Electrical Insulation / Dielectric Encapsulants and Potting Compounds

Dow DOWSIL™3-4150 Dielectric Gel Encapsulant Green 36.2 kg Kit -- 3-4150 DIELECT GEL 36.2KG [3127460 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow DOWSIL ™3-4150 Dielectric Gel Clear-Green is a two component, fast room temperature curing, silicone gel that is used for potting, sealing, encapsulating, and protecting a variety of materials in the electronics industry. It offers flexibility, stress relief, and offers excellent... [See More]

  • Type: High Dielectric
  • Cure / Technology: Two Component  
  • Chemical System: Silicone
  • Dielectric Strength: 381
Black Polyimide Film -- Pyralux® HXC
from DuPont Electronics & Imaging

DuPont ™ Pyralux ® HXC is DuPont ™ Kapton ® MBC black polyimide film coated with epoxy ideal for products where uniform matte black appearance is desired. It is coated on one side with a proprietary B-staged modified epoxy adhesive. The Pyralux ® HXC coverlay is used to... [See More]

  • Type: High Dielectric
  • Features: UL Rating
  • Chemical System: Polyimide
  • Industry: Electronics; OEM or Industrial
Addition Cured Silicone is Optically Clear with Enhanced Low Temperature Serviceability -- MasterSil 157
from Master Bond, Inc.

MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]

  • Type: High Dielectric; Optical; Thermally Conductive
  • Chemical System: Silicone
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid
  • Composition: Unfilled
ELAN-Cast® -- E 2154 Black Resin / C 2154 Hardener
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Type: High Dielectric
  • Chemical System: Epoxy
  • Form / Function: Liquid
  • Composition: Filled
Biocompatible, Thermally Conductive Epoxy -- EPO-TEK® MED-T905BN-3
from Epoxy Technology

EPO-TEK ® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries.  Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market... [See More]

  • Type: High Dielectric; Optical; Thermally Conductive
  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Epoxy
  • Industry: Sanitary; Electronics; Photonics
Dow DOWSIL™EG-3810 Dielectric Gel Encapsulant Clear 18 kg Pail -- EG-3810 DIELECTRIC GEL 18KG PAIL [4116483 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow DOWSIL ™EG-3810 Dielectric Gel is a one component, clear, heat curing silicone gel that is used for potting, sealing, encapsulating, and protecting a variety of materials in the electronics industry. It offers a wide range of operating temperatures ranging from -60 °C to 200 °C,... [See More]

  • Type: High Dielectric
  • Cure / Technology: Single Component
  • Chemical System: Silicone
  • Industry: Electronics; Semiconductors, IC's
B-Staged Epoxy Meets Airbus Standards for Flame Retardancy & Toxicity -- EP36FR
from Master Bond, Inc.

EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Composition: Unfilled
Dual Curing, Thixotropic Adhesive -- UV22DC80-10F
from Master Bond, Inc.

One part, nanosilica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: UV Curing
  • Form / Function: Liquid; Encapsulant or Conformal Coating; Glob Top, Daub, Doming or Overfill
  • Composition: Filled
Electrically Conductive Die Attach Adhesive Has Very High Thermal Conductivity -- EP3HTSDA-1
from Master Bond, Inc.

EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
  • Composition: Unfilled
Epoxy Features Very Low Coefficient of Thermal Expansion -- EP30LTE-2
from Master Bond, Inc.

Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating. [See More]

  • Type: High Dielectric; Thermal Insulation
  • Chemical System: Epoxy
  • Form / Function: Liquid; Encapsulant or Conformal Coating
  • Composition: Unfilled
Epoxy Meets Airbus Standards for Flame Retardancy, Smoke and Gas Emissions -- EP93FRHT
from Master Bond, Inc.

EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Composition: Unfilled
Epoxy with High Elongation Passes ISO 10993-5 Certification for Cytotoxicity -- EP40Med
from Master Bond, Inc.

EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Composition: Unfilled
Extremely Soft MasterSil 170 Gel Encapsulant Offers Removability and Optical Clarity -- MasterSil 170 Gel
from Master Bond, Inc.

MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]

  • Type: High Dielectric; Optical; Thermally Conductive
  • Chemical System: Silicone
  • Form / Function: Liquid
  • Composition: Unfilled
High Temperature Resistant, One Component Epoxy System -- EP13
from Master Bond, Inc.

Master Bond Polymer System EP13 is a one component heat curing epoxy featuring high shear strength and very high temperature resistance. This one component system is formulated to cure at temperatures from 300 °F to 350 °F for 60-90 minutes. Upon cure, EP13 readily attains tensile shear... [See More]

  • Type: High Dielectric
  • Chemical System: Epoxy
  • Form / Function: Encapsulant or Conformal Coating; Die Bonding Adhesives
  • Composition: Unfilled
High Temperature Resistant, Toughened Epoxy -- EP125
from Master Bond, Inc.

Master Bond Polymer System 125 is a two component toughened epoxy resin for prolonged service above 500 °F with truly outstanding chemical resistance. High strength bonds serviceable up to 600 °F can be obtained with this exceptionally thermally stable and chemically resistant epoxy resin... [See More]

  • Type: High Dielectric; Thermal Insulation
  • Chemical System: Epoxy
  • Form / Function: Powder; Gap Filler, Foam in Place Gasket; Impregnating Resin; Die Bonding Adhesives
  • Composition: Unfilled
Highly Flexible Addition Cured Silicone Offers Low Thermal Resistance -- MasterSil 151TC
from Master Bond, Inc.

MasterSil 151TC is a highly flexible, temperature resistant two component silicone adhesive offering low thermal resistance and outstanding thermal conductivity. It was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Silicone
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid
  • Composition: Filled
Low Outgassing, Optically Clear Two Component Epoxy -- EP29LPSP
from Master Bond, Inc.

Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. Not only is EP29LPSP able to function as an adhesive, sealant and protective coating at temperatures as low as 4K, but it is... [See More]

  • Type: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Composition: Unfilled
Low Viscosity Structural Epoxy Adhesive System -- EP112
from Master Bond, Inc.

Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronic/ structural applications. The two components are combined in a convenient noncritical mix... [See More]

  • Type: High Dielectric; Optical; Thermal Insulation
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating; Impregnating Resin
  • Composition: Unfilled
Low Viscosity, Electrically Insulating Epoxy Features Excellent Optical Clarity -- EP30LP-2
from Master Bond, Inc.

Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. [See More]

  • Type: High Dielectric; Optical; Thermally Conductive
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Composition: Unfilled
Low Viscosity, Fast Curing, Two Component Epoxy -- EP38
from Master Bond, Inc.

Master Bond Polymer System EP38 is a fast curing, low viscosity, optically clear two component epoxy system for high performance coating, bonding and sealing. It is 100% reactive and does not contain any volatiles. The mix ratio is a convenient 3 to 1 by weight. EP38 is very fast curing. Coatings as... [See More]

  • Type: High Dielectric
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Die Bonding Adhesives
  • Composition: Unfilled
Moderate Viscosity Thermally Conductive Epoxy -- EP112AO
from Master Bond, Inc.

Master Bond Polymer System EP112AO is a solventless, moderate viscosity two component epoxy resin system which is specifically designed for high performance outdoor and indoor electrical and electronic applications where good thermal conductivity and electrial isolation is required. The two... [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid
  • Composition: Filled
Nanosilica Filled Optically Clear Epoxy with High Abrasion Resistance -- EP30NS
from Master Bond, Inc.

Master Bond EP30NS is a nanosilica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically clear and meets NASA low outgassing specifications. [See More]

  • Type: High Dielectric; Optical; Thermally Conductive
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Composition: Filled
NASA Low Outgassing Rated Epoxy Features Enhanced Chemical Resistance -- EP42-2LV Black
from Master Bond, Inc.

EP42-2LV Black is a two component, room temperature curing epoxy compound featuring low viscosity and superior chemical resistance. It meets NASA low outgassing specifications, is black in color and optically opaque. [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Composition: Unfilled
New Epoxy Offers Rapid Cures and Chemical Resistance -- EP41S-F
from Master Bond, Inc.

Offering impressive physical strength characteristics, EP41S-F is an electrically insulative two component epoxy that cures rapidly at ambient and elevated temperatures. Typically faster curing epoxies are somewhat less chemically resistant than other types of systems, but EP41S-F is one of the few... [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Composition: Unfilled
One Component Toughened Epoxy System For Bonding And Sealing -- Supreme 17HT
from Master Bond, Inc.

Master Bond Supreme 17HT is a one component toughened epoxy for bonding and sealing. It has a moderate viscosity system with good flow properties. [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
  • Form / Function: Liquid
  • Composition: Unfilled
One Component, High Temperature Resistant Epoxy -- EP36
from Master Bond, Inc.

Master Bond Polymer System EP36 is a unique one component high performance toughened epoxy system for electrical potting, casting, encapsulation, baked coatings and adhesive applications. It features an outstanding combination of properties including high temperature stability up to 500 °F,... [See More]

  • Type: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
  • Composition: Unfilled
One component, high temperature resistant epoxy system for bonding and sealing -- EP17HTDA-1
from Master Bond, Inc.

Formulated for die attach applications, Master Bond EP17HTDA-1 is a one component epoxy that can also be used for conventional bonding and sealing. This system features an excellent die shear strength of 24-27 kg-f and can be used in a typical die size ranging from 4-400 mm2. EP17HTDA-1 can also be... [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
  • Composition: Unfilled
One Component, Storage Stable Epoxy -- EP19HT
from Master Bond, Inc.

Master Bond Polymer System EP19HT is a storage stable one component liquid epoxy resin system for durable, high performance adhesive/sealants, impregnants and liners. It features remarkably long shelf life and excellent storage characteristics at ambient temperatures yet cures readily at elevated... [See More]

  • Type: High Dielectric
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Impregnating Resin; Die Bonding Adhesives
  • Composition: Unfilled
Cement -- No. 31
from Sauereisen, Inc.

Sauereisen Cement No. 31 is a white, porcelain-like cement that is widely used throughout industry in a variety of applications. including assembling, sealing, insulating and cementing of ceramics, porcelain, metal, and glass. [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Ceramic
  • Form / Function: Powder; Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
  • Composition: Unfilled
Dielectric Silicone Gel For Sealing Electronics -- SEMICOSIL® 912
from Wacker Chemical Corp.

SEMICOSIL ® 912 is a pourable, addition-curing, 2-part. silicone rubber that cures to a soft silicone gel when. mixed with ELASTOSIL ® CAT PT, ELASTOSIL ® CAT. PT-F or ELASTOSIL ® CAT UV. Special features. two-part, 10 : 1 mixing ratio. low viscosity. modular system allows flexible... [See More]

  • Type: High Dielectric; Optical
  • Chemical System: Silicone; Elastomeric
  • Form / Function: Liquid
  • Cure / Technology: Two Component  ; UV or Radiation Cured
Adhesive and encapsulating resin -- 60-7170R
from Epoxies Etc...

UV Cure 60-7170 is a one- component epoxy that cures with low intensity black light or high intensity UV lamps. UV 60-7170 is water clear and is designed to be used as an adhesive, coating, or encapsulant. This system is moisture and chemical resistant. UV Cure 60-7170 is a good choice for potting... [See More]

  • Type: High Dielectric
  • Chemical System: Epoxy
  • Form / Function: Liquid; Die Bonding Adhesives
  • Cure / Technology: UV or Radiation Cured; Single Component
TECHNOMELT PA 2384 -- 8807299842049
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Polyamide
  • Form / Function: Pellets
  • Cure / Technology: Thermoplastic / Hot Melt; Single Component
Clear Urethane Cast/Adhesive -- PNU-46201
from Protavic America, Inc.

The two component polyurethane compound described in this data sheet is specifically designed for the encapsulation by casting of completed circuit board. The cured material meets the flammability requirements of UL 94, V-O at thickness of 0.070 in. and greater (UL File Number E116296) and provides... [See More]

  • Type: High Dielectric; Thermal Insulation
  • Chemical System: Polyurethane
  • Form / Function: Liquid; Encapsulant or Conformal Coating
  • Composition: Filled
Di-Pak™ E-4000 Series Elastomeric Eletrical Insulating Compound -- E-4021
from Hapco, Inc.

Flexible, colorless, potting and encapsulating systems. Available in 5 minute (-5), 16 minute, and 20 minute gel times, and in shore hardness ’s from 20 A to 80 A . [See More]

  • Type: High Dielectric
  • Cure / Technology: Thermoset; Two Component  
  • Form / Function: Liquid
  • Industry: Electronics
Electrically Non-Conductive Adhesives -- LOCTITE ABLESTIK 8387BM
from Henkel Corporation - Industrial

LOCTITE ABLESTIK 8387BM, Epoxy, Encapsulant LOCTITE ® ABLESTIK 8387BM single component adhesive is designed for high throughput encapsulation applications. Non-conductive. Black pigmentation for blocking stray light [See More]

  • Type: High Dielectric
  • Cure / Technology: Single Component
  • Chemical System: Epoxy
  • Viscosity: 9200
Potting, Encapsulant Elastomer -- Bluesil™ Esa 7252 QC A/B
from Bluestar Silicones USA Corp.

Potting, encapsulant elastomer. Properties. Viscosity 3500. Hardness Sha 48. Description. a quick curing two-component silicone elastomer which cures at room temperature, cure can be acceleration by the application of heat. BLUESIL ™ ESA 7252 QC A & B is supplied as a viscous liquid which... [See More]

  • Type: High Dielectric
  • Chemical System: Silicone
  • Form / Function: Liquid; Encapsulant or Conformal Coating
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
High Temperature Cement -- OMEGABOND® Air Set Series
from OMEGA Engineering, Inc.

Air Set Cements set or cure through loss of moisture by evaporation. Atmospheric conditions therefore affect the drying rate. Air Set Cements are used mainly in thin film applications (applied in thicknesses less than 1/4")*. SELECTION CRITERIA FOR CEMENTS. 1. Type of Application Potting, sealing,... [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Ceramic
  • Form / Function: Powder (optional feature); Liquid (optional feature); Encapsulant or Conformal Coating
  • Cure / Technology: Two Component   (optional feature); Single Component (optional feature)
Elastomer Modified Epoxy -- 20-3236
from Epoxies Etc...

20-3236 Resin is a low viscosity copolymer adhesive and potting compound specifically designed for bonding vinyls and neoprenes. 20-3236 Resin has an extended working time and a convenient 2:1 mix ratio. [See More]

  • Type: High Dielectric
  • Chemical System: Epoxy; Elastomeric
  • Form / Function: Liquid; Die Bonding Adhesives
  • Composition: Unfilled
TECHNOMELT PA 2692
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Polyamide
  • Form / Function: Pellets
  • Cure / Technology: Thermoplastic / Hot Melt
Epoxy Adhesive -- ANE-26144
from Protavic America, Inc.

Clear unfilled epoxy also available in a one-part system. Use life is over three days after mixing at room temperature. Excellent for ferrite and optical bonding applications. Requires heat assist to cure. [See More]

  • Type: High Dielectric
  • Chemical System: Epoxy
  • Form / Function: Liquid; Encapsulant or Conformal Coating; Die Bonding Adhesives
  • Composition: Unfilled
Di-Pak™ E-4500 Elastomeric Eletrical Insulating Compound -- E-4540
from Hapco, Inc.

Flexible, 45, 65 and, 95 shore A hardness, potting and encapsulating systems. Flame retardant (FR), accelerated 3 minute (-3) gel time, and black or unpigmented versions are available. [See More]

  • Type: High Dielectric
  • Cure / Technology: Thermoset; Two Component  
  • Form / Function: Liquid
  • Features: Flame Retardant
Electrically Non-Conductive Adhesives -- LOCTITE ABLESTIK NCA 9300UV
from Henkel Corporation - Industrial

LOCTITE ABLESTIK NCA 9300UV, Acrylate, Non-conductive adhesive, Single component, Photocurable LOCTITE ® ABLESTIK NCA 9300UV single component, photocurable adhesive is designed for disk drive assembly applications such as conformal coating and component tracking. This product also contains a... [See More]

  • Type: High Dielectric
  • Viscosity: 70000
  • Cure / Technology: UV or Radiation Cured; Single Component
High Temperature Cement -- OMEGABOND® Chemical Set Series
from OMEGA Engineering, Inc.

Chemical Set Cements set or cure by an internal chemical action which does not require exposure to air. Chemical Set Cements can be used in thick applications (applied in thicknesses greater than 1/4")*. SELECTION CRITERIA FOR CEMENTS. 1. Type of Application Potting, sealing, encapsulating,... [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Ceramic
  • Form / Function: Powder (optional feature); Liquid (optional feature); Encapsulant or Conformal Coating
  • Cure / Technology: Two Component   (optional feature); Single Component (optional feature)
Epoxy Adhesive & Potting Compound -- 10-3009
from Epoxies Etc...

10-3009 is a low viscosity epoxy adhesive and potting compound. It is easy to use and allows the end user to adjust the flexibility of the cured epoxy. This product offers a good combination of peel and tensile strength. 10-3009 provides electrical insulation and outstanding adhesion. [See More]

  • Type: High Dielectric; Thermal Insulation
  • Chemical System: Epoxy
  • Form / Function: Liquid
  • Composition: Unfilled
TECHNOMELT PA 341 -- 8802588327937
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Polyamide
  • Form / Function: Pellets
  • Cure / Technology: Thermoplastic / Hot Melt
Polyurethane Adhesive -- PNU-56200
from Protavic America, Inc.

PNU-56200 ™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term circuit protection and... [See More]

  • Type: High Dielectric
  • Chemical System: Polyurethane
  • Form / Function: Liquid; Encapsulant or Conformal Coating; Die Bonding Adhesives
  • Composition: Unfilled
Di-Pak™ E-4600 Elastomeric Eletrical Insulating Compound -- E-4650
from Hapco, Inc.

Flexible, high strength, 50 to 71 shore D hardness potting and encapsulating systems. Available in flame retardant (FR), 3 minute (-3) gel time, and in black or unpigmented. [See More]

  • Type: High Dielectric
  • Cure / Technology: Thermoset; Two Component  
  • Form / Function: Liquid
  • Features: Flame Retardant
Encapsulants -- LOCTITE ECCOBOND DP 1006
from Henkel Corporation - Industrial

LOCTITE ECCOBOND DP 1006, Epoxy, Die attach and Encapsulant, non-conductive LOCTITE ® ECCOBOND DP 1006 fast and low temperature adhesive is formulated for use in digital printing applications. One component. Non-conductive. Extremely flexible. Fast cure. Low temperature cure. Excellent chemical... [See More]

  • Type: High Dielectric
  • Viscosity: 65000
  • CTE: 28
High Thermally Conductive Paste -- OMEGATHERM® OT-201 Series
from OMEGA Engineering, Inc.

OMEGATHERM thermal conducting paste is a high temperature and high thermally conductive paste product. They are specially formulated for permanent and temporary bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics,... [See More]

  • Type: High Dielectric; Thermally Conductive
  • Cure / Technology: Single Component
  • Chemical System: Silicone
  • Use Temperature: 392
One Component MicroElectric Grade Epoxy -- 50-3115
from Epoxies Etc...

50-3115 is a one part thermally conductive electrically insulating epoxy. This epoxy system is designed and engineered for demanding electronic bonding applications. It is formulated with low ionic high performance polymers and new proprietary thermally conductive fillers. [See More]

  • Type: High Dielectric; Thermally Conductive
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Single Component
TECHNOMELT PA 5375
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Polyolefin
  • Form / Function: Pellets
  • Cure / Technology: Thermoplastic / Hot Melt; Single Component
Reworkable Underfill Epoxy Resin -- ANA-10199R
from Protavic America, Inc.

Fast flow, fast cure capillary reworkable underfill. The rheology of the PROTAVIC ANA 10199 R in combination with its fineness make the product perfectly adapted to high reliability small gap underfill applications. It presents a good pot life at room temperature 20-22C and a high reactivity at... [See More]

  • Type: High Dielectric; Thermal Insulation
  • Composition: Unfilled
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
  • Cure / Technology: Thermoset; Single Component
Di-Pak™ Elastomeric Eletrical Insulating Compound -- E-4501
from Hapco, Inc.

Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E products are flame... [See More]

  • Type: High Dielectric; Thermally Conductive
  • Cure / Technology: Thermoset; Two Component  
  • Form / Function: Liquid
  • Features: Flame Retardant; UL Rating
Encapsulants -- LOCTITE ECCOBOND E 3230
from Henkel Corporation - Industrial

LOCTITE ECCOBOND E 3230, Epoxy, Assembly, Sag resistant LOCTITE ® ECCOBOND E 3230 chemically resistant, fast and low temperature heat curing adhesive is formulated for bonding dissimilar engineering substrates commonly used in ink jet applications and other MEMS devices. Fast and low... [See More]

  • Type: High Dielectric
  • Viscosity: 9500
Thermally Conductive Grease -- OT-201 Series
from OMEGA Engineering, Inc.

OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics, paper products. [See More]

  • Type: High Dielectric; Thermally Conductive
  • Cure / Technology: Single Component
  • Chemical System: Silicone
  • Use Temperature: 392
UV Curable Low CTE Encapsulant -- 60-7106
from Epoxies Etc...

UV Cure 60-7106 is a one-component ultraviolet (UV) curable encapsulant, adhesive and coating. This is an electronic grade material designed for applications requiring a low Coefficient of Thermal Expansion (CTE). [See More]

  • Type: High Dielectric
  • Composition: Filled
  • Form / Function: Gel; Die Bonding Adhesives
  • Cure / Technology: UV or Radiation Cured; Single Component
TECHNOMELT PA 6208 Black -- 8799566462977
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Polyamide
  • Form / Function: Pellets
  • Cure / Technology: Thermoplastic / Hot Melt; Single Component
Di-Pak™ Elastomeric Eletrical Insulating Compound -- E-4888
from Hapco, Inc.

High performance, flexible potting systems designed to be in constant water immersion while maintaining electrical and physical properties. DI-PAK E-4888 & E-4889 were designed to meet Naval underwater applications. [See More]

  • Type: High Dielectric
  • Cure / Technology: Thermoset; Two Component  
  • Form / Function: Liquid
  • Industry: Electronics
Encapsulants -- LOCTITE ECCOBOND EN 1350
from Henkel Corporation - Industrial

LOCTITE ECCOBOND EN 1350, Epoxy, Encapsulant. LOCTITE ® ECCOBOND EN 1350 encapsulant is designed for thermal sensor assembly applications. Non-conductive. Fast cure at low temperatures. Low temperature cure. High temperature resistance. Water resistant [See More]

  • Type: High Dielectric
  • Cure / Technology: Two Component  
  • Chemical System: Epoxy
  • CTE: 15
TECHNOMELT PA 668 Clear
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Type: High Dielectric; Optical; Thermally Conductive
  • Chemical System: Polyamide
  • Form / Function: Pellets
  • Cure / Technology: Thermoplastic / Hot Melt
Di-Pak™ Elastomeric Eletrical Insulating Compound -- E-4901-2
from Hapco, Inc.

Low cost, easy to use, potting compounds with fast cycle times. Available in 3 speeds. [See More]

  • Type: High Dielectric
  • Cure / Technology: Thermoset; Two Component  
  • Form / Function: Liquid
  • Industry: Electronics
Encapsulants -- LOCTITE ECCOBOND NCP 5209
from Henkel Corporation - Industrial

LOCTITE ® ECCOBOND NCP 5209 is designed for thermal compression bonding processes in flip chip to laminate assembly. LOCTITE ECCOBOND NCP 5209 is a non-conductive paste adhesive designed for advanced flip chip Cu pillar applications. It is formulated to be pre-applied to the subtrate and provide... [See More]

  • Type: High Dielectric
  • Viscosity: 12500
  • CTE: 16
Di-Pak™ Rigid Eletrical Insulating Compound -- R-4200
from Hapco, Inc.

DI-COAT R-4721 / DI-COAT R-4721 LV (lower viscosity). Shore 90 D, room temperature curing, medium to high thixotropic coating for dielectric insulating applications. DI-COAT R-4721 is ideal for use on vertical or sloping surfaces where flow or drain-off cannot be tolerated. DI-COAT R-4721 is easy to... [See More]

  • Type: High Dielectric
  • Cure / Technology: Thermoset; Two Component  
  • Form / Function: Liquid
  • Industry: Electronics
Encapsulants -- LOCTITE ECCOBOND PH 1
from Henkel Corporation - Industrial

LOCTITE ECCOBOND PH 1, Non-conductive Adhesive, Encapsulant. LOCTITE ® ECCOBOND PH 1 is a one component, non-conductive adhesive.   It has excellent ink resistance and has good adhesion to metal substrates and polyimide. LOCTITE ECCOBOND PH 1 is designed for stencil/screen printing, pin... [See More]

  • Type: High Dielectric
  • Viscosity: 3500
  • CTE: 28
Encapsulants -- LOCTITE STYCAST 1265J
from Henkel Corporation - Industrial

LOCTITE STYCAST 1265J, Epoxy, Encapsulant. LOCTITE ® STYCAST 1265J Parts AB is designed for embedding stress sensitive components or where inspections and repairs are desired. It can be cut easily for repairing and replacing components. Fresh material can be poured and then cured to form a... [See More]

  • Type: High Dielectric
  • Cure / Technology: Two Component  
  • Chemical System: Epoxy
  • Use Temperature: 40 to 149
Encapsulants -- LOCTITE STYCAST 5952-1
from Henkel Corporation - Industrial

LOCTITE STYCAST 5952-1, Silicone, Potting or Encapsulant. LOCTITE ® STYCAST 5952-1 is designed for encapsulation of heat generating devices. It is also recommended for applications requiring a non-corrosive casting and coating. Electrically non-conductive. Good elongation strength. Moderate tear... [See More]

  • Type: High Dielectric; Thermally Conductive
  • Cure / Technology: Two Component  
  • Chemical System: Silicone
  • Thermal Conductivity: 0.8000
Industrial Adhesives -- LOCTITE ABLESTIK 2033SC
from Henkel Corporation - Industrial

LOCTITE ABLESTIK 2033SC, Proprietary Hybrid Chemistry, Die Attach. LOCTITE ® ABLESTIK 2033SC die attach adhesive is designed for high throughput smart card bonding applications. It is compatible with various encapsulant chemistries. Non-conductive. Single component. Low bleed. Long work life. [See More]

  • Type: High Dielectric
  • Cure / Technology: Single Component
  • Form / Function: Paste
  • CTE: 31
Industrial Adhesives -- LOCTITE ABLESTIK ABP 2036SF
from Henkel Corporation - Industrial

LOCTITE ABLESTIK ABP 6892, BMI/Acrylate, Die Attach, Non-conductive Paste LOCTITE ® ABLESTIK ABP 6892 non-conductive die attach paste is designed for applications requiring low stress and robust mechanical properties. A package using this material will have a greater resistance to delamination... [See More]

  • Type: High Dielectric
  • Cure / Technology: Single Component
  • Form / Function: Paste
  • Thermal Conductivity: 0.3500