Encapsulant / Potting Compound Encapsulants and Potting Compounds
from Arnold Magnetic Technologies
Arnold Magnetic Technologies offers composite and metallic encapsulation solutions for a wide range of permanent magnet systems and applications. While metallic sleeved magnet containment solutions are used extensively for magnet containment, Wraptite composite sleeves offer a superior design... [See More]
- Chemical System: Include Carbon Fiber, Zylon Fiber And Glass Fiber Composites
- Industry: Aerospace; Automotive; OEM or Industrial; Oil and Gas
- Cure / Technology: Wound in place or pressed on sleeve
- Use Temperature: 338
from MacDermid Alpha Electronics Solutions
Flame-retardant two-part epoxy potting and encapsulating compound, offering a cost-effective solution for various applications. Product Overview. ER2188 General Purpose Epoxy Potting Compound is a two-part epoxy resin designed for general use in the electronics industry. It offers a cost-effective... [See More]
- Type: Thermally Conductive
- Cure / Technology: Two Component
- Chemical System: Epoxy
- Features: Flame Retardant
from ELANTAS North America LLC
ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]
- Type: High Dielectric
- Chemical System: Epoxy
- Form / Function: Liquid
- Composition: Filled
from RS Components, Ltd.
Gel box line ISAAC 4 [See More]
- Form / Function: Blister; Gel
- Use Temperature: 194
from Master Bond, Inc.
MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]
- Type: High Dielectric; Optical; Thermally Conductive
- Chemical System: Silicone
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid
- Composition: Unfilled
from Dymax
Multi-Cure ® 9001-E-V3.0 is a performance grade with improved moisture and thermal cycle resistance and adhesion to various component substrates. Curing completely in as little as 5 seconds upon exposure to LED, longwave UV, and visible light, this material is environmentally resistant with... [See More]
- Cure / Technology: UV or Radiation Cured
- Viscosity: 400
from DigiKey
Thermal Potting Compound, 2 Part 0.75 kg Container [See More]
- Thermal Conductivity: 1.1
from TE Connectivity
Body Features. Primary Product Color : Transparent. Electrical Characteristics. Voltage Class (KV) : ≤ 1. Industry Standards. UL Flammability Rating : No. Operation/Application. Mechanical Resistance : Mechanical Protection & Insulation. Packaging Features. [See More]
- Chemical System: Two-Component Hydrocarbon Resin
from CHT USA Inc.
CHT's QSil 12 is a 2-part, condensation cure, transparent, low viscosity, liquid silicone elastomer which cures at room temperature. QSil 12 is primarily intended for electronic and lighting potting applications. This material is typically mixed at a ratio of 100:5. Once mixed, the material is... [See More]
- Cure / Technology: Two Component ; Condensation
- Use Temperature: -67 to 399
- Industry: Automotive; Electronics
- Thermal Conductivity: 0.1800
from Hernon Manufacturing, Inc.
Tuffbond ® 302 is a modified epoxy adhesive that provides a very fast room temperature cure. Tuffbond ® 302 exhibits very good moisture chemical and heat resistance. This very fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loud speakers. Tuffbond ® 302... [See More]
- Form / Function: 50 ml (two component)
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Chemical System: Ceramic; Epoxy
from Ellsworth Adhesives
3M Scotch-Weld DP270 Epoxy Adhesive Duo-Pak Black is a two-part epoxy adhesive. It is used for the potting and encapsulation of many heat sensitive or delicate components. It has good thermal shock resistance, long worklife, and excellent electrical properties. 400 mL Cartridge. [See More]
- Chemical System: Epoxy
- Thermal Conductivity: 0.1770
- Cure / Technology: Two Component
- Dielectric Strength: 850
from RS Components, Ltd.
Gel box line WATT [See More]
- Form / Function: Blister; Gel
- Use Temperature: 194
from Master Bond, Inc.
EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]
- Type: High Dielectric; Thermally Conductive
- Chemical System: Epoxy
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
- Composition: Unfilled
from Dymax
Dual-cure 9014 encapsulant is formulated to cure primarily with UV light and includes a secondary moisture curing function for applications where shadow areas exist on printed circuit boards. Curing in seconds upon exposure to UV light energy, the product increases manufacturing efficiency because... [See More]
- Form / Function: Gel
- Industry: electric vehicle battery management systems
- Cure / Technology: UV or Radiation Cured
- Viscosity: 18000
from DigiKey
SILICONE POTTING COMPOUND 1KG GR [See More]
- Use Temperature: -13 to ?
- Thermal Conductivity: 2.8
from TE Connectivity
Body Features. Primary Product Color : Blue. Electrical Characteristics. Voltage Class (KV) : ≤ 7.2, ≤ 1. Industry Standards. Compatible With Approved Standards Products : EN 50393, HD 631.1 S2. UL Flammability Rating : No. Operation/Application. Mechanical... [See More]
- Chemical System: Polyurethane; Two-Part Polyurethane
from CHT USA Inc.
CHT's QSil 58 is a 2-part, condensation cure, high temperature, self-leveling, silicone elastomer primarily used for electronic potting applications to provide protection from moisture, debris, vibration and shock. The two applicable catalysts are 0.5% DBT by weight and 10% Deep Section Catalyst by... [See More]
- Cure / Technology: Two Component ; Condensation
- Use Temperature: -65 to 500
- Industry: Automotive; Electronics
- Thermal Conductivity: 0.3100
from Hernon Manufacturing, Inc.
Tuffbond ® 304 is a modified epoxy adhesive that provides a very fast room temperature cure. Tuffbond ® 304 exhibits very good moisture chemical and heat resistance. This very fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loudy speakers. Tuffbond ® 304... [See More]
- Form / Function: 20 gm
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Chemical System: Ceramic; Epoxy
from Ellsworth Adhesives
3M Scotch-Weld Epoxy Potting Compound/Adhesive DP270 Black is a two component, epoxy resin system that is used for sealing, encapsulating, and potting electronic and heat sensitive components. It offers low viscosity, long handling times, noncorrosive to copper, good electrical properties, and... [See More]
- Chemical System: Epoxy
- Thermal Conductivity: 0.1770
- Cure / Technology: Two Component
- Dielectric Strength: 850
from RS Components, Ltd.
Gel box line KELVIN [See More]
- Form / Function: Blister; Gel
- Use Temperature: 194
from Master Bond, Inc.
One part, nano silica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]
- Type: High Dielectric; Thermally Conductive
- Chemical System: UV Curing
- Form / Function: Liquid; Encapsulant or Conformal Coating; Glob Top, Daub, Doming or Overfill
- Composition: Filled
from Dymax
Multi-Cure ® 9037-F is a resilient chip encapsulant designed for applications where a thixotropic, high-viscosity encapsulant or a damming material is required. This is often the case for conventional glob top encapsulation applications – for chip on glass, chip on board, or chip on flex... [See More]
- Cure / Technology: UV or Radiation Cured
- Viscosity: 55000
from DigiKey
Thermal Potting Compound, 2 Part 0.75 kg Container [See More]
- Thermal Conductivity: 1.1
from TE Connectivity
Body Features. Color : Black. Industry Standards. UL Rating : No. Operation/Application. Application : Potting. Halogen Free : Yes. Isocyanate-Free : No. Label-Free Acc REACH & CLP : No. Marine-Offshore-Shipbuilding Certified : No. [See More]
- Chemical System: Polyurethane; Two-Component Polyurethane
from CHT USA Inc.
CHT's QSil 216 is a 2-part, platinum cure, optically clear silicone encapsulant designed for optical applications. QSil 216 features a 10:1 mix ratio by weight and its low viscosity profile enables excellent flow around components and is excellent for potting complex parts. The chemical composition... [See More]
- Type: High Dielectric; Optical
- Industry: Automotive; Electronics; OEM or Industrial
- Cure / Technology: Two Component ; Addition
- Use Temperature: -67 to 399
from Hernon Manufacturing, Inc.
Tuffbond ® 305 is a modified epoxy adhesive that provides a very fast room temperature cure. Tuffbond ® 305 exhibits very good moisture chemical and heat resistance. This very fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loud speakers. Tuffbond ® 305... [See More]
- Form / Function: 50 ml (two component)
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Chemical System: Ceramic; Epoxy
from Ellsworth Adhesives
3M Scotch-Weld Epoxy Potting Compound/Adhesive DP270 Clear is a two component, epoxy resin system that is used for sealing, encapsulating, and potting electronic and heat sensitive components. It offers low viscosity, long handling times, noncorrosive to copper, good electrical properties, and... [See More]
- Chemical System: Epoxy
- Thermal Conductivity: 0.1770
- Cure / Technology: Two Component
- Dielectric Strength: 850
from RS Components, Ltd.
Gel box line ISAAC 4 MP [See More]
- Form / Function: Pack; Gel
- Use Temperature: 194
from Master Bond, Inc.
MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]
- Type: Electrically Conductive; Thermally Conductive
- Chemical System: Silicone
- Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating
- Composition: Filled
from Dymax
UV Light + moisture cure 9201-W electronic encapsulant is a next-generation product formulated without materials of concern such as IBOA (isobornyl acrylate), a known skin sensitizer. This encapsulant utilizes low-sensitizing ingredients, making it optimal for assembling end-user consumer wearable... [See More]
- Form / Function: Gel
- Industry: encapsulating wire bonds, chip-on-board, or chip-on-flex circuits
- Cure / Technology: UV or Radiation Cured
- Elongation: 178.0
from DigiKey
SI 5140 METHOXY 85 GR TB/BN [See More]
- Features: Non-corrosive
from TE Connectivity
Body Features. Color : Opaque. Flexibility : Elastic. Industry Standards. UL Rating : No. Operation/Application. Application : Potting. Halogen Free : Yes. Isocyanate-Free : No. Label-Free Acc REACH & CLP : No. Marine-Offshore-Shipbuilding... [See More]
- Chemical System: Polyurethane; Two-Component Polyurethane
from CHT USA Inc.
CHT's QSil 563 is a 2-part, platinum cure, 100% silicone solids elastomer designed for electronic potting and encapsulation applications. QSil 562 offers a hard, low modulus material that is readily repairable. QSil 563 is thermally conductive to aid in efficient heat dissipation. This silicone... [See More]
- Type: Thermally Conductive
- Features: Flame Retardant; UL Rating
- Cure / Technology: Two Component ; Addition
- Industry: Automotive; Electronics
from Hernon Manufacturing, Inc.
Tuffbond ® 313 adhesive/sealant is a two component, 100% solid system, one to one ratio, room temperature cure system. Tuffbond ® 313 is recommended for bonding metals, wood, ceramics, etc., and can be used for potting and encapsulation of electrical and electronic components. [See More]
- Form / Function: 50 ml (two component)
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Ceramic
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
from Ellsworth Adhesives
Dow 3-4237 Dielectric Firm Gel Clear-Green is a two component, room temperature curing, silicone gel that is used for potting, sealing, encapsulating, and protecting electrical components from contaminants, moisture, and stress. It is durable, flexible, self healing, and offers long working times. [See More]
- Type: High Dielectric
- Cure / Technology: Two Component
- Chemical System: Silicone
- Industry: Electronics
from RS Components, Ltd.
Gel box line PASCAL 6 MP [See More]
- Form / Function: Pack; Gel
- Use Temperature: 194
from Master Bond, Inc.
EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]
- Type: High Dielectric; Thermally Conductive
- Chemical System: Epoxy
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
- Composition: Unfilled
from Dymax
Dual-cure 9210-W electronic encapsulant is designed for FPC reinforcement, selective coating, and component encapsulation applications in consumer wearable devices. The product cures with light energy first and then ambient moisture for parts where shadow areas are present. 9210-W is IBOA-free and... [See More]
- Cure / Technology: UV or Radiation Cured
- Elongation: 28.2
- Industry: consumer wearable devices.
- Viscosity: 29000
from DigiKey
SI 5140 METHOXY 300ML CQ/BN [See More]
- Features: Non-corrosive
from TE Connectivity
Body Features. Primary Product Color : Brown. Electrical Characteristics. Voltage Class (KV) : ≤ 1. Industry Standards. UL Flammability Rating : No. Operation/Application. Mechanical Resistance : Mechanical Protection & Insulation. Packaging Features. Packaging... [See More]
- Chemical System: Polyurethane; Two-Part Polyurethane
from CHT USA Inc.
CHT's QSil 553 is a 2-part, platinum cure, silicone potting compound and encapsulant designed to protect electronic components from harsh environmental conditions and shock and vibration. It features a low viscosity for convenient dispensing and will easily flow throughout components. Because of its... [See More]
- Type: Thermally Conductive
- Features: Flame Retardant; UL Rating
- Cure / Technology: Two Component ; Addition
- Industry: Automotive; Electronics; OEM or Industrial
from Hernon Manufacturing, Inc.
Tuffbond ® 315 is a modified epoxy adhesive that provides a fast room temperature cure. Tuffbond ® 315 exhibits very good moisture chemical and heat resistance. This fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loudy speakers. Tuffbond ® 315 is also... [See More]
- Form / Function: 50 ml (two component)
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Chemical System: Ceramic; Epoxy
from Ellsworth Adhesives
Dow DOWSIL ™ 3-4150 Dielectric Gel Clear-Green is a two component, fast room temperature curing, silicone gel that is used for potting, sealing, encapsulating, and protecting a variety of materials in the electronics industry. It offers flexibility, stress relief, and offers excellent... [See More]
- Type: High Dielectric
- Cure / Technology: Two Component
- Chemical System: Silicone
- Dielectric Strength: 381
from RS Components, Ltd.
Gel box line WATT MP [See More]
- Form / Function: Pack; Gel
- Use Temperature: 194
from Master Bond, Inc.
Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]
- Type: Electrically Conductive; Thermally Conductive
- Chemical System: Polyphenylene Sulfide; Epoxy
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
- Composition: Filled
from Dymax
Dymax 9309-SC adhesive cures upon exposure to UV/Visible light to quickly ruggedize circuit board components. This edgebond material is ideal for applications where shock attenuation or ruggedization is necessary. The material provides rapid bonding to leadframe, PCB, silicon, and ceramic. The... [See More]
- Form / Function: Gel
- Industry: where shock attenuation or ruggedization is necessary.
- Cure / Technology: UV or Radiation Cured
- Viscosity: 45000
from DigiKey
TRANSFER ADHESIVE FOR DISPLAY WI [See More]
- Features: Flame Retardant
from TE Connectivity
Body Features. Primary Product Color : Beige. Electrical Characteristics. Voltage Class (KV) : ≤ 1. Industry Standards. Compatible With Approved Standards Products : HD 631.1 S2, EN 50393. UL Flammability Rating : No. Operation/Application. Mechanical Resistance... [See More]
- Chemical System: Polyurethane; Two-Part Polyurethane
from Hernon Manufacturing, Inc.
Tuffbond ® 316 is a two component, room temperature cure system. By changing the ratio of resin and hardener, the cured adhesive can change from a tough and flexible to a hard and rigid system. Tuffbond ® 316 is recommended for bonding metal, glass, wood, concrete, and rubber, and can be... [See More]
- Form / Function: 50 ml (two component)
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Elastomeric
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
from Ellsworth Adhesives
Dow DOWSIL ™ 3-4155 HV Dielectric Gel Clear-Green is a two component, high viscosity, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. It cures quickly at room temperature, offers flexibility, thermal stability,... [See More]
- Type: High Dielectric
- Cure / Technology: Two Component
- Chemical System: Silicone
- Industry: Electric Power
from RS Components, Ltd.
Gel box line KELVIN MP [See More]
- Form / Function: Pack; Gel
- Use Temperature: 194
from Master Bond, Inc.
Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating. [See More]
- Type: High Dielectric; Thermal Insulation
- Chemical System: Epoxy
- Form / Function: Liquid; Encapsulant or Conformal Coating
- Composition: Unfilled
from DigiKey
TWO-PART POTTING COMPOUND 100ML [See More]
from TE Connectivity
Body Features. Primary Product Color : Blue. Electrical Characteristics. Voltage Class (KV) : ≤ 12, ≤ 7.2, ≤ 36, ≤ 42, ≤ 15, ≤ 17.5, ≤ 46, ≤ 25, ≤ 35, ≤ 24. Industry Standards. Compatible With Approved Standards Products : HD 629.1. UL... [See More]
- Chemical System: Two-Part Hydrocarbon Resin
from Hernon Manufacturing, Inc.
Tuffbond ® 317 is a two component, room temperature cure system. By changing the ratio of resin and hardener, the cured adhesive can change from a tough and flexible to a hard and rigid system. The resin offers a unique combination of hardness and flexibility with high chemical and solvent... [See More]
- Form / Function: 50 ml (two component)
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Elastomeric
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
from Ellsworth Adhesives
Dow DOWSIL ™ 3-4207 Dielectric Tough Gel Clear-Green is a two component, room temperature curing, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. It is durable, fast curing, requires no primer, and has good... [See More]
- Type: High Dielectric
- Cure / Technology: Two Component
- Chemical System: Silicone
- Dielectric Strength: 425
from RS Components, Ltd.
Silicone compound DC4 tube 100g [See More]
- Form / Function: Tube
- Use Temperature: -58 to 392
- Chemical System: Silicone
- Thermal Conductivity: 0.1460
from Master Bond, Inc.
EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]
- Type: High Dielectric; Thermally Conductive
- Chemical System: Epoxy
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
- Composition: Unfilled
from DigiKey
TWO-PART POTTING COMPOUND 200ML [See More]
from TE Connectivity
Body Features. Primary Product Color : Transparent. Electrical Characteristics. Voltage Class (KV) : ≤ 1. Industry Standards. UL Flammability Rating : No. Operation/Application. Mechanical Resistance : Mechanical Shock & Vibration, High Elongation. Potting... [See More]
- Chemical System: Two-Part Hydrocarbon Resin
from Hernon Manufacturing, Inc.
Tuffbond ® 42121 is a thixotropic and modified epoxy adhesive that provides a very fast room temperature cure. Tuffbond ® 42121 exhibits very good moisture chemical and heat resistance. This very fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loud-speakers. [See More]
- Form / Function: 50 ml (two component)
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Chemical System: Ceramic; Epoxy
from Ellsworth Adhesives
Dow DOWSIL ™ 3-4207 Dielectric Tough Gel Clear-Green is a two component, room temperature curing, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. It is durable, fast curing, requires no primer, and has good... [See More]
- Type: High Dielectric
- Cure / Technology: Two Component
- Chemical System: Silicone
- Industry: Electronics
from RS Components, Ltd.
MG Black flexible epoxy 832FX 450ml [See More]
- Form / Function: Bottle
- Use Temperature: 284
- Chemical System: Epoxy; Epoxy
- Thermal Conductivity: 0.2600
from Master Bond, Inc.
EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]
- Type: High Dielectric; Thermally Conductive
- Chemical System: Epoxy
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
- Composition: Unfilled
from DigiKey
TWO-PART POTTING COMPOUND 400ML [See More]
from TE Connectivity
Body Features. Primary Product Color : Green. Electrical Characteristics. Voltage Class (KV) : ≤ 1. Industry Standards. Compatible With Approved Standards Products : EN 50393, HD 631.1 S2. UL Flammability Rating : No. Operation/Application. Mechanical Resistance... [See More]
- Chemical System: Two-Part Hydrocarbon Resin
from Hernon Manufacturing, Inc.
Tuffbond ® 65891 is a two-component, room temperature cure system. Tuffbond ® 65891 is recommended for bonding metal, glass, wood, concrete, and rubber, and can be used for potting and encapsulation of electrical and electronic components. [See More]
- Form / Function: 50 ml (two component)
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Elastomeric
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
from Ellsworth Adhesives
Dow DOWSIL ™ 3-4207 Dielectric Tough Gel Clear-Green is a two component, room temperature curing, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. It is durable, fast curing, requires no primer, and has good... [See More]
- Type: High Dielectric
- Cure / Technology: Two Component
- Chemical System: Silicone
- Industry: Electronics
from RS Components, Ltd.
MG Translucent epoxy 832C 450ml [See More]
- Form / Function: Cartridge
- Thermal Conductivity: 0.3090
- Chemical System: Epoxy; Epoxy
from Master Bond, Inc.
MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]
- Type: High Dielectric; Optical; Thermally Conductive
- Chemical System: Silicone
- Form / Function: Liquid
- Composition: Unfilled
from DigiKey
POTTING COMPOUND CLEAR 400ML [See More]
from TE Connectivity
Body Features. Color : Milky-Translucent. Electrical Characteristics. Potting Resin Voltage Rating : ≤ 36. Industry Standards. CSA Certified : No. Standards : HD 629.1. UL Rating : No. Operation/Application. Application : Potting. Free of Lead,... [See More]
- Form / Function: Liquid
- Chemical System: Silicone; Fluid Silicone
from Hernon Manufacturing, Inc.
Hernon 397 is a single component, high temperature resistant, heat activated epoxy. It cures to a high-performance thermoset system with excellent adhesion properties to a wide variety of substrates. Tuffbond 397 will change from amber-yellow to a reddish brown upon cure. Product... [See More]
- Chemical System: Epoxy
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Cure / Technology: Thermoset; Single Component
from Ellsworth Adhesives
Dow DOWSIL ™ 3-4222 Dielectric Firm Gel Clear-Green is a two component, room temperature curing, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. It is durable, fast curing, requires no primer, and has excellent... [See More]
- Type: High Dielectric
- Cure / Technology: Two Component
- Chemical System: Silicone
- Dielectric Strength: 350
from RS Components, Ltd.
Silicone gel encapsulant 2kg kit [See More]
- Form / Function: Kit
- Use Temperature: -67 to 392
- Chemical System: Silicone
from Master Bond, Inc.
Master Bond EP62-1 is a two component heat cured and chemically resistant epoxy resin system featuring a long pot life at ambient temperatures and efficient cures at moderately elevated temperatures. The recommended mix ratio is 100 parts of component A to 10 parts of component B. The pot life of... [See More]
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
- Industry: Marine; Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial; Semiconductors, IC's
- Cure / Technology: Thermoset; Two Component
- Use Temperature: -60 to 400
from DigiKey
POTTING COMPOUND CLEAR 200ML [See More]
from Ellsworth Adhesives
Dow DOWSIL ™ 3-4222 Dielectric Firm Gel Clear-Green is a two component, room temperature curing, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. It is durable, fast curing, requires no primer, and has excellent... [See More]
- Type: High Dielectric
- Cure / Technology: Two Component
- Chemical System: Silicone
- Industry: Electronics
from RS Components, Ltd.
Thermally conductive encapsulent 2kg kit [See More]
- Type: Thermally Conductive
- Chemical System: Silicone
- Form / Function: Kit
- Thermal Conductivity: 1.17
from Master Bond, Inc.
MasterSil 151TC is a highly flexible, temperature resistant two component silicone adhesive offering low thermal resistance and outstanding thermal conductivity. It was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. [See More]
- Type: High Dielectric; Thermally Conductive
- Chemical System: Silicone
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid
- Composition: Filled
from DigiKey
POTTING COMPOUND BLACK 50ML [See More]
from Ellsworth Adhesives
Dow DOWSIL ™ 3-4222 Dielectric Firm Gel Clear-Green is a two component, room temperature curing, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. It is durable, fast curing, requires no primer, and has excellent... [See More]
- Type: High Dielectric
- Cure / Technology: Two Component
- Chemical System: Silicone
- Industry: Electronics
from RS Components, Ltd.
Optically clear polyurethane 250g [See More]
- Type: Optical
- Chemical System: Polyurethane; PUR
- Form / Function: Pack
- Thermal Conductivity: 0.2000
from Master Bond, Inc.
Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronicc/ structural applications. The two components are combined in a convenient noncritical mix... [See More]
- Type: High Dielectric; Optical; Thermal Insulation
- Chemical System: Epoxy
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating; Impregnating Resin
- Composition: Unfilled
from DigiKey
POTTING COMPOUND BLACK 400ML [See More]
from Ellsworth Adhesives
Dow DOWSIL ™ 3-4241 Dielectric Tough Gel Clear-Green is a two component, heat curing, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. It is durable, fast curing, requires no primer, flame resistant, long working... [See More]
- Type: High Dielectric
- Cure / Technology: Two Component
- Chemical System: Silicone
- Dielectric Strength: 450
from Hapco, Inc.
Flexible, colorless, potting and encapsulating systems. Available in 5 minute (-5), 16 minute, and 20 minute gel times, and in shore hardness ’s from 20 A to 80 A . [See More]
- Type: High Dielectric
- Cure / Technology: Thermoset; Two Component
- Form / Function: Liquid
- Industry: Electronics
from OMEGA Engineering, Inc.
Air Set Cements set or cure through loss of moisture by evaporation. Atmospheric conditions therefore affect the drying rate. Air Set Cements are used mainly in thin film applications (applied in thicknesses less than 1/4")*. SELECTION CRITERIA FOR CEMENTS. 1. Type of Application Potting, sealing,... [See More]
- Type: High Dielectric; Thermally Conductive
- Chemical System: Ceramic
- Form / Function: Powder (optional feature); Liquid (optional feature); Encapsulant or Conformal Coating
- Cure / Technology: Two Component (optional feature); Single Component (optional feature)
from Epoxies Etc...
20-3004 LV & HV are two component chemical resistance epoxy systems. They were developed for potting, coating, and adhesive applications requiring superior chemical resistance. They exhibit outstanding bonds to a variety of substrates. [See More]
- Form / Function: Gel
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Henkel Corporation - Industrial
LOCTITE ABLESTIK NCA 9300UV, Acrylate, Non-conductive adhesive, Single component, Photocurable LOCTITE ® ABLESTIK NCA 9300UV single component, photocurable adhesive is designed for disk drive assembly applications such as conformal coating and component tracking. This product also contains a... [See More]
- Type: High Dielectric
- Viscosity: 70000
- Cure / Technology: UV or Radiation Cured; Single Component
from Wacker Chemical Corp.
WACKER ’s silicone adhesives and sealants are based on many years of experience, innovative research and comprehensive technological expertise. In a wide variety of industries, especially in lighting technology, flowable or non-sag silicone products offer decisive advantages in performance and... [See More]
- Type: Thermally Conductive
- Industry: Electronics
- Chemical System: Silicone; Elastomeric
from Aremco Products, Inc.
Aremco offers an expansive range of ceramic-based materials used for the assembly of high temperature, high power electrical devices, and high temperature fixtures, molds and tooling. These materials, based on aluminum oxide, aluminum nitride, magnesium oxide, silicon dioxide, silicon carbide,... [See More]
- Chemical System: Ceramic; Silicone
- Industry: Electronics
- Composition: Filled
- Use Temperature: 900
from Protavic America, Inc.
PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]
- Type: Electrically Conductive; Thermally Conductive
- Chemical System: Silicone
- Form / Function: Liquid; Encapsulant or Conformal Coating; Die Bonding Adhesives
- Composition: Unfilled
from Bluestar Silicones USA Corp.
Clear, Two-Component, Addition Cure, Heat Curing Electronic coating Silicone Compound. Properties. Viscosity 6000. Hardness Sha 30. Description. BLUESIL V-207 is a clear, two component, addition cure, heat curing silicone rubber compound. It is designed as a primerless coating and encapsulating... [See More]
- Form / Function: Liquid; Encapsulant or Conformal Coating
- Cure / Technology: Thermoset; Two Component ; Reactive or Moisture Cured
- Chemical System: Silicone
- Industry: Electronics
from Chemence Inc.
Krylex KU3064 is a revolutionary odorless light curing cyanoacrylate adhesive. It is designed for bonding applications that require very rapid fixture, fillet cure or surface cure. The UV / visible light cure properties facilitate rapid curing of exposed surface areas while the moisture curing... [See More]
- Form / Function: Liquid; Die Bonding Adhesives
- Gap Fill: 0.0500
- Cure / Technology: UV or Radiation Cured; Single Component; Reactive or Moisture Cured
- Industry: Sanitary; Electronics; OEM or Industrial; Printing, Medical use and General Industrial Assembly
from Shiu Li Technology Co., Ltd
LiPOLY's TPS series is a low-density, potting material. Its low density and lightweight properties enhance product performance, reduce production costs. The product has a thermal conductivity of 0.55-1.50 W/m*K and can cure at room temperature or high temperatures. [See More]
- Type: Thermally Conductive
- Chemical System: Silicone
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid
- Cure / Technology: Room Temperature Vulcanizing or Curing
from Techsil Limited
TC-5120 from BJB is a room temperature, 20 Shore A, addition/platinum curing silicone rubber designed for part making or mould making. Can be easily pigmented, encapsulating products, making flexible moulds and creating parts and skins. Product Specifications. 20 Shore A. 40 Minute Work Time. 24... [See More]
from Epoxy Technology
EPO-TEK ® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries. Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market... [See More]
- Type: Optical
- Chemical System: Epoxy
- Form / Function: Liquid; Glob Top, Daub, Doming or Overfill
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Electro-Lite Corporation
ELC-2900 is a flexible conformal coating for PCB's and provides a flexible, reworkable finish for components and various substrates. [See More]
- Type: Anti-static, ESD
- Chemical System: Epoxy
- Form / Function: Liquid; Encapsulant or Conformal Coating
- Cure / Technology: UV or Radiation Cured
from ACCRAbond, Inc.
CONATHANE ® UF-3 is a unique polyurethane foam characterized by low vapor pressure. UF-3 is unaffected by grease, oils, and most solvents. Also, it is ozone resistant, has excellent insulation characteristics, is dimensionally stable and will not rot or mildew. [See More]
- Chemical System: Epoxy
from Sauereisen, Inc.
Sauereisen Cement No. 31 is a white, porcelain-like cement that is widely used throughout industry in a variety of applications. including assembling, sealing, insulating and cementing of ceramics, porcelain, metal, and glass. [See More]
- Type: High Dielectric; Thermally Conductive
- Chemical System: Ceramic
- Form / Function: Powder; Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
- Composition: Unfilled
from R. S. Hughes Company, Inc.
3M LC-1114 clear potting & encapsulating compound is compatible with plastic materials. [See More]
from Shenzhen DeepMaterial Technologies Co., Ltd
DeepMaterial COB encapsulating adhesives are formulated with heat-curing epoxy [See More]
- Chemical System: Epoxy
- Industry: Electronics; Semiconductors, IC's
- Cure / Technology: Heat Curing
- Viscosity: 32500 to 50000
from Henkel Corporation - Electronics
Developed for encapsulation of wire bonded dies, used for Smartcard IC modules. It is designed for use only with Hysol ® UV dam encapsulants, such as Hysol 3323. This combination of dam and fill will pass mechanical stress testing and high reliability tests; typically thermal shock cycling -55... [See More]
- Industry: Electronics
- Viscosity: 8000
- CTE: 25
from LG Chemical of America Inc.
OLED Encapsulant. LG Chem developed the OLED Encapsulant that is superior to the existing packing material. LG Chem developed the face seal OLED Encapsulant whose performance is superior to the existing packing materials, improving the lifespan of an OLED display element drastically. [See More]
from DuPont Electronics & Imaging
DuPont ™ Pyralux ® HT bonding film can be used in conjunction with Pyralux ® AP to create a complete all-polyimide flex laminate system that includes a double-sided, copper-clad laminate and a unique all-polyimide coverfilm or bonding material that becomes a flexible coverlay after... [See More]
- Chemical System: Polyimide
- Industry: Electronics; OEM or Industrial
- Features: UL Rating
- Use Temperature: 437
from Hapco, Inc.
Flexible, 45, 65 and, 95 shore A hardness, potting and encapsulating systems. Flame retardant (FR), accelerated 3 minute (-3) gel time, and black or unpigmented versions are available. [See More]
- Type: High Dielectric
- Cure / Technology: Thermoset; Two Component
- Form / Function: Liquid
- Features: Flame Retardant
from OMEGA Engineering, Inc.
Chemical Set Cements set or cure by an internal chemical action which does not require exposure to air. Chemical Set Cements can be used in thick applications (applied in thicknesses greater than 1/4")*. SELECTION CRITERIA FOR CEMENTS. 1. Type of Application Potting, sealing, encapsulating,... [See More]
- Type: High Dielectric; Thermally Conductive
- Chemical System: Ceramic
- Form / Function: Powder (optional feature); Liquid (optional feature); Encapsulant or Conformal Coating
- Cure / Technology: Two Component (optional feature); Single Component (optional feature)
from Epoxies Etc...
10-3009 is a low viscosity epoxy adhesive and potting compound. It is easy to use and allows the end user to adjust the flexibility of the cured epoxy. This product offers a good combination of peel and tensile strength. 10-3009 provides electrical insulation and outstanding adhesion. [See More]
- Type: High Dielectric; Thermal Insulation
- Chemical System: Epoxy
- Form / Function: Liquid
- Composition: Unfilled
from Henkel Corporation - Industrial
LOCTITE ABLESTIK UV300X, Acrylate, Assembly, Single Component, Photocurable Adhesive LOCTITE ® ABLESTIK UV300X single component, photocurable adhesive is designed for disk drive assembly applications such as conformal coating and component tracking. This product also contains a secondary thermal... [See More]
- Cure / Technology: UV or Radiation Cured; Single Component
- Viscosity: 70000
from Wacker Chemical Corp.
GENIOSIL® WP1 is a polyether-based silane-terminated polymer suitable asbinder in moisture curing formulations. It is a clear liquid with a slight but characteristic odor and differs to conventional silylated polymers due to its high reactivity. This is a direct consequence of the structural... [See More]
- Form / Function: Liquid
- Cure / Technology: Two Component
- Chemical System: Silicone
- Industry: Construction
from Protavic America, Inc.
The two component polyurethane compound described in this data sheet is specifically designed for the encapsulation by casting of completed circuit board. The cured material meets the flammability requirements of UL 94, V-O at thickness of 0.070 in. and greater (UL File Number E116296) and provides... [See More]
- Type: High Dielectric; Thermal Insulation
- Chemical System: Polyurethane
- Form / Function: Liquid; Encapsulant or Conformal Coating
- Composition: Filled
from Chemence Inc.
KSC12028 is a silicone RTV gel developed for electronic applications requiring a re-penetrable self-sealing, silicone gel product. KSC12028 is a two part, solvent free, 1:1 mix ratio silicone that when mixed cures in 12 hours at room temperature. Alternatively, KSC12028 can be cured in approximately... [See More]
- Form / Function: Gel; Die Bonding Adhesives
- Cure / Technology: Single Component
- Chemical System: Silicone
- Industry: Electronics
from Techsil Limited
LOCTITE ® 595 is for superior bonding and sealing properties to most surfaces (although not recommended for use on concrete). This product resists aging weathering and thermal cycling without having adverse reactions such as hardening, shrinking or cracking. The thixotropic nature of LOCTITE... [See More]
- Chemical System: Silicone; Elastomeric
from R. S. Hughes Company, Inc.
3M Scotch-Weld 270 black potting & encapsulating compound is compatible with aluminum, glass, plastic, rubber and steel materials with a 48 hr cure time. Provides a 60 to 70 min working time. Works in a mix ratio of 1:1. Delivers great performance with a shear strength of 2450 to 2500 psi. [See More]
- Thermal Conductivity: 0.1770
- Dielectric Strength: 850
from Shenzhen DeepMaterial Technologies Co., Ltd
It is a conformal coating designed to provide strong protection from moisture and harsh chemicals. Compatible with industry standard solder masks, no-clean fluxes, metallization, components and substrate materials. [See More]
- Form / Function: Encapsulant or Conformal Coating
- Cure / Technology: UV or Radiation Cured; Reactive or Moisture Cured
- Chemical System: Acrylic
- Industry: Electronics
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Form / Function: Pellets
- Cure / Technology: Thermoplastic / Hot Melt
- Chemical System: Polyolefin
- Features: UL Rating
from Hapco, Inc.
Flexible, high strength, 50 to 71 shore D hardness potting and encapsulating systems. Available in flame retardant (FR), 3 minute (-3) gel time, and in black or unpigmented. [See More]
- Type: High Dielectric
- Cure / Technology: Thermoset; Two Component
- Form / Function: Liquid
- Features: Flame Retardant
from OMEGA Engineering, Inc.
OMEGATHERM thermal conducting paste is a high temperature and high thermally conductive paste product. They are specially formulated for permanent and temporary bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics,... [See More]
- Type: High Dielectric; Thermally Conductive
- Cure / Technology: Single Component
- Chemical System: Silicone
- Use Temperature: 392
from Epoxies Etc...
The 50-2369FR Potting and Encapsulating Compound has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-2369 FR Urethane is listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low exotherm, and excellent electrical... [See More]
- Type: Thermally Conductive
- Chemical System: Polyurethane
- Form / Function: Gel
- Composition: Filled
from Henkel Corporation - Industrial
TECHNOMELT AS 8998, Hot Melt Polyolefin, Masking TECHNOMELT ® AS 8998 peelable hot melt adhesive is recommended for use for masking off areas that needs protection before conformal coating applications. It is formulated to have excellent slump resistance up to 100 °C. TECHNOMELT AS 8998 is... [See More]
- Cure / Technology: Thermoplastic / Hot Melt
- Viscosity: ? to 4000
from Wacker Chemical Corp.
GENIOSIL® XT 50 is a silicone-modified polyetherbasedsilane-terminated polymer suitable as a binderin moisture curing formulations. It is a clear liquid witha slight but characteristic odor and differs toconventional silylated polymers due to its highreactivity. This is a direct consequence of the... [See More]
- Form / Function: Liquid
- Cure / Technology: Two Component (optional feature); Single Component; Reactive or Moisture Cured
- Chemical System: Silicone
- Industry: Construction
from Protavic America, Inc.
Amber epoxy system . Excellent for use in high heat (steam) and chemical environments. 2 hour gel time.Bonds well to metal, plastics and wood. High thermal shock resistance. Available in colors and higher or lower viscosities. Passes NASA outgassingrequirements. [See More]
- Type: High Dielectric
- Chemical System: Epoxy
- Form / Function: Liquid; Die Bonding Adhesives
- Composition: Unfilled
from Techsil Limited
MG Chemicals 832B is a black electronic grade epoxy designed for encapsulating and potting. This compound is simple mix, easy to use and protects against static discharges, shocks, vibrations, and mechanical impacts. It insulates against heat and conductivity as well as being extremely resistant to... [See More]
- Chemical System: Epoxy
- Industry: Electronics
from R. S. Hughes Company, Inc.
3M Scotch-Weld 270 black potting & encapsulating compound is compatible with aluminum, glass, plastic, rubber and steel materials with a 48 hr cure time. Provides a 60 to 70 min working time. Works in a mix ratio of 1:1. Delivers great performance with a shear strength of 2450 to 2500 psi. [See More]
- Thermal Conductivity: 0.1770
- Dielectric Strength: 850
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Type: High Dielectric; Thermally Conductive
- Chemical System: Polyamide
- Form / Function: Pellets
- Cure / Technology: Thermoplastic / Hot Melt; Single Component
from Hapco, Inc.
Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E products are flame... [See More]
- Type: High Dielectric; Thermally Conductive
- Cure / Technology: Thermoset; Two Component
- Form / Function: Liquid
- Features: Flame Retardant; UL Rating
from OMEGA Engineering, Inc.
OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics, paper products. [See More]
- Type: High Dielectric; Thermally Conductive
- Cure / Technology: Single Component
- Chemical System: Silicone
- Use Temperature: 392
from Epoxies Etc...
50-3150 FR has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-3150 FR Black Epoxy with Catalyst 190 and Catalyst 105 are listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low shrinkage, and outstanding insulation... [See More]
- Type: Thermally Conductive
- Chemical System: Epoxy
- Form / Function: Liquid
- Composition: Unfilled
from Henkel Corporation - Industrial
TECHNOMELT PA 638, Polyamide, Molding compound thermoplastic TECHNOMELT ® PA 638 high performance thermoplastic polyamide is designed to meet low pressure molding process requirements. This product can be processed at low processing pressure due to its low viscosity, allowing encapsulation of... [See More]
- Form / Function: Liquid
- Use Temperature: 40 to 212
- Chemical System: Polyamide
- Viscosity: 4000
from Wacker Chemical Corp.
WACKER SilGel ® 612 A/B is a pourable, additioncuring, RTV-2 silicone rubber that vulcanizes at room temperature to a very soft silicone gel. Special features. two-part, 1 : 1 mixing ratio. low viscosity. rapid heat cure. very low hardness (silicone gel). crystal clear. pronounced inherent tack. [See More]
- Type: Optical
- Chemical System: Silicone; Elastomeric
- Form / Function: Liquid
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
from Techsil Limited
MG Chemicals 834ATH Flame Retardant Epoxy is a economical, electronic-grade, self-extinguishing, flame retardant epoxy that provides excellent physical, chemical and electrical protection with a degree of thermal conductivity. Designed for encapsulating and potting, this two-part epoxy protects... [See More]
- Chemical System: Epoxy
- Industry: Electronics
- Features: Flame Retardant
from R. S. Hughes Company, Inc.
3M Scotch-Weld 270 clear potting & encapsulating compound is compatible with aluminum, glass, plastic, rubber and steel materials with a 48 hr cure time. Provides a 60 to 70 min working time. Works in a mix ratio of 1:1. Delivers great performance with a shear strength of 2450 to 2500 psi. [See More]
- Thermal Conductivity: 0.1770
- Dielectric Strength: 850
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Type: High Dielectric; Thermally Conductive
- Chemical System: Polyamide
- Form / Function: Pellets
- Cure / Technology: Thermoplastic / Hot Melt
from Hapco, Inc.
High performance, flexible potting systems designed to be in constant water immersion while maintaining electrical and physical properties. DI-PAK E-4888 & E-4889 were designed to meet Naval underwater applications. [See More]
- Type: High Dielectric
- Cure / Technology: Thermoset; Two Component
- Form / Function: Liquid
- Industry: Electronics
from Epoxies Etc...
UV 60-7016 is a high performance Ultraviolet Curable Adhesive, Sealant, and Potting Compound. This new one component urethane acrylate system was specifically designed for the difficult bonding of glass to metal. UV 60-7016 has outstanding thermal shock and impact resistance, and is an excellent... [See More]
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
- Composition: Unfilled
- Chemical System: Elastomeric; Polyurethane
- Cure / Technology: UV or Radiation Cured; Single Component
from Henkel Corporation - Industrial
LOCTITE STYCAST UV 7993, Urethane, Conformal coating LOCTITE STYCAST UV 7993 is a conformal coating designed to provide rugged protection from moisture and harsh chemicals. It is compatible with industry standard solder masks, no-clean fluxes, metallization, components and substrate materials. [See More]
- Chemical System: Polyurethane
- Viscosity: 120
- Cure / Technology: UV or Radiation Cured; Single Component
from Techsil Limited
MG 834FRB is a black, flame retardant potting and encapsulation compound that offers extreme environmental, mechanical and physical protection for printed circuit boards and electronic assemblies. Thanks to its low viscosity, MG 834 FRB is the ideal choice when applications require small gaps or... [See More]
- Chemical System: Epoxy
- Industry: Electronics
- Features: Flame Retardant
from R. S. Hughes Company, Inc.
3M Scotch-Weld 812NS yellow potting & encapsulating compound is compatible with metal, plastic and wood materials. Provides a 10 min working time. Works in a mix ratio of 1:1. [See More]
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Type: High Dielectric; Thermally Conductive
- Chemical System: Polyamide
- Form / Function: Pellets
- Cure / Technology: Thermoplastic / Hot Melt
from Hapco, Inc.
Low cost, easy to use, potting compounds with fast cycle times. Available in 3 speeds. [See More]
- Type: High Dielectric
- Cure / Technology: Thermoset; Two Component
- Form / Function: Liquid
- Industry: Electronics
from Henkel Corporation - Industrial
BERGQUIST GAP PAD TGP 7000ULM, Thermally conductive soft gap filling material, For high performance applications. BERGQUIST GAP PAD TGP 7000ULM is an extremely soft gap filling material rated at a thermal conductivity of 7.0 W/m-K. It is specially formulated for high performance applications... [See More]
- Type: Thermally Conductive
- Chemical System: Silicone
- Form / Function: Gap Filler, Foam in Place Gasket
- Use Temperature: 140 to 392
from Techsil Limited
MG Chemicals 832C is a translucent electronic grade epoxy designed for encapsulating and potting. This compound is simple mix, easy to use and protects against static discharges, shocks, vibrations, and mechanical impacts. It insulates against heat and conductivity as well as being extremely... [See More]
- Chemical System: Epoxy
- Industry: Electronics
from R. S. Hughes Company, Inc.
3M Scotch-Weld DP270 black potting & encapsulating compound is compatible with aluminum, glass, plastic, rubber and steel materials with a 48 hr cure time. Provides a 60 to 70 min working time. Works in a mix ratio of 1:1. Delivers great performance with a shear strength of 2450 to 2500 psi. [See More]
- Thermal Conductivity: 0.1770
- Dielectric Strength: 850
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Type: High Dielectric; Thermally Conductive
- Chemical System: Polyolefin
- Form / Function: Pellets
- Cure / Technology: Thermoplastic / Hot Melt; Single Component
from Hapco, Inc.
DI-COAT R-4721 / DI-COAT R-4721 LV (lower viscosity). Shore 90 D, room temperature curing, medium to high thixotropic coating for dielectric insulating applications. DI-COAT R-4721 is ideal for use on vertical or sloping surfaces where flow or drain-off cannot be tolerated. DI-COAT R-4721 is easy to... [See More]
- Type: High Dielectric
- Cure / Technology: Thermoset; Two Component
- Form / Function: Liquid
- Industry: Electronics
from Techsil Limited
MG Chemicals 832C is a translucent electronic grade epoxy designed for encapsulating and potting. This compound is simple mix, easy to use and protects against static discharges, shocks, vibrations, and mechanical impacts. It insulates against heat and conductivity as well as being extremely... [See More]
- Chemical System: Epoxy
- Industry: Electronics
from R. S. Hughes Company, Inc.
3M Scotch-Weld DP270 black potting & encapsulating compound is compatible with aluminum, glass, plastic, rubber and steel materials with a 48 hr cure time. Provides a 60 to 70 min working time. Works in a mix ratio of 1:1. Delivers great performance with a shear strength of 2450 to 2500 psi. [See More]
- Thermal Conductivity: 0.1770
- Dielectric Strength: 850
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Type: High Dielectric; Thermally Conductive
- Chemical System: Polyamide
- Form / Function: Pellets
- Cure / Technology: Thermoplastic / Hot Melt; Single Component
from Hapco, Inc.
Filter-bond ™ is a series of casting and potting compounds ideally suited for potting, sealing, and bonding filtration and ultrafiltration products. The Filter-bond ™ E-Series is manufactured to ultra-high quality standards and has been used by customers to pass FDA approval. Filter-bond... [See More]
- Form / Function: Liquid
- Cure / Technology: Two Component
- Chemical System: Elastomeric; Polyurethane
- Features: Flexible
from Techsil Limited
Momentive RTV11 is a general purpose silicone rubber potting compound suitable for a range of applications. It is widely used for the potting and encapsulation of electrical coils and connectors, alongside making cast-in-place gaskets and moulds. RTV11 is supplied ready-to-use with DBT as the... [See More]
- Chemical System: Silicone; Elastomeric
- Use Temperature: -54 to 204
- Industry: Sanitary
from R. S. Hughes Company, Inc.
3M Scotch-Weld DP270 black potting & encapsulating compound is compatible with aluminum, glass, plastic, rubber and steel materials with a 48 hr cure time. Provides a 60 to 70 min working time. Works in a mix ratio of 1:1. Delivers great performance with a shear strength of 2450 to 2500 psi. [See More]
- Thermal Conductivity: 0.1770
- Dielectric Strength: 850
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Type: High Dielectric; Optical; Thermally Conductive
- Chemical System: Polyamide
- Form / Function: Pellets
- Cure / Technology: Thermoplastic / Hot Melt
from Techsil Limited
Momentive RTV11 is a general purpose silicone rubber potting compound suitable for a range of applications. It is widely used for the potting and encapsulation of electrical coils and connectors, alongside making cast-in-place gaskets and moulds. RTV11 is supplied ready-to-use with DBT as the... [See More]
- Chemical System: Silicone; Elastomeric
- Use Temperature: -54 to 204
- Industry: Sanitary
from R. S. Hughes Company, Inc.
3M Scotch-Weld DP270 clear potting & encapsulating compound is compatible with aluminum, glass, plastic, rubber and steel materials with a 48 hr cure time. Provides a 60 to 70 min working time. Works in a mix ratio of 1:1. Delivers great performance with a shear strength of 2450 to 2500 psi. [See More]
- Thermal Conductivity: 0.1770
- Dielectric Strength: 850
from Techsil Limited
Momentive RTV11 is a general purpose silicone rubber potting compound suitable for a range of applications. It is widely used for the potting and encapsulation of electrical coils and connectors, alongside making cast-in-place gaskets and moulds. RTV11 is supplied ready-to-use with DBT as the... [See More]
- Chemical System: Silicone; Elastomeric
- Use Temperature: -54 to 204
- Industry: Sanitary
from R. S. Hughes Company, Inc.
3M Scotch-Weld DP805 off-white potting & encapsulating compound is compatible with ceramic, metal, plastic and wood materials with a 24 hr cure time. Provides a 3 to 4 min working time. Works in a mix ratio of 1:1. Delivers great performance with a shear strength of 3500 psi. [See More]
from Techsil Limited
RTV12 A is a clear, two component, low viscosity potting compound that cures at room temperature to a soft pliable rubber. It will cure in deep sections without additional heating or moisture. RTV12 A is the base compound and requires a curing agent to be mixed with. For a clear product which allows... [See More]
- Chemical System: Silicone; Elastomeric
- Industry: Electronics
from R. S. Hughes Company, Inc.
3M Scotch-Weld DP805 off-white potting & encapsulating compound is compatible with ceramic, metal, plastic and wood materials with a 24 hr cure time. Provides a 3 to 4 min working time. Works in a mix ratio of 1:1. Delivers great performance with a shear strength of 3500 psi. [See More]
from Techsil Limited
RTV12 A is a clear, two component, low viscosity potting compound that cures at room temperature to a soft pliable rubber. It will cure in deep section without additional heating or moisture. RTV12 A is the base compound and requires a curing agent to be mixed with. For a clear product which allows... [See More]
- Chemical System: Silicone; Elastomeric
- Industry: Electronics
from R. S. Hughes Company, Inc.
3M Scotch-Weld DP805 off-white potting & encapsulating compound is compatible with ceramic, metal, plastic and wood materials with a 24 hr cure time. Provides a 3 to 4 min working time. Works in a mix ratio of 1:1. Delivers great performance with a shear strength of 3500 psi. [See More]
from Techsil Limited
Momentive RTV31 is a high temperature silicone rubber potting compound suitable for a range of applications. It is widely used for the potting and encapsulation of electric motors and transformers, casting moulds for low-melting point metals and for the fabrication of rubber parts. Also suitable for... [See More]
- Chemical System: Silicone; Elastomeric
- Use Temperature: -54 to 260
- Industry: Electronics
from R. S. Hughes Company, Inc.
3M Scotch-Weld DP807 off-white potting & encapsulating compound is compatible with ceramic, metal, plastic and wood materials with a 24 hr cure time. Provides a 4 to 6 min working time. Works in a mix ratio of 1:1. Delivers great performance with a shear strength of 2500 psi. [See More]