Die Bonding Adhesive / Compound Encapsulants and Potting Compounds

Electrically Conductive Die Attach Adhesive Has Very High Thermal Conductivity -- EP3HTSDA-1
from Master Bond, Inc.

EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]

  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
  • Chemical System: Epoxy
  • Type: High Dielectric; Thermally Conductive
  • Composition: Unfilled
Coverlay, Bondply & Sheet Adhesive -- Pyralux® FR
from DuPont Electronics & Imaging

DuPont ™ Pyralux ® FR products are acrylic-based flame retardant copper clad laminates, coverlays, bonpdplys and sheet adhesives for products requiring UL rating. Features: High bond strength. High thermal resistance. No refrigeration required for storage. Two-year product performance... [See More]

  • Form / Function: Die Bonding Adhesives
  • Features: UL Rating
  • Chemical System: Acrylic; Polyimide
  • Industry: Electronics; OEM or Industrial
Thermally Conductive Epoxy -- EPO-TEK® TV2001
from Epoxy Technology

Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting hostile environments,... [See More]

  • Form / Function: Die Bonding Adhesives
  • Chemical System: Epoxy
  • Type: High Dielectric; Thermally Conductive
  • Cure / Technology: Thermoset; Two Component  
Electrically Conductive Die Attach Epoxy With High Glass Transition Temperature -- EP17HTS-DA
from Master Bond, Inc.

Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]

  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
  • Chemical System: Polyphenylene Sulfide; Epoxy
  • Type: Electrically Conductive; Thermally Conductive
  • Composition: Filled
Fast Curing, Optically Clear, Two Part Epoxy -- EP39-2
from Master Bond, Inc.

Master Bond Polymer System EP39-2 is a fast curing, low viscosity, optically clear two component epoxy system for high performance bonding, sealing, coating and casting. It is 100% reactive and does not contain any diluents, solvents or other volatiles. The mix ratio is a convenient 2 to 1 by... [See More]

  • Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Die Bonding Adhesives
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
High Temperature Resistant Epoxy Compound -- EP45HT
from Master Bond, Inc.

Master Bond Polymer System EP45HT is a two component epoxy system for high performance structural bonding and casting. It is suitable for applications where long term exposure to temperatures from -80 °F to +500 °F is required. lt is 100% reactive and does not contain any solvents or... [See More]

  • Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Die Bonding Adhesives
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
High Temperature Resistant, One Component Epoxy System -- EP13
from Master Bond, Inc.

Master Bond Polymer System EP13 is a one component heat curing epoxy featuring high shear strength and very high temperature resistance. This one component system is formulated to cure at temperatures from 300 °F to 350 °F for 60-90 minutes. Upon cure, EP13 readily attains tensile shear... [See More]

  • Form / Function: Encapsulant or Conformal Coating; Die Bonding Adhesives
  • Chemical System: Epoxy
  • Type: High Dielectric
  • Composition: Unfilled
High Temperature Resistant, Toughened Epoxy -- EP125
from Master Bond, Inc.

Master Bond Polymer System 125 is a two component toughened epoxy resin for prolonged service above 500 °F with truly outstanding chemical resistance. High strength bonds serviceable up to 600 °F can be obtained with this exceptionally thermally stable and chemically resistant epoxy resin... [See More]

  • Form / Function: Powder; Gap Filler, Foam in Place Gasket; Impregnating Resin; Die Bonding Adhesives
  • Chemical System: Epoxy
  • Type: High Dielectric; Thermal Insulation
  • Composition: Unfilled
Low Viscosity, Fast Curing, Two Component Epoxy -- EP38
from Master Bond, Inc.

Master Bond Polymer System EP38 is a fast curing, low viscosity, optically clear two component epoxy system for high performance coating, bonding and sealing. It is 100% reactive and does not contain any volatiles. The mix ratio is a convenient 3 to 1 by weight. EP38 is very fast curing. Coatings as... [See More]

  • Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Die Bonding Adhesives
  • Chemical System: Epoxy
  • Type: High Dielectric
  • Composition: Unfilled
Nickel Filled Electrically Conductive Epoxy System -- EP76M
from Master Bond, Inc.

Master Bond Polymer System EP76M is a two component, nickel filled, electrically conductive adhesive for high performance bonding, sealing, and coating formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part nickel conductive systems, EP76M... [See More]

  • Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Die Bonding Adhesives
  • Chemical System: Epoxy
  • Type: Anti-static, ESD; Electrically Conductive; EMI/RFI Shielding; Thermally Conductive
  • Composition: Filled
One Component, High Temperature Resistant Epoxy -- EP36
from Master Bond, Inc.

Master Bond Polymer System EP36 is a unique one component high performance toughened epoxy system for electrical potting, casting, encapsulation, baked coatings and adhesive applications. It features an outstanding combination of properties including high temperature stability up to 500 °F,... [See More]

  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
  • Chemical System: Epoxy
  • Type: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding
  • Composition: Unfilled
One component, high temperature resistant epoxy system for bonding and sealing -- EP17HTDA-1
from Master Bond, Inc.

Formulated for die attach applications, Master Bond EP17HTDA-1 is a one component epoxy that can also be used for conventional bonding and sealing. This system features an excellent die shear strength of 24-27 kg-f and can be used in a typical die size ranging from 4-400 mm2. EP17HTDA-1 can also be... [See More]

  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
  • Chemical System: Epoxy
  • Type: High Dielectric; Thermally Conductive
  • Composition: Unfilled
Elastomer Modified Epoxy -- 20-3236
from Epoxies Etc...

20-3236 Resin is a low viscosity copolymer adhesive and potting compound specifically designed for bonding vinyls and neoprenes. 20-3236 Resin has an extended working time and a convenient 2:1 mix ratio. [See More]

  • Form / Function: Liquid; Die Bonding Adhesives
  • Chemical System: Epoxy; Elastomeric
  • Type: High Dielectric
  • Composition: Unfilled
UV Curable Epoxy -- ELC 2500 Clear
from Electro-Lite Corporation

ELC-2500 clear is a standard potting and encapsulating material. Also used to adhere and fixture. The adhesive is clear an enables the identification of specific board populations. [See More]

  • Form / Function: Liquid; Encapsulant or Conformal Coating; Die Bonding Adhesives
  • Cure / Technology: UV or Radiation Cured
  • Chemical System: Epoxy
  • Industry: Electronics; OEM or Industrial
Clear Non-Yellowing Silicone Encapsulant -- PNS-56225
from Protavic America, Inc.

PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]

  • Form / Function: Liquid; Encapsulant or Conformal Coating; Die Bonding Adhesives
  • Chemical System: Silicone
  • Type: Electrically Conductive; Thermally Conductive
  • Composition: Unfilled
Adhesive; Epoxy Potting Compound; Black -- 70113956 [DP-270-BLACK from 3M Electronics and Energy Business]
from Allied Electronics, Inc.

Silver Print, 27 °C Flash Point, 1.6 Specific Gravity. The Scotch-Weld EPX Applicator System is a fast, convenient way to simultaneously meter, mix and apply two-component adhesives and potting compounds. The system features handy Duo-Pak cartridges that snap quickly into the durable,... [See More]

  • Form / Function: Liquid; Die Bonding Adhesives
  • Chemical System: Epoxy
Cement -- No. 31
from Sauereisen, Inc.

Sauereisen Cement No. 31 is a white, porcelain-like cement that is widely used throughout industry in a variety of applications. including assembling, sealing, insulating and cementing of ceramics, porcelain, metal, and glass. [See More]

  • Form / Function: Powder; Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
  • Chemical System: Ceramic
  • Type: High Dielectric; Thermally Conductive
  • Composition: Unfilled
Light Cure Cyanoacrylate Instant Adhesive -- KU3064
from Chemence Inc.

Krylex KU3064 is a revolutionary odorless light curing cyanoacrylate adhesive. It is designed for bonding applications that require very rapid fixture, fillet cure or surface cure. The UV / visible light cure properties facilitate rapid curing of exposed surface areas while the moisture curing... [See More]

  • Form / Function: Liquid; Die Bonding Adhesives
  • Gap Fill: 0.0500
  • Cure / Technology: UV or Radiation Cured; Single Component; Reactive or Moisture Cured
  • Industry: Sanitary; Electronics; OEM or Industrial; Printing, Medical use and General Industrial Assembly
Flexible UV Curable Compound -- UV 60-7016
from Epoxies Etc...

UV 60-7016 is a high performance Ultraviolet Curable Adhesive, Sealant, and Potting Compound. This new one component urethane acrylate system was specifically designed for the difficult bonding of glass to metal. UV 60-7016 has outstanding thermal shock and impact resistance, and is an excellent... [See More]

  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
  • Composition: Unfilled
  • Chemical System: Elastomeric; Polyurethane
  • Cure / Technology: UV or Radiation Cured; Single Component
Epoxy Adhesive -- ANE-26144
from Protavic America, Inc.

Clear unfilled epoxy also available in a one-part system. Use life is over three days after mixing at room temperature. Excellent for ferrite and optical bonding applications. Requires heat assist to cure. [See More]

  • Form / Function: Liquid; Encapsulant or Conformal Coating; Die Bonding Adhesives
  • Chemical System: Epoxy
  • Type: High Dielectric
  • Composition: Unfilled
Adhesive; Epoxy Potting Compound; Black -- 70113974 [DP270-BLACK-200ML from 3M Electronics and Energy Business]
from Allied Electronics, Inc.

Silver Print, 27 °C Flash Point, 1.6 Specific Gravity. The Scotch-Weld EPX Applicator System is a fast, convenient way to simultaneously meter, mix and apply two-component adhesives and potting compounds. The system features handy Duo-Pak cartridges that snap quickly into the durable,... [See More]

  • Form / Function: Liquid; Die Bonding Adhesives
  • Chemical System: Epoxy
Two Component Thermally Conductive Silicone - High Viscosity -- KSC1202
from Chemence Inc.

KSC1202 is a high performance, high viscosity thermally conductive gap filling material. It is formulated to develop a soft, 'form in place' elastomer ideal for coupling hot PC board components to heat sinks. KSC1202 is supplied as a two part, 1:1 mix ratio silicone that when mixed will cure at room... [See More]

  • Form / Function: Die Bonding Adhesives
  • Cure / Technology: Single Component
  • Chemical System: Silicone
  • Industry: Electronics
Thermally Conductive Epoxy -- 50-3170
from Epoxies Etc...

50-3170 is a high performance, thermally conductive epoxy rubber formulation designed for those applications requiring excellent electrical insulation and low stress during cure. [See More]

  • Form / Function: Liquid; Die Bonding Adhesives
  • Chemical System: Epoxy
  • Type: High Dielectric; Thermally Conductive
  • Composition: Unfilled
Epoxy Potting/Sealant -- PNE-47207
from Protavic America, Inc.

PNE-47207 ™ is an adhesive/sealant and potting compound. PNE-47207 ™ is designed to provide air free potting and casting of electronic devices. PNE-47207 ™ will bond difficult substrates such as glass, ceramics, and metals. It passes UL 94V0 for fire retardant properties,and has a... [See More]

  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
  • Chemical System: Epoxy
  • Type: High Dielectric
  • Composition: Filled
Adhesive; Epoxy Potting Compound; Clear -- 70113955 [DP-270-CLEAR from 3M Electronics and Energy Business]
from Allied Electronics, Inc.

Silver Print, 27 °C Flash Point, 1.6 Specific Gravity. The Scotch-Weld EPX Applicator System is a fast, convenient way to simultaneously meter, mix and apply two-component adhesives and potting compounds. The system features handy Duo-Pak cartridges that snap quickly into the durable,... [See More]

  • Form / Function: Liquid; Die Bonding Adhesives
  • Chemical System: Epoxy
UV Curable Low CTE Encapsulant -- 60-7106
from Epoxies Etc...

UV Cure 60-7106 is a one-component ultraviolet (UV) curable encapsulant, adhesive and coating. This is an electronic grade material designed for applications requiring a low Coefficient of Thermal Expansion (CTE). [See More]

  • Form / Function: Gel; Die Bonding Adhesives
  • Composition: Filled
  • Type: High Dielectric
  • Cure / Technology: UV or Radiation Cured; Single Component
Optically Clear UV Adhesive -- ANA-97290
from Protavic America, Inc.

ANA-97290 is a clear Ultraviolet/ Visible light curing adhesive. It has very low shrinkage during cure for alignment sensitive parts. It is recommended for small electrical/electronic casting and encapsulating applications that require a unique combination of excellent wetting, flow, good thermal... [See More]

  • Form / Function: Liquid; Encapsulant or Conformal Coating; Gel (optional feature); Die Bonding Adhesives
  • Composition: Unfilled
  • Type: Electrically Conductive; Thermal Insulation
  • Cure / Technology: Thermoset; Two Component  ; UV or Radiation Cured
EPOXY - OPTICALLY CLEAR ENCAPSULATING &POTTING COMPOUND, 320 mL Liquid -- 70125741 [8321C-320ML from MG Chemicals]
from Allied Electronics, Inc.

Ideal for potting LED lights or other optics. Can be cured with or without heating. It is tough, water and chemical resistant, an electrical insulator, and has excellent maching properties. Features. Water Clear Potting. Non-Porous, Water and Chemical Resistant [See More]

  • Form / Function: Liquid; Die Bonding Adhesives
  • Viscosity: 900
  • Chemical System: Epoxy
Polyurethane Adhesive -- PNU-56200
from Protavic America, Inc.

PNU-56200 ™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term circuit protection and... [See More]

  • Form / Function: Liquid; Encapsulant or Conformal Coating; Die Bonding Adhesives
  • Chemical System: Polyurethane
  • Type: High Dielectric
  • Composition: Unfilled
Epoxy Compound; for potting and encapsulating; 2 part; black; .8 gal liquid -- 70125817 [832B-3L from MG Chemicals]
from Allied Electronics, Inc.

Instant Adhesives, Cyanoacrylate Chemical Component. Provides excellent protection from impact, shock, conductivity, moisture, abuse, chemicals and analysis. Provides technology security. Excellent for explosion proof components. Encapsulating epoxy kit, reaction product of epichlorohydrin and... [See More]

  • Form / Function: Liquid; Die Bonding Adhesives
  • Chemical System: Epoxy
Reworkable Underfill Epoxy Resin -- ANA-10199R
from Protavic America, Inc.

Fast flow, fast cure capillary reworkable underfill. The rheology of the PROTAVIC ANA 10199 R in combination with its fineness make the product perfectly adapted to high reliability small gap underfill applications. It presents a good pot life at room temperature 20-22C and a high reactivity at... [See More]

  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
  • Composition: Unfilled
  • Type: High Dielectric; Thermal Insulation
  • Cure / Technology: Thermoset; Single Component
Epoxy Compound; for potting and encapsulating; 2 part; black; 12 oz liquid -- 70125812 [832B-375ML from MG Chemicals]
from Allied Electronics, Inc.

Instant Adhesives, Cyanoacrylate Chemical Component. Provides excellent protection from impact, shock, conductivity, moisture, abuse, chemicals and analysis. Provides technology security. Excellent for explosion proof components. Encapsulating epoxy kit, reaction product of epichlorohydrin and... [See More]

  • Form / Function: Liquid; Die Bonding Adhesives
  • Chemical System: Epoxy
Epoxy Compound; for potting and encapsulating; 2 part; clear; .8 gal liquid -- 70125827 [832C-3L from MG Chemicals]
from Allied Electronics, Inc.

Instant Adhesives, Cyanoacrylate Chemical Component. Provides excellent protection from impact, shock, conductivity, moisture, abuse, chemicals and analysis. Provides technology security. Excellent for explosion proof components. Encapsulating epoxy kit, reaction product of epichlorohydrin and... [See More]

  • Form / Function: Liquid; Die Bonding Adhesives
  • Chemical System: Epoxy
Epoxy Compound; for potting and encapsulating; 2 part; clear; 12 oz liquid -- 70125822 [832C-375ML from MG Chemicals]
from Allied Electronics, Inc.

Instant Adhesives, Cyanoacrylate Chemical Component. Provides excellent protection from impact, shock, conductivity, moisture, abuse, chemicals and analysis. Provides technology security. Excellent for explosion proof components. Encapsulating epoxy kit, reaction product of epichlorohydrin and... [See More]

  • Form / Function: Liquid; Die Bonding Adhesives
  • Chemical System: Epoxy
Epoxy; Flame Retardant Epoxy Encapsulating & Potting Compound; Black; 0.8 Gal. -- 70125732 [833FRB-3L from MG Chemicals]
from Allied Electronics, Inc.

A two component self extinguishing epoxy compound. Provides insulation and protects sensitive components and circuits from: static discharge, impact, heat, shock, conductivity, abuse, vibration, moisture, fresh and salt water, chemicals and analysis. [See More]

  • Form / Function: Die Bonding Adhesives
  • Features: Flame Retardant
  • Chemical System: Epoxy
  • Use Temperature: 437
Epoxy; Flame Retardant Epoxy Encapsulating & Potting Compound; Black; 12 Oz. -- 70125731 [833FRB-375ML from MG Chemicals]
from Allied Electronics, Inc.

A two component self extinguishing epoxy compound. Provides insulation and protects sensitive components and circuits from: static discharge, impact, heat, shock, conductivity, abuse, vibration, moisture, fresh and salt water, chemicals and analysis. Copper Electroplating Solution and is ready to... [See More]

  • Form / Function: Die Bonding Adhesives
  • Features: Flame Retardant
  • Chemical System: Epoxy
  • Use Temperature: 437