Thermoplastic / Hot Melt Encapsulants and Potting Compounds
from Ellsworth Adhesives
Henkel Loctite Technomelt PA 633, formerly known as Macromelt OM 633, is a low viscosity, high performance thermoplastic polyamide that is designed to meet low pressure molding process requirements. It is suitable for automotive firewall applications where 125 °C service temperatures are... [See More]
- Cure / Technology: Thermoplastic / Hot Melt
- Elongation: 400.0
- Industry: Automotive
- Dielectric Strength: 610
from Ellsworth Adhesives
Henkel Loctite Technomelt PA 638, formerly known as Macromelt OM 638, is a low viscosity, high performance thermoplastic polyamide that is designed to meet low pressure molding process requirements. It is suitable for automotive firewall applications where 125 °C service temperatures are... [See More]
- Cure / Technology: Thermoplastic / Hot Melt
- Dielectric Strength: 483
- Industry: Automotive
- Viscosity: 3400
from Ellsworth Adhesives
Henkel Loctite Technomelt PA 641, formerly known as Macromelt OM 641, is a low viscosity, high performance thermoplastic polyamide that is designed to meet low pressure molding process requirements. It is useful for applications that require increased strength and hardness such as memory sticks and... [See More]
- Cure / Technology: Thermoplastic / Hot Melt
- Dielectric Strength: 635
- Elongation: 400.0
- Viscosity: 4500
from Ellsworth Adhesives
Henkel Loctite Technomelt PA 687, formerly known as Macromelt OM 687, polyamide that is formulated for very low water vapor transmission for the most demanding high humidity applications such as on the inside of an automobile tire. [See More]
- Cure / Technology: Thermoplastic / Hot Melt
- Elongation: 800.0
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Cure / Technology: Thermoplastic / Hot Melt
- Chemical System: Polyolefin
- Form / Function: Pellets
- Features: UL Rating
from Henkel Corporation - Industrial
TECHNOMELT AS 8998, Hot Melt Polyolefin, Masking TECHNOMELT ® AS 8998 peelable hot melt adhesive is recommended for use for masking off areas that needs protection before conformal coating applications. It is formulated to have excellent slump resistance up to 100 °C. TECHNOMELT AS 8998 is... [See More]
- Cure / Technology: Thermoplastic / Hot Melt
- Viscosity: ? to 4000
from Techsil Limited
OverTec 5 FR is a polyamide resin specifically designed for over-molding. It has UL-VO flammability rating and excellent electrical properties. Components can be electrically insulated and sealed from water without the need of housing or the use of slow and wasteful 2- component casting/potting... [See More]
- Cure / Technology: Thermoplastic / Hot Melt
- Form / Function: Pellets
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Cure / Technology: Thermoplastic / Hot Melt; Single Component
- Form / Function: Pellets
- Type: High Dielectric; Thermally Conductive
- Chemical System: Polyamide
from Henkel Corporation - Industrial
TECHNOMELT PA 6344, Polyamide, Encapsulation TECHNOMELT ® PA 6344 UV resistance, polyamide-based, thermoplastic, hot melt adhesive is designed for molding compound applications. This material adheres well to a variety of substrates including plastic, glass, metals and ABS. UV resistant. Adheres... [See More]
- Cure / Technology: Thermoplastic / Hot Melt
from Techsil Limited
Techsil HM 2277 is a amber colored potting & encapsulating polyamide adhesive. HM 2277 has a very low viscosity that sets very hard. It is used for two main applications; the first is for potting and encapsulation in the electronics industry; secondly it is an ideal substance for knot filling... [See More]
- Cure / Technology: Thermoplastic / Hot Melt
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Cure / Technology: Thermoplastic / Hot Melt
- Form / Function: Pellets
- Type: High Dielectric; Thermally Conductive
- Chemical System: Polyamide
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Cure / Technology: Thermoplastic / Hot Melt
- Form / Function: Pellets
- Type: High Dielectric; Thermally Conductive
- Chemical System: Polyamide
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Cure / Technology: Thermoplastic / Hot Melt; Single Component
- Form / Function: Pellets
- Type: High Dielectric; Thermally Conductive
- Chemical System: Polyolefin
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Cure / Technology: Thermoplastic / Hot Melt; Single Component
- Form / Function: Pellets
- Type: High Dielectric; Thermally Conductive
- Chemical System: Polyamide
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Cure / Technology: Thermoplastic / Hot Melt
- Form / Function: Pellets
- Type: High Dielectric; Optical; Thermally Conductive
- Chemical System: Polyamide