Single Component System Encapsulants and Potting Compounds

90 Results
Ripley™ -- E 468-2-7-55F
from ELANTAS PDG, Inc.

Mineral-filled VPI resin - semi-flexible for transformers with improved heat dissipation [See More]

  • Cure / Technology: Thermoset; Single Component
  • Form / Function: Liquid; Impregnating Resin
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
Capillary Underfill -- ALPHA® HiTech™ CU11-3127
from MacDermid Alpha Electronics Solutions

ALPHA ® HiTech ™ CU11-3127 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards. The high Tg, low CTE properties of ALPHA ® HiTech ™ CU11-3127 protects the solder joints from mechanical stresses such as drop... [See More]

  • Cure / Technology: Single Component
  • Industry: Electronics; Semiconductors, IC's
  • Chemical System: Epoxy
  • CTE: 16 to 111
B-Staged Epoxy Meets Airbus Standards for Flame Retardancy & Toxicity -- EP36FR
from Master Bond, Inc.

EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]

  • Cure / Technology: Thermoset; Single Component
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
3M Novec™ 1700 Electronic Grade Conformal Coating Clear 1 gal Jug -- 1700 GALLON [98021229947 from 3M]
from Ellsworth Adhesives

3M Novec ™ 1700 Electronic Grade Conformal Coating Clear is a one component, low viscosity, low surface tension fluorochemical acrylic polymer solution carried in a hydrofluoroether solvent. Dries to a thin, transparent film with excellent oleophobic and hydrophobic properties. Removable,... [See More]

  • Cure / Technology: Single Component
  • Chemical System: Acrylic
  • Form / Function: Encapsulant or Conformal Coating
  • Dielectric Strength: 1000
Edgebond -- ALPHA HiTech
from MacDermid Alpha Electronics Solutions

ALPHA HiTech Edgebond is a one component, heat curable material. It is an epoxy material to be dispensed on the corners or edges of the BGA. Upon deposition, minimal flow will take place beneath the BGA, to minimize contact with outer solder balls. The cured edgebond will help to strengthen the... [See More]

  • Cure / Technology: Single Component
  • Chemical System: Epoxy
  • Form / Function: Liquid; Glob Top, Daub, Doming or Overfill
  • Industry: Electronics; Semiconductors, IC's
Dual Curing, Thixotropic Adhesive -- UV22DC80-10F
from Master Bond, Inc.

One part, nanosilica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]

  • Cure / Technology: UV or Radiation Cured; Single Component; Dual Curing
  • Form / Function: Liquid; Encapsulant or Conformal Coating; Glob Top, Daub, Doming or Overfill
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: UV Curing
3M Novec™ 1702 Electronic Grade Conformal Coating Clear 1 gal Jug -- 1702 GALLON [98021230424 from 3M]
from Ellsworth Adhesives

3M Novec ™ 1702 Electronic Grade Conformal Coating Clear is a one component, low viscosity, low surface tension fluorochemical acrylic polymer solution carried in a hydrofluoroether solvent. Contains a lower solids content compared to Novec ™ 1700. Dries to a very thin, transparent film... [See More]

  • Cure / Technology: Single Component
  • Chemical System: Acrylic
  • Form / Function: Encapsulant or Conformal Coating
  • Dielectric Strength: 1000
Underfills -- ALPHA HiTech
from MacDermid Alpha Electronics Solutions

ALPHA HiTech Underfills are dispensed along edges of BGA, CSP, or flip chip devices, flowing to perfectly fill the device footprint. The one-component, halogen-free epoxies provide superior drop-shock, impact bend, and thermal cycle test performance for the most demanding component designs.Through... [See More]

  • Cure / Technology: Single Component
  • Chemical System: Epoxy
  • Form / Function: Liquid
  • Industry: Electronics; Semiconductors, IC's
Electrically Conductive Die Attach Adhesive Has Very High Thermal Conductivity -- EP3HTSDA-1
from Master Bond, Inc.

EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]

  • Cure / Technology: Thermoset; Single Component
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
3M Novec™ 1702 Electronic Grade Conformal Coating Clear 2 oz Bottle -- 1702 2OZ [98021236967 from 3M]
from Ellsworth Adhesives

3M Novec ™ 1702 Electronic Grade Conformal Coating Clear is a one component, low viscosity, low surface tension fluorochemical acrylic polymer solution carried in a hydrofluoroether solvent. Contains a lower solids content compared to Novec ™ 1700. Dries to a very thin, transparent film... [See More]

  • Cure / Technology: Single Component
  • Chemical System: Acrylic
  • Form / Function: Encapsulant or Conformal Coating
  • Dielectric Strength: 1000
Electrically Conductive Die Attach Epoxy With High Glass Transition Temperature -- EP17HTS-DA
from Master Bond, Inc.

Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]

  • Cure / Technology: Thermoset; Single Component
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
  • Type: Electrically Conductive; Thermally Conductive
  • Chemical System: Polyphenylene Sulfide; Epoxy
3M Novec™ 1710 Electronic Grade Conformal Coating Clear 1 gal Jug -- 1710 GALLON [98021236272 from 3M]
from Ellsworth Adhesives

3M Novec ™ 1710 Electronic Grade Conformal Coating Clear is a one component fluorinated polymer carried in a hydrofluoroether solvent. It provides corrosion and moisture protection as a concentrate or when combined with other liquid solutions. Excellent oleophobic and hydrophobic properties,... [See More]

  • Cure / Technology: Single Component
  • Chemical System: Acrylic
  • Form / Function: Encapsulant or Conformal Coating
  • Dielectric Strength: 1000
Flexible, Low Viscosity LED Curable Adhesive with a Fluorescent Dye -- LED405FL3
from Master Bond, Inc.

LED405FL3 is a flexible one component, LED curing adhesive system with excellent optical clarity and a refractive index of 1.51. [See More]

  • Cure / Technology: Single Component; Cures by LED light
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating; Impregnating Resin
  • Type: High Dielectric
  • Composition: Unfilled
3M Novec™ 1902 Electronic Grade Conformal Coating Clear 1 gal Jug -- 1902 GALLON [98021248608 from 3M]
from Ellsworth Adhesives

3M Novec ™ 1902 Electronic Grade Conformal Coating Clear is a one component fluorinated polymer diluted in a blend of 3M Novec ™ 7100 and 7200, segregated hydrofluoroether solvents. It provides a low surface tension, low viscosity coating solution. Dries to an ultrathin, transparent film... [See More]

  • Cure / Technology: Single Component
  • Chemical System: Acrylic
  • Form / Function: Encapsulant or Conformal Coating
  • Dielectric Strength: 3700
Flexible,Fast Curing Silicone for Medical Device Assemblies -- MasterSil 910Med
from Master Bond, Inc.

Passing both USP Class VI testing and ISO cytotoxicity specifications, MasterSil 910Med is formulated for bonding, sealing, coating in medical device applications. As an acetoxy type system, it bonds exceptionally well to a wide variety of substrates including metals, composites, ceramics, glass as... [See More]

  • Cure / Technology: Thermoset; Single Component
  • Form / Function: Gap Filler, Foam in Place Gasket
  • Type: High Dielectric; Thermal Insulation
  • Chemical System: Silicone
3M Novec™ 1904 Electronic Grade Conformal Coating Clear 1 gal Jug -- 1904 GALLON [98021248632 from 3M]
from Ellsworth Adhesives

3M Novec ™ 1904 Electronic Grade Conformal Coating Clear is a one component fluorinated polymer diluted in a blend of 3M Novec ™ 7100 and 7200 segregated hydrofluoroether solvents. It provides a low surface tension, low viscosity coating solution. Dries to a very thin, transparent film... [See More]

  • Cure / Technology: Single Component
  • Chemical System: Acrylic
  • Form / Function: Encapsulant or Conformal Coating
  • Dielectric Strength: 3700
High Strength UV Curable Adhesive -- UV15
from Master Bond, Inc.

Master Bond UV15 is a new one component, high strength, low viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It is a 100% reactive and does not contain any solvents or other volatiles. When exposed to a source... [See More]

  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating; Impregnating Resin
  • Type: High Dielectric; Optical; Thermal Insulation
  • Chemical System: Epoxy
3M Novec™ 1908 Electronic Grade Conformal Coating Clear 1 gal Jug -- 1908 GALLON 11LBS [98021248665 from 3M]
from Ellsworth Adhesives

3M Novec ™ 1908 Electronic Grade Conformal Coating Clear is a fluorinated polymer diluted in a blend of 3M Novec ™ 7100 and 7200 segregated hydrofluoroether solvents. It provides a low surface tension, low viscosity coating solution. Dries to a thin, transparent film with excellent... [See More]

  • Cure / Technology: Single Component
  • Chemical System: Acrylic
  • Form / Function: Encapsulant or Conformal Coating
  • Dielectric Strength: 3700
High Strength, Chemically Resistant UV Curable System -- UV18S
from Master Bond, Inc.

Master Bond UV18S is a new one component, high strength UV curable system with superb chemical resistance & flexibility for coating, sealing and bonding. It is a 100% reactive, mobile liquid at ambient temperatures which does not contain any solvents or other volatiles. When exposed to a source... [See More]

  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating; Impregnating Resin
  • Type: High Dielectric; Optical; Thermal Insulation
  • Features: Non-corrosive; Dissimilar Substrates
3M Novec™ 2704 Electronic Grade Conformal Coating Light Yellow 1 gal Jug -- 2704 GALLON [98021236637 from 3M]
from Ellsworth Adhesives

3M Novec ™ 2704 Electronic Grade Conformal Coating Light Yellow is a one component fluorinated polymer solution carried in a hydrofluoroether solvent. Dries to a thin, transparent film with excellent oleophobic and hydrophobic properties. Removable, repairable, non-flammable, and easy to... [See More]

  • Cure / Technology: Single Component
  • Chemical System: Acrylic
  • Form / Function: Encapsulant or Conformal Coating
  • Dielectric Strength: 3700
High Strength, Non-Yellowing UV Curable -- UV15-7NV
from Master Bond, Inc.

Master Bond Polymer system UV15-7NV is a new one component, optically clear, non yellowing UV curable polymer system for high performance bonding, sealing and coating. It is 100% reactive and does not contain any solvents or other volatiles. When exposed to a source of UV light of adequate wave... [See More]

  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Type: High Dielectric; Optical; Thermal Insulation
  • Features: Non-corrosive; Dissimilar Substrates
3M Novec™ 2708 Electronic Grade Conformal Coating Light Yellow 1 gal Jug -- 2708 GALLON [98021236686 from 3M]
from Ellsworth Adhesives

3M Novec ™ 2708 Electronic Grade Conformal Coating Light Yellow is a fluorinated polymer diluted in 3M Novec ™ 7200, a segregated hydrofluoroether solvent. It provides a low surface tension, low viscosity coating solution. Dries to an ultrathin, transparent film with excellent oleophobic... [See More]

  • Cure / Technology: Single Component
  • Chemical System: Acrylic
  • Form / Function: Encapsulant or Conformal Coating
  • Dielectric Strength: 3700
High Strength, UV Curable Epoxy System -- UV16
from Master Bond, Inc.

Master Bond UV16 is a new one component, high strength, low viscosity, UV curable epoxy resin based polymer system for bonding, sealing, & coating with exceptionally high performance properties. It is a 100% reactive and does not contain any solvents or other volatiles. When exposed to a source... [See More]

  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating; Impregnating Resin
  • Type: High Dielectric; Optical; Thermal Insulation
  • Chemical System: Epoxy
ACL Staticide 8690 Acrylic Conformal Coating 12 oz Aerosol -- 8690 12OZ AEROSOL [8690 12OZ AEROSOL from ACL Staticide]
from Ellsworth Adhesives

ACL Staticide 8690 Acrylic Conformal Coating was created for insulation against high voltage arcing and electrical shorts. 8690 is RoHS compliant, UL recognized, and is easily repairable - self healing. 12 oz Aerosol. [See More]

  • Cure / Technology: Single Component
  • Chemical System: Acrylic
  • Form / Function: Encapsulant or Conformal Coating
  • Dielectric Strength: 8300
High Temperature Resistant, One Component Epoxy Adhesive -- EP17HT-100
from Master Bond, Inc.

Formulated for potting, encapsulation, bonding and sealing applications, Master Bond EP17HT-100 is a single part epoxy system that is designed to cure in 60-90 minutes at 200-220 °F. This low heat curing schedule is useful in bonding applications involving temperature sensitive substrates. It is... [See More]

  • Cure / Technology: Thermoset; Single Component; Reactive or Moisture Cured
  • Form / Function: Gap Filler, Foam in Place Gasket; Glob Top, Daub, Doming or Overfill; Die Bonding Adhesives
  • Type: High Dielectric; Thermal Insulation
  • Chemical System: Epoxy
Dow DOWSIL™ 1-2577 Low VOC RTV Silicone Conformal Coating Clear 15 kg Pail -- 1-2577 LOW VOC CTG 15KG [4017645 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow DOWSIL ™ 1-2577 Low-VOC Conformal Coating Clear is a one component, low viscosity, silicone resin coating that is used to protect electronic components from stress and abrasions. It is an RTV elastoplastic, solvent based, low odor, cures at room temperature, and has reduced VOC. 15 kg... [See More]

  • Cure / Technology: Single Component
  • Chemical System: Silicone
  • Form / Function: Encapsulant or Conformal Coating
  • Dielectric Strength: 350
High Temperature Resistant, One Component Epoxy System -- EP13
from Master Bond, Inc.

Master Bond Polymer System EP13 is a one component heat curing epoxy featuring high shear strength and very high temperature resistance. This one component system is formulated to cure at temperatures from 300 °F to 350 °F for 60-90 minutes. Upon cure, EP13 readily attains tensile shear... [See More]

  • Cure / Technology: Thermoset; Single Component
  • Form / Function: Encapsulant or Conformal Coating; Die Bonding Adhesives
  • Type: High Dielectric
  • Chemical System: Epoxy
Dow DOWSIL™ 3-1944 RTV Conformal Coating Clear 18.1 kg Pail -- 3-1944 RTV COATING 18.1KG [4001941 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow DOWSIL ™ 3-1944 RTV Coating Clear is a one component, solvent free conformal coating that is used for protection, encapsulation, and bonding of common materials in the electronics industry. It flowable, self leveling, flame resistant, and cures at room temperature. 18.1 kg Pail. [See More]

  • Cure / Technology: Single Component
  • Chemical System: Silicone
  • Form / Function: Encapsulant or Conformal Coating
  • Dielectric Strength: 525
Low Stress, NASA Low Outgassing Silicone Adhesive -- MasterSil 920-LO
from Master Bond, Inc.

MasterSil 920-LO is an ideal material for the encapsulation of sensitive electronic and optical components, especially when low stress is a critical requirement. This neutral curing, non-corrosive, RTV silicone has very good flow properties and outstanding electrical insulation values, which enhance... [See More]

  • Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Type: High Dielectric; Optical; Thermal Insulation
  • Chemical System: Silicone
Dow DOWSIL™ 3-1953 Silicone Conformal Coating 18.1 kg Pail -- 3-1953 CONF CTG 18.1KG PL [4001900 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow DOWSIL ™ 3-1953 Conformal Coating Clear is a one component, medium viscosity, solvent free silicone that is used for print wire boards, circuit boards, and other sensitive electronic components. It has fast RTV cure, offers stress relief, and is environmentally friendly. 18.1 kg Pail. [See More]

  • Cure / Technology: Single Component
  • Chemical System: Silicone
  • Form / Function: Encapsulant or Conformal Coating
  • Dielectric Strength: 400
Low Viscosity, Thermally Conductive Underfill Epoxy -- EP3UF-1
from Master Bond, Inc.

Master Bond EP3UF-1 is a one component, highly flowable epoxy for bonding and underfill applications. [See More]

  • Cure / Technology: Thermoset; Single Component
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
Dow DOWSIL™ 3-1953 Silicone Conformal Coating 3.6 kg Pail -- 3-1953 CONFORM CTG 3.6KG [4007531 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow DOWSIL ™ 3-1953 Conformal Coating Clear is a one component, medium viscosity, solvent free silicone that is used for print wire boards, circuit boards, and other sensitive electronic components. It has fast RTV cure, offers stress relief, and is environmentally friendly. 3.6 kg Pail. [See More]

  • Cure / Technology: Single Component
  • Chemical System: Silicone
  • Form / Function: Encapsulant or Conformal Coating
  • Dielectric Strength: 400
NASA Low Outgassing Approved, One Component Epoxy -- EP17HT-LO
from Master Bond, Inc.

Passing ASTM E595 testing for NASA low outgassing, EP17HT-LO is widely used in a variety of applications in the aerospace, oil/chemical processing, optical, opto-electronic and specialty OEM industries. This single component, thermally stable system has a glass transition temperature of 225 °C. [See More]

  • Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Type: High Dielectric; EMI/RFI Shielding; Optical; Thermal Insulation
  • Composition: Unfilled
Dow DOWSIL™ 3-1965 Silicone Conformal Coating Clear 18.1 kg Pail -- 3-1965 CONFORM CTG 18.1KG [4006079 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow DOWSIL ™ 3-1965 Conformal Coating Clear is a one component, low viscosity solvent free coating that is used for print wire boards, circuit boards, and other sensitive electronic components. It cures at room temperature, offers stress relief, and is environmentally friendly. 18.1 kg Pail. [See More]

  • Cure / Technology: Single Component
  • Chemical System: Silicone
  • Form / Function: Encapsulant or Conformal Coating
  • Dielectric Strength: 450
No Mix, Thermally Conductive Epoxy Adhesive -- EP3RR-80
from Master Bond, Inc.

Moderate viscosity EP3RR-80 is a one part epoxy that is particularly compatible for sealing, potting and encapsulation applications. It is a superior thermal conductor, while retaining first class electrical insulation properties. EP3RR-80 can cure in thicker sections up to and beyond a 1/2 inch... [See More]

  • Cure / Technology: Thermoset; Single Component; Reactive or Moisture Cured
  • Form / Function: Gap Filler, Foam in Place Gasket; Glob Top, Daub, Doming or Overfill
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
Dow DOWSIL™ 3-1965 Silicone Conformal Coating Clear 3.6 kg Pail -- 3-1965 CONFORM CTG 3.6KG [4007474 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow DOWSIL ™ 3-1965 Conformal Coating Clear is a one component, low viscosity solvent free coating that is used for print wire boards, circuit boards, and other sensitive electronic components. It cures at room temperature, offers stress relief, and is environmentally friendly. 3.6 kg Pail. [See More]

  • Cure / Technology: Single Component
  • Chemical System: Silicone
  • Form / Function: Encapsulant or Conformal Coating
  • Dielectric Strength: 450
Non-Yellowing, Abrasion Resistant UV Curable Adhesive -- UV15X-6NM-2
from Master Bond, Inc.

UV15X-6NM-2 features vibrant flexibility, excellent toughness and superior abrasion resistance. This fast curing moderate viscosity compound can be used for bonding, sealing, coating and encapsulation. Its robust flexibility gives it the capacity to withstand severe thermal cycling as well as... [See More]

  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component; Reactive or Moisture Cured
  • Form / Function: Gap Filler, Foam in Place Gasket
  • Type: Optical; Thermal Insulation
  • Chemical System: Polyurethane
Dow DOWSIL™ 3-6371 UV Silicone Encapsulant Clear 175 mL Cartridge -- 3-6371 UV GEL 175ML CART [4026370 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow DOWSIL ™ 3-6371 UV Gel Clear is a one component, UV and moisture curing silicone that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. It is durable, fast curing, flexible, and self healing. 175 mL Cartridge. [See More]

  • Cure / Technology: Single Component
  • Dielectric Strength: 305
  • Chemical System: Silicone
  • Viscosity: 900
One Component Toughened Epoxy System For Bonding And Sealing -- Supreme 17HT
from Master Bond, Inc.

Master Bond Supreme 17HT is a one component toughened epoxy for bonding and sealing. It has a moderate viscosity system with good flow properties. [See More]

  • Cure / Technology: Thermoset; Single Component
  • Form / Function: Liquid
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
Dow DOWSIL™ 3-6635 Dielectric Gel Clear 18.1 kg Pail -- 3-6635 DIELECT GEL 18.1KG [2187850 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow DOWSIL ™ 3-6635 Dielectric Gel Clear is a one component, heat curing, low temperature gel that is used to protect electrical components from extreme environments, moisture, and stress. It is flowable, low viscosity, durable, and self healing. 18.1 kg Pail. [See More]

  • Cure / Technology: Single Component
  • Chemical System: Silicone
  • Type: High Dielectric
  • Industry: Electronics
One Component, High Temperature Resistant Epoxy -- EP36
from Master Bond, Inc.

Master Bond Polymer System EP36 is a unique one component high performance toughened epoxy system for electrical potting, casting, encapsulation, baked coatings and adhesive applications. It features an outstanding combination of properties including high temperature stability up to 500 °F,... [See More]

  • Cure / Technology: Thermoset; Single Component
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
  • Type: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding
  • Chemical System: Epoxy
Dow DOWSIL™ 3140 RTV Silicone Conformal Coating Clear 17.6 kg Pail -- 3140 17.6KG MIL-A-46146 [1665367 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow DOWSIL ™ 3140 RTV Coating Clear is a one component, room temperature curing, solvent free coating that is used for pin sealing, increased solder joint coverage, thin section encapsulation, and protecting sensitive components from corrosion. It is self leveling, flowable, and flame... [See More]

  • Cure / Technology: Single Component
  • Chemical System: Silicone
  • Form / Function: Encapsulant or Conformal Coating
  • Tensile (Break): 495
One component, high temperature resistant epoxy system for bonding and sealing -- EP17HTDA-1
from Master Bond, Inc.

Formulated for die attach applications, Master Bond EP17HTDA-1 is a one component epoxy that can also be used for conventional bonding and sealing. This system features an excellent die shear strength of 24-27 kg-f and can be used in a typical die size ranging from 4-400 mm2. EP17HTDA-1 can also be... [See More]

  • Cure / Technology: Thermoset; Single Component
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
Dow DOWSIL™ 3140 RTV Silicone Conformal Coating Clear 493 g Can -- 3140 493G MIL-A-46146 [2298139 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow DOWSIL ™ 3140 RTV Coating Clear is a one component, room temperature curing, solvent free coating that is used for pin sealing, increased solder joint coverage, thin section encapsulation, and protecting sensitive components from corrosion. It is self leveling, flowable, and flame... [See More]

  • Cure / Technology: Single Component
  • Chemical System: Silicone
  • Form / Function: Encapsulant or Conformal Coating
  • Tensile (Break): 495
One Component, Storage Stable Epoxy -- EP19HT
from Master Bond, Inc.

Master Bond Polymer System EP19HT is a storage stable one component liquid epoxy resin system for durable, high performance adhesive/sealants, impregnants and liners. It features remarkably long shelf life and excellent storage characteristics at ambient temperatures yet cures readily at elevated... [See More]

  • Cure / Technology: Thermoset; Single Component
  • Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Impregnating Resin; Die Bonding Adhesives
  • Type: High Dielectric
  • Chemical System: Epoxy
Dow DOWSIL™ 3140 RTV Silicone Conformal Coating Clear 90 mL Tube -- 3140 90 ML MIL-A-46146 [1665341 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow DOWSIL ™ 3140 RTV Coating Clear is a one component, room temperature curing, solvent free coating that is used for pin sealing, increased solder joint coverage, thin section encapsulation, and protecting sensitive components from corrosion. It is self leveling, flowable, and flame... [See More]

  • Cure / Technology: Single Component
  • Chemical System: Silicone
  • Form / Function: Encapsulant or Conformal Coating
  • Tensile (Break): 495
One Component, UV Curable Adhesive System -- UV10
from Master Bond, Inc.

Master Bond UV10 and UV10TK are one component UV curable modified epoxy compounds, ready for use as supplied, for high performance casting, coatings, sealing and bonding applications. UV10 is a low viscosity amber liquid at room temperature and UV10TK is a medium viscosity amber liquid at room... [See More]

  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating; Impregnating Resin
  • Type: High Dielectric; Optical; Thermal Insulation
  • Features: Non-corrosive; Dissimilar Substrates
Dow DOWSIL™ EG-3810 Dielectric Gel Encapsulant Clear 18 kg Pail -- EG-3810 DIELECTRIC GEL 18KG PAIL [4116483 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow DOWSIL ™ EG-3810 Dielectric Gel is a one component, clear, heat curing silicone gel that is used for potting, sealing, encapsulating, and protecting a variety of materials in the electronics industry. It offers a wide range of operating temperatures ranging from -60 °C to 200 °C,... [See More]

  • Cure / Technology: Single Component
  • Chemical System: Silicone
  • Type: High Dielectric
  • Industry: Electronics; Semiconductors, IC's
One Part, Toughened Epoxy for Specialty Dam-and-Fill Encapsulation -- Supreme 3HTND-2DM
from Master Bond, Inc.

Supreme 3HTND-2DM is a rapid curing, toughened, one part epoxy system used for the dam-and-fill method for chip-on-board encapsulation. It passes ASTM E595 specifications for NASA low outgassing allowing it to be used in vacuum, aerospace, electro-optic and other related applications. Supreme... [See More]

  • Cure / Technology: Thermoset; Single Component
  • Form / Function: Gap Filler, Foam in Place Gasket; Glob Top, Daub, Doming or Overfill
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
Dow DOWSIL™ Q2-3067 Optical Couplant 113 g Jar -- Q2-3067 OPT COUPLANT 113G [3127061 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow DOWSIL ™ Q2-3067 Optical Couplant is a grease-like material that is used to improve sensitivity of optical devices, prevent loss of intensity during light transmission, and for optical coupling. It provides good shear stability, low temperature bonding, and high clarity. 113 g Bottle. [See More]

  • Cure / Technology: Single Component
  • Elongation: 110.0
  • Industry: Photonics
Underlayment -- No. F-120
from Sauereisen, Inc.

Sauereisen Underlayment No. F-120 is a fast-setting, high early strength, Portland based resurfacing material available in. three formulations - Trowelable, Castable or Gunite. Selection of material is dependent upon concrete condition and whether application is on vertical, horizontal or overhead... [See More]

  • Cure / Technology: Single Component
  • Chemical System: Ceramic; Portland Based Cement
  • Form / Function: Powder
  • Composition: Unfilled
Light Cure Cyanoacrylate Instant Adhesive -- KU3064
from Chemence Inc.

Krylex KU3064 is a revolutionary odorless light curing cyanoacrylate adhesive. It is designed for bonding applications that require very rapid fixture, fillet cure or surface cure. The UV / visible light cure properties facilitate rapid curing of exposed surface areas while the moisture curing... [See More]

  • Cure / Technology: UV or Radiation Cured; Single Component; Reactive or Moisture Cured
  • Gap Fill: 0.0500
  • Form / Function: Liquid; Die Bonding Adhesives
  • Industry: Sanitary; Electronics; OEM or Industrial; Printing, Medical use and General Industrial Assembly
Biocompatible, UV Curing Epoxy -- EPO-TEK® MED-OG116-31
from Epoxy Technology

EPO-TEK ® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries.  Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market... [See More]

  • Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
  • Form / Function: Liquid
  • Type: Optical
  • Chemical System: Epoxy
Conap™ Conformal Coating -- CONAP® CE-1170
from ACCRAbond, Inc.

CONAP ® CE-1170 is a single-component air drying room temperature curing acrylic conformal coating that meets the requirements of MIL-I-46058-C for Type AR coatings. [See More]

  • Cure / Technology: Single Component
  • Chemical System: Acrylic
  • Form / Function: Encapsulant or Conformal Coating
Dielectric Silicone Gel For Sealing Electronics -- SEMICOSIL® 924
from Wacker Chemical Corp.

SEMICOSIL ® 924 is a pourable,thermally curable, addition-curing one-part silicone rubber that cures to a very soft silicone gel. Special features. one-part, ready-to-use. thixotropic flow. forms a soft gel on vulcanization. low content of volatiles. low content of uncured polymer. low ion... [See More]

  • Cure / Technology: Thermoset; Single Component
  • Industry: Electronics
  • Chemical System: Silicone; Elastomeric
  • Use Temperature: -58 to 356
Epoxy Adhesive -- PNE-30270
from Protavic America, Inc.

A solvent-free, single component resin with low linear expansion and high ionic purity for protecting semi-conductor silicon crystals. [See More]

  • Cure / Technology: Thermoset; Single Component
  • Form / Function: Liquid; Glob Top, Daub, Doming or Overfill; Die Bonding Adhesives
  • Type: Electrically Conductive; Thermally Conductive
  • Chemical System: Epoxy
High Thermally Conductive Paste -- OMEGATHERM® OT-201 Series
from OMEGA Engineering, Inc.

OMEGATHERM thermal conducting paste is a high temperature and high thermally conductive paste product. They are specially formulated for permanent and temporary bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics,... [See More]

  • Cure / Technology: Single Component
  • Chemical System: Silicone
  • Type: High Dielectric; Thermally Conductive
  • Use Temperature: 392
Flexible UV Curable Compound -- UV 60-7016
from Epoxies Etc...

UV 60-7016 is a high performance Ultraviolet Curable Adhesive, Sealant, and Potting Compound. This new one component urethane acrylate system was specifically designed for the difficult bonding of glass to metal. UV 60-7016 has outstanding thermal shock and impact resistance, and is an excellent... [See More]

  • Cure / Technology: UV or Radiation Cured; Single Component
  • Chemical System: Elastomeric; Polyurethane
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
  • Composition: Unfilled
Electrically Conductive Adhesives -- LOCTITE ABLESTIK XCE 3104XL
from Henkel Corporation - Industrial

LOCTITE ABLESTIK XCE 3104XL, Epoxy, Assembly LOCTITE ® ABLESTIK XCE 3104XL is an electrically conductive adhesive with tin compatibility for fine stencil and screen print applications. It uses a unique blend of fillers with tightly controlled particle sizes to provide fine pitch printing... [See More]

  • Cure / Technology: Single Component
  • Viscosity: 54000
  • Chemical System: Epoxy
Conformal EMI Shielding Material -- LOCTITE ABLESTIK EMI 8660S
from Henkel Corporation - Electronics

With the increasing proliferation of wireless devices, designers are challenged with various electromagnetic waves from multiple sources radiating at the same spectrum of frequencies resulting in electromagnetic interference(EMI). Radio-frequency(RF) emitting devices require effective isolation to... [See More]

  • Cure / Technology: Single Component
  • Form / Function: Liquid; Encapsulant or Conformal Coating
  • Type: Electrically Conductive; EMI/RFI Shielding
  • Industry: Electronics
Two Component Thermally Conductive Silicone - High Viscosity -- KSC1202
from Chemence Inc.

KSC1202 is a high performance, high viscosity thermally conductive gap filling material. It is formulated to develop a soft, 'form in place' elastomer ideal for coupling hot PC board components to heat sinks. KSC1202 is supplied as a two part, 1:1 mix ratio silicone that when mixed will cure at room... [See More]

  • Cure / Technology: Single Component
  • Chemical System: Silicone
  • Form / Function: Die Bonding Adhesives
  • Industry: Electronics
GENIOSIL® XT SILANE TERMINATED POLYMER -- GENIOSIL® XT 50
from Wacker Chemical Corp.

GENIOSIL® XT 50 is a silicone-modified polyetherbasedsilane-terminated polymer suitable as a binderin moisture curing formulations. It is a clear liquid witha slight but characteristic odor and differs toconventional silylated polymers due to its highreactivity. This is a direct consequence of the... [See More]

  • Cure / Technology: Two Component   (optional feature); Single Component; Reactive or Moisture Cured
  • Chemical System: Silicone
  • Form / Function: Liquid
  • Industry: Construction
Filled Epoxy Cast -- PNE-20262
from Protavic America, Inc.

Single component resin with very low linear expansion of 10 ppm per degree and high ionic purity for protecting semi-conductor silicon crystals, in particularly BGA. [See More]

  • Cure / Technology: Thermoset; Single Component
  • Form / Function: Liquid; Encapsulant or Conformal Coating
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
Thermally Conductive Grease -- OT-201 Series
from OMEGA Engineering, Inc.

OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics, paper products. [See More]

  • Cure / Technology: Single Component
  • Chemical System: Silicone
  • Type: High Dielectric; Thermally Conductive
  • Use Temperature: 392
One Component Epoxy Adhesive -- 10-3782
from Epoxies Etc...

These one component heat cure epoxy adhesives are fast setting materials formulated in three different viscosities. They are known for their low temperature cure, heat and excellent chemical resistance. [See More]

  • Cure / Technology: Thermoset; Single Component
  • Chemical System: Epoxy
  • Form / Function: Liquid
  • Composition: Unfilled
Electrically Non-Conductive Adhesives -- LOCTITE ABLESTIK 813J01 BIPAX
from Henkel Corporation - Industrial

LOCTITE ABLESTIK 813J01 BIPAX, Silicone, Non-corrosive, Encapsulant LOCTITE ® ABLESTIK 813J01 BIPAX exhibits very low stress upon cure thus preventing component cracking and other stress-related problems. This adhesive can be cured at room temperature in thick or thin sections. It is... [See More]

  • Cure / Technology: Single Component
  • Chemical System: Silicone
  • Type: Thermally Conductive
  • Viscosity: 40000
Hysol EO1088 -- 8799542214657
from Henkel Corporation - Electronics

One component encapsulants potting epoxy. [See More]

  • Cure / Technology: Single Component
  • Chemical System: Epoxy
  • Form / Function: Glob Top, Daub, Doming or Overfill
  • Industry: Electronics
Reworkable Underfill Epoxy Resin -- ANA-10199R
from Protavic America, Inc.

Fast flow, fast cure capillary reworkable underfill. The rheology of the PROTAVIC ANA 10199 R in combination with its fineness make the product perfectly adapted to high reliability small gap underfill applications. It presents a good pot life at room temperature 20-22C and a high reactivity at... [See More]

  • Cure / Technology: Thermoset; Single Component
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
  • Type: High Dielectric; Thermal Insulation
  • Composition: Unfilled
One Component Flame Retardant Epoxy -- 20-3067
from Epoxies Etc...

Epoxies, Etc's resins are used to protect, insulate, and conceal circuitry, components, and devices. These formulations were designed to satisfy the requirements of many demanding potting, encapsulating, and casting applications in the electronic, electrical, automotive, and aerospace industries. [See More]

  • Cure / Technology: Thermoset; Single Component
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid
  • Composition: Unfilled
Electrically Non-Conductive Adhesives -- LOCTITE ABLESTIK 8387BM
from Henkel Corporation - Industrial

LOCTITE ABLESTIK 8387BM, Epoxy, Encapsulant LOCTITE ® ABLESTIK 8387BM single component adhesive is designed for high throughput encapsulation applications. Non-conductive. Black pigmentation for blocking stray light [See More]

  • Cure / Technology: Single Component
  • Chemical System: Epoxy
  • Type: High Dielectric
  • Viscosity: 9200
TECHNOMELT PA 2384 -- 8807299842049
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Cure / Technology: Thermoplastic / Hot Melt; Single Component
  • Form / Function: Pellets
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Polyamide
One Component MicroElectric Grade Epoxy -- 50-3115
from Epoxies Etc...

50-3115 is a one part thermally conductive electrically insulating epoxy. This epoxy system is designed and engineered for demanding electronic bonding applications. It is formulated with low ionic high performance polymers and new proprietary thermally conductive fillers. [See More]

  • Cure / Technology: Thermoset; Single Component
  • Chemical System: Epoxy
  • Type: High Dielectric; Thermally Conductive
  • Composition: Unfilled
Electrically Non-Conductive Adhesives -- LOCTITE ABLESTIK 933-1
from Henkel Corporation - Industrial

LOCTITE ABLESTIK 933-1, Long work life, Low CTE, Low Moisture Sensitivity, Epoxy, Encapsulant LOCTITE ® ABLESTIK 933-1 epoxy encapsulant is designed for encapsulating microelectronic chips. The low coefficient of thermal expansion minimizes stress effects on components and wiring during thermal... [See More]

  • Cure / Technology: Single Component
  • Viscosity: 360500
  • Chemical System: Epoxy
TECHNOMELT PA 5375
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Cure / Technology: Thermoplastic / Hot Melt; Single Component
  • Form / Function: Pellets
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Polyolefin
UV Curable Low CTE Encapsulant -- 60-7106
from Epoxies Etc...

UV Cure 60-7106 is a one-component ultraviolet (UV) curable encapsulant, adhesive and coating. This is an electronic grade material designed for applications requiring a low Coefficient of Thermal Expansion (CTE). [See More]

  • Cure / Technology: UV or Radiation Cured; Single Component
  • Form / Function: Gel; Die Bonding Adhesives
  • Type: High Dielectric
  • Composition: Filled
Electrically Non-Conductive Adhesives -- LOCTITE ABLESTIK ME 990
from Henkel Corporation - Industrial

LOCTITE ABLESTIK ME 990, Epoxy, Encapsulant LOCTITE ® ABLESTIK ME 990 is designed for die bonding and other assembly applications where electrical conductivity is not required. One component. Oxide filled. Low levels of ionic contaminants [See More]

  • Cure / Technology: Single Component
  • Use Temperature: 40 to 257
  • Chemical System: Epoxy
  • Viscosity: 50000
TECHNOMELT PA 6208 -- 8807692926977
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Cure / Technology: Thermoplastic / Hot Melt; Single Component
  • Form / Function: Pellets
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Polyamide
Electrically Non-Conductive Adhesives -- LOCTITE ABLESTIK NCA 9300UV
from Henkel Corporation - Industrial

LOCTITE ABLESTIK NCA 9300UV, Acrylate, Non-conductive adhesive, Single component, Photocurable LOCTITE ® ABLESTIK NCA 9300UV single component, photocurable adhesive is designed for disk drive assembly applications such as conformal coating and component tracking. This product also contains a... [See More]

  • Cure / Technology: UV or Radiation Cured; Single Component
  • Viscosity: 70000
  • Type: High Dielectric
TECHNOMELT PA 6208 Black -- 8799566462977
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Cure / Technology: Thermoplastic / Hot Melt; Single Component
  • Form / Function: Pellets
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Polyamide
Electrically Non-Conductive Adhesives -- LOCTITE ABLESTIK UV300X
from Henkel Corporation - Industrial

LOCTITE ABLESTIK UV300X, Acrylate, Assembly, Single Component, Photocurable Adhesive LOCTITE ® ABLESTIK UV300X single component, photocurable adhesive is designed for disk drive assembly applications such as conformal coating and component tracking. This product also contains a secondary thermal... [See More]

  • Cure / Technology: UV or Radiation Cured; Single Component
  • Viscosity: 70000
Encapsulants -- LOCTITE ECCOBOND FP0087
from Henkel Corporation - Industrial

LOCTITE ECCOBOND FP0087, Epoxy, Encapsulation. LOCTITE ® ECCOBOND FP0087 yields best results when used to encapsulate a device enclosed in a cavity or potting ring, which restricts the flow of the material. The unique combination of low stress and excellent resistance to moisture and process... [See More]

  • Cure / Technology: Single Component
  • CTE: 10
  • Chemical System: Epoxy
  • Viscosity: 20000
Encapsulants -- LOCTITE STYCAST 2851FT
from Henkel Corporation - Industrial

LOCTITE STYCAST 2851FT, Epoxy, Encapsulant LOCTITE ® STYCAST 2851FT is recommended for encapsulation of components that require heat dissipation and thermal shock properties . It has a low coefficient of thermal expansion and exhibits excellent resistance to a wide variety of industrial... [See More]

  • Cure / Technology: Single Component
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Thermal Conductivity: 1.36
Encapsulants -- LOCTITE STYCAST E 2517
from Henkel Corporation - Industrial

LOCTITE STYCAST E 2517, Epoxy, Encapsulant LOCTITE ® STYCAST E 2517 epoxy encapsulant is formulated for use on bare chip protection in a variety of advanced packages where ease of flow and high thermal stability are required. One component. Low CTE. Low stress. Low viscosity. High temperature... [See More]

  • Cure / Technology: Single Component
  • Thermal Conductivity: 1.5
  • Chemical System: Epoxy
  • Viscosity: 22500
Encapsulants -- LOCTITE STYCAST EO 8019
from Henkel Corporation - Industrial

LOCTITE STYCAST EO 8019, Epoxy, Potting and Encapsulating, Resilient, Non-sag, Heat Cure Glass adhesive LOCTITE STYCAST EO 8019 epoxy, is a resilient, non-sag, heat cure glass adhesive. Non-sag properties are at room temperature and to 149 ºC in a 1/8 inch bead. Resilient. Non-sag [See More]

  • Cure / Technology: Single Component
  • Viscosity: 325000
  • Chemical System: Epoxy
Encapsulants -- LOCTITE STYCAST ESP 4536
from Henkel Corporation - Industrial

LOCTITE STYCAST ESP 4536, Epoxy, Fast-setting, Industrial Grade, Surface Mounted Devices LOCTITE ® STYCAST ESP 4536 is a fast-setting, industrial grade surface mount adhesive. It is designed to set quickly when heated, providing a material with high shear strength. One component. Solvent-free. [See More]

  • Cure / Technology: Single Component
  • Viscosity: 7500
  • Chemical System: Epoxy
Industrial Adhesives -- LOCTITE ABLESTIK 2033SC
from Henkel Corporation - Industrial

LOCTITE ABLESTIK 2033SC, Proprietary Hybrid Chemistry, Die Attach. LOCTITE ® ABLESTIK 2033SC die attach adhesive is designed for high throughput smart card bonding applications. It is compatible with various encapsulant chemistries. Non-conductive. Single component. Low bleed. Long work life. [See More]

  • Cure / Technology: Single Component
  • Form / Function: Paste
  • Type: High Dielectric
  • CTE: 31
Industrial Adhesives -- LOCTITE ABLESTIK ABP 2036SF
from Henkel Corporation - Industrial

LOCTITE ABLESTIK ABP 6892, BMI/Acrylate, Die Attach, Non-conductive Paste LOCTITE ® ABLESTIK ABP 6892 non-conductive die attach paste is designed for applications requiring low stress and robust mechanical properties. A package using this material will have a greater resistance to delamination... [See More]

  • Cure / Technology: Single Component
  • Form / Function: Paste
  • Type: High Dielectric
  • Thermal Conductivity: 0.3500
Industrial Adhesives -- LOCTITE STYCAST UV 7993
from Henkel Corporation - Industrial

LOCTITE STYCAST UV 7993, Urethane, Conformal coating LOCTITE STYCAST UV 7993 is a conformal coating designed to provide rugged protection from moisture and harsh chemicals. It is compatible with industry standard solder masks, no-clean fluxes, metallization, components and substrate materials. [See More]

  • Cure / Technology: UV or Radiation Cured; Single Component
  • Viscosity: 120
  • Chemical System: Polyurethane
Potting, Encapsulating and Injection Molding Compounds -- LOCTITE 3703
from Henkel Corporation - Industrial

Acrylated urethane acrylic structural adhesive primarily designed for bonding rigid and flexible PVC to polycarbonate. LOCTITE ® 3703 is a bone white to beige, translucent, acrylated urethane acrylic structural adhesive primarily designed for bonding rigid and flexible PVC to polycarbonate... [See More]

  • Cure / Technology: UV or Radiation Cured; Single Component
  • Chemical System: Acrylic
  • Form / Function: Paste; Gap Filler, Foam in Place Gasket
  • Viscosity: ? to 35000
Structural Adhesives -- LOCTITE ECCOBOND DS 6349
from Henkel Corporation - Industrial

LOCTITE ECCOBOND DS 6349, Acrylic, Single component, UV light curable, Encapsulant LOCTITE ® ECCOBOND DS 6349 is a single component, UV light curable material designed for LCD module assembly. This product is also suitable for use in applications requiring LED-UV light cure. UV curable. LED-UV... [See More]

  • Cure / Technology: UV or Radiation Cured; Single Component
  • Viscosity: 8000