Two Component System Encapsulants and Potting Compounds
from Master Bond, Inc.
MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing; Addition Cure
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid
- Type: High Dielectric; Optical; Thermally Conductive
- Chemical System: Silicone
from RS Components, Ltd.
Two Components Silicone Gel - 1 liter [See More]
- Cure / Technology: Two Component
- Industry: Insulation
- Form / Function: Bottle; Gel
from MacDermid Alpha Electronics Solutions
High-reliability, two-component polyurethane conformal coating for demanding applications. Product Overview. Electrolube ® 2K301P is a high-performance, two-component conformal coating specifically formulated for selective coating processes. It features increased coating thickness, enhanced... [See More]
- Cure / Technology: Two Component
- Form / Function: Encapsulant or Conformal Coating
- Type: Thermally Conductive
- Industry: Automotive; Electronics; Semiconductors, IC's
from CHT USA Inc.
CHT's QSil 12 is a 2-part, condensation cure, transparent, low viscosity, liquid silicone elastomer which cures at room temperature. QSil 12 is primarily intended for electronic and lighting potting applications. This material is typically mixed at a ratio of 100:5. Once mixed, the material is... [See More]
- Cure / Technology: Two Component ; Condensation
- Use Temperature: -67 to 399
- Industry: Automotive; Electronics
- Thermal Conductivity: 0.1800
from ELANTAS North America LLC
ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]
- Cure / Technology: Thermoset; Two Component
- Form / Function: Liquid
- Type: High Dielectric
- Chemical System: Epoxy
from Hernon Manufacturing, Inc.
Tuffbond ® 313 adhesive/sealant is a two component, 100% solid system, one to one ratio, room temperature cure system. Tuffbond ® 313 is recommended for bonding metals, wood, ceramics, etc., and can be used for potting and encapsulation of electrical and electronic components. [See More]
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Ceramic
- Form / Function: 50 ml (two component)
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
from Ellsworth Adhesives
3M Scotch-Weld DP270 Epoxy Adhesive Duo-Pak Black is a two-part epoxy adhesive. It is used for the potting and encapsulation of many heat sensitive or delicate components. It has good thermal shock resistance, long worklife, and excellent electrical properties. 400 mL Cartridge. [See More]
- Cure / Technology: Two Component
- Thermal Conductivity: 0.1770
- Chemical System: Epoxy
- Dielectric Strength: 850
from Master Bond, Inc.
MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]
- Cure / Technology: Thermoset; Two Component ; Addition Cure
- Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating
- Type: Electrically Conductive; Thermally Conductive
- Chemical System: Silicone
from CHT USA Inc.
CHT's QSil 58 is a 2-part, condensation cure, high temperature, self-leveling, silicone elastomer primarily used for electronic potting applications to provide protection from moisture, debris, vibration and shock. The two applicable catalysts are 0.5% DBT by weight and 10% Deep Section Catalyst by... [See More]
- Cure / Technology: Two Component ; Condensation
- Use Temperature: -65 to 500
- Industry: Automotive; Electronics
- Thermal Conductivity: 0.3100
from Hernon Manufacturing, Inc.
Tuffbond ® 316 is a two component, room temperature cure system. By changing the ratio of resin and hardener, the cured adhesive can change from a tough and flexible to a hard and rigid system. Tuffbond ® 316 is recommended for bonding metal, glass, wood, concrete, and rubber, and can be... [See More]
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Elastomeric
- Form / Function: 50 ml (two component)
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
from Ellsworth Adhesives
3M Scotch-Weld Epoxy Potting Compound/Adhesive DP270 Black is a two component, epoxy resin system that is used for sealing, encapsulating, and potting electronic and heat sensitive components. It offers low viscosity, long handling times, noncorrosive to copper, good electrical properties, and... [See More]
- Cure / Technology: Two Component
- Thermal Conductivity: 0.1770
- Chemical System: Epoxy
- Dielectric Strength: 850
from Master Bond, Inc.
Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Form / Function: Liquid; Encapsulant or Conformal Coating
- Type: High Dielectric; Thermal Insulation
- Chemical System: Epoxy
from CHT USA Inc.
CHT ’s TufGel 336 is a 2-part, tough, black silicone gel designed for electronic potting applications to provide protection from moisture, vibration and thermal or mechanical shock. TufGel 336 can also function as a contrast enhancement material in LED applications. TufGel 336 is also flame... [See More]
- Cure / Technology: Two Component ; Addition
- Chemical System: Silicone
- Form / Function: Gel
- Features: Flame Retardant
from Hernon Manufacturing, Inc.
Tuffbond ® 317 is a two component, room temperature cure system. By changing the ratio of resin and hardener, the cured adhesive can change from a tough and flexible to a hard and rigid system. The resin offers a unique combination of hardness and flexibility with high chemical and solvent... [See More]
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Elastomeric
- Form / Function: 50 ml (two component)
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
from Ellsworth Adhesives
3M Scotch-Weld Epoxy Potting Compound/Adhesive DP270 Clear is a two component, epoxy resin system that is used for sealing, encapsulating, and potting electronic and heat sensitive components. It offers low viscosity, long handling times, noncorrosive to copper, good electrical properties, and... [See More]
- Cure / Technology: Two Component
- Thermal Conductivity: 0.1770
- Chemical System: Epoxy
- Dielectric Strength: 850
from Master Bond, Inc.
EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
- Type: High Dielectric; Thermally Conductive
- Chemical System: Epoxy
from CHT USA Inc.
CHT's TufGel 330 is a 2-part, clear, tough, moderately cross-linked silicone gel. It has good room temperature cure adhesion to many substrates. TufGel 330 is used to provide protection from vibration and thermal or mechanical shock and will also provide excellent moisture protection. [See More]
- Cure / Technology: Two Component ; Addition
- Industry: Automotive; Electronics; OEM or Industrial
- Form / Function: Gel
- Use Temperature: -67 to 399
from Hernon Manufacturing, Inc.
Tuffbond ® 65891 is a two-component, room temperature cure system. Tuffbond ® 65891 is recommended for bonding metal, glass, wood, concrete, and rubber, and can be used for potting and encapsulation of electrical and electronic components. [See More]
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Elastomeric
- Form / Function: 50 ml (two component)
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
from Ellsworth Adhesives
Dow 3-4237 Dielectric Firm Gel Clear-Green is a two component, room temperature curing, silicone gel that is used for potting, sealing, encapsulating, and protecting electrical components from contaminants, moisture, and stress. It is durable, flexible, self healing, and offers long working times. [See More]
- Cure / Technology: Two Component
- Chemical System: Silicone
- Type: High Dielectric
- Industry: Electronics
from Master Bond, Inc.
EP40Med is a two component, room temperature curing epoxy with high elongation that passes ISO 10993-5 for cytotoxicity. It features exceptional adhesion to polycarbonates and acrylics. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
- Type: High Dielectric; Thermally Conductive
- Chemical System: Epoxy
from CHT USA Inc.
CHT's QSil 216 is a 2-part, platinum cure, optically clear silicone encapsulant designed for optical applications. QSil 216 features a 10:1 mix ratio by weight and its low viscosity profile enables excellent flow around components and is excellent for potting complex parts. The chemical composition... [See More]
- Cure / Technology: Two Component ; Addition
- Industry: Automotive; Electronics; OEM or Industrial
- Type: High Dielectric; Optical
- Use Temperature: -67 to 399
from Ellsworth Adhesives
Dow DOWSIL ™ 3-4150 Dielectric Gel Clear-Green is a two component, fast room temperature curing, silicone gel that is used for potting, sealing, encapsulating, and protecting a variety of materials in the electronics industry. It offers flexibility, stress relief, and offers excellent... [See More]
- Cure / Technology: Two Component
- Chemical System: Silicone
- Type: High Dielectric
- Dielectric Strength: 381
from Master Bond, Inc.
MasterSil 170 Gel is an addition cured, two component, low viscosity silicone material for specialty potting and encapsulation. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Form / Function: Liquid
- Type: High Dielectric; Optical; Thermally Conductive
- Chemical System: Silicone
from CHT USA Inc.
CHT's QGEl 311UV is a 2-part, platinum cure, special purpose silicone gel. It is designed with convenient 1:1 mix ratio, and low viscosity for easy dispensing. QGel 311UV is soft, but resilient and is amoderately cross-linked silicone polymer. QGel 311UV is clear but contains a UV tracer for easy QC... [See More]
- Cure / Technology: Two Component ; Addition
- Industry: Automotive; Electronics; OEM or Industrial
- Form / Function: Gel
- Use Temperature: -67 to 399
from Ellsworth Adhesives
Dow DOWSIL ™ 3-4155 HV Dielectric Gel Clear-Green is a two component, high viscosity, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. It cures quickly at room temperature, offers flexibility, thermal stability,... [See More]
- Cure / Technology: Two Component
- Chemical System: Silicone
- Type: High Dielectric
- Industry: Electric Power
from Master Bond, Inc.
Master Bond Polymer System EP39-2 is a fast curing, low viscosity, optically clear two component epoxy system for high performance bonding, sealing, coating and casting. It is 100% reactive and does not contain any diluents, solvents or other volatiles. The mix ratio is a convenient 2 to 1 by... [See More]
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Die Bonding Adhesives
- Composition: Unfilled
from CHT USA Inc.
CHT's QSil 563 is a 2-part, platinum cure, 100% silicone solids elastomer designed for electronic potting and encapsulation applications. QSil 562 offers a hard, low modulus material that is readily repairable. QSil 563 is thermally conductive to aid in efficient heat dissipation. This silicone... [See More]
- Cure / Technology: Two Component ; Addition
- Features: Flame Retardant; UL Rating
- Type: Thermally Conductive
- Industry: Automotive; Electronics
from Ellsworth Adhesives
Dow DOWSIL ™ 3-4207 Dielectric Tough Gel Clear-Green is a two component, room temperature curing, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. It is durable, fast curing, requires no primer, and has good... [See More]
- Cure / Technology: Two Component
- Chemical System: Silicone
- Type: High Dielectric
- Dielectric Strength: 425
from Master Bond, Inc.
Master Bond EP62-1 is a two component heat cured and chemically resistant epoxy resin system featuring a long pot life at ambient temperatures and efficient cures at moderately elevated temperatures. The recommended mix ratio is 100 parts of component A to 10 parts of component B. The pot life of... [See More]
- Cure / Technology: Thermoset; Two Component
- Industry: Marine; Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial; Semiconductors, IC's
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
- Use Temperature: -60 to 400
from CHT USA Inc.
CHT's SE3000 is a 2-part, platinum cure silicone elastomer designed for electronic potting and encapsulation applications. It offers good prtection against chemicals, environmental contamination, mechanical shock, vibration and impact damage. SE3000 can be used in applications where low flammability... [See More]
- Cure / Technology: Two Component ; Addition
- Features: Flame Retardant; UL Rating
- Type: Thermally Conductive
- Industry: Electronics
from Ellsworth Adhesives
Dow DOWSIL ™ 3-4207 Dielectric Tough Gel Clear-Green is a two component, room temperature curing, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. It is durable, fast curing, requires no primer, and has good... [See More]
- Cure / Technology: Two Component
- Chemical System: Silicone
- Type: High Dielectric
- Industry: Electronics
from Master Bond, Inc.
Master Bond Polymer System EP45HT is a two component epoxy system for high performance structural bonding and casting. It is suitable for applications where long term exposure to temperatures from -80 °F to +500 °F is required. lt is 100% reactive and does not contain any solvents or... [See More]
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Die Bonding Adhesives
- Composition: Unfilled
from CHT USA Inc.
CHT's QSil 553 is a 2-part, platinum cure, silicone potting compound and encapsulant designed to protect electronic components from harsh environmental conditions and shock and vibration. It features a low viscosity for convenient dispensing and will easily flow throughout components. Because of its... [See More]
- Cure / Technology: Two Component ; Addition
- Features: Flame Retardant; UL Rating
- Type: Thermally Conductive
- Industry: Automotive; Electronics; OEM or Industrial
from Ellsworth Adhesives
Dow DOWSIL ™ 3-4207 Dielectric Tough Gel Clear-Green is a two component, room temperature curing, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. It is durable, fast curing, requires no primer, and has good... [See More]
- Cure / Technology: Two Component
- Chemical System: Silicone
- Type: High Dielectric
- Industry: Electronics
from Master Bond, Inc.
Master Bond Polymer System 125 is a two component toughened epoxy resin for prolonged service above 500 °F with truly outstanding chemical resistance. High strength bonds serviceable up to 600 °F can be obtained with this exceptionally thermally stable and chemically resistant epoxy resin... [See More]
- Cure / Technology: Thermoset; Two Component
- Form / Function: Powder; Gap Filler, Foam in Place Gasket; Impregnating Resin; Die Bonding Adhesives
- Type: High Dielectric; Thermal Insulation
- Chemical System: Epoxy
from Ellsworth Adhesives
Dow DOWSIL ™ 3-4222 Dielectric Firm Gel Clear-Green is a two component, room temperature curing, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. It is durable, fast curing, requires no primer, and has excellent... [See More]
- Cure / Technology: Two Component
- Chemical System: Silicone
- Type: High Dielectric
- Dielectric Strength: 350
from Master Bond, Inc.
MasterSil 151TC is a highly flexible, temperature resistant two component silicone adhesive offering low thermal resistance and outstanding thermal conductivity. It was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid
- Type: High Dielectric; Thermally Conductive
- Chemical System: Silicone
from Ellsworth Adhesives
Dow DOWSIL ™ 3-4222 Dielectric Firm Gel Clear-Green is a two component, room temperature curing, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. It is durable, fast curing, requires no primer, and has excellent... [See More]
- Cure / Technology: Two Component
- Chemical System: Silicone
- Type: High Dielectric
- Industry: Electronics
from Master Bond, Inc.
Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. Not only is EP29LPSP able to function as an adhesive, sealant and protective coating at temperatures as low as 4K, but it is... [See More]
- Cure / Technology: Thermoset; Two Component
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
- Type: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding
- Chemical System: Epoxy
from Ellsworth Adhesives
Dow DOWSIL ™ 3-4222 Dielectric Firm Gel Clear-Green is a two component, room temperature curing, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. It is durable, fast curing, requires no primer, and has excellent... [See More]
- Cure / Technology: Two Component
- Chemical System: Silicone
- Type: High Dielectric
- Industry: Electronics
from Master Bond, Inc.
Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronicc/ structural applications. The two components are combined in a convenient noncritical mix... [See More]
- Cure / Technology: Thermoset; Two Component
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating; Impregnating Resin
- Type: High Dielectric; Optical; Thermal Insulation
- Chemical System: Epoxy
from Ellsworth Adhesives
Dow DOWSIL ™ 3-4241 Dielectric Tough Gel Clear-Green is a two component, heat curing, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. It is durable, fast curing, requires no primer, flame resistant, long working... [See More]
- Cure / Technology: Two Component
- Chemical System: Silicone
- Type: High Dielectric
- Dielectric Strength: 450
from Master Bond, Inc.
Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
- Type: High Dielectric; Optical; Thermally Conductive
- Chemical System: Epoxy
from Ellsworth Adhesives
Dow DOWSIL ™ 3-4241 Dielectric Tough Gel Clear-Green is a two component, heat curing, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. It is durable, fast curing, requires no primer, flame resistant, long working... [See More]
- Cure / Technology: Two Component
- Chemical System: Silicone
- Type: High Dielectric
- Industry: Electronics
from Master Bond, Inc.
Master Bond Polymer System EP38 is a fast curing, low viscosity, optically clear two component epoxy system for high performance coating, bonding and sealing. It is 100% reactive and does not contain any volatiles. The mix ratio is a convenient 3 to 1 by weight. EP38 is very fast curing. Coatings as... [See More]
- Cure / Technology: Thermoset; Two Component
- Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Die Bonding Adhesives
- Type: High Dielectric
- Chemical System: Epoxy
from Ellsworth Adhesives
Dow DOWSIL ™ 3-4680 Silicone Gel Clear-Blue is a two component, room temperature curing, low viscosity, dielectric gel that is used for potting, sealing, encapsulating, and protecting electrical components from contaminants, moisture, and stress. It is durable, flexible, and fast curing. 1:1... [See More]
- Cure / Technology: Two Component
- Dielectric Strength: 406
- Chemical System: Silicone
- Viscosity: 275
from Master Bond, Inc.
Master Bond EP30NS is a nano silica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically clear and meets NASA low outgassing specifications. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
- Type: High Dielectric; Optical; Thermally Conductive
- Chemical System: Epoxy
from Ellsworth Adhesives
Dow DOWSIL ™ 3-6121 Low Temperature Elastomer Clear is a two component, room to high temperature curing, silicone encapsulant that is used to protect electrical components from contaminants, moisture, and stress. It is fast curing, flowable, tear resistant, and has high tensile strength. 10:1... [See More]
- Cure / Technology: Two Component
- Thermal Conductivity: 0.1900
- Chemical System: Silicone
- Dielectric Strength: 450
from Master Bond, Inc.
EP42-2LV Black is a two component, room temperature curing epoxy compound featuring low viscosity and superior chemical resistance. It meets NASA low outgassing specifications, is black in color and optically opaque. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
- Type: High Dielectric; Thermally Conductive
- Chemical System: Epoxy
from Ellsworth Adhesives
Dow DOWSIL ™ 93-500 Thixotropic Space Grade Encapsulant and 93-500 Space Grade Encapsulant Clear are two component, silicone elastomers that are used for aerospace applications such as sealing optical sensors, encapsulating/potting electronic components, and bonding solar cells to substrates,... [See More]
- Cure / Technology: Two Component
- Thermal Conductivity: 0.2000
- Chemical System: Silicone
- Tensile (Break): 1225
from Master Bond, Inc.
Master Bond Polymer System EP76M is a two component, nickel filled, electrically conductive adhesive for high performance bonding, sealing, and coating formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part nickel conductive systems, EP76M... [See More]
- Cure / Technology: Thermoset; Two Component
- Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Die Bonding Adhesives
- Type: Anti-static, ESD; Electrically Conductive; EMI/RFI Shielding; Thermally Conductive
- Chemical System: Epoxy
from Ellsworth Adhesives
Dow DOWSIL ™ CY 52-276 Kit Clear is a two component, low volatility silicone gel that is used for protecting and sealing electronic devices from thermal shock, vibration, fuels, and solvents. with addition cure, It offers flexibility and a low temperature cure. 1:1 mix ratio. Part A, 1 kg... [See More]
- Cure / Technology: Two Component
- Dielectric Strength: 356
- Chemical System: Silicone
- Viscosity: 900 to 1200
from Master Bond, Inc.
Master Bond Polymer System EP30 is a low viscosity, two component epoxy adhesive for general purpose bonding, coating, sealing and casting formulated to cure at room temperature or more rapidly at elevated temperatures with a four (4) to one (1) mix ratio by weight. This adhesive is 100% reactive... [See More]
- Cure / Technology: Thermoset; Two Component
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
- Type: Optical; Thermal Insulation
- Chemical System: Epoxy
from Ellsworth Adhesives
Dow DOWSIL ™ CY 52-276 Kit Clear is a two component, low volatility silicone gel that is used for protecting and sealing electronic devices from thermal shock, vibration, fuels, and solvents. with addition cure, It offers flexibility and a low temperature cure. 1:1 mix ratio. Part B, 1 kg... [See More]
- Cure / Technology: Two Component
- Dielectric Strength: 356
- Chemical System: Silicone
- Viscosity: 900
from Master Bond, Inc.
Formulated to have special optical transmission properties, EP30-2LB is an optically clear epoxy that does not permit UV light transmission, but transmits well from 450-900 nm and above. It is a user friendly compound that has a non-critical ten to one mix ratio by weight. This system cures readily... [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
- Type: High Dielectric; Optical; Thermally Conductive
- Chemical System: Epoxy
from Ellsworth Adhesives
Dow DOWSIL ™ EE-1010 Low Viscosity Encapsulant is a two component, 1:1 mix ratio silicone elastomer for the electronics industry. Benefits include a room temperature cure that can be accelerated with heat, and a long working time. Part A and Part B are different colors for easy identification... [See More]
- Cure / Technology: Two Component
- Thermal Conductivity: 0.6000
- Chemical System: Silicone
- Dielectric Strength: 450
from Master Bond, Inc.
Formulated for thermal management applications, EP30TC is a two component epoxy that contains robust thermally conductive fillers with very fine particle sizes. It has thermal conductivity of 18-20 BTU •in/ft2 •hr • °F [2.60-2.88 W/(m •K)] and can be applied in sections as... [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
- Type: High Dielectric; Thermally Conductive
- Chemical System: Epoxy
from Ellsworth Adhesives
Dow DOWSIL ™ EE-3200 Low Stress Silicone Encapsulant is a two component, low viscosity encapsulant with a 1:1 mix ratio, good heat dissipation, and good thermal conductivity. Once thoroughly mixed, the mixture will cure to a flexible elastomer for the protection of electronic and electrical... [See More]
- Cure / Technology: Two Component
- Industry: Automotive; Electronics
- Chemical System: Silicone
- Thermal Conductivity: 0.5000
from Master Bond, Inc.
EP41S-5 is chemically resistant and withstands acids, bases, alcohols, fuels and many solvents. This two part epoxy is widely used for bonding, sealing, coating, and encapsulating. It provides high physical strength properties and electrical insulation values. EP41S-5 offers convenient handling with... [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Form / Function: Liquid; Encapsulant or Conformal Coating; Impregnating Resin
- Type: High Dielectric; Thermally Conductive
- Chemical System: Epoxy
from Ellsworth Adhesives
Dow DOWSIL ™ EE-3200 Low Stress Silicone Encapsulant is a two component, low viscosity encapsulant with a 1:1 mix ratio, good heat dissipation, and good thermal conductivity. Once thoroughly mixed, the mixture will cure to a flexible elastomer for the protection of electronic and electrical... [See More]
- Cure / Technology: Two Component
- Industry: Automotive; Electronics
- Chemical System: Silicone
- Thermal Conductivity: 0.5000
from Epoxy Technology
EPO-TEK ® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries. Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market... [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Form / Function: Liquid; Glob Top, Daub, Doming or Overfill
- Type: Optical
- Chemical System: Epoxy
from Techsil Limited
Techsil ® EP25485 is a low viscosity, thermally conductive flame retardant potting and encapsulating compound. The mixed system has a long usable life and may be hot or cold cured. The system exhibits a good surface finish, high electrical strength, high thermal conductivity and low cure... [See More]
- Cure / Technology: Two Component
- Form / Function: Liquid
- Type: Thermally Conductive
- Chemical System: Epoxy
from Henkel Corporation - Industrial
LOCTITE STYCAST 3103 BIPAX, Epoxy, Potting, Encapsulant LOCTITE ® STYCAST 3103 BIPAX epoxy casting compound is designed for use in applications where a combination of good mechanical, thermal and electrical insulating properties are required. LOCTITE STYCAST 3103 BIPAX passes cytotoxicity... [See More]
- Cure / Technology: Two Component
- Chemical System: Epoxy
from Protavic America, Inc.
PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]
- Cure / Technology: Thermoset; Two Component
- Form / Function: Liquid; Encapsulant or Conformal Coating; Die Bonding Adhesives
- Type: Electrically Conductive; Thermally Conductive
- Chemical System: Silicone
from Bluestar Silicones USA Corp.
Clear, Two-Component, Addition Cure, Heat Curing Electronic coating Silicone Compound. Properties. Viscosity 6000. Hardness Sha 30. Description. BLUESIL V-207 is a clear, two component, addition cure, heat curing silicone rubber compound. It is designed as a primerless coating and encapsulating... [See More]
- Cure / Technology: Thermoset; Two Component ; Reactive or Moisture Cured
- Chemical System: Silicone
- Form / Function: Liquid; Encapsulant or Conformal Coating
- Industry: Electronics
from Wacker Chemical Corp.
GENIOSIL® WP1 is a polyether-based silane-terminated polymer suitable asbinder in moisture curing formulations. It is a clear liquid with a slight but characteristic odor and differs to conventional silylated polymers due to its high reactivity. This is a direct consequence of the structural... [See More]
- Cure / Technology: Two Component
- Chemical System: Silicone
- Form / Function: Liquid
- Industry: Construction
from Sauereisen, Inc.
Sauereisen Cement No. 31 is a white, porcelain-like cement that is widely used throughout industry in a variety of applications. including assembling, sealing, insulating and cementing of ceramics, porcelain, metal, and glass. [See More]
- Cure / Technology: Two Component ; Chemically Set
- Form / Function: Powder; Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
- Type: High Dielectric; Thermally Conductive
- Chemical System: Ceramic
from Henkel Corporation - Electronics
HYSOL ® ES1000 ™ is a two-component, long pot life casting system with excellent handling properties. This material has good thermal shock resistance and low exotherm, making it suitable for encapsulation of various components and modules. [See More]
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
- Industry: Electronics
- Chemical System: Epoxy
- Use Temperature: -13 to 221
from ACCRAbond, Inc.
CONATHANE ® CE-1155 is a two-component, solvent-based polyurethane printed circuit board coating designed for use in adverse environments. CE-1155 provides outstanding resistance to moisture and good abrasion resistance. [See More]
- Cure / Technology: Two Component
- Chemical System: Polyurethane
- Form / Function: Encapsulant or Conformal Coating
- Features: Solvent Based
from Epoxies Etc...
20-3004 LV & HV are two component chemical resistance epoxy systems. They were developed for potting, coating, and adhesive applications requiring superior chemical resistance. They exhibit outstanding bonds to a variety of substrates. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Chemical System: Epoxy
- Form / Function: Gel
- Composition: Unfilled
from Hapco, Inc.
Flexible, colorless, potting and encapsulating systems. Available in 5 minute (-5), 16 minute, and 20 minute gel times, and in shore hardness ’s from 20 A to 80 A . [See More]
- Cure / Technology: Thermoset; Two Component
- Form / Function: Liquid
- Type: High Dielectric
- Industry: Electronics
from Henkel Corporation - Industrial
LOCTITE ECCOBOND EN 1350, Epoxy, Encapsulant. LOCTITE ® ECCOBOND EN 1350 encapsulant is designed for thermal sensor assembly applications. Non-conductive. Fast cure at low temperatures. Low temperature cure. High temperature resistance. Water resistant [See More]
- Cure / Technology: Two Component
- Chemical System: Epoxy
- Type: High Dielectric
- CTE: 15
from Protavic America, Inc.
The two component polyurethane compound described in this data sheet is specifically designed for the encapsulation by casting of completed circuit board. The cured material meets the flammability requirements of UL 94, V-O at thickness of 0.070 in. and greater (UL File Number E116296) and provides... [See More]
- Cure / Technology: Thermoset; Two Component
- Form / Function: Liquid; Encapsulant or Conformal Coating
- Type: High Dielectric; Thermal Insulation
- Chemical System: Polyurethane
from Wacker Chemical Corp.
GENIOSIL® XT 55 is a silicon reinforced polyetherbasedsilane-terminated polymer suitable as a binderin moisture curing formulations. It is a clear liquid witha slight but characteristic odor and differs toconventional silylated polymers due to its highreactivity. This is a direct consequence of... [See More]
- Cure / Technology: Two Component ; Reactive or Moisture Cured
- Chemical System: Silicone
- Form / Function: Liquid
- Industry: Construction
from Sauereisen, Inc.
ConoCrete - Fast Patch No. 149 is a three-component, fast setting epoxy monolithic that is designed for patching cracks and holes. This material is ideal for use on highways, bridge decks,. docks, ramps, traffic aisles, industrial floors and airport runways. Fast Patch No. 149 produces extremely... [See More]
- Cure / Technology: Thermoset; Two Component
- Chemical System: Epoxy
- Form / Function: Powder
- Composition: Unfilled
from Epoxies Etc...
10-3009 is a low viscosity epoxy adhesive and potting compound. It is easy to use and allows the end user to adjust the flexibility of the cured epoxy. This product offers a good combination of peel and tensile strength. 10-3009 provides electrical insulation and outstanding adhesion. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Form / Function: Liquid
- Type: High Dielectric; Thermal Insulation
- Chemical System: Epoxy
from Hapco, Inc.
Flexible, 45, 65 and, 95 shore A hardness, potting and encapsulating systems. Flame retardant (FR), accelerated 3 minute (-3) gel time, and black or unpigmented versions are available. [See More]
- Cure / Technology: Thermoset; Two Component
- Form / Function: Liquid
- Type: High Dielectric
- Features: Flame Retardant
from Henkel Corporation - Industrial
LOCTITE STYCAST 1264J, Epoxy, Slightly Flexible, Virtually Stress Free, Encapsulant, Potting. LOCTITE ® STYCAST 1264J Parts AB cures slightly flexible and virtually stress free. Some darkening of the cured material will occur after long exposure to temperatures above 65 ºC or after... [See More]
- Cure / Technology: Two Component
- Chemical System: Epoxy
- Form / Function: Liquid
- Use Temperature: 248
from Protavic America, Inc.
Amber epoxy system . Excellent for use in high heat (steam) and chemical environments. 2 hour gel time.Bonds well to metal, plastics and wood. High thermal shock resistance. Available in colors and higher or lower viscosities. Passes NASA outgassingrequirements. [See More]
- Cure / Technology: Thermoset; Two Component
- Form / Function: Liquid; Die Bonding Adhesives
- Type: High Dielectric
- Chemical System: Epoxy
from Wacker Chemical Corp.
WACKER SilGel ® 612 A/B is a pourable, additioncuring, RTV-2 silicone rubber that vulcanizes at room temperature to a very soft silicone gel. Special features. two-part, 1 : 1 mixing ratio. low viscosity. rapid heat cure. very low hardness (silicone gel). crystal clear. pronounced inherent tack. [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Form / Function: Liquid
- Type: Optical
- Chemical System: Silicone; Elastomeric
from Epoxies Etc...
The 50-2369FR Potting and Encapsulating Compound has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-2369 FR Urethane is listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low exotherm, and excellent electrical... [See More]
- Cure / Technology: Thermoset; Two Component
- Form / Function: Gel
- Type: Thermally Conductive
- Chemical System: Polyurethane
from Hapco, Inc.
Flexible, high strength, 50 to 71 shore D hardness potting and encapsulating systems. Available in flame retardant (FR), 3 minute (-3) gel time, and in black or unpigmented. [See More]
- Cure / Technology: Thermoset; Two Component
- Form / Function: Liquid
- Type: High Dielectric
- Features: Flame Retardant
from Henkel Corporation - Industrial
LOCTITE STYCAST 1265J, Epoxy, Encapsulant. LOCTITE ® STYCAST 1265J Parts AB is designed for embedding stress sensitive components or where inspections and repairs are desired. It can be cut easily for repairing and replacing components. Fresh material can be poured and then cured to form a... [See More]
- Cure / Technology: Two Component
- Chemical System: Epoxy
- Type: High Dielectric
- Use Temperature: 40 to 149
from Protavic America, Inc.
ANA-97290 is a clear Ultraviolet/ Visible light curing adhesive. It has very low shrinkage during cure for alignment sensitive parts. It is recommended for small electrical/electronic casting and encapsulating applications that require a unique combination of excellent wetting, flow, good thermal... [See More]
- Cure / Technology: Thermoset; Two Component ; UV or Radiation Cured
- Form / Function: Liquid; Encapsulant or Conformal Coating; Gel (optional feature); Die Bonding Adhesives
- Type: Electrically Conductive; Thermal Insulation
- Composition: Unfilled
from Epoxies Etc...
50-3150 FR has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-3150 FR Black Epoxy with Catalyst 190 and Catalyst 105 are listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low shrinkage, and outstanding insulation... [See More]
- Cure / Technology: Thermoset; Two Component ; Room Temperature Vulcanizing or Curing
- Form / Function: Liquid
- Type: Thermally Conductive
- Chemical System: Epoxy
from Hapco, Inc.
Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E products are flame... [See More]
- Cure / Technology: Thermoset; Two Component
- Form / Function: Liquid
- Type: High Dielectric; Thermally Conductive
- Features: Flame Retardant; UL Rating
from Henkel Corporation - Industrial
LOCTITE STYCAST 2651, Dielectric Grade, Epoxy, Encapsulant LOCTITE ® STYCAST 2651 is a dielectric grade epoxy encapsulant designed for general purpose applications and has excellent adhesion to a wide variety of substrates. LOCTITE STYCAST 2651 can be used with a variety of catalysts. For more... [See More]
- Cure / Technology: Two Component
- CTE: 68
- Chemical System: Epoxy
- Viscosity: 225000
from Protavic America, Inc.
PNU-56200 ™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term circuit protection and... [See More]
- Cure / Technology: Thermoset; Two Component
- Form / Function: Liquid; Encapsulant or Conformal Coating; Die Bonding Adhesives
- Type: High Dielectric
- Chemical System: Polyurethane
from Hapco, Inc.
High performance, flexible potting systems designed to be in constant water immersion while maintaining electrical and physical properties. DI-PAK E-4888 & E-4889 were designed to meet Naval underwater applications. [See More]
- Cure / Technology: Thermoset; Two Component
- Form / Function: Liquid
- Type: High Dielectric
- Industry: Electronics
from Henkel Corporation - Industrial
LOCTITE STYCAST 2651-40 W1, Epoxy, Potting, Encapsulant LOCTITE ® STYCAST 2651-40 W1 epoxy encapsulant is designed for general purpose applications and has excellent adhesion to a wide variety of substrates. When fully cured, the material is readily machined with carbide tools. LOCTITE STYCAST... [See More]
- Cure / Technology: Two Component
- Viscosity: 33000
- Chemical System: Epoxy
from Hapco, Inc.
Low cost, easy to use, potting compounds with fast cycle times. Available in 3 speeds. [See More]
- Cure / Technology: Thermoset; Two Component
- Form / Function: Liquid
- Type: High Dielectric
- Industry: Electronics
from Henkel Corporation - Industrial
LOCTITE STYCAST 2741, Epoxy, Encapsulant. LOCTITE ® STYCAST 2741 is designed for electronic embedment and in sealing or cementing of metals, ceramics and plastics. The hardness can be adjusted by varying the amount of LOCTITE CAT 15 used. The technical information shown on this page reflects the... [See More]
- Cure / Technology: Two Component
- Use Temperature: 67 to 176
- Chemical System: Epoxy
- Thermal Conductivity: 0.3500
from Hapco, Inc.
DI-COAT R-4721 / DI-COAT R-4721 LV (lower viscosity). Shore 90 D, room temperature curing, medium to high thixotropic coating for dielectric insulating applications. DI-COAT R-4721 is ideal for use on vertical or sloping surfaces where flow or drain-off cannot be tolerated. DI-COAT R-4721 is easy to... [See More]
- Cure / Technology: Thermoset; Two Component
- Form / Function: Liquid
- Type: High Dielectric
- Industry: Electronics
from Henkel Corporation - Industrial
LOCTITE STYCAST 2762FT, Epoxy, High Temperature Resistance, High Thermal Conductivity, Potting, Encapsulant LOCTITE ® STYCAST 2762FT epoxy encapsulant is designed for potting electronic components exposed to harsh environments. This material is also ideal for large and complex castings that... [See More]
- Cure / Technology: Two Component
- Chemical System: Epoxy
- Type: Thermally Conductive
- Viscosity: 25000
from Hapco, Inc.
Filter-bond ™ is a series of casting and potting compounds ideally suited for potting, sealing, and bonding filtration and ultrafiltration products. The Filter-bond ™ E-Series is manufactured to ultra-high quality standards and has been used by customers to pass FDA approval. Filter-bond... [See More]
- Cure / Technology: Two Component
- Chemical System: Elastomeric; Polyurethane
- Form / Function: Liquid
- Features: Flexible
from Henkel Corporation - Industrial
LOCTITE STYCAST 2850FTJ, Epoxy, Encapsulant. LOCTITE ® STYCAST 2850FTJ epoxy encapsulant is designed for use in high voltage applications where surface arcing or tracking is a concern. LOCTITE STYCAST 2850FTJ is recommended for encapsulation of components that require heat dissipation and... [See More]
- Cure / Technology: Two Component
- Chemical System: Epoxy
- Type: Thermally Conductive
- Viscosity: 225000
from Henkel Corporation - Industrial
LOCTITE STYCAST 2850KT CAT 24LV, Epoxy, Encapsulant LOCTITE ® STYCAST 2850KT CAT 24LV epoxy encapsulant is designed for heat sink replacement in non-integrated electrical components and assemblies. It is also recommended for use in high voltage applications where surface arching or tracking is a... [See More]
- Cure / Technology: Two Component
- Chemical System: Epoxy
- Type: Thermally Conductive
- Use Temperature: 85 to 221
from Henkel Corporation - Industrial
LOCTITE STYCAST 4640, Silicone, Flexible, Potting or Encapsulant LOCTITE ® STYCAST 4640 RTV condensation cure silicone rubber syntactic foam is engineered to yield a flexible, low density material with a low dielectric constant and dissipation factor. It is designed for airborne potting, sealing... [See More]
- Cure / Technology: Two Component
- Chemical System: Silicone
- Form / Function: Liquid
- Use Temperature: 85 to 500
from Henkel Corporation - Industrial
LOCTITE STYCAST 5952-1, Silicone, Potting or Encapsulant. LOCTITE ® STYCAST 5952-1 is designed for encapsulation of heat generating devices. It is also recommended for applications requiring a non-corrosive casting and coating. Electrically non-conductive. Good elongation strength. Moderate tear... [See More]
- Cure / Technology: Two Component
- Chemical System: Silicone
- Type: High Dielectric; Thermally Conductive
- Thermal Conductivity: 0.8000
from Henkel Corporation - Industrial
LOCTITE STYCAST E 2534 FR CAT 9, Epoxy, Potting LOCTITE ® STYCAST E 2534 FR CAT 9 epoxy potting compound complies with recent demands on environmentally friendly products and does not contain brominated flame retardants. LOCTITE STYCAST E 2534 FR CAT 9 can be used with a variety of catalysts. [See More]
- Cure / Technology: Two Component
- Chemical System: Epoxy
- Type: Thermally Conductive
- Use Temperature: 40 to 302
from Henkel Corporation - Industrial
LOCTITE STYCAST EE 4215/HD 3561, Epoxy, Potting and Encapsulating. LOCTITE ® STYCAST EE 4215/HD 3561 is a filled system recommended for potting applications where rigid or flexible wire leads protrude directly from the encapsulation and where high impact strength is required. This system... [See More]
- Cure / Technology: Two Component
- Chemical System: Epoxy
- Type: Thermally Conductive
from Henkel Corporation - Industrial
LOCTITE STYCAST ES 0626, Epoxy, Potting, Encapsulating. LOCTITE ® STYCAST ES 0626 is a two part, white epoxy casting system with low abrasion and rapid gel properties. Please refer to the TDS for alternate cure schedules. Two components - requires mixing [See More]
- Cure / Technology: Two Component
- CTE: 51
- Chemical System: Epoxy
- Tensile (Break): 1091
from Henkel Corporation - Industrial
LOCTITE STYCAST ES 2510, Epoxy, Dielectric Grade, Encapsulant and Potting. LOCTITE ® STYCAST ES 2510 is a dielectric grade epoxy encapsulant designed for general purpose applications. It is suitable for potting and encapsulating electrical devices that require flame retardancy. LOCTITE STYCAST... [See More]
- Cure / Technology: Two Component
- Chemical System: Epoxy
- Form / Function: Liquid
- Features: UL Rating
from Henkel Corporation - Industrial
LOCTITE STYCAST ES 6050, Two part, Low Volatile, Potting and Sealing. LOCTITE ® STYCAST ES 6050 is a two part, low volatile sealing and potting system. Resin and hardener are of different colors, yielding a third color when mixed. Please refer to the TDS for alternate cure schedules. Two... [See More]
- Cure / Technology: Two Component
- Viscosity: 8000
- Chemical System: Epoxy
from Henkel Corporation - Industrial
LOCTITE STYCAST ES 6501, Epoxy, Encapsulation, Potting. LOCTITE ® STYCAST ES 6501 epoxy encapsulant is designed for general potting and encapsulation applications. Two components - requires mixing. Rigid. Low to medium viscosity [See More]
- Cure / Technology: Two Component
- Thermal Conductivity: 0.4600
- Chemical System: Epoxy
from Henkel Corporation - Industrial
LOCTITE STYCAST S 5225, Silicone, Potting, Encapsulating. LOCTITE ® STYCAST S 5225 liquid encapsulant is designed for use on small electronic devices requiring a low viscosity material capable of flowing throughout tightly packed components. LOCTITE STYCAST S 5225 features primerless adhesion... [See More]
- Cure / Technology: Two Component
- Viscosity: 2230
- Chemical System: Silicone
from Henkel Corporation - Industrial
LOCTITE STYCAST U 2500 HTR, Polyurethane, Potting, Encapsulant, Low Viscosity, Excellent Wetting. LOCTITE ® STYCAST U 2500 HTR flexible polyurethane encapsulant is formulated to have low viscosity and excellent wetting properties allowing complete impregnation of either small slightly wound... [See More]
- Cure / Technology: Two Component
- Thermal Conductivity: 0.5000
- Chemical System: Polyurethane
- CTE: 74
from Henkel Corporation - Industrial
LOCTITE STYCAST US 0152, Urethane, Potting and Encapsulating. LOCTITE ® STYCAST US 0152 is an unfilled, low viscosity, reenterable potting and encapsulation compound. It has excellent low temperature properties and surface finish. This material can be used to encapsulate electronics for various... [See More]
- Cure / Technology: Two Component
- Chemical System: Polyurethane
- Form / Function: Liquid
- Thermal Conductivity: 0.1700
from Henkel Corporation - Industrial
LOCTITE STYCAST US 0155, Urethane, Potting and Encapsulating. LOCTITE ® STYCAST US 0155 is a low viscosity, flexible, flame retardant, castor oil/MDI based urethane potting/encapsulating compound. This material was designed for potting indoor and outdoor telephone connector blocks. It is... [See More]
- Cure / Technology: Two Component
- Form / Function: Liquid
- Type: Thermally Conductive
- Chemical System: Polyurethane