Two Component System Encapsulants and Potting Compounds

Techsil® EP25485 Black Flame Retardant Epoxy 5kg -- TESI19080
from Techsil Limited

Techsil ® EP25485 is a low viscosity, thermally conductive flame retardant potting and encapsulating compound. The mixed system has a long usable life and may be hot or cold cured. The system exhibits a good surface finish, high electrical strength, high thermal conductivity and low cure... [See More]

  • Cure / Technology: Two Component  
  • Form / Function: Liquid
  • Type: Thermally Conductive
  • Chemical System: Epoxy
ELAN-Cast® -- E 2154 Black Resin / C 2154 Hardener
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Form / Function: Liquid
  • Type: High Dielectric
  • Chemical System: Epoxy
3M Scotch-Weld DP270 Epoxy Potting Compound Black 48.5 mL Duo-Pak Cartridge -- DP270 BLACK 48.5ML [7100148745 from 3M]
from Ellsworth Adhesives

3M Scotch-Weld Epoxy Potting Compound/Adhesive DP270 Black is a two component, epoxy resin system that is used for sealing, encapsulating, and potting electronic and heat sensitive components. It offers low viscosity, long handling times, noncorrosive to copper, good electrical properties, and... [See More]

  • Cure / Technology: Two Component  
  • Thermal Conductivity: 0.1770
  • Chemical System: Epoxy
  • Dielectric Strength: 850
Addition Cured Silicone is Optically Clear with Enhanced Low Temperature Serviceability -- MasterSil 157
from Master Bond, Inc.

MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing; Addition Cure
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid
  • Type: High Dielectric; Optical; Thermally Conductive
  • Chemical System: Silicone
Biocompatible, Spectrally Transparent Epoxy -- EPO-TEK® MED-301
from Epoxy Technology

EPO-TEK ® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries.  Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market... [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Form / Function: Liquid; Glob Top, Daub, Doming or Overfill
  • Type: Optical
  • Chemical System: Epoxy
3M Scotch-Weld DP270 Epoxy Potting Compound Clear 48.5 mL Duo-Pak Cartridge -- DP270 CLEAR 48.5ML [7100148730 from 3M]
from Ellsworth Adhesives

3M Scotch-Weld Epoxy Potting Compound/Adhesive DP270 Clear is a two component, epoxy resin system that is used for sealing, encapsulating, and potting electronic and heat sensitive components. It offers low viscosity, long handling times, noncorrosive to copper, good electrical properties, and... [See More]

  • Cure / Technology: Two Component  
  • Thermal Conductivity: 0.1770
  • Chemical System: Epoxy
  • Dielectric Strength: 850
Electrically and Thermally Conductive, Two Part Silicone Meets NASA Low Outgassing Specifications -- MasterSil 973S-LO
from Master Bond, Inc.

MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]

  • Cure / Technology: Thermoset; Two Component  ; Addition Cure
  • Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating
  • Type: Electrically Conductive; Thermally Conductive
  • Chemical System: Silicone
Dow DOWSIL™3-4150 Dielectric Gel Encapsulant Green 36.2 kg Kit -- 3-4150 DIELECT GEL 36.2KG [3127460 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow DOWSIL ™3-4150 Dielectric Gel Clear-Green is a two component, fast room temperature curing, silicone gel that is used for potting, sealing, encapsulating, and protecting a variety of materials in the electronics industry. It offers flexibility, stress relief, and offers excellent... [See More]

  • Cure / Technology: Two Component  
  • Chemical System: Silicone
  • Type: High Dielectric
  • Dielectric Strength: 381
Epoxy Features Very Low Coefficient of Thermal Expansion -- EP30LTE-2
from Master Bond, Inc.

Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating. [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Form / Function: Liquid; Encapsulant or Conformal Coating
  • Type: High Dielectric; Thermal Insulation
  • Chemical System: Epoxy
Dow DOWSIL™93-500 Space Grade Encapsulant Clear 110 g Kit -- 93-500 SPACE GR ENCAP 110G [1091450 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow DOWSIL ™93-500 Space Grade Encapsulant and 93-500 Thixotropic Space Grade Encapsulant Clear are two component, silicone elastomers that are used for aerospace applications such as sealing optical sensors, encapsulating/potting electronic components, and bonding solar cells to substrates,... [See More]

  • Cure / Technology: Two Component  
  • Thermal Conductivity: 0.2000
  • Chemical System: Silicone
  • Tensile (Break): 975
Epoxy Meets Airbus Standards for Flame Retardancy, Smoke and Gas Emissions -- EP93FRHT
from Master Bond, Inc.

EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
Dow DOWSIL™93-500 Thixotropic Space Grade Encapsulant Clear 115 g Kit -- 93-500 THIXOTROPIC 115G [2410613 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow DOWSIL ™93-500 Thixotropic Space Grade Encapsulant and 93-500 Space Grade Encapsulant Clear are two component, silicone elastomers that are used for aerospace applications such as sealing optical sensors, encapsulating/potting electronic components, and bonding solar cells to substrates,... [See More]

  • Cure / Technology: Two Component  
  • Thermal Conductivity: 0.2000
  • Chemical System: Silicone
  • Tensile (Break): 1225
Epoxy with High Elongation Passes ISO 10993-5 Certification for Cytotoxicity -- EP40Med
from Master Bond, Inc.

EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
Dow DOWSIL™CY 52-276 Silicone Encapsulant Part A Clear 1 kg Bottle -- CY 52-276 PART A 1KG [2624028 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow DOWSIL ™CY 52-276 Kit Clear is a two component, low volatility silicone gel that is used for protecting and sealing electronic devices from thermal shock, vibration, fuels, and solvents. with addition cure, It offers flexibility and a low temperature cure. 1:1 mix ratio. Part A, 1 kg... [See More]

  • Cure / Technology: Two Component  
  • Dielectric Strength: 356
  • Chemical System: Silicone
  • Viscosity: 900 to 1200
Extremely Soft MasterSil 170 Gel Encapsulant Offers Removability and Optical Clarity -- MasterSil 170 Gel
from Master Bond, Inc.

MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Form / Function: Liquid
  • Type: High Dielectric; Optical; Thermally Conductive
  • Chemical System: Silicone
Dow DOWSIL™CY 52-276 Silicone Encapsulant Part B Clear 1 kg Bottle -- CY 52-276 PART B 1KG [2624052 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow DOWSIL ™CY 52-276 Kit Clear is a two component, low volatility silicone gel that is used for protecting and sealing electronic devices from thermal shock, vibration, fuels, and solvents. with addition cure, It offers flexibility and a low temperature cure. 1:1 mix ratio. Part B, 1 kg... [See More]

  • Cure / Technology: Two Component  
  • Dielectric Strength: 356
  • Chemical System: Silicone
  • Viscosity: 900
Fast Curing, Optically Clear, Two Part Epoxy -- EP39-2
from Master Bond, Inc.

Master Bond Polymer System EP39-2 is a fast curing, low viscosity, optically clear two component epoxy system for high performance bonding, sealing, coating and casting. It is 100% reactive and does not contain any diluents, solvents or other volatiles. The mix ratio is a convenient 2 to 1 by... [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Die Bonding Adhesives
  • Composition: Unfilled
Dow DOWSIL™EE-1010 Low Viscosity Encapsulant 36.2 kg Kit -- EE-1010 SIL ELAST 36.2KG [4101626 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow DOWSIL ™EE-1010 Low Viscosity Encapsulant is a two component, 1:1 mix ratio silicone elastomer for the electronics industry. Benefits include a room temperature cure that can be accelerated with heat, and a long working time. Part A and Part B are different colors for easy identification... [See More]

  • Cure / Technology: Two Component  
  • Thermal Conductivity: 0.6000
  • Chemical System: Silicone
  • Dielectric Strength: 450
High Glass Transition Temperature Epoxy System -- EP62-1
from Master Bond, Inc.

Master Bond EP62-1 is a two component heat cured and chemically resistant epoxy resin system featuring a long pot life at ambient temperatures and efficient cures at moderately elevated temperatures. The reccommended mix ratio is 100 parts of component A to 10 parts of component B. The pot life of... [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Industry: Marine; Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial; Semiconductors, IC's
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Use Temperature: -60 to 400
Dow DOWSIL™EE-3200 Silicone Encapsulant Part A Off-White 0.5 kg Jar -- EE-3200 PART A .5KG [4121014 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow DOWSIL ™EE-3200 Low Stress Silicone Encapsulant is a two component, low viscosity encapsulant with a 1:1 mix ratio, good heat dissipation, and good thermal conductivity. Once thoroughly mixed, the mixture will cure to a flexible elastomer for the protection of electronic and electrical... [See More]

  • Cure / Technology: Two Component  
  • Industry: Automotive; Electronics
  • Chemical System: Silicone
  • Thermal Conductivity: 0.5000
High Temperature Resistant Epoxy Compound -- EP45HT
from Master Bond, Inc.

Master Bond Polymer System EP45HT is a two component epoxy system for high performance structural bonding and casting. It is suitable for applications where long term exposure to temperatures from -80 °F to +500 °F is required. lt is 100% reactive and does not contain any solvents or... [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Die Bonding Adhesives
  • Composition: Unfilled
Dow DOWSIL™EE-3200 Silicone Encapsulant Part B Black 0.5 kg Jar -- EE-3200 PART B .5KG [4121013 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow DOWSIL ™EE-3200 Low Stress Silicone Encapsulant is a two component, low viscosity encapsulant with a 1:1 mix ratio, good heat dissipation, and good thermal conductivity. Once thoroughly mixed, the mixture will cure to a flexible elastomer for the protection of electronic and electrical... [See More]

  • Cure / Technology: Two Component  
  • Industry: Automotive; Electronics
  • Chemical System: Silicone
  • Thermal Conductivity: 0.5000
High Temperature Resistant, Toughened Epoxy -- EP125
from Master Bond, Inc.

Master Bond Polymer System 125 is a two component toughened epoxy resin for prolonged service above 500 °F with truly outstanding chemical resistance. High strength bonds serviceable up to 600 °F can be obtained with this exceptionally thermally stable and chemically resistant epoxy resin... [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Form / Function: Powder; Gap Filler, Foam in Place Gasket; Impregnating Resin; Die Bonding Adhesives
  • Type: High Dielectric; Thermal Insulation
  • Chemical System: Epoxy
Dow DOWSIL™EI-1184 Optical Encapsulant Clear 36 kg Kit -- EI-1184 OPTIC ENCAP 36KG KIT [4124807 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow DOWSIL ™EI-1184 Optical Encapsulant is a two component, silicone that is used for encapsulating circuit boards, electrical and LED Lighting applications. It offers high transparency and rapid, heat and room temperature cure. 36 kg Kit. [See More]

  • Cure / Technology: Two Component  
  • Elongation: 55.0
  • Tensile (Break): 1375
  • Dielectric Strength: 483
Highly Flexible Addition Cured Silicone Offers Low Thermal Resistance -- MasterSil 151TC
from Master Bond, Inc.

MasterSil 151TC is a highly flexible, temperature resistant two component silicone adhesive offering low thermal resistance and outstanding thermal conductivity. It was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Silicone
Dow HIPEC™Q3-6646 LED Encapsulant Clear 210 mL Kit -- Q3-6646 PR/CTG A/B 210ML [4026188 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow HIPEC ™Q3-6646 Semiconductor Protective Coating Kit Clear is a two component, low modulus LED gel encapsulant that is used for protecting and sealing LEDs. It offers stress relief, low viscosity, and long working times. 210 mL Kit. [See More]

  • Cure / Technology: Two Component  
  • Viscosity: 630 to 660
Low Outgassing, Optically Clear Two Component Epoxy -- EP29LPSP
from Master Bond, Inc.

Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. Not only is EP29LPSP able to function as an adhesive, sealant and protective coating at temperatures as low as 4K, but it is... [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Type: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding
  • Chemical System: Epoxy
Dow SE 4445 CV Thermally Conductive Gel Gray 210 mL Cartridge -- SE 4445 CV KIT 210ML [4025973 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow SE 4445 CV Thermally Conductive Gel Gray is a two component, heat curing gel that is used for potting electronic modules, base material for thermally conductive gel sheet, and gap fill material between heat sinks and electronic heat sinks. It offers low viscosity, wide service temperature range,... [See More]

  • Cure / Technology: Two Component  
  • Thermal Conductivity: 1.26
  • Type: Thermally Conductive
  • Dielectric Strength: 127
Low Viscosity Structural Epoxy Adhesive System -- EP112
from Master Bond, Inc.

Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronic/ structural applications. The two components are combined in a convenient noncritical mix... [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating; Impregnating Resin
  • Type: High Dielectric; Optical; Thermal Insulation
  • Chemical System: Epoxy
Dow SYLGARD™160 Silicone Encapsulant Gray 210 mL Kit -- 160 A/B 210ML KIT [4026218 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow SYLGARD ™160 Silicone Elastomer is a two component, room temperature or heat curing encapsulant that is used for general potting applications of power supplies. It has good flowability, moderate thermal conductivity, and flame resistance. 1:1 mix ratio. 210 mL Cartridge. [See More]

  • Cure / Technology: Two Component  
  • Industry: Electric Power
  • Chemical System: Silicone
  • Thermal Conductivity: 0.6200
Low Viscosity, Electrically Insulating Epoxy Features Excellent Optical Clarity -- EP30LP-2
from Master Bond, Inc.

Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Type: High Dielectric; Optical; Thermally Conductive
  • Chemical System: Epoxy
Dow SYLGARD™160 Silicone Encapsulant Part A Gray 226.7 kg Pail -- 160 SIL ELAST PT A 226.7KG [2417600 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow SYLGARD ™160 Silicone Elastomer is a two component, room temperature or heat curing encapsulant that is used for general potting applications of power supplies. It has good flowability, moderate thermal conductivity, and flame resistance. 1:1 mix ratio. Part A, 226.7 kg Pail. [See More]

  • Cure / Technology: Two Component  
  • Industry: Electric Power
  • Chemical System: Silicone
  • Thermal Conductivity: 0.6200
Low Viscosity, Fast Curing, Two Component Epoxy -- EP38
from Master Bond, Inc.

Master Bond Polymer System EP38 is a fast curing, low viscosity, optically clear two component epoxy system for high performance coating, bonding and sealing. It is 100% reactive and does not contain any volatiles. The mix ratio is a convenient 3 to 1 by weight. EP38 is very fast curing. Coatings as... [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Die Bonding Adhesives
  • Type: High Dielectric
  • Chemical System: Epoxy
Dow SYLGARD™160 Silicone Encapsulant Part A Gray 24.9 kg Pail -- 160 SIL ELAST PT A 24.9KG [2468531 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow SYLGARD ™160 Silicone Elastomer is a two component, room temperature or heat curing encapsulant that is used for general potting applications of power supplies. It has good flowability, moderate thermal conductivity, and flame resistance. 1:1 mix ratio. Part A, 24.9 kg Pail. [See More]

  • Cure / Technology: Two Component  
  • Industry: Electric Power
  • Chemical System: Silicone
  • Thermal Conductivity: 0.6200
Moderate Viscosity Thermally Conductive Epoxy -- EP112AO
from Master Bond, Inc.

Master Bond Polymer System EP112AO is a solventless, moderate viscosity two component epoxy resin system which is specifically designed for high performance outdoor and indoor electrical and electronic applications where good thermal conductivity and electrial isolation is required. The two... [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
Dow SYLGARD™160 Silicone Encapsulant Part A Gray 5.4 kg Pail -- 160 SIL ELAST PT A 5.4KG [3088111 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow SYLGARD ™160 Silicone Elastomer is a two component, room temperature or heat curing encapsulant that is used for general potting applications of power supplies. It has good flowability, moderate thermal conductivity, and flame resistance. 1:1 mix ratio. Part A, 5.4 kg Pail. [See More]

  • Cure / Technology: Two Component  
  • Industry: Electric Power
  • Chemical System: Silicone
  • Thermal Conductivity: 0.6200
Nanosilica Filled Optically Clear Epoxy with High Abrasion Resistance -- EP30NS
from Master Bond, Inc.

Master Bond EP30NS is a nanosilica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically clear and meets NASA low outgassing specifications. [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Type: High Dielectric; Optical; Thermally Conductive
  • Chemical System: Epoxy
Dow SYLGARD™160 Silicone Encapsulant Part B Off-White 226.7 kg Pail -- 160 SIL ELAST PT B 226.7KG [2417618 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow SYLGARD ™160 Silicone Elastomer is a two component, room temperature or heat curing encapsulant that is used for general potting applications of power supplies. It has good flowability, moderate thermal conductivity, and flame resistance. 1:1 mix ratio. Part B, 226.7 kg Pail. [See More]

  • Cure / Technology: Two Component  
  • Industry: Electric Power
  • Chemical System: Silicone
  • Thermal Conductivity: 0.6200
NASA Low Outgassing Rated Epoxy Features Enhanced Chemical Resistance -- EP42-2LV Black
from Master Bond, Inc.

EP42-2LV Black is a two component, room temperature curing epoxy compound featuring low viscosity and superior chemical resistance. It meets NASA low outgassing specifications, is black in color and optically opaque. [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
Dow SYLGARD™160 Silicone Encapsulant Part B Off-White 24.9 kg Pail -- 160 SIL ELAST PT B 24.9KG [2468549 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow SYLGARD ™160 Silicone Elastomer is a two component, room temperature or heat curing encapsulant that is used for general potting applications of power supplies. It has good flowability, moderate thermal conductivity, and flame resistance. 1:1 mix ratio. Part B, 24.9 kg Pail. [See More]

  • Cure / Technology: Two Component  
  • Industry: Electric Power
  • Chemical System: Silicone
  • Thermal Conductivity: 0.6200
New Epoxy Offers Rapid Cures and Chemical Resistance -- EP41S-F
from Master Bond, Inc.

Offering impressive physical strength characteristics, EP41S-F is an electrically insulative two component epoxy that cures rapidly at ambient and elevated temperatures. Typically faster curing epoxies are somewhat less chemically resistant than other types of systems, but EP41S-F is one of the few... [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
Dow SYLGARD™160 Silicone Encapsulant Part B Off-White 5.4 kg Pail -- 160 SIL ELAST PT B 5.4KG [3088120 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow SYLGARD ™160 Silicone Elastomer is a two component, room temperature or heat curing encapsulant that is used for general potting applications of power supplies. It has good flowability, moderate thermal conductivity, and flame resistance. 1:1 mix ratio. Part B, 5.4 kg Pail. [See More]

  • Cure / Technology: Two Component  
  • Industry: Electric Power
  • Chemical System: Silicone
  • Thermal Conductivity: 0.6200
Nickel Filled Electrically Conductive Epoxy System -- EP76M
from Master Bond, Inc.

Master Bond Polymer System EP76M is a two component, nickel filled, electrically conductive adhesive for high performance bonding, sealing, and coating formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part nickel conductive systems, EP76M... [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Die Bonding Adhesives
  • Type: Anti-static, ESD; Electrically Conductive; EMI/RFI Shielding; Thermally Conductive
  • Chemical System: Epoxy
Dow SYLGARD™164 Silicone Encapsulant Gray 210 mL Kit -- 164 SIL ELAST KIT 210ML [4028273 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow SYLGARD ™164 Silicone Elastomer Gray is a two component, room temperature and heat curing, encapsulant that is used as a protective coating for electrical applications such as power supplies, transformers, sensors, amplifiers, and connectors. It provides good flowability, thermal... [See More]

  • Cure / Technology: Two Component  
  • Industry: Electric Power
  • Chemical System: Silicone
  • Thermal Conductivity: 0.6400
Optically Clear, Low Viscosity, Two Component Epoxy -- EP30
from Master Bond, Inc.

Master Bond Polymer System EP30 is a low viscosity, two component epoxy adhesive for general purpose bonding, coating, sealing and casting formulated to cure at room temperature or more rapidly at elevated temperatures with a four (4) to one (1) mix ratio by weight. This adhesive is 100% reactive... [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Type: Optical; Thermal Insulation
  • Chemical System: Epoxy
Dow SYLGARD™164 Silicone Encapsulant Part A Gray 24.9 kg Pail -- 164 SIL ELAST PT A 24.9KG [4013032 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow SYLGARD ™164 Silicone Elastomer Gray is a two component, room temperature and heat curing, encapsulant that is used as a protective coating for electrical applications such as power supplies, transformers, sensors, amplifiers, and connectors. It provides good flowability, thermal... [See More]

  • Cure / Technology: Two Component  
  • Industry: Electric Power
  • Chemical System: Silicone
  • Thermal Conductivity: 0.6400
Optically Clear, Room Temperature Curing Epoxy Blocks UV Light Transmission -- EP30-2LB
from Master Bond, Inc.

Formulated to have special optical transmission properties, EP30-2LB is an optically clear epoxy that does not permit UV light transmission, but transmits well from 450-900 nm and above. It is a user friendly compound that has a non-critical ten to one mix ratio by weight. This system cures readily... [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Type: High Dielectric; Optical; Thermally Conductive
  • Chemical System: Epoxy
Dow SYLGARD™164 Silicone Encapsulant Part B Off-White 24.9 kg Pail -- 164 SIL ELAST PT B 24.9KG [4013034 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow SYLGARD ™164 Silicone Elastomer Gray is a two component, room temperature and heat curing, encapsulant that is used as a protective coating for electrical applications such as power supplies, transformers, sensors, amplifiers, and connectors. It provides good flowability, thermal... [See More]

  • Cure / Technology: Two Component  
  • Industry: Electric Power
  • Chemical System: Silicone
  • Thermal Conductivity: 0.6400
Room Temperature Curing Epoxy Features Low Thermal Resistance -- EP30TC
from Master Bond, Inc.

Formulated for thermal management applications, EP30TC is a two component epoxy that contains robust thermally conductive fillers with very fine particle sizes. It has thermal conductivity of 18-20 BTU •in/ft2 •hr • °F [2.60-2.88 W/(m •K)] and can be applied in sections as... [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
Dow SYLGARD™170 Fast Cure Silicone Encapsulant Black 210 mL Kit -- 170 FAST CURE A/B 210ML KT [4026167 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow SYLGARD ™170 Fast Cure Silicone Elastomer Black is a two component, room temperature and heat curing, encapsulant that is used as a protective coating for electrical applications such as power supplies, transformers, sensors, amplifiers, and connectors. It provides good flowability,... [See More]

  • Cure / Technology: Two Component  
  • Industry: Electric Power
  • Chemical System: Silicone
  • Thermal Conductivity: 0.4000
Room Temperature Curing, Two Component Epoxy System -- EP34
from Master Bond, Inc.

Master Bond Polymer System EP34 is a unique room temperature curing two component epoxy compound for high temperature potting and encapsulating applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non critical mix ratio (part A/part B: 100/70). [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Form / Function: Optional Premixed and Frozen; Gap Filler, Foam in Place Gasket; Die Bonding Adhesives
  • Type: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding
  • Chemical System: Epoxy
Dow SYLGARD™170 Fast Cure Silicone Encapsulant Part A Black 22.6 kg Pail -- 170 FAST CURE A 22.6KG [3144712 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow SYLGARD ™170 Fast Cure Silicone Elastomer is a two component, room temperature and heat curing, encapsulant that is used as a protective coating for electrical applications such as power supplies, transformers, sensors, amplifiers, and connectors. It provides good flowability, moderate... [See More]

  • Cure / Technology: Two Component  
  • Industry: Electric Power
  • Chemical System: Silicone
  • Thermal Conductivity: 0.4000
Solvent Resistant Adhesive Withstands Methylene Cholride, Alcohols and Fuels -- EP41S-5
from Master Bond, Inc.

EP41S-5 is chemically resistant and withstands acids, bases, alcohols, fuels and many solvents. This two part epoxy is widely used for bonding, sealing, coating, and encapsulating. It provides high physical strength properties and electrical insulation values. EP41S-5 offers convenient handling with... [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Form / Function: Liquid; Encapsulant or Conformal Coating; Impregnating Resin
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
Heat Curing Electronic Coating Silicone Compound -- Bluesil™ V-207
from Bluestar Silicones USA Corp.

Clear, Two-Component, Addition Cure, Heat Curing Electronic coating Silicone Compound. Properties. Viscosity 6000. Hardness Sha 30. Description. BLUESIL V-207 is a clear, two component, addition cure, heat curing silicone rubber compound. It is designed as a primerless coating and encapsulating... [See More]

  • Cure / Technology: Thermoset; Two Component  ; Reactive or Moisture Cured
  • Chemical System: Silicone
  • Form / Function: Liquid; Encapsulant or Conformal Coating
  • Industry: Electronics
GENIOSIL® WP Liquid Waterproofing Coatings -- GENIOSIL® WP1
from Wacker Chemical Corp.

GENIOSIL® WP1 is a polyether-based silane-terminated polymer suitable asbinder in moisture curing formulations. It is a clear liquid with a slight but characteristic odor and differs to conventional silylated polymers due to its high reactivity. This is a direct consequence of the structural... [See More]

  • Cure / Technology: Two Component  
  • Chemical System: Silicone
  • Form / Function: Liquid
  • Industry: Construction
3110 RTV Silicone Rubber -- 3110 453G [3110 453G from Dow Corning Oil & Gas Solutions]
from Applied Industrial Technologies

453 g Tub; Use As A Flexible Potting & Encapsulating Material [See More]

  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing; Cure By Methanol
  • Industry: General Purpose
  • Chemical System: Silicone; Elastomeric
  • Use Temperature: -65 to 390
Di-Pak™ E-4000 Series Elastomeric Eletrical Insulating Compound -- E-4021
from Hapco, Inc.

Flexible, colorless, potting and encapsulating systems. Available in 5 minute (-5), 16 minute, and 20 minute gel times, and in shore hardness ’s from 20 A to 80 A . [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Form / Function: Liquid
  • Type: High Dielectric
  • Industry: Electronics
Chemical Resistant Epoxy System -- 20-3004 HV
from Epoxies Etc...

20-3004 LV & HV are two component chemical resistance epoxy systems. They were developed for potting, coating, and adhesive applications requiring superior chemical resistance. They exhibit outstanding bonds to a variety of substrates. [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Chemical System: Epoxy
  • Form / Function: Gel
  • Composition: Unfilled
Electrically Non-Conductive Adhesives -- LOCTITE STYCAST 3103 BIPAX
from Henkel Corporation - Industrial

LOCTITE STYCAST 3103 BIPAX, Epoxy, Potting, Encapsulant LOCTITE ® STYCAST 3103 BIPAX epoxy casting compound is designed for use in applications where a combination of good mechanical, thermal and electrical insulating properties are required. LOCTITE STYCAST 3103 BIPAX passes cytotoxicity... [See More]

  • Cure / Technology: Two Component  
  • Chemical System: Epoxy
Cement -- No. 31
from Sauereisen, Inc.

Sauereisen Cement No. 31 is a white, porcelain-like cement that is widely used throughout industry in a variety of applications. including assembling, sealing, insulating and cementing of ceramics, porcelain, metal, and glass. [See More]

  • Cure / Technology: Two Component  ; Chemically Set
  • Form / Function: Powder; Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Ceramic
Clear Non-Yellowing Silicone Encapsulant -- PNS-56225
from Protavic America, Inc.

PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Form / Function: Liquid; Encapsulant or Conformal Coating; Die Bonding Adhesives
  • Type: Electrically Conductive; Thermally Conductive
  • Chemical System: Silicone
HYSOL ES1000 -- 8802586656769
from Henkel Corporation - Electronics

HYSOL ® ES1000 ™ is a two-component, long pot life casting system with excellent handling properties. This material has good thermal shock resistance and low exotherm, making it suitable for encapsulation of various components and modules. [See More]

  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
  • Industry: Electronics
  • Chemical System: Epoxy
  • Use Temperature: -13 to 221
Conap™ Conformal Coating -- CONATHANE® CE-1155
from ACCRAbond, Inc.

CONATHANE ® CE-1155 is a two-component, solvent-based polyurethane printed circuit board coating designed for use in adverse environments. CE-1155 provides outstanding resistance to moisture and good abrasion resistance. [See More]

  • Cure / Technology: Two Component  
  • Chemical System: Polyurethane
  • Form / Function: Encapsulant or Conformal Coating
  • Features: Solvent Based
Polyurethane Polyols -- VORANOL™ 220-260
from Dow Polyurethanes

Dow provides a wide variety of VORANOL* polyether polyols. with an extensive selection of performance and processing attrib-. utes. Designed to meet your needs, this large family of polyols. is sure to provide the balance of properties needed within rigid. and molded foam and isocyanate product... [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Polyurethane; Polyether Polyol
  • Form / Function: Gel
  • Features: Water Based 
GENIOSIL® XT SILANE TERMINATED POLYMER -- GENIOSIL® XT 55
from Wacker Chemical Corp.

GENIOSIL® XT 55 is a silicon reinforced polyetherbasedsilane-terminated polymer suitable as a binderin moisture curing formulations. It is a clear liquid witha slight but characteristic odor and differs toconventional silylated polymers due to its highreactivity. This is a direct consequence of... [See More]

  • Cure / Technology: Two Component  ; Reactive or Moisture Cured
  • Chemical System: Silicone
  • Form / Function: Liquid
  • Industry: Construction
5-Minute® Epoxy -- 14200 [14200 from ITW Devcon]
from Applied Industrial Technologies

15 oz Tube; A Rapid-Curing, General Purpose Adhesive/Encapsulant [See More]

  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
  • Composition: Unfilled
  • Form / Function: Liquid
  • Industry: OEM or Industrial
Di-Pak™ E-4500 Elastomeric Eletrical Insulating Compound -- E-4540
from Hapco, Inc.

Flexible, 45, 65 and, 95 shore A hardness, potting and encapsulating systems. Flame retardant (FR), accelerated 3 minute (-3) gel time, and black or unpigmented versions are available. [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Form / Function: Liquid
  • Type: High Dielectric
  • Features: Flame Retardant
Epoxy Adhesive & Potting Compound -- 10-3009
from Epoxies Etc...

10-3009 is a low viscosity epoxy adhesive and potting compound. It is easy to use and allows the end user to adjust the flexibility of the cured epoxy. This product offers a good combination of peel and tensile strength. 10-3009 provides electrical insulation and outstanding adhesion. [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Form / Function: Liquid
  • Type: High Dielectric; Thermal Insulation
  • Chemical System: Epoxy
Encapsulants -- LOCTITE ECCOBOND EN 1350
from Henkel Corporation - Industrial

LOCTITE ECCOBOND EN 1350, Epoxy, Encapsulant. LOCTITE ® ECCOBOND EN 1350 encapsulant is designed for thermal sensor assembly applications. Non-conductive. Fast cure at low temperatures. Low temperature cure. High temperature resistance. Water resistant [See More]

  • Cure / Technology: Two Component  
  • Chemical System: Epoxy
  • Type: High Dielectric
  • CTE: 15
Conocrete - Fast Patch -- No. 149
from Sauereisen, Inc.

ConoCrete - Fast Patch No. 149 is a three-component, fast setting epoxy monolithic that is designed for patching cracks and holes. This material is ideal for use on highways, bridge decks,. docks, ramps, traffic aisles, industrial floors and airport runways. Fast Patch No. 149 produces extremely... [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Chemical System: Epoxy
  • Form / Function: Powder
  • Composition: Unfilled
Clear Urethane Cast/Adhesive -- PNU-46201
from Protavic America, Inc.

The two component polyurethane compound described in this data sheet is specifically designed for the encapsulation by casting of completed circuit board. The cured material meets the flammability requirements of UL 94, V-O at thickness of 0.070 in. and greater (UL File Number E116296) and provides... [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Form / Function: Liquid; Encapsulant or Conformal Coating
  • Type: High Dielectric; Thermal Insulation
  • Chemical System: Polyurethane
Silicone Elastomer Gel Encapsulant And Potting Compound -- SilGel® 612 A/B
from Wacker Chemical Corp.

WACKER SilGel ® 612 A/B is a pourable, additioncuring, RTV-2 silicone rubber that vulcanizes at room temperature to a very soft silicone gel. Special features. two-part, 1 : 1 mixing ratio. low viscosity. rapid heat cure. very low hardness (silicone gel). crystal clear. pronounced inherent tack. [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Form / Function: Liquid
  • Type: Optical
  • Chemical System: Silicone; Elastomeric
Di-Pak™ E-4600 Elastomeric Eletrical Insulating Compound -- E-4650
from Hapco, Inc.

Flexible, high strength, 50 to 71 shore D hardness potting and encapsulating systems. Available in flame retardant (FR), 3 minute (-3) gel time, and in black or unpigmented. [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Form / Function: Liquid
  • Type: High Dielectric
  • Features: Flame Retardant
Flame Retardant Polyurethane -- 50-2369 FR
from Epoxies Etc...

The 50-2369FR Potting and Encapsulating Compound has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-2369 FR Urethane is listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low exotherm, and excellent electrical... [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Form / Function: Gel
  • Type: Thermally Conductive
  • Chemical System: Polyurethane
Encapsulants -- LOCTITE STYCAST 1264J
from Henkel Corporation - Industrial

LOCTITE STYCAST 1264J, Epoxy, Slightly Flexible, Virtually Stress Free, Encapsulant, Potting. LOCTITE ® STYCAST 1264J Parts AB cures slightly flexible and virtually stress free. Some darkening of the cured material will occur after long exposure to temperatures above 65 ºC or after... [See More]

  • Cure / Technology: Two Component  
  • Chemical System: Epoxy
  • Form / Function: Liquid
  • Use Temperature: 248
Epoxy Adhesive -- ANE-46505
from Protavic America, Inc.

Amber epoxy system . Excellent for use in high heat (steam) and chemical environments. 2 hour gel time.Bonds well to metal, plastics and wood. High thermal shock resistance. Available in colors and higher or lower viscosities. Passes NASA outgassingrequirements. [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Form / Function: Liquid; Die Bonding Adhesives
  • Type: High Dielectric
  • Chemical System: Epoxy
Di-Pak™ Elastomeric Eletrical Insulating Compound -- E-4501
from Hapco, Inc.

Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E products are flame... [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Form / Function: Liquid
  • Type: High Dielectric; Thermally Conductive
  • Features: Flame Retardant; UL Rating
Flame Retardant Thermally Conductive -- 50-3150 FR
from Epoxies Etc...

50-3150 FR has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-3150 FR Black Epoxy with Catalyst 190 and Catalyst 105 are listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low shrinkage, and outstanding insulation... [See More]

  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
  • Form / Function: Liquid
  • Type: Thermally Conductive
  • Chemical System: Epoxy
Encapsulants -- LOCTITE STYCAST 1265J
from Henkel Corporation - Industrial

LOCTITE STYCAST 1265J, Epoxy, Encapsulant. LOCTITE ® STYCAST 1265J Parts AB is designed for embedding stress sensitive components or where inspections and repairs are desired. It can be cut easily for repairing and replacing components. Fresh material can be poured and then cured to form a... [See More]

  • Cure / Technology: Two Component  
  • Chemical System: Epoxy
  • Type: High Dielectric
  • Use Temperature: 40 to 149
Optically Clear UV Adhesive -- ANA-97290
from Protavic America, Inc.

ANA-97290 is a clear Ultraviolet/ Visible light curing adhesive. It has very low shrinkage during cure for alignment sensitive parts. It is recommended for small electrical/electronic casting and encapsulating applications that require a unique combination of excellent wetting, flow, good thermal... [See More]

  • Cure / Technology: Thermoset; Two Component  ; UV or Radiation Cured
  • Form / Function: Liquid; Encapsulant or Conformal Coating; Gel (optional feature); Die Bonding Adhesives
  • Type: Electrically Conductive; Thermal Insulation
  • Composition: Unfilled
Di-Pak™ Elastomeric Eletrical Insulating Compound -- E-4888
from Hapco, Inc.

High performance, flexible potting systems designed to be in constant water immersion while maintaining electrical and physical properties. DI-PAK E-4888 & E-4889 were designed to meet Naval underwater applications. [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Form / Function: Liquid
  • Type: High Dielectric
  • Industry: Electronics
Encapsulants -- LOCTITE STYCAST 2651
from Henkel Corporation - Industrial

LOCTITE STYCAST 2651, Dielectric Grade, Epoxy, Encapsulant LOCTITE ® STYCAST 2651 is a dielectric grade epoxy encapsulant designed for general purpose applications and has excellent adhesion to a wide variety of substrates. LOCTITE STYCAST 2651 can be used with a variety of catalysts. For more... [See More]

  • Cure / Technology: Two Component  
  • CTE: 68
  • Chemical System: Epoxy
  • Viscosity: 225000
Polyurethane Adhesive -- PNU-56200
from Protavic America, Inc.

PNU-56200 ™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term circuit protection and... [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Form / Function: Liquid; Encapsulant or Conformal Coating; Die Bonding Adhesives
  • Type: High Dielectric
  • Chemical System: Polyurethane
Di-Pak™ Elastomeric Eletrical Insulating Compound -- E-4901-2
from Hapco, Inc.

Low cost, easy to use, potting compounds with fast cycle times. Available in 3 speeds. [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Form / Function: Liquid
  • Type: High Dielectric
  • Industry: Electronics
Encapsulants -- LOCTITE STYCAST 2651-40 W1
from Henkel Corporation - Industrial

LOCTITE STYCAST 2651-40 W1, Epoxy, Potting, Encapsulant LOCTITE ® STYCAST 2651-40 W1 epoxy encapsulant is designed for general purpose applications and has excellent adhesion to a wide variety of substrates. When fully cured, the material is readily machined with carbide tools. LOCTITE STYCAST... [See More]

  • Cure / Technology: Two Component  
  • Viscosity: 33000
  • Chemical System: Epoxy
Di-Pak™ Rigid Eletrical Insulating Compound -- R-4200
from Hapco, Inc.

DI-COAT R-4721 / DI-COAT R-4721 LV (lower viscosity). Shore 90 D, room temperature curing, medium to high thixotropic coating for dielectric insulating applications. DI-COAT R-4721 is ideal for use on vertical or sloping surfaces where flow or drain-off cannot be tolerated. DI-COAT R-4721 is easy to... [See More]

  • Cure / Technology: Thermoset; Two Component  
  • Form / Function: Liquid
  • Type: High Dielectric
  • Industry: Electronics
Encapsulants -- LOCTITE STYCAST 2741
from Henkel Corporation - Industrial

LOCTITE STYCAST 2741, Epoxy, Encapsulant. LOCTITE ® STYCAST 2741 is designed for electronic embedment and in sealing or cementing of metals, ceramics and plastics. The hardness can be adjusted by varying the amount of LOCTITE CAT 15 used. The technical information shown on this page reflects the... [See More]

  • Cure / Technology: Two Component  
  • Use Temperature: 67 to 176
  • Chemical System: Epoxy
  • Thermal Conductivity: 0.3500
Filter-bond™ Elastomeric Casting and Potting Compound -- E-3264
from Hapco, Inc.

Filter-bond ™ is a series of casting and potting compounds ideally suited for potting, sealing, and bonding filtration and ultrafiltration products. The Filter-bond ™ E-Series is manufactured to ultra-high quality standards and has been used by customers to pass FDA approval. Filter-bond... [See More]

  • Cure / Technology: Two Component  
  • Chemical System: Elastomeric; Polyurethane
  • Form / Function: Liquid
  • Features: Flexible
Encapsulants -- LOCTITE STYCAST 2762FT
from Henkel Corporation - Industrial

LOCTITE STYCAST 2762FT, Epoxy, High Temperature Resistance, High Thermal Conductivity, Potting, Encapsulant LOCTITE ® STYCAST 2762FT epoxy encapsulant is designed for potting electronic components exposed to harsh environments. This material is also ideal for large and complex castings that... [See More]

  • Cure / Technology: Two Component  
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Viscosity: 25000
Encapsulants -- LOCTITE STYCAST 2850FTJ
from Henkel Corporation - Industrial

LOCTITE STYCAST 2850FTJ, Epoxy, Encapsulant. LOCTITE ® STYCAST 2850FTJ epoxy encapsulant is designed for use in high voltage applications where surface arcing or tracking is a concern. LOCTITE STYCAST 2850FTJ is recommended for encapsulation of components that require heat dissipation and... [See More]

  • Cure / Technology: Two Component  
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Viscosity: 225000
Encapsulants -- LOCTITE STYCAST 2850KT CAT 24LV
from Henkel Corporation - Industrial

LOCTITE STYCAST 2850KT CAT 24LV, Epoxy, Encapsulant LOCTITE ® STYCAST 2850KT CAT 24LV epoxy encapsulant is designed for heat sink replacement in non-integrated electrical components and assemblies. It is also recommended for use in high voltage applications where surface arching or tracking is a... [See More]

  • Cure / Technology: Two Component  
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Use Temperature: 85 to 221
Encapsulants -- LOCTITE STYCAST 4640
from Henkel Corporation - Industrial

LOCTITE STYCAST 4640, Silicone, Flexible, Potting or Encapsulant LOCTITE ® STYCAST 4640 RTV condensation cure silicone rubber syntactic foam is engineered to yield a flexible, low density material with a low dielectric constant and dissipation factor. It is designed for airborne potting, sealing... [See More]

  • Cure / Technology: Two Component  
  • Chemical System: Silicone
  • Form / Function: Liquid
  • Use Temperature: 85 to 500
Encapsulants -- LOCTITE STYCAST 5952-1
from Henkel Corporation - Industrial

LOCTITE STYCAST 5952-1, Silicone, Potting or Encapsulant. LOCTITE ® STYCAST 5952-1 is designed for encapsulation of heat generating devices. It is also recommended for applications requiring a non-corrosive casting and coating. Electrically non-conductive. Good elongation strength. Moderate tear... [See More]

  • Cure / Technology: Two Component  
  • Chemical System: Silicone
  • Type: High Dielectric; Thermally Conductive
  • Thermal Conductivity: 0.8000
Encapsulants -- LOCTITE STYCAST E 2534 FR CAT 9
from Henkel Corporation - Industrial

LOCTITE STYCAST E 2534 FR CAT 9, Epoxy, Potting LOCTITE ® STYCAST E 2534 FR CAT 9 epoxy potting compound complies with recent demands on environmentally friendly products and does not contain brominated flame retardants. LOCTITE STYCAST E 2534 FR CAT 9 can be used with a variety of catalysts. [See More]

  • Cure / Technology: Two Component  
  • Chemical System: Epoxy
  • Type: Thermally Conductive
  • Use Temperature: 40 to 302
Encapsulants -- LOCTITE STYCAST EE 4215/HD 3561
from Henkel Corporation - Industrial

LOCTITE STYCAST EE 4215/HD 3561, Epoxy, Potting and Encapsulating. LOCTITE ® STYCAST EE 4215/HD 3561 is a filled system recommended for potting applications where rigid or flexible wire leads protrude directly from the encapsulation and where high impact strength is required. This system... [See More]

  • Cure / Technology: Two Component  
  • Chemical System: Epoxy
  • Type: Thermally Conductive
Encapsulants -- LOCTITE STYCAST ES 0626
from Henkel Corporation - Industrial

LOCTITE STYCAST ES 0626, Epoxy, Potting, Encapsulating. LOCTITE ® STYCAST ES 0626 is a two part, white epoxy casting system with low abrasion and rapid gel properties. Please refer to the TDS for alternate cure schedules. Two components - requires mixing [See More]

  • Cure / Technology: Two Component  
  • CTE: 51
  • Chemical System: Epoxy
  • Tensile (Break): 1091
Encapsulants -- LOCTITE STYCAST ES 2510
from Henkel Corporation - Industrial

LOCTITE STYCAST ES 2510, Epoxy, Dielectric Grade, Encapsulant and Potting. LOCTITE ® STYCAST ES 2510 is a dielectric grade epoxy encapsulant designed for general purpose applications. It is suitable for potting and encapsulating electrical devices that require flame retardancy. LOCTITE STYCAST... [See More]

  • Cure / Technology: Two Component  
  • Chemical System: Epoxy
  • Form / Function: Liquid
  • Features: UL Rating
Encapsulants -- LOCTITE STYCAST ES 6050
from Henkel Corporation - Industrial

LOCTITE STYCAST ES 6050, Two part, Low Volatile, Potting and Sealing. LOCTITE ® STYCAST ES 6050 is a two part, low volatile sealing and potting system. Resin and hardener are of different colors, yielding a third color when mixed. Please refer to the TDS for alternate cure schedules. Two... [See More]

  • Cure / Technology: Two Component  
  • Viscosity: 8000
  • Chemical System: Epoxy
Encapsulants -- LOCTITE STYCAST ES 6501
from Henkel Corporation - Industrial

LOCTITE STYCAST ES 6501, Epoxy, Encapsulation, Potting. LOCTITE ® STYCAST ES 6501 epoxy encapsulant is designed for general potting and encapsulation applications. Two components - requires mixing. Rigid. Low to medium viscosity [See More]

  • Cure / Technology: Two Component  
  • Thermal Conductivity: 0.4600
  • Chemical System: Epoxy
Encapsulants -- LOCTITE STYCAST S 5225
from Henkel Corporation - Industrial

LOCTITE STYCAST S 5225, Silicone, Potting, Encapsulating. LOCTITE ® STYCAST S 5225 liquid encapsulant is designed for use on small electronic devices requiring a low viscosity material capable of flowing throughout tightly packed components. LOCTITE STYCAST S 5225 features primerless adhesion... [See More]

  • Cure / Technology: Two Component  
  • Viscosity: 2230
  • Chemical System: Silicone
Encapsulants -- LOCTITE STYCAST U 2500 HTR
from Henkel Corporation - Industrial

LOCTITE STYCAST U 2500 HTR, Polyurethane, Potting, Encapsulant, Low Viscosity, Excellent Wetting. LOCTITE ® STYCAST U 2500 HTR flexible polyurethane encapsulant is formulated to have low viscosity and excellent wetting properties allowing complete impregnation of either small slightly wound... [See More]

  • Cure / Technology: Two Component  
  • Thermal Conductivity: 0.5000
  • Chemical System: Polyurethane
  • CTE: 74
Encapsulants -- LOCTITE STYCAST US 0152
from Henkel Corporation - Industrial

LOCTITE STYCAST US 0152, Urethane, Potting and Encapsulating. LOCTITE ® STYCAST US 0152 is an unfilled, low viscosity, reenterable potting and encapsulation compound. It has excellent low temperature properties and surface finish. This material can be used to encapsulate electronics for various... [See More]

  • Cure / Technology: Two Component  
  • Chemical System: Polyurethane
  • Form / Function: Liquid
  • Thermal Conductivity: 0.1700
Encapsulants -- LOCTITE STYCAST US 0155
from Henkel Corporation - Industrial

LOCTITE STYCAST US 0155, Urethane, Potting and Encapsulating. LOCTITE ® STYCAST US 0155 is a low viscosity, flexible, flame retardant, castor oil/MDI based urethane potting/encapsulating compound. This material was designed for potting indoor and outdoor telephone connector blocks. It is... [See More]

  • Cure / Technology: Two Component  
  • Form / Function: Liquid
  • Type: Thermally Conductive
  • Chemical System: Polyurethane
Encapsulants -- LOCTITE STYCAST US 5002
from Henkel Corporation - Industrial

LOCTITE STYCAST US 5002, Potting and Encapsulating. LOCTITE ® STYCAST US 5002 is formulated for high speed sealing and potting applications. Two components - requires mixing. Unfilled. Non-sag on mixing. Tack-free in only 1.5 hours [See More]

  • Cure / Technology: Two Component  
  • Chemical System: Polyurethane
  • Form / Function: Liquid
  • Viscosity: ? to 90000
Encapsulants -- LOCTITE UK 3182
from Henkel Corporation - Industrial

Polyurethane black hardener that when mixed with the appropriate resin forms a low-shrinkage, low-exotherm potting compound. LOCTITE ® UK 3182 is a black polyurethane resin that when mixed with LOCTITE UK 3173 polyurethane resin forms a low-shrinkage, low-exotherm potting compound. The two... [See More]

  • Cure / Technology: Two Component  
  • Chemical System: Polyurethane
Encapsulants -- LOCTITE UK 3364
from Henkel Corporation - Industrial

Rigid 2-part polyisocyanate urethane adhesive for use in fiber optic components. It is designed for flame resistance and fast cure. LOCTITE ® UK 3364 ™ is a black, rigid 2-part polyisocyanate urethane adhesive for use in fiber optic components. It is designed for flame resistance and fast... [See More]

  • Cure / Technology: Two Component  
  • Chemical System: Polyurethane
  • Form / Function: Liquid
  • Use Temperature: 200 to 240