Electrical Insulation / Dielectric Encapsulants and Potting Compounds
from Master Bond, Inc.
MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]
- Type: High Dielectric; Optical; Thermally Conductive
- Chemical System: Silicone
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid
- Composition: Unfilled
from ELANTAS North America LLC
ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]
- Type: High Dielectric
- Chemical System: Epoxy
- Form / Function: Liquid
- Composition: Filled
from CHT USA Inc.
CHT's QSil 216 is a 2-part, platinum cure, optically clear silicone encapsulant designed for optical applications. QSil 216 features a 10:1 mix ratio by weight and its low viscosity profile enables excellent flow around components and is excellent for potting complex parts. The chemical composition... [See More]
- Type: High Dielectric; Optical
- Industry: Automotive; Electronics; OEM or Industrial
- Cure / Technology: Two Component ; Addition
- Use Temperature: -67 to 399
from Ellsworth Adhesives
Dow 3-4237 Dielectric Firm Gel Clear-Green is a two component, room temperature curing, silicone gel that is used for potting, sealing, encapsulating, and protecting electrical components from contaminants, moisture, and stress. It is durable, flexible, self healing, and offers long working times. [See More]
- Type: High Dielectric
- Cure / Technology: Two Component
- Chemical System: Silicone
- Industry: Electronics
from Master Bond, Inc.
EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]
- Type: High Dielectric; Thermally Conductive
- Chemical System: Epoxy
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
- Composition: Unfilled
from Ellsworth Adhesives
Dow DOWSIL ™ 3-4150 Dielectric Gel Clear-Green is a two component, fast room temperature curing, silicone gel that is used for potting, sealing, encapsulating, and protecting a variety of materials in the electronics industry. It offers flexibility, stress relief, and offers excellent... [See More]
- Type: High Dielectric
- Cure / Technology: Two Component
- Chemical System: Silicone
- Dielectric Strength: 381
from Master Bond, Inc.
One part, nano silica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]
- Type: High Dielectric; Thermally Conductive
- Chemical System: UV Curing
- Form / Function: Liquid; Encapsulant or Conformal Coating; Glob Top, Daub, Doming or Overfill
- Composition: Filled
from Ellsworth Adhesives
Dow DOWSIL ™ 3-4155 HV Dielectric Gel Clear-Green is a two component, high viscosity, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. It cures quickly at room temperature, offers flexibility, thermal stability,... [See More]
- Type: High Dielectric
- Cure / Technology: Two Component
- Chemical System: Silicone
- Industry: Electric Power
from Master Bond, Inc.
EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]
- Type: High Dielectric; Thermally Conductive
- Chemical System: Epoxy
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
- Composition: Unfilled
from Ellsworth Adhesives
Dow DOWSIL ™ 3-4207 Dielectric Tough Gel Clear-Green is a two component, room temperature curing, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. It is durable, fast curing, requires no primer, and has good... [See More]
- Type: High Dielectric
- Cure / Technology: Two Component
- Chemical System: Silicone
- Dielectric Strength: 425
from Master Bond, Inc.
Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating. [See More]
- Type: High Dielectric; Thermal Insulation
- Chemical System: Epoxy
- Form / Function: Liquid; Encapsulant or Conformal Coating
- Composition: Unfilled
from Ellsworth Adhesives
Dow DOWSIL ™ 3-4207 Dielectric Tough Gel Clear-Green is a two component, room temperature curing, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. It is durable, fast curing, requires no primer, and has good... [See More]
- Type: High Dielectric
- Cure / Technology: Two Component
- Chemical System: Silicone
- Industry: Electronics
from Master Bond, Inc.
EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]
- Type: High Dielectric; Thermally Conductive
- Chemical System: Epoxy
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
- Composition: Unfilled
from Ellsworth Adhesives
Dow DOWSIL ™ 3-4207 Dielectric Tough Gel Clear-Green is a two component, room temperature curing, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. It is durable, fast curing, requires no primer, and has good... [See More]
- Type: High Dielectric
- Cure / Technology: Two Component
- Chemical System: Silicone
- Industry: Electronics
from Master Bond, Inc.
EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]
- Type: High Dielectric; Thermally Conductive
- Chemical System: Epoxy
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
- Composition: Unfilled
from Ellsworth Adhesives
Dow DOWSIL ™ 3-4222 Dielectric Firm Gel Clear-Green is a two component, room temperature curing, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. It is durable, fast curing, requires no primer, and has excellent... [See More]
- Type: High Dielectric
- Cure / Technology: Two Component
- Chemical System: Silicone
- Dielectric Strength: 350
from Master Bond, Inc.
MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]
- Type: High Dielectric; Optical; Thermally Conductive
- Chemical System: Silicone
- Form / Function: Liquid
- Composition: Unfilled
from Ellsworth Adhesives
Dow DOWSIL ™ 3-4222 Dielectric Firm Gel Clear-Green is a two component, room temperature curing, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. It is durable, fast curing, requires no primer, and has excellent... [See More]
- Type: High Dielectric
- Cure / Technology: Two Component
- Chemical System: Silicone
- Industry: Electronics
from Master Bond, Inc.
Master Bond Polymer System EP13 is a one component heat curing epoxy featuring high shear strength and very high temperature resistance. This one component system is formulated to cure at temperatures from 300 °F to 350 °F for 60-90 minutes. Upon cure, EP13 readily attains tensile shear... [See More]
- Type: High Dielectric
- Chemical System: Epoxy
- Form / Function: Encapsulant or Conformal Coating; Die Bonding Adhesives
- Composition: Unfilled
from Ellsworth Adhesives
Dow DOWSIL ™ 3-4222 Dielectric Firm Gel Clear-Green is a two component, room temperature curing, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. It is durable, fast curing, requires no primer, and has excellent... [See More]
- Type: High Dielectric
- Cure / Technology: Two Component
- Chemical System: Silicone
- Industry: Electronics
from Master Bond, Inc.
Master Bond Polymer System 125 is a two component toughened epoxy resin for prolonged service above 500 °F with truly outstanding chemical resistance. High strength bonds serviceable up to 600 °F can be obtained with this exceptionally thermally stable and chemically resistant epoxy resin... [See More]
- Type: High Dielectric; Thermal Insulation
- Chemical System: Epoxy
- Form / Function: Powder; Gap Filler, Foam in Place Gasket; Impregnating Resin; Die Bonding Adhesives
- Composition: Unfilled
from Ellsworth Adhesives
Dow DOWSIL ™ 3-4241 Dielectric Tough Gel Clear-Green is a two component, heat curing, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. It is durable, fast curing, requires no primer, flame resistant, long working... [See More]
- Type: High Dielectric
- Cure / Technology: Two Component
- Chemical System: Silicone
- Dielectric Strength: 450
from Master Bond, Inc.
MasterSil 151TC is a highly flexible, temperature resistant two component silicone adhesive offering low thermal resistance and outstanding thermal conductivity. It was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. [See More]
- Type: High Dielectric; Thermally Conductive
- Chemical System: Silicone
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid
- Composition: Filled
from Ellsworth Adhesives
Dow DOWSIL ™ 3-4241 Dielectric Tough Gel Clear-Green is a two component, heat curing, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. It is durable, fast curing, requires no primer, flame resistant, long working... [See More]
- Type: High Dielectric
- Cure / Technology: Two Component
- Chemical System: Silicone
- Industry: Electronics
from Master Bond, Inc.
Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. Not only is EP29LPSP able to function as an adhesive, sealant and protective coating at temperatures as low as 4K, but it is... [See More]
- Type: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding
- Chemical System: Epoxy
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
- Composition: Unfilled
from Ellsworth Adhesives
Dow DOWSIL ™ 3-6635 Dielectric Gel Clear is a one component, heat curing, low temperature gel that is used to protect electrical components from extreme environments, moisture, and stress. It is flowable, low viscosity, durable, and self healing. 18.1 kg Pail. [See More]
- Type: High Dielectric
- Cure / Technology: Single Component
- Chemical System: Silicone
- Industry: Electronics
from Master Bond, Inc.
Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronicc/ structural applications. The two components are combined in a convenient noncritical mix... [See More]
- Type: High Dielectric; Optical; Thermal Insulation
- Chemical System: Epoxy
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating; Impregnating Resin
- Composition: Unfilled
from Ellsworth Adhesives
Dow DOWSIL ™ EG-3810 Dielectric Gel is a one component, clear, heat curing silicone gel that is used for potting, sealing, encapsulating, and protecting a variety of materials in the electronics industry. It offers a wide range of operating temperatures ranging from -60 °C to 200 °C,... [See More]
- Type: High Dielectric
- Cure / Technology: Single Component
- Chemical System: Silicone
- Industry: Electronics; Semiconductors, IC's
from Master Bond, Inc.
Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. [See More]
- Type: High Dielectric; Optical; Thermally Conductive
- Chemical System: Epoxy
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
- Composition: Unfilled
from Ellsworth Adhesives
Dow DOWSIL ™ Q3-6575 Dielectric Gel Clear is a two component, heat curing, low temperature, silicone gel that is used for protecting and sealing electronic devices from high voltages, moisture, mechanical and thermal shock. 1:1 mix ratio by weight or volume. 0.9 kg Kit.This is a Dow product... [See More]
- Type: High Dielectric
- Cure / Technology: Two Component
- Chemical System: Silicone
- Dielectric Strength: 457
from Master Bond, Inc.
Master Bond Polymer System EP38 is a fast curing, low viscosity, optically clear two component epoxy system for high performance coating, bonding and sealing. It is 100% reactive and does not contain any volatiles. The mix ratio is a convenient 3 to 1 by weight. EP38 is very fast curing. Coatings as... [See More]
- Type: High Dielectric
- Chemical System: Epoxy
- Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Die Bonding Adhesives
- Composition: Unfilled
from Ellsworth Adhesives
Dow DOWSIL ™ Q3-6575 Dielectric Gel Clear is a two component, heat curing, low temperature, silicone gel that is used for protecting and sealing electronic devices from high voltages, moisture, mechanical and thermal shock. 1:1 mix ratio by weight or volume. 35 kg Kit. [See More]
- Type: High Dielectric
- Cure / Technology: Two Component
- Chemical System: Silicone
- Elongation: 300.0
from Master Bond, Inc.
Master Bond EP30NS is a nano silica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically clear and meets NASA low outgassing specifications. [See More]
- Type: High Dielectric; Optical; Thermally Conductive
- Chemical System: Epoxy
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
- Composition: Filled
from Ellsworth Adhesives
Dow SYLGARD ™ 527 Silicone Dielectric Gel is a two component, room temperature and heat curing gel that is used for coating, encapsulating, potting, and sealing electronic devices. It provides flexibility, good flow, and low viscosity. 1:1 mix ratio. 0.9 kg Kit. [See More]
- Type: High Dielectric
- Cure / Technology: Two Component
- Chemical System: Silicone
- Industry: Electronics
from Master Bond, Inc.
EP42-2LV Black is a two component, room temperature curing epoxy compound featuring low viscosity and superior chemical resistance. It meets NASA low outgassing specifications, is black in color and optically opaque. [See More]
- Type: High Dielectric; Thermally Conductive
- Chemical System: Epoxy
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
- Composition: Unfilled
from Ellsworth Adhesives
Dow SYLGARD ™ 527 Silicone Dielectric Gel is a two component, room temperature and heat curing gel that is used for coating, encapsulating, potting, and sealing electronic devices. It provides flexibility, good flow, and low viscosity. 1:1 mix ratio. 36.3 kg Kit. [See More]
- Type: High Dielectric
- Cure / Technology: Two Component
- Chemical System: Silicone
- Industry: Electronics
from Master Bond, Inc.
Master Bond Supreme 17HT is a one component toughened epoxy for bonding and sealing. It has a moderate viscosity system with good flow properties. [See More]
- Type: High Dielectric; Thermally Conductive
- Chemical System: Epoxy
- Form / Function: Liquid
- Composition: Unfilled
from Ellsworth Adhesives
Dow SYLGARD ™ 527 Silicone Dielectric Gel is a two component, room temperature and heat curing gel that is used for coating, encapsulating, potting, and sealing electronic devices. It provides flexibility, good flow, and low viscosity. 1:1 mix ratio. 7.2 kg Kit. [See More]
- Type: High Dielectric
- Cure / Technology: Two Component
- Chemical System: Silicone
- Industry: Electronics
from Master Bond, Inc.
Master Bond Polymer System EP36 is a unique one component high performance toughened epoxy system for electrical potting, casting, encapsulation, baked coatings and adhesive applications. It features an outstanding combination of properties including high temperature stability up to 500 °F,... [See More]
- Type: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding
- Chemical System: Epoxy
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
- Composition: Unfilled
from Ellsworth Adhesives
Dow SYLGARD ™ 527 Silicone Dielectric Gel is a two component, room temperature and heat curing gel that is used for coating, encapsulating, potting, and sealing electronic devices. It provides flexibility, good flow, and low viscosity. 1:1 mix ratio. Part B, 18.1 kg Pail. [See More]
- Type: High Dielectric
- Cure / Technology: Two Component
- Chemical System: Silicone
- Industry: Electronics
from Master Bond, Inc.
Formulated for die attach applications, Master Bond EP17HTDA-1 is a one component epoxy that can also be used for conventional bonding and sealing. This system features an excellent die shear strength of 24-27 kg-f and can be used in a typical die size ranging from 4-400 mm2. EP17HTDA-1 can also be... [See More]
- Type: High Dielectric; Thermally Conductive
- Chemical System: Epoxy
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
- Composition: Unfilled
from Master Bond, Inc.
Master Bond Polymer System EP19HT is a storage stable one component liquid epoxy resin system for durable, high performance adhesive/sealants, impregnates and liners. It features remarkably long shelf life and excellent storage characteristics at ambient temperatures yet cures readily at elevated... [See More]
- Type: High Dielectric
- Chemical System: Epoxy
- Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Impregnating Resin; Die Bonding Adhesives
- Composition: Unfilled
from Master Bond, Inc.
Master Bond UV10 and UV10TK are one component UV curable modified epoxy compounds, ready for use as supplied, for high performance casting, coatings, sealing and bonding applications. UV10 is a low viscosity amber liquid at room temperature and UV10TK is a medium viscosity amber liquid at room... [See More]
- Type: High Dielectric; Optical; Thermal Insulation
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating; Impregnating Resin
- Features: Non-corrosive; Dissimilar Substrates
from Master Bond, Inc.
Supreme 3HTND-2DM is a rapid curing, toughened, one part epoxy system used for the dam-and-fill method for chip-on-board encapsulation. It passes ASTM E595 specifications for NASA low outgassing allowing it to be used in vacuum, aerospace, electro-optic and other related applications. Supreme... [See More]
- Type: High Dielectric; Thermally Conductive
- Chemical System: Epoxy
- Form / Function: Gap Filler, Foam in Place Gasket; Glob Top, Daub, Doming or Overfill
- Composition: Unfilled
from Master Bond, Inc.
Formulated to have special optical transmission properties, EP30-2LB is an optically clear epoxy that does not permit UV light transmission, but transmits well from 450-900 nm and above. It is a user friendly compound that has a non-critical ten to one mix ratio by weight. This system cures readily... [See More]
- Type: High Dielectric; Optical; Thermally Conductive
- Chemical System: Epoxy
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
- Composition: Unfilled
from Protavic America, Inc.
The two component polyurethane compound described in this data sheet is specifically designed for the encapsulation by casting of completed circuit board. The cured material meets the flammability requirements of UL 94, V-O at thickness of 0.070 in. and greater (UL File Number E116296) and provides... [See More]
- Type: High Dielectric; Thermal Insulation
- Chemical System: Polyurethane
- Form / Function: Liquid; Encapsulant or Conformal Coating
- Composition: Filled
from DuPont Electronics & Imaging
DuPont ™ Pyralux ® HXC is DuPont ™ Kapton ® MBC black polyimide film coated with epoxy ideal for products where uniform matte black appearance is desired. It is coated on one side with a proprietary B-staged modified epoxy adhesive. The Pyralux ® HXC coverlay is used to... [See More]
- Type: High Dielectric
- Features: UL Rating
- Chemical System: Polyimide
- Industry: Electronics; OEM or Industrial
from Bluestar Silicones USA Corp.
Potting, encapsulant elastomer. Properties. Viscosity 3500. Hardness Sha 48. Description. a quick curing two-component silicone elastomer which cures at room temperature, cure can be acceleration by the application of heat. BLUESIL ™ ESA 7252 QC A & B is supplied as a viscous liquid which... [See More]
- Type: High Dielectric
- Chemical System: Silicone
- Form / Function: Liquid; Encapsulant or Conformal Coating
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
from Epoxies Etc...
UV Cure 60-7170 is a one- component epoxy that cures with low intensity black light or high intensity UV lamps. UV 60-7170 is water clear and is designed to be used as an adhesive, coating, or encapsulant. This system is moisture and chemical resistant. UV Cure 60-7170 is a good choice for potting... [See More]
- Type: High Dielectric
- Chemical System: Epoxy
- Form / Function: Liquid; Die Bonding Adhesives
- Cure / Technology: UV or Radiation Cured; Single Component
from Epoxy Technology
EPO-TEK ® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries. Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market... [See More]
- Type: High Dielectric; Optical; Thermally Conductive
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Industry: Sanitary; Electronics; Photonics
from Sauereisen, Inc.
Sauereisen Cement No. 31 is a white, porcelain-like cement that is widely used throughout industry in a variety of applications. including assembling, sealing, insulating and cementing of ceramics, porcelain, metal, and glass. [See More]
- Type: High Dielectric; Thermally Conductive
- Chemical System: Ceramic
- Form / Function: Powder; Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
- Composition: Unfilled
from Hapco, Inc.
Flexible, colorless, potting and encapsulating systems. Available in 5 minute (-5), 16 minute, and 20 minute gel times, and in shore hardness ’s from 20 A to 80 A . [See More]
- Type: High Dielectric
- Cure / Technology: Thermoset; Two Component
- Form / Function: Liquid
- Industry: Electronics
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Type: High Dielectric; Thermally Conductive
- Chemical System: Polyamide
- Form / Function: Pellets
- Cure / Technology: Thermoplastic / Hot Melt; Single Component
from Wacker Chemical Corp.
SEMICOSIL ® 912 is a pourable, addition-curing, 2-part. silicone rubber that cures to a soft silicone gel when. mixed with ELASTOSIL ® CAT PT, ELASTOSIL ® CAT. PT-F or ELASTOSIL ® CAT UV. Special features. two-part, 10 : 1 mixing ratio. low viscosity. modular system allows flexible... [See More]
- Type: High Dielectric; Optical
- Chemical System: Silicone; Elastomeric
- Form / Function: Liquid
- Cure / Technology: Two Component ; UV or Radiation Cured
from OMEGA Engineering, Inc.
Air Set Cements set or cure through loss of moisture by evaporation. Atmospheric conditions therefore affect the drying rate. Air Set Cements are used mainly in thin film applications (applied in thicknesses less than 1/4")*. SELECTION CRITERIA FOR CEMENTS. 1. Type of Application Potting, sealing,... [See More]
- Type: High Dielectric; Thermally Conductive
- Chemical System: Ceramic
- Form / Function: Powder (optional feature); Liquid (optional feature); Encapsulant or Conformal Coating
- Cure / Technology: Two Component (optional feature); Single Component (optional feature)
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 8387BM, Epoxy, Encapsulant LOCTITE ® ABLESTIK 8387BM single component adhesive is designed for high throughput encapsulation applications. Non-conductive. Black pigmentation for blocking stray light [See More]
- Type: High Dielectric
- Cure / Technology: Single Component
- Chemical System: Epoxy
- Viscosity: 9200
from Protavic America, Inc.
Clear unfilled epoxy also available in a one-part system. Use life is over three days after mixing at room temperature. Excellent for ferrite and optical bonding applications. Requires heat assist to cure. [See More]
- Type: High Dielectric
- Chemical System: Epoxy
- Form / Function: Liquid; Encapsulant or Conformal Coating; Die Bonding Adhesives
- Composition: Unfilled
from Epoxies Etc...
20-3236 Resin is a low viscosity copolymer adhesive and potting compound specifically designed for bonding vinyls and neoprenes. 20-3236 Resin has an extended working time and a convenient 2:1 mix ratio. [See More]
- Type: High Dielectric
- Chemical System: Epoxy; Elastomeric
- Form / Function: Liquid; Die Bonding Adhesives
- Composition: Unfilled
from Hapco, Inc.
Flexible, 45, 65 and, 95 shore A hardness, potting and encapsulating systems. Flame retardant (FR), accelerated 3 minute (-3) gel time, and black or unpigmented versions are available. [See More]
- Type: High Dielectric
- Cure / Technology: Thermoset; Two Component
- Form / Function: Liquid
- Features: Flame Retardant
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Type: High Dielectric; Thermally Conductive
- Chemical System: Polyamide
- Form / Function: Pellets
- Cure / Technology: Thermoplastic / Hot Melt
from OMEGA Engineering, Inc.
Chemical Set Cements set or cure by an internal chemical action which does not require exposure to air. Chemical Set Cements can be used in thick applications (applied in thicknesses greater than 1/4")*. SELECTION CRITERIA FOR CEMENTS. 1. Type of Application Potting, sealing, encapsulating,... [See More]
- Type: High Dielectric; Thermally Conductive
- Chemical System: Ceramic
- Form / Function: Powder (optional feature); Liquid (optional feature); Encapsulant or Conformal Coating
- Cure / Technology: Two Component (optional feature); Single Component (optional feature)
from Henkel Corporation - Industrial
LOCTITE ABLESTIK NCA 9300UV, Acrylate, Non-conductive adhesive, Single component, Photocurable LOCTITE ® ABLESTIK NCA 9300UV single component, photocurable adhesive is designed for disk drive assembly applications such as conformal coating and component tracking. This product also contains a... [See More]
- Type: High Dielectric
- Viscosity: 70000
- Cure / Technology: UV or Radiation Cured; Single Component
from Protavic America, Inc.
PNU-56200 ™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term circuit protection and... [See More]
- Type: High Dielectric
- Chemical System: Polyurethane
- Form / Function: Liquid; Encapsulant or Conformal Coating; Die Bonding Adhesives
- Composition: Unfilled
from Epoxies Etc...
10-3009 is a low viscosity epoxy adhesive and potting compound. It is easy to use and allows the end user to adjust the flexibility of the cured epoxy. This product offers a good combination of peel and tensile strength. 10-3009 provides electrical insulation and outstanding adhesion. [See More]
- Type: High Dielectric; Thermal Insulation
- Chemical System: Epoxy
- Form / Function: Liquid
- Composition: Unfilled
from Hapco, Inc.
Flexible, high strength, 50 to 71 shore D hardness potting and encapsulating systems. Available in flame retardant (FR), 3 minute (-3) gel time, and in black or unpigmented. [See More]
- Type: High Dielectric
- Cure / Technology: Thermoset; Two Component
- Form / Function: Liquid
- Features: Flame Retardant
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Type: High Dielectric; Thermally Conductive
- Chemical System: Polyamide
- Form / Function: Pellets
- Cure / Technology: Thermoplastic / Hot Melt
from OMEGA Engineering, Inc.
OMEGATHERM thermal conducting paste is a high temperature and high thermally conductive paste product. They are specially formulated for permanent and temporary bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics,... [See More]
- Type: High Dielectric; Thermally Conductive
- Cure / Technology: Single Component
- Chemical System: Silicone
- Use Temperature: 392
from Henkel Corporation - Industrial
LOCTITE ECCOBOND DP 1006, Epoxy, Die attach and Encapsulant, non-conductive LOCTITE ® ECCOBOND DP 1006 fast and low temperature adhesive is formulated for use in digital printing applications. One component. Non-conductive. Extremely flexible. Fast cure. Low temperature cure. Excellent chemical... [See More]
- Type: High Dielectric
- Viscosity: 65000
- CTE: 28
from Protavic America, Inc.
Fast flow, fast cure capillary reworkable underfill. The rheology of the PROTAVIC ANA 10199 R in combination with its fineness make the product perfectly adapted to high reliability small gap underfill applications. It presents a good pot life at room temperature 20-22C and a high reactivity at... [See More]
- Type: High Dielectric; Thermal Insulation
- Composition: Unfilled
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
- Cure / Technology: Thermoset; Single Component
from Epoxies Etc...
50-3115 is a one part thermally conductive electrically insulating epoxy. This epoxy system is designed and engineered for demanding electronic bonding applications. It is formulated with low ionic high performance polymers and new proprietary thermally conductive fillers. [See More]
- Type: High Dielectric; Thermally Conductive
- Composition: Unfilled
- Chemical System: Epoxy
- Cure / Technology: Thermoset; Single Component
from Hapco, Inc.
Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E products are flame... [See More]
- Type: High Dielectric; Thermally Conductive
- Cure / Technology: Thermoset; Two Component
- Form / Function: Liquid
- Features: Flame Retardant; UL Rating
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Type: High Dielectric; Thermally Conductive
- Chemical System: Polyolefin
- Form / Function: Pellets
- Cure / Technology: Thermoplastic / Hot Melt; Single Component
from OMEGA Engineering, Inc.
OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics, paper products. [See More]
- Type: High Dielectric; Thermally Conductive
- Cure / Technology: Single Component
- Chemical System: Silicone
- Use Temperature: 392
from Henkel Corporation - Industrial
LOCTITE ECCOBOND E 3230, Epoxy, Assembly, Sag resistant LOCTITE ® ECCOBOND E 3230 chemically resistant, fast and low temperature heat curing adhesive is formulated for bonding dissimilar engineering substrates commonly used in ink jet applications and other MEMS devices. Fast and low... [See More]
- Type: High Dielectric
- Viscosity: 9500
from Epoxies Etc...
UV Cure 60-7106 is a one-component ultraviolet (UV) curable encapsulant, adhesive and coating. This is an electronic grade material designed for applications requiring a low Coefficient of Thermal Expansion (CTE). [See More]
- Type: High Dielectric
- Composition: Filled
- Form / Function: Gel; Die Bonding Adhesives
- Cure / Technology: UV or Radiation Cured; Single Component
from Hapco, Inc.
High performance, flexible potting systems designed to be in constant water immersion while maintaining electrical and physical properties. DI-PAK E-4888 & E-4889 were designed to meet Naval underwater applications. [See More]
- Type: High Dielectric
- Cure / Technology: Thermoset; Two Component
- Form / Function: Liquid
- Industry: Electronics
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Type: High Dielectric; Thermally Conductive
- Chemical System: Polyamide
- Form / Function: Pellets
- Cure / Technology: Thermoplastic / Hot Melt; Single Component
from Henkel Corporation - Industrial
LOCTITE ECCOBOND EN 1350, Epoxy, Encapsulant. LOCTITE ® ECCOBOND EN 1350 encapsulant is designed for thermal sensor assembly applications. Non-conductive. Fast cure at low temperatures. Low temperature cure. High temperature resistance. Water resistant [See More]
- Type: High Dielectric
- Cure / Technology: Two Component
- Chemical System: Epoxy
- CTE: 15
from Hapco, Inc.
Low cost, easy to use, potting compounds with fast cycle times. Available in 3 speeds. [See More]
- Type: High Dielectric
- Cure / Technology: Thermoset; Two Component
- Form / Function: Liquid
- Industry: Electronics
from Henkel Corporation - Electronics
Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]
- Type: High Dielectric; Optical; Thermally Conductive
- Chemical System: Polyamide
- Form / Function: Pellets
- Cure / Technology: Thermoplastic / Hot Melt
from Henkel Corporation - Industrial
LOCTITE ® ECCOBOND NCP 5209 is designed for thermal compression bonding processes in flip chip to laminate assembly. LOCTITE ECCOBOND NCP 5209 is a non-conductive paste adhesive designed for advanced flip chip Cu pillar applications. It is formulated to be pre-applied to the subtrate and provide... [See More]
- Type: High Dielectric
- Viscosity: 12500
- CTE: 16
from Hapco, Inc.
DI-COAT R-4721 / DI-COAT R-4721 LV (lower viscosity). Shore 90 D, room temperature curing, medium to high thixotropic coating for dielectric insulating applications. DI-COAT R-4721 is ideal for use on vertical or sloping surfaces where flow or drain-off cannot be tolerated. DI-COAT R-4721 is easy to... [See More]
- Type: High Dielectric
- Cure / Technology: Thermoset; Two Component
- Form / Function: Liquid
- Industry: Electronics
from Henkel Corporation - Industrial
LOCTITE ECCOBOND PH 1, Non-conductive Adhesive, Encapsulant. LOCTITE ® ECCOBOND PH 1 is a one component, non-conductive adhesive. It has excellent ink resistance and has good adhesion to metal substrates and polyimide. LOCTITE ECCOBOND PH 1 is designed for stencil/screen printing, pin... [See More]
- Type: High Dielectric
- Viscosity: 3500
- CTE: 28
from Henkel Corporation - Industrial
LOCTITE STYCAST 1265J, Epoxy, Encapsulant. LOCTITE ® STYCAST 1265J Parts AB is designed for embedding stress sensitive components or where inspections and repairs are desired. It can be cut easily for repairing and replacing components. Fresh material can be poured and then cured to form a... [See More]
- Type: High Dielectric
- Cure / Technology: Two Component
- Chemical System: Epoxy
- Use Temperature: 40 to 149
from Henkel Corporation - Industrial
LOCTITE STYCAST 5952-1, Silicone, Potting or Encapsulant. LOCTITE ® STYCAST 5952-1 is designed for encapsulation of heat generating devices. It is also recommended for applications requiring a non-corrosive casting and coating. Electrically non-conductive. Good elongation strength. Moderate tear... [See More]
- Type: High Dielectric; Thermally Conductive
- Cure / Technology: Two Component
- Chemical System: Silicone
- Thermal Conductivity: 0.8000
from Henkel Corporation - Industrial
LOCTITE ABLESTIK 2033SC, Proprietary Hybrid Chemistry, Die Attach. LOCTITE ® ABLESTIK 2033SC die attach adhesive is designed for high throughput smart card bonding applications. It is compatible with various encapsulant chemistries. Non-conductive. Single component. Low bleed. Long work life. [See More]
- Type: High Dielectric
- Cure / Technology: Single Component
- Form / Function: Paste
- CTE: 31
from Henkel Corporation - Industrial
LOCTITE ABLESTIK ABP 6892, BMI/Acrylate, Die Attach, Non-conductive Paste LOCTITE ® ABLESTIK ABP 6892 non-conductive die attach paste is designed for applications requiring low stress and robust mechanical properties. A package using this material will have a greater resistance to delamination... [See More]
- Type: High Dielectric
- Cure / Technology: Single Component
- Form / Function: Paste
- Thermal Conductivity: 0.3500