Chem developed the face seal OLED Encapsulant whose performance is superior to the existing packing materials, improving the lifespan of an OLED display element drastically. [See More]

TECHNOMELT AS 8998
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Form / Function: Pellets
  • Cure / Technology: Thermoplastic / Hot Melt
  • Chemical System: Polyolefin
  • Features: UL Rating
Adhesive; Epoxy Potting Compound; Black -- 70113974 [DP270-BLACK-200ML from 3M Electronics and Energy Business]
from Allied Electronics, Inc.

Silver Print, 27 °C Flash Point, 1.6 Specific Gravity. The Scotch-Weld EPX Applicator System is a fast, convenient way to simultaneously meter, mix and apply two-component adhesives and potting compounds. The system features handy Duo-Pak cartridges that snap quickly into the durable,... [See More]

  • Form / Function: Liquid; Die Bonding Adhesives
  • Chemical System: Epoxy
High Temperature Cement -- OMEGABOND® Chemical Set Series
from OMEGA Engineering, Inc.

Chemical Set Cements set or cure by an internal chemical action which does not require exposure to air. Chemical Set Cements can be used in thick applications (applied in thicknesses greater than 1/4")*. SELECTION CRITERIA FOR CEMENTS. 1. Type of Application Potting, sealing, encapsulating,... [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Ceramic
  • Form / Function: Powder (optional feature); Liquid (optional feature); Encapsulant or Conformal Coating
  • Cure / Technology: Two Component   (optional feature); Single Component (optional feature)
Repenetrable 2 Part RTV Silicone Gel -- KSC12028
from Chemence Inc.

KSC12028 is a silicone RTV gel developed for electronic applications requiring a re-penetrable self-sealing, silicone gel product. KSC12028 is a two part, solvent free, 1:1 mix ratio silicone that when mixed cures in 12 hours at room temperature. Alternatively, KSC12028 can be cured in approximately... [See More]

  • Form / Function: Gel; Die Bonding Adhesives
  • Cure / Technology: Single Component
  • Chemical System: Silicone
  • Industry: Electronics
Clear Urethane Cast/Adhesive -- PNU-46201
from Protavic America, Inc.

The two component polyurethane compound described in this data sheet is specifically designed for the encapsulation by casting of completed circuit board. The cured material meets the flammability requirements of UL 94, V-O at thickness of 0.070 in. and greater (UL File Number E116296) and provides... [See More]

  • Type: High Dielectric; Thermal Insulation
  • Chemical System: Polyurethane
  • Form / Function: Liquid; Encapsulant or Conformal Coating
  • Composition: Filled
Epoxy Adhesive & Potting Compound -- 10-3009
from Epoxies Etc...

10-3009 is a low viscosity epoxy adhesive and potting compound. It is easy to use and allows the end user to adjust the flexibility of the cured epoxy. This product offers a good combination of peel and tensile strength. 10-3009 provides electrical insulation and outstanding adhesion. [See More]

  • Type: High Dielectric; Thermal Insulation
  • Chemical System: Epoxy
  • Form / Function: Liquid
  • Composition: Unfilled
5-Minute® Epoxy -- 14200 [14200 from ITW Devcon]
from Applied Industrial Technologies

15 oz Tube; A Rapid-Curing, General Purpose Adhesive/Encapsulant [See More]

  • Form / Function: Liquid
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
  • Composition: Unfilled
  • Industry: OEM or Industrial
GENIOSIL® WP Liquid Waterproofing Coatings -- GENIOSIL® WP1
from Wacker Chemical Corp.

GENIOSIL® WP1 is a polyether-based silane-terminated polymer suitable asbinder in moisture curing formulations. It is a clear liquid with a slight but characteristic odor and differs to conventional silylated polymers due to its high reactivity. This is a direct consequence of the structural... [See More]

  • Form / Function: Liquid
  • Cure / Technology: Two Component  
  • Chemical System: Silicone
  • Industry: Construction
Di-Pak™ E-4500 Elastomeric Eletrical Insulating Compound -- E-4540
from Hapco, Inc.

Flexible, 45, 65 and, 95 shore A hardness, potting and encapsulating systems. Flame retardant (FR), accelerated 3 minute (-3) gel time, and black or unpigmented versions are available. [See More]

  • Type: High Dielectric
  • Cure / Technology: Thermoset; Two Component  
  • Form / Function: Liquid
  • Features: Flame Retardant
Electrically Non-Conductive Adhesives -- LOCTITE ABLESTIK UV300X
from Henkel Corporation - Industrial

LOCTITE ABLESTIK UV300X, Acrylate, Assembly, Single Component, Photocurable Adhesive LOCTITE ® ABLESTIK UV300X single component, photocurable adhesive is designed for disk drive assembly applications such as conformal coating and component tracking. This product also contains a secondary thermal... [See More]

  • Cure / Technology: UV or Radiation Cured; Single Component
  • Viscosity: 70000
3M Scotch-Weld 270 Black Base & Accelerator (B/A) Potting & Encapsulating Compound - 1 gal - 82263 -- 021200-82263 [62326674306 from 3M]
from R. S. Hughes Company, Inc.

3M Scotch-Weld 270 black potting & encapsulating compound is compatible with aluminum, glass, plastic, rubber and steel materials with a 48 hr cure time. Provides a 60 to 70 min working time. Works in a mix ratio of 1:1. Delivers great performance with a shear strength of 2450 to 2500 psi. [See More]

  • Thermal Conductivity: 0.1770
  • Dielectric Strength: 850
TECHNOMELT PA 2384 -- 8807299842049
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Polyamide
  • Form / Function: Pellets
  • Cure / Technology: Thermoplastic / Hot Melt; Single Component
Adhesive; Epoxy Potting Compound; Clear -- 70113955 [DP-270-CLEAR from 3M Electronics and Energy Business]
from Allied Electronics, Inc.

Silver Print, 27 °C Flash Point, 1.6 Specific Gravity. The Scotch-Weld EPX Applicator System is a fast, convenient way to simultaneously meter, mix and apply two-component adhesives and potting compounds. The system features handy Duo-Pak cartridges that snap quickly into the durable,... [See More]

  • Form / Function: Liquid; Die Bonding Adhesives
  • Chemical System: Epoxy
High Thermally Conductive Paste -- OMEGATHERM® OT-201 Series
from OMEGA Engineering, Inc.

OMEGATHERM thermal conducting paste is a high temperature and high thermally conductive paste product. They are specially formulated for permanent and temporary bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics,... [See More]

  • Type: High Dielectric; Thermally Conductive
  • Cure / Technology: Single Component
  • Chemical System: Silicone
  • Use Temperature: 392
Epoxy Adhesive -- ANE-46505
from Protavic America, Inc.

Amber epoxy system . Excellent for use in high heat (steam) and chemical environments. 2 hour gel time.Bonds well to metal, plastics and wood. High thermal shock resistance. Available in colors and higher or lower viscosities. Passes NASA outgassingrequirements. [See More]

  • Type: High Dielectric
  • Chemical System: Epoxy
  • Form / Function: Liquid; Die Bonding Adhesives
  • Composition: Unfilled
Flame Retardant Polyurethane -- 50-2369 FR
from Epoxies Etc...

The 50-2369FR Potting and Encapsulating Compound has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-2369 FR Urethane is listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low exotherm, and excellent electrical... [See More]

  • Type: Thermally Conductive
  • Chemical System: Polyurethane
  • Form / Function: Gel
  • Composition: Filled
734 Flowable Sealant -- 734CL300ML CRT [734CL300ML CRT from Dow Corning Oil & Gas Solutions]
from Applied Industrial Technologies

10.1 oz Cartridge; Clear; One Part RTV Liquid; Cures At Room Temperature; Not For Use on Vertical Or Overhead Surfaces [See More]

  • Form / Function: Liquid
  • Features: UL Rating
  • Cure / Technology: Single Component; Room Temperature Vulcanizing or Curing; Cure By Acetic Acid
  • Industry: Automotive; Electronics; Compressors, Gear Boxes, Pumps
GENIOSIL® XT SILANE TERMINATED POLYMER -- GENIOSIL® XT 50
from Wacker Chemical Corp.

GENIOSIL® XT 50 is a silicone-modified polyetherbasedsilane-terminated polymer suitable as a binderin moisture curing formulations. It is a clear liquid witha slight but characteristic odor and differs toconventional silylated polymers due to its highreactivity. This is a direct consequence of the... [See More]

  • Form / Function: Liquid
  • Cure / Technology: Two Component   (optional feature); Single Component; Reactive or Moisture Cured
  • Chemical System: Silicone
  • Industry: Construction
Di-Pak™ E-4600 Elastomeric Eletrical Insulating Compound -- E-4650
from Hapco, Inc.

Flexible, high strength, 50 to 71 shore D hardness potting and encapsulating systems. Available in flame retardant (FR), 3 minute (-3) gel time, and in black or unpigmented. [See More]

  • Type: High Dielectric
  • Cure / Technology: Thermoset; Two Component  
  • Form / Function: Liquid
  • Features: Flame Retardant
Encapsulants -- TECHNOMELT AS 8998
from Henkel Corporation - Industrial

TECHNOMELT AS 8998, Hot Melt Polyolefin, Masking TECHNOMELT ® AS 8998 peelable hot melt adhesive is recommended for use for masking off areas that needs protection before conformal coating applications. It is formulated to have excellent slump resistance up to 100 °C. TECHNOMELT AS 8998 is... [See More]

  • Cure / Technology: Thermoplastic / Hot Melt
  • Viscosity: ? to 4000
3M Scotch-Weld 270 Black Base (Part B) Potting & Encapsulating Compound - 5 gal Pail - 82264 -- 021200-82264 [62326685302 from 3M]
from R. S. Hughes Company, Inc.

3M Scotch-Weld 270 black potting & encapsulating compound is compatible with aluminum, glass, plastic, rubber and steel materials with a 48 hr cure time. Provides a 60 to 70 min working time. Works in a mix ratio of 1:1. Delivers great performance with a shear strength of 2450 to 2500 psi. [See More]

  • Thermal Conductivity: 0.1770
  • Dielectric Strength: 850
TECHNOMELT PA 2692
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Polyamide
  • Form / Function: Pellets
  • Cure / Technology: Thermoplastic / Hot Melt
EPOXY - OPTICALLY CLEAR ENCAPSULATING &POTTING COMPOUND, 320 mL Liquid -- 70125741 [8321C-320ML from MG Chemicals]
from Allied Electronics, Inc.

Ideal for potting LED lights or other optics. Can be cured with or without heating. It is tough, water and chemical resistant, an electrical insulator, and has excellent maching properties. Features. Water Clear Potting. Non-Porous, Water and Chemical Resistant [See More]

  • Form / Function: Liquid; Die Bonding Adhesives
  • Viscosity: 900
  • Chemical System: Epoxy
Thermally Conductive Grease -- OT-201 Series
from OMEGA Engineering, Inc.

OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics, paper products. [See More]

  • Type: High Dielectric; Thermally Conductive
  • Cure / Technology: Single Component
  • Chemical System: Silicone
  • Use Temperature: 392
Flame Retardant Thermally Conductive -- 50-3150 FR
from Epoxies Etc...

50-3150 FR has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-3150 FR Black Epoxy with Catalyst 190 and Catalyst 105 are listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low shrinkage, and outstanding insulation... [See More]

  • Type: Thermally Conductive
  • Chemical System: Epoxy
  • Form / Function: Liquid
  • Composition: Unfilled
734 Flowable Sealant -- 734CL90ML TUBE [734CL90ML TUBE from Dow Corning Oil & Gas Solutions]
from Applied Industrial Technologies

3 oz Tube; Clear; One Part RTV Liquid; Cures At Room Temperature; Not For Use on Vertical Or Overhead Surfaces [See More]

  • Form / Function: Liquid
  • Features: UL Rating
  • Cure / Technology: Single Component; Room Temperature Vulcanizing or Curing; Cure By Acetic Acid
  • Industry: Automotive; Electronics; Compressors, Gear Boxes, Pumps
Silicone Elastomer Gel Encapsulant And Potting Compound -- SilGel® 612 A/B
from Wacker Chemical Corp.

WACKER SilGel ® 612 A/B is a pourable, additioncuring, RTV-2 silicone rubber that vulcanizes at room temperature to a very soft silicone gel. Special features. two-part, 1 : 1 mixing ratio. low viscosity. rapid heat cure. very low hardness (silicone gel). crystal clear. pronounced inherent tack. [See More]

  • Type: Optical
  • Chemical System: Silicone; Elastomeric
  • Form / Function: Liquid
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Di-Pak™ Elastomeric Eletrical Insulating Compound -- E-4501
from Hapco, Inc.

Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E products are flame... [See More]

  • Type: High Dielectric; Thermally Conductive
  • Cure / Technology: Thermoset; Two Component  
  • Form / Function: Liquid
  • Features: Flame Retardant; UL Rating
Encapsulants -- TECHNOMELT PA 638
from Henkel Corporation - Industrial

TECHNOMELT PA 638, Polyamide, Molding compound thermoplastic TECHNOMELT ® PA 638 high performance thermoplastic polyamide is designed to meet low pressure molding process requirements. This product can be processed at low processing pressure due to its low viscosity, allowing encapsulation of... [See More]

  • Form / Function: Liquid
  • Use Temperature: 40 to 212
  • Chemical System: Polyamide
  • Viscosity: 4000
3M Scotch-Weld 270 Clear Base (Part B) Potting & Encapsulating Compound - 5 gal Pail - 82250 -- 021200-82250 [62326285301 from 3M]
from R. S. Hughes Company, Inc.

3M Scotch-Weld 270 clear potting & encapsulating compound is compatible with aluminum, glass, plastic, rubber and steel materials with a 48 hr cure time. Provides a 60 to 70 min working time. Works in a mix ratio of 1:1. Delivers great performance with a shear strength of 2450 to 2500 psi. [See More]

  • Thermal Conductivity: 0.1770
  • Dielectric Strength: 850
TECHNOMELT PA 341 -- 8802588327937
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Polyamide
  • Form / Function: Pellets
  • Cure / Technology: Thermoplastic / Hot Melt
Epoxy Compound; for potting and encapsulating; 2 part; black; .8 gal liquid -- 70125817 [832B-3L from MG Chemicals]
from Allied Electronics, Inc.

Instant Adhesives, Cyanoacrylate Chemical Component. Provides excellent protection from impact, shock, conductivity, moisture, abuse, chemicals and analysis. Provides technology security. Excellent for explosion proof components. Encapsulating epoxy kit, reaction product of epichlorohydrin and... [See More]

  • Form / Function: Liquid; Die Bonding Adhesives
  • Chemical System: Epoxy
Flexible UV Curable Compound -- UV 60-7016
from Epoxies Etc...

UV 60-7016 is a high performance Ultraviolet Curable Adhesive, Sealant, and Potting Compound. This new one component urethane acrylate system was specifically designed for the difficult bonding of glass to metal. UV 60-7016 has outstanding thermal shock and impact resistance, and is an excellent... [See More]

  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
  • Composition: Unfilled
  • Chemical System: Elastomeric; Polyurethane
  • Cure / Technology: UV or Radiation Cured; Single Component
Di-Pak™ Elastomeric Eletrical Insulating Compound -- E-4888
from Hapco, Inc.

High performance, flexible potting systems designed to be in constant water immersion while maintaining electrical and physical properties. DI-PAK E-4888 & E-4889 were designed to meet Naval underwater applications. [See More]

  • Type: High Dielectric
  • Cure / Technology: Thermoset; Two Component  
  • Form / Function: Liquid
  • Industry: Electronics
Industrial Adhesives -- LOCTITE STYCAST UV 7993
from Henkel Corporation - Industrial

LOCTITE STYCAST UV 7993, Urethane, Conformal coating LOCTITE STYCAST UV 7993 is a conformal coating designed to provide rugged protection from moisture and harsh chemicals. It is compatible with industry standard solder masks, no-clean fluxes, metallization, components and substrate materials. [See More]

  • Chemical System: Polyurethane
  • Viscosity: 120
  • Cure / Technology: UV or Radiation Cured; Single Component
3M Scotch-Weld 812NS Yellow Accelerator (Part A) Potting & Encapsulating Compound - 5 gal Pail - 64501 -- 051115-64501 [62366785301 from 3M]
from R. S. Hughes Company, Inc.

3M Scotch-Weld 812NS yellow potting & encapsulating compound is compatible with metal, plastic and wood materials. Provides a 10 min working time. Works in a mix ratio of 1:1. [See More]

TECHNOMELT PA 5375
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Polyolefin
  • Form / Function: Pellets
  • Cure / Technology: Thermoplastic / Hot Melt; Single Component
Epoxy Compound; for potting and encapsulating; 2 part; black; 12 oz liquid -- 70125812 [832B-375ML from MG Chemicals]
from Allied Electronics, Inc.

Instant Adhesives, Cyanoacrylate Chemical Component. Provides excellent protection from impact, shock, conductivity, moisture, abuse, chemicals and analysis. Provides technology security. Excellent for explosion proof components. Encapsulating epoxy kit, reaction product of epichlorohydrin and... [See More]

  • Form / Function: Liquid; Die Bonding Adhesives
  • Chemical System: Epoxy
Di-Pak™ Elastomeric Eletrical Insulating Compound -- E-4901-2
from Hapco, Inc.

Low cost, easy to use, potting compounds with fast cycle times. Available in 3 speeds. [See More]

  • Type: High Dielectric
  • Cure / Technology: Thermoset; Two Component  
  • Form / Function: Liquid
  • Industry: Electronics
Thermal Interface Materials -- BERGQUIST GAP PAD TGP 7000ULM
from Henkel Corporation - Industrial

BERGQUIST GAP PAD TGP 7000ULM, Thermally conductive soft gap filling material, For high performance applications. BERGQUIST GAP PAD TGP 7000ULM is an extremely soft gap filling material rated at a thermal conductivity of 7.0 W/m-K. It is specially formulated for high performance applications... [See More]

  • Type: Thermally Conductive
  • Chemical System: Silicone
  • Form / Function: Gap Filler, Foam in Place Gasket
  • Use Temperature: 140 to 392
3M Scotch-Weld DP270 Black Base & Accelerator (B/A) Potting & Encapsulating Compound - 1.7 fl oz Cartridge - 82262 -- 021200-82262 [62326614351 from 3M]
from R. S. Hughes Company, Inc.

3M Scotch-Weld DP270 black potting & encapsulating compound is compatible with aluminum, glass, plastic, rubber and steel materials with a 48 hr cure time. Provides a 60 to 70 min working time. Works in a mix ratio of 1:1. Delivers great performance with a shear strength of 2450 to 2500 psi. [See More]

  • Thermal Conductivity: 0.1770
  • Dielectric Strength: 850
TECHNOMELT PA 6208 Black -- 8799566462977
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Polyamide
  • Form / Function: Pellets
  • Cure / Technology: Thermoplastic / Hot Melt; Single Component
Epoxy Compound; for potting and encapsulating; 2 part; clear; .8 gal liquid -- 70125827 [832C-3L from MG Chemicals]
from Allied Electronics, Inc.

Instant Adhesives, Cyanoacrylate Chemical Component. Provides excellent protection from impact, shock, conductivity, moisture, abuse, chemicals and analysis. Provides technology security. Excellent for explosion proof components. Encapsulating epoxy kit, reaction product of epichlorohydrin and... [See More]

  • Form / Function: Liquid; Die Bonding Adhesives
  • Chemical System: Epoxy
Di-Pak™ Rigid Eletrical Insulating Compound -- R-4200
from Hapco, Inc.

DI-COAT R-4721 / DI-COAT R-4721 LV (lower viscosity). Shore 90 D, room temperature curing, medium to high thixotropic coating for dielectric insulating applications. DI-COAT R-4721 is ideal for use on vertical or sloping surfaces where flow or drain-off cannot be tolerated. DI-COAT R-4721 is easy to... [See More]

  • Type: High Dielectric
  • Cure / Technology: Thermoset; Two Component  
  • Form / Function: Liquid
  • Industry: Electronics
3M Scotch-Weld DP270 Black Base & Accelerator (B/A) Potting & Encapsulating Compound - 200 ml Dual Cartridge - 87836 -- 021200-87836 [62326638301 from 3M]
from R. S. Hughes Company, Inc.

3M Scotch-Weld DP270 black potting & encapsulating compound is compatible with aluminum, glass, plastic, rubber and steel materials with a 48 hr cure time. Provides a 60 to 70 min working time. Works in a mix ratio of 1:1. Delivers great performance with a shear strength of 2450 to 2500 psi. [See More]

  • Thermal Conductivity: 0.1770
  • Dielectric Strength: 850
TECHNOMELT PA 668 Clear
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Type: High Dielectric; Optical; Thermally Conductive
  • Chemical System: Polyamide
  • Form / Function: Pellets
  • Cure / Technology: Thermoplastic / Hot Melt
Epoxy Compound; for potting and encapsulating; 2 part; clear; 12 oz liquid -- 70125822 [832C-375ML from MG Chemicals]
from Allied Electronics, Inc.

Instant Adhesives, Cyanoacrylate Chemical Component. Provides excellent protection from impact, shock, conductivity, moisture, abuse, chemicals and analysis. Provides technology security. Excellent for explosion proof components. Encapsulating epoxy kit, reaction product of epichlorohydrin and... [See More]

  • Form / Function: Liquid; Die Bonding Adhesives
  • Chemical System: Epoxy
Filter-bond™ Elastomeric Casting and Potting Compound -- E-3264
from Hapco, Inc.

Filter-bond ™ is a series of casting and potting compounds ideally suited for potting, sealing, and bonding filtration and ultrafiltration products. The Filter-bond ™ E-Series is manufactured to ultra-high quality standards and has been used by customers to pass FDA approval. Filter-bond... [See More]

  • Form / Function: Liquid
  • Cure / Technology: Two Component  
  • Chemical System: Elastomeric; Polyurethane
  • Features: Flexible
3M Scotch-Weld DP270 Black Base & Accelerator (B/A) Potting & Encapsulating Compound - 400 ml Dual Cartridge - 87837 -- 021200-87837 [62326635307 from 3M]
from R. S. Hughes Company, Inc.

3M Scotch-Weld DP270 black potting & encapsulating compound is compatible with aluminum, glass, plastic, rubber and steel materials with a 48 hr cure time. Provides a 60 to 70 min working time. Works in a mix ratio of 1:1. Delivers great performance with a shear strength of 2450 to 2500 psi. [See More]

  • Thermal Conductivity: 0.1770
  • Dielectric Strength: 850
Epoxy; Flame Retardant Epoxy Encapsulating & Potting Compound; Black; 0.8 Gal. -- 70125732 [833FRB-3L from MG Chemicals]
from Allied Electronics, Inc.

A two component self extinguishing epoxy compound. Provides insulation and protects sensitive components and circuits from: static discharge, impact, heat, shock, conductivity, abuse, vibration, moisture, fresh and salt water, chemicals and analysis. [See More]

  • Form / Function: Die Bonding Adhesives
  • Features: Flame Retardant
  • Chemical System: Epoxy
  • Use Temperature: 437
3M Scotch-Weld DP270 Clear Base & Accelerator (B/A) Potting & Encapsulating Compound - 1.7 fl oz Dual Cartridge - 82248 -- 021200-82248 [62326214350 from 3M]
from R. S. Hughes Company, Inc.

3M Scotch-Weld DP270 clear potting & encapsulating compound is compatible with aluminum, glass, plastic, rubber and steel materials with a 48 hr cure time. Provides a 60 to 70 min working time. Works in a mix ratio of 1:1. Delivers great performance with a shear strength of 2450 to 2500 psi. [See More]

  • Thermal Conductivity: 0.1770
  • Dielectric Strength: 850
Epoxy; Flame Retardant Epoxy Encapsulating & Potting Compound; Black; 12 Oz. -- 70125731 [833FRB-375ML from MG Chemicals]
from Allied Electronics, Inc.

A two component self extinguishing epoxy compound. Provides insulation and protects sensitive components and circuits from: static discharge, impact, heat, shock, conductivity, abuse, vibration, moisture, fresh and salt water, chemicals and analysis. Copper Electroplating Solution and is ready to... [See More]

  • Form / Function: Die Bonding Adhesives
  • Features: Flame Retardant
  • Chemical System: Epoxy
  • Use Temperature: 437
3M Scotch-Weld DP805 Off-White Base & Accelerator (B/A) Potting & Encapsulating Compound - 1.6 fl oz Dual Cartridge - 83758 -- 021200-83758 [62328814355 from 3M]
from R. S. Hughes Company, Inc.

3M Scotch-Weld DP805 off-white potting & encapsulating compound is compatible with ceramic, metal, plastic and wood materials with a 24 hr cure time. Provides a 3 to 4 min working time. Works in a mix ratio of 1:1. Delivers great performance with a shear strength of 3500 psi. [See More]

POTTING EPOXY 8 OZ -- 70159833 [19-823 from GC Electronics]
from Allied Electronics, Inc.

3M Scotch-Weld ™ Epoxy Potting Compound-Adhesives. Black opaque highly filled epoxy used for potting and encapsulating electronic circuits. Use to environmentally protect or conceal circuits. This product is excellent when used with GC Chassis Boxes. Working Time (Pott Life): 1 hour. Mix... [See More]

  • Form / Function: Liquid; Die Bonding Adhesives
  • Use Temperature: -40 to 300
  • Chemical System: Epoxy
3M Scotch-Weld DP805 Off-White Base & Accelerator (B/A) Potting & Encapsulating Compound - 6.76 fl oz Dual Cartridge - 87828 -- 021200-87828 [62328838305 from 3M]
from R. S. Hughes Company, Inc.

3M Scotch-Weld DP805 off-white potting & encapsulating compound is compatible with ceramic, metal, plastic and wood materials with a 24 hr cure time. Provides a 3 to 4 min working time. Works in a mix ratio of 1:1. Delivers great performance with a shear strength of 3500 psi. [See More]

Scotch-Weld Epoxy Potting Compound Black, 400 mL -- 70113003 [DP270-BLACK-400ML from 3M Electronics and Energy Business]
from Allied Electronics, Inc.

Scotch-Weld Epoxy Potting Compound Black, 400 mL [See More]

  • Form / Function: Die Bonding Adhesives
  • Chemical System: Epoxy
3M Scotch-Weld DP805 Off-White Base (Part B) Potting & Encapsulating Compound - 5 gal - 87233 -- 021200-87233 [62328885306 from 3M]
from R. S. Hughes Company, Inc.

3M Scotch-Weld DP805 off-white potting & encapsulating compound is compatible with ceramic, metal, plastic and wood materials with a 24 hr cure time. Provides a 3 to 4 min working time. Works in a mix ratio of 1:1. Delivers great performance with a shear strength of 3500 psi. [See More]

Silicone; hi temp; encapsulating & sealing; red paste; 3 oz cartridge -- 70125880 [RTV106-85ML from MG Chemicals]
from Allied Electronics, Inc.

Specific Gravity 1.07, Red, RTV Silicone Adhesive Sealant. Offering higher performance qualities over conventional RTV silicones. MG Chemicals sealants will bond to many clean surfaces without the aid of primers. Many of these one-part RTV silicone adhesive sealants are suitable for assembly... [See More]

  • Chemical System: Silicone
  • Use Temperature: -76 to 500
  • Features: UL Rating
  • Thermal Conductivity: 0.2092
3M Scotch-Weld DP807 Off-White Base (Part B) Potting & Encapsulating Compound - 5 gal Pail - 31638 -- 051115-31638 [62329085302 from 3M]
from R. S. Hughes Company, Inc.

3M Scotch-Weld DP807 off-white potting & encapsulating compound is compatible with ceramic, metal, plastic and wood materials with a 24 hr cure time. Provides a 4 to 6 min working time. Works in a mix ratio of 1:1. Delivers great performance with a shear strength of 2500 psi. [See More]

Silicone; high temp potting; red;1 gal;2 part; requires SS4155 primer -- 70125507 [RTV60-1G from MG Chemicals]
from Allied Electronics, Inc.

Silicone; high temp potting; red;1 gal;2 part; requires SS4155 primer [See More]

  • Chemical System: Silicone
  • Thermal Conductivity: 0.3100
  • Use Temperature: -65 to 500
  • Tensile (Break): 990
3M Scotch-Weld DP807 Yellow Base & Accelerator (B/A) Potting & Encapsulating Compound - 13.53 fl oz Dual Cartridge - 31637 -- 051115-31637 [62329035307 from 3M]
from R. S. Hughes Company, Inc.

3M Scotch-Weld DP807 yellow potting & encapsulating compound is compatible with ceramic, metal, plastic and wood materials with a 24 hr cure time. Provides a 4 to 6 min working time. Works in a mix ratio of 1:1. Delivers great performance with a shear strength of 3500 psi. [See More]