Thermoplastic / Hot Melt Encapsulants and Potting Compounds

tecbond® OverTec 5FR Black Bulk 10kg -- PAHM20053
from Techsil Limited

OverTec 5 FR is a polyamide resin specifically designed for over-molding. It has UL-VO flammability rating and excellent electrical properties. Components can be electrically insulated and sealed from water without the need of housing or the use of slow and wasteful 2- component casting/potting... [See More]

  • Cure / Technology: Thermoplastic / Hot Melt
  • Form / Function: Pellets
Henkel Loctite Technomelt PA 633 Amber 44 lb Bag -- 122242 [122242 from Henkel Corporation - Industrial]
from Ellsworth Adhesives

Henkel Loctite Technomelt PA 633, formerly known as Macromelt OM 633, is a low viscosity, high performance thermoplastic polyamide that is designed to meet low pressure molding process requirements. It is suitable for automotive firewall applications where 125 °C service temperatures are... [See More]

  • Cure / Technology: Thermoplastic / Hot Melt
  • Elongation: 400.0
  • Industry: Automotive
  • Dielectric Strength: 610
Techsil HM 2277 12 Amber Potting Hot melt Adhesive -- PAHM20218
from Techsil Limited

Techsil HM 2277 is a amber colored potting & encapsulating polyamide adhesive. HM 2277 has a very low viscosity that sets very hard. It is used for two main applications; the first is for potting and encapsulation in the electronics industry; secondly it is an ideal substance for knot filling... [See More]

  • Cure / Technology: Thermoplastic / Hot Melt
Henkel Loctite Technomelt PA 638 Black 44 lb Bag -- 79123 [NULL from Henkel Corporation - Industrial]
from Ellsworth Adhesives

Henkel Loctite Technomelt PA 638, formerly known as Macromelt OM 638, is a low viscosity, high performance thermoplastic polyamide that is designed to meet low pressure molding process requirements. It is suitable for automotive firewall applications where 125 °C service temperatures are... [See More]

  • Cure / Technology: Thermoplastic / Hot Melt
  • Dielectric Strength: 483
  • Industry: Automotive
  • Viscosity: 3400
Henkel Loctite Technomelt PA 641 Amber 44 lb Bag -- 122243 [NULL from Henkel Corporation - Industrial]
from Ellsworth Adhesives

Henkel Loctite Technomelt PA 641, formerly known as Macromelt OM 641, is a low viscosity, high performance thermoplastic polyamide that is designed to meet low pressure molding process requirements. It is useful for applications that require increased strength and hardness such as memory sticks and... [See More]

  • Cure / Technology: Thermoplastic / Hot Melt
  • Dielectric Strength: 635
  • Elongation: 400.0
  • Viscosity: 4500
Henkel Loctite Technomelt PA 646 Black 44 lb Bag -- 1055521 [NULL from Henkel Corporation - Industrial]
from Ellsworth Adhesives

Henkel Loctite Technomelt PA 646, formerly known as Macromelt OM 646, is a low viscosity, high performance thermoplastic polyamide that is designed to meet low pressure molding process requirements. It is useful for applications that require increased strength and hardness such as memory sticks and... [See More]

  • Cure / Technology: Thermoplastic / Hot Melt
  • Dielectric Strength: 559
  • Elongation: 800.0
  • Viscosity: 4500
Henkel Loctite Technomelt PA 687 Black 40 lb Case -- 884104 [NULL from Henkel Corporation - Industrial]
from Ellsworth Adhesives

Henkel Loctite Technomelt PA 687, formerly known as Macromelt OM 687, polyamide that is formulated for very low water vapor transmission for the most demanding high humidity applications such as on the inside of an automobile tire. [See More]

  • Cure / Technology: Thermoplastic / Hot Melt
  • Elongation: 800.0
TECHNOMELT AS 8998
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Cure / Technology: Thermoplastic / Hot Melt
  • Chemical System: Polyolefin
  • Form / Function: Pellets
  • Features: UL Rating
Encapsulants -- TECHNOMELT AS 8998
from Henkel Corporation - Industrial

TECHNOMELT AS 8998, Hot Melt Polyolefin, Masking TECHNOMELT ® AS 8998 peelable hot melt adhesive is recommended for use for masking off areas that needs protection before conformal coating applications. It is formulated to have excellent slump resistance up to 100 °C. TECHNOMELT AS 8998 is... [See More]

  • Cure / Technology: Thermoplastic / Hot Melt
  • Viscosity: ? to 4000
TECHNOMELT PA 2384 -- 8807299842049
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Cure / Technology: Thermoplastic / Hot Melt; Single Component
  • Form / Function: Pellets
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Polyamide
Encapsulants -- TECHNOMELT PA 6344
from Henkel Corporation - Industrial

TECHNOMELT PA 6344, Polyamide, Encapsulation TECHNOMELT ® PA 6344 UV resistance, polyamide-based, thermoplastic, hot melt adhesive is designed for molding compound applications. This material adheres well to a variety of substrates including plastic, glass, metals and ABS. UV resistant. Adheres... [See More]

  • Cure / Technology: Thermoplastic / Hot Melt
TECHNOMELT PA 2692
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Cure / Technology: Thermoplastic / Hot Melt
  • Form / Function: Pellets
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Polyamide
TECHNOMELT PA 341 -- 8802588327937
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Cure / Technology: Thermoplastic / Hot Melt
  • Form / Function: Pellets
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Polyamide
TECHNOMELT PA 5375
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Cure / Technology: Thermoplastic / Hot Melt; Single Component
  • Form / Function: Pellets
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Polyolefin
TECHNOMELT PA 6208 Black -- 8799566462977
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Cure / Technology: Thermoplastic / Hot Melt; Single Component
  • Form / Function: Pellets
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Polyamide
TECHNOMELT PA 668 Clear
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Cure / Technology: Thermoplastic / Hot Melt
  • Form / Function: Pellets
  • Type: High Dielectric; Optical; Thermally Conductive
  • Chemical System: Polyamide