Electrical Power / HV (Coils, Motors) Encapsulants and Potting Compounds

ELAN-Cast® -- E 2154 Black Resin / C 2154 Hardener
from ELANTAS PDG, Inc.

ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire... [See More]

  • Industry: Electric Power; OEM or Industrial
  • Form / Function: Liquid
  • Type: High Dielectric
  • Chemical System: Epoxy
Addition Cured Silicone is Optically Clear with Enhanced Low Temperature Serviceability -- MasterSil 157
from Master Bond, Inc.

MasterSil 157 is a two part system for potting, encapsulation and sealing applications. This optically clear formulation features a low index of refraction and excellent light transmittance. Highly flexible, it is capable of withstanding the most rigorous thermal cycling and mechanical shock. These... [See More]

  • Industry: Marine; Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid
  • Type: High Dielectric; Optical; Thermally Conductive
  • Chemical System: Silicone
Dow DOWSIL™ 3-4155 HV Dielectric Gel Green 36.2 kg Kit -- 3-4155 HV GEL 36.2KG KIT [2866480 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow DOWSIL ™ 3-4155 HV Dielectric Gel Clear-Green is a two component, high viscosity, silicone gel that is used for electrical insulation and protecting electrical components from contaminants, moisture, and stress. It cures quickly at room temperature, offers flexibility, thermal stability,... [See More]

  • Industry: Electric Power
  • Chemical System: Silicone
  • Type: High Dielectric
  • Cure / Technology: Two Component  
B-Staged Epoxy Meets Airbus Standards for Flame Retardancy & Toxicity -- EP36FR
from Master Bond, Inc.

EP36FR is a one component, high performance epoxy that meets the Airbus standards from ABD0031, Issue F, June 8, 2005 for flame retardancy. It is used in all kinds of aircraft applications where protection is needed from flames, smoke and materials that might burn. [See More]

  • Industry: Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's; Aerospace
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
Dow SYLGARD™ 160 Silicone Encapsulant Gray 210 mL Kit -- 160 A/B 210ML KIT [4026218 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow SYLGARD ™ 160 Silicone Elastomer is a two component, room temperature or heat curing encapsulant that is used for general potting applications of power supplies. It has good flowability, moderate thermal conductivity, and flame resistance. 1:1 mix ratio. 210 mL Cartridge. [See More]

  • Industry: Electric Power
  • Cure / Technology: Two Component  
  • Chemical System: Silicone
  • Thermal Conductivity: 0.6200
Dual Curing, Thixotropic Adhesive -- UV22DC80-10F
from Master Bond, Inc.

One part, nanosilica filled UV22DC80-10F has the ability to cure in shadowed out areas. It features a UV and heat curing mechanism. Some noteworthy properties include optical clarity, excellent dimensional stability and outstanding physical strength. [See More]

  • Industry: Marine; Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
  • Form / Function: Liquid; Encapsulant or Conformal Coating; Glob Top, Daub, Doming or Overfill
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: UV Curing
Dow SYLGARD™ 160 Silicone Encapsulant Part A Gray 226.7 kg Pail -- 160 SIL ELAST PT A 226.7KG [2417600 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow SYLGARD ™ 160 Silicone Elastomer is a two component, room temperature or heat curing encapsulant that is used for general potting applications of power supplies. It has good flowability, moderate thermal conductivity, and flame resistance. 1:1 mix ratio. Part A, 226.7 kg Pail. [See More]

  • Industry: Electric Power
  • Cure / Technology: Two Component  
  • Chemical System: Silicone
  • Thermal Conductivity: 0.6200
Electrically and Thermally Conductive, Two Part Silicone Meets NASA Low Outgassing Specifications -- MasterSil 973S-LO
from Master Bond, Inc.

MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]

  • Industry: Marine; Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial; Semiconductors, IC's
  • Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating
  • Type: Electrically Conductive; Thermally Conductive
  • Chemical System: Silicone
Dow SYLGARD™ 160 Silicone Encapsulant Part A Gray 24.9 kg Pail -- 160 SIL ELAST PT A 24.9KG [2468531 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow SYLGARD ™ 160 Silicone Elastomer is a two component, room temperature or heat curing encapsulant that is used for general potting applications of power supplies. It has good flowability, moderate thermal conductivity, and flame resistance. 1:1 mix ratio. Part A, 24.9 kg Pail. [See More]

  • Industry: Electric Power
  • Cure / Technology: Two Component  
  • Chemical System: Silicone
  • Thermal Conductivity: 0.6200
Electrically Conductive Die Attach Adhesive Has Very High Thermal Conductivity -- EP3HTSDA-1
from Master Bond, Inc.

EP3HTSDA-1 is a one part, highly electrically conductive epoxy designed for die attach applications. It dispenses smoothly and easily, without tailing. Its easy handling and desirable performance properties, such as thermal conductivity, die shear strength and dimensional stability, allow it to be... [See More]

  • Industry: Marine; Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
Dow SYLGARD™ 160 Silicone Encapsulant Part A Gray 5.4 kg Pail -- 160 SIL ELAST PT A 5.4KG [3088111 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow SYLGARD ™ 160 Silicone Elastomer is a two component, room temperature or heat curing encapsulant that is used for general potting applications of power supplies. It has good flowability, moderate thermal conductivity, and flame resistance. 1:1 mix ratio. Part A, 5.4 kg Pail. [See More]

  • Industry: Electric Power
  • Cure / Technology: Two Component  
  • Chemical System: Silicone
  • Thermal Conductivity: 0.6200
Electrically Conductive Die Attach Epoxy With High Glass Transition Temperature -- EP17HTS-DA
from Master Bond, Inc.

Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]

  • Industry: Marine; Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
  • Type: Electrically Conductive; Thermally Conductive
  • Chemical System: Polyphenylene Sulfide; Epoxy
Dow SYLGARD™ 160 Silicone Encapsulant Part B Off-White 226.7 kg Pail -- 160 SIL ELAST PT B 226.7KG [2417618 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow SYLGARD ™ 160 Silicone Elastomer is a two component, room temperature or heat curing encapsulant that is used for general potting applications of power supplies. It has good flowability, moderate thermal conductivity, and flame resistance. 1:1 mix ratio. Part B, 226.7 kg Pail. [See More]

  • Industry: Electric Power
  • Cure / Technology: Two Component  
  • Chemical System: Silicone
  • Thermal Conductivity: 0.6200
Epoxy Features Very Low Coefficient of Thermal Expansion -- EP30LTE-2
from Master Bond, Inc.

Master Bond EP30LTE-2 is a two part epoxy with an extraordinarily low coefficient of thermal expansion (CTE).It is used for bonding, sealing, coating and encapsulating. [See More]

  • Industry: Marine; Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
  • Form / Function: Liquid; Encapsulant or Conformal Coating
  • Type: High Dielectric; Thermal Insulation
  • Chemical System: Epoxy
Dow SYLGARD™ 160 Silicone Encapsulant Part B Off-White 24.9 kg Pail -- 160 SIL ELAST PT B 24.9KG [2468549 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow SYLGARD ™ 160 Silicone Elastomer is a two component, room temperature or heat curing encapsulant that is used for general potting applications of power supplies. It has good flowability, moderate thermal conductivity, and flame resistance. 1:1 mix ratio. Part B, 24.9 kg Pail. [See More]

  • Industry: Electric Power
  • Cure / Technology: Two Component  
  • Chemical System: Silicone
  • Thermal Conductivity: 0.6200
Epoxy Meets Airbus Standards for Flame Retardancy, Smoke and Gas Emissions -- EP93FRHT
from Master Bond, Inc.

EP93FRHT is a two component epoxy that readily passes the Airbus specifications for flame resistance, smoke emission and toxic gas emission as listed under ABD 0031, Issue F. These tests focus on how quickly this adhesive will self extinguish when subjected to a vertical burn test, optical density... [See More]

  • Industry: Marine; Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
Dow SYLGARD™ 160 Silicone Encapsulant Part B Off-White 5.4 kg Pail -- 160 SIL ELAST PT B 5.4KG [3088120 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow SYLGARD ™ 160 Silicone Elastomer is a two component, room temperature or heat curing encapsulant that is used for general potting applications of power supplies. It has good flowability, moderate thermal conductivity, and flame resistance. 1:1 mix ratio. Part B, 5.4 kg Pail. [See More]

  • Industry: Electric Power
  • Cure / Technology: Two Component  
  • Chemical System: Silicone
  • Thermal Conductivity: 0.6200
Fast Curing, Optically Clear, Two Part Epoxy -- EP39-2
from Master Bond, Inc.

Master Bond Polymer System EP39-2 is a fast curing, low viscosity, optically clear two component epoxy system for high performance bonding, sealing, coating and casting. It is 100% reactive and does not contain any diluents, solvents or other volatiles. The mix ratio is a convenient 2 to 1 by... [See More]

  • Industry: Marine; Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Die Bonding Adhesives
  • Composition: Unfilled
Dow SYLGARD™ 164 Silicone Encapsulant Gray 210 mL Kit -- 164 SIL ELAST KIT 210ML [4028273 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow SYLGARD ™ 164 Silicone Elastomer Gray is a two component, room temperature and heat curing, encapsulant that is used as a protective coating for electrical applications such as power supplies, transformers, sensors, amplifiers, and connectors. It provides good flowability, thermal... [See More]

  • Industry: Electric Power
  • Cure / Technology: Two Component  
  • Chemical System: Silicone
  • Thermal Conductivity: 0.6400
High Glass Transition Temperature Epoxy System -- EP62-1
from Master Bond, Inc.

Master Bond EP62-1 is a two component heat cured and chemically resistant epoxy resin system featuring a long pot life at ambient temperatures and efficient cures at moderately elevated temperatures. The reccommended mix ratio is 100 parts of component A to 10 parts of component B. The pot life of... [See More]

  • Industry: Marine; Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial; Semiconductors, IC's
  • Cure / Technology: Thermoset; Two Component  
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Use Temperature: -60 to 400
Dow SYLGARD™ 164 Silicone Encapsulant Part A Gray 24.9 kg Pail -- 164 SIL ELAST PT A 24.9KG [4013032 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow SYLGARD ™ 164 Silicone Elastomer Gray is a two component, room temperature and heat curing, encapsulant that is used as a protective coating for electrical applications such as power supplies, transformers, sensors, amplifiers, and connectors. It provides good flowability, thermal... [See More]

  • Industry: Electric Power
  • Cure / Technology: Two Component  
  • Chemical System: Silicone
  • Thermal Conductivity: 0.6400
High Temperature Resistant Epoxy Compound -- EP45HT
from Master Bond, Inc.

Master Bond Polymer System EP45HT is a two component epoxy system for high performance structural bonding and casting. It is suitable for applications where long term exposure to temperatures from -80 °F to +500 °F is required. lt is 100% reactive and does not contain any solvents or... [See More]

  • Industry: Marine; Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial; Semiconductors, IC's
  • Chemical System: Epoxy
  • Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Die Bonding Adhesives
  • Composition: Unfilled
Dow SYLGARD™ 164 Silicone Encapsulant Part B Off-White 24.9 kg Pail -- 164 SIL ELAST PT B 24.9KG [4013034 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow SYLGARD ™ 164 Silicone Elastomer Gray is a two component, room temperature and heat curing, encapsulant that is used as a protective coating for electrical applications such as power supplies, transformers, sensors, amplifiers, and connectors. It provides good flowability, thermal... [See More]

  • Industry: Electric Power
  • Cure / Technology: Two Component  
  • Chemical System: Silicone
  • Thermal Conductivity: 0.6400
High Temperature Resistant, One Component Epoxy System -- EP13
from Master Bond, Inc.

Master Bond Polymer System EP13 is a one component heat curing epoxy featuring high shear strength and very high temperature resistance. This one component system is formulated to cure at temperatures from 300 °F to 350 °F for 60-90 minutes. Upon cure, EP13 readily attains tensile shear... [See More]

  • Industry: Marine; Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Semiconductors, IC's
  • Form / Function: Encapsulant or Conformal Coating; Die Bonding Adhesives
  • Type: High Dielectric
  • Chemical System: Epoxy
Dow SYLGARD™ 170 Fast Cure Silicone Encapsulant Black 210 mL Kit -- 170 FAST CURE A/B 210ML KT [4026167 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow SYLGARD ™ 170 Fast Cure Silicone Elastomer Black is a two component, room temperature and heat curing, encapsulant that is used as a protective coating for electrical applications such as power supplies, transformers, sensors, amplifiers, and connectors. It provides good flowability,... [See More]

  • Industry: Electric Power
  • Cure / Technology: Two Component  
  • Chemical System: Silicone
  • Thermal Conductivity: 0.4000
High Temperature Resistant, Toughened Epoxy -- EP125
from Master Bond, Inc.

Master Bond Polymer System 125 is a two component toughened epoxy resin for prolonged service above 500 °F with truly outstanding chemical resistance. High strength bonds serviceable up to 600 °F can be obtained with this exceptionally thermally stable and chemically resistant epoxy resin... [See More]

  • Industry: Marine; Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
  • Form / Function: Powder; Gap Filler, Foam in Place Gasket; Impregnating Resin; Die Bonding Adhesives
  • Type: High Dielectric; Thermal Insulation
  • Chemical System: Epoxy
Dow SYLGARD™ 170 Fast Cure Silicone Encapsulant Part A Black 22.6 kg Pail -- 170 FAST CURE A 22.6KG [3144712 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow SYLGARD ™ 170 Fast Cure Silicone Elastomer is a two component, room temperature and heat curing, encapsulant that is used as a protective coating for electrical applications such as power supplies, transformers, sensors, amplifiers, and connectors. It provides good flowability, moderate... [See More]

  • Industry: Electric Power
  • Cure / Technology: Two Component  
  • Chemical System: Silicone
  • Thermal Conductivity: 0.4000
Highly Flexible Addition Cured Silicone Offers Low Thermal Resistance -- MasterSil 151TC
from Master Bond, Inc.

MasterSil 151TC is a highly flexible, temperature resistant two component silicone adhesive offering low thermal resistance and outstanding thermal conductivity. It was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. [See More]

  • Industry: Marine; Sanitary; Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Silicone
Dow SYLGARD™ 170 Fast Cure Silicone Encapsulant Part B Off-White 22.6 kg Pail -- 170 FAST CURE B 22.6KG [3144721 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow SYLGARD ™ 170 Fast Cure Silicone Elastomer is a two component, room temperature and heat curing, encapsulant that is used as a protective coating for electrical applications such as power supplies, transformers, sensors, amplifiers, and connectors. It provides good flowability, moderate... [See More]

  • Industry: Electric Power
  • Cure / Technology: Two Component  
  • Chemical System: Silicone
  • Thermal Conductivity: 0.4000
Low Outgassing, Optically Clear Two Component Epoxy -- EP29LPSP
from Master Bond, Inc.

Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. Not only is EP29LPSP able to function as an adhesive, sealant and protective coating at temperatures as low as 4K, but it is... [See More]

  • Industry: Marine; Aerospace; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Type: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding
  • Chemical System: Epoxy
Dow SYLGARD™ 170 Silicone Encapsulant Part A Black 22.6 kg Pail -- 170 SIL ELAST PT A 22.6KG [1706951 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow SYLGARD ™ 170 Silicone Elastomer is a two component, room temperature and heat curing, encapsulant that is used as a protective coating for electrical applications such as power supplies, transformers, sensors, amplifiers, and connectors. It provides good flowability, moderate thermal... [See More]

  • Industry: Electric Power
  • Cure / Technology: Two Component  
  • Chemical System: Silicone
  • Thermal Conductivity: 0.3900
Low Viscosity Structural Epoxy Adhesive System -- EP112
from Master Bond, Inc.

Master Bond Polymer System EP112 is a solventless, low viscosity two component cycloaliphatic epoxy resin system which is specifically designed for high performance outdoor and indoor electrical/electronic/ structural applications. The two components are combined in a convenient noncritical mix... [See More]

  • Industry: Marine; Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating; Impregnating Resin
  • Type: High Dielectric; Optical; Thermal Insulation
  • Chemical System: Epoxy
Dow SYLGARD™ 170 Silicone Encapsulant Part A Black 4.9 kg Pail -- 170 SIL ELAST PT A 4.9KG [3120414 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow SYLGARD ™ 170 Silicone Elastomer is a two component, room temperature and heat curing, encapsulant that is used as a protective coating for electrical applications such as power supplies, transformers, sensors, amplifiers, and connectors. It provides good flowability, moderate thermal... [See More]

  • Industry: Electric Power
  • Cure / Technology: Two Component  
  • Chemical System: Silicone
  • Thermal Conductivity: 0.3900
Low Viscosity, Electrically Insulating Epoxy Features Excellent Optical Clarity -- EP30LP-2
from Master Bond, Inc.

Two component, EP30LP-2 produces high strength, rigid bonds with exceptionally low linear shrinkage for bonding, sealing, coating, and encapsulation applications. This system is very resistant to chemicals including water, oils, solvents, acids and bases. [See More]

  • Industry: Marine; Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Type: High Dielectric; Optical; Thermally Conductive
  • Chemical System: Epoxy
Dow SYLGARD™ 170 Silicone Encapsulant Part B Off-White 22.6 kg Pail -- 170 SIL ELAST PT B 22.6KG [1706977 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow SYLGARD ™ 170 Silicone Elastomer is a two component, room temperature and heat curing, encapsulant that is used as a protective coating for electrical applications such as power supplies, transformers, sensors, amplifiers, and connectors. It provides good flowability, moderate thermal... [See More]

  • Industry: Electric Power
  • Cure / Technology: Two Component  
  • Chemical System: Silicone
  • Thermal Conductivity: 0.3900
Low Viscosity, Fast Curing, Two Component Epoxy -- EP38
from Master Bond, Inc.

Master Bond Polymer System EP38 is a fast curing, low viscosity, optically clear two component epoxy system for high performance coating, bonding and sealing. It is 100% reactive and does not contain any volatiles. The mix ratio is a convenient 3 to 1 by weight. EP38 is very fast curing. Coatings as... [See More]

  • Industry: Marine; Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Die Bonding Adhesives
  • Type: High Dielectric
  • Chemical System: Epoxy
Dow SYLGARD™ 170 Silicone Encapsulant Part B Off-White 4.9 kg Pail -- 170 SIL ELAST PT B 4.9KG [3120422 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow SYLGARD ™ 170 Silicone Elastomer is a two component, room temperature and heat curing, encapsulant that is used as a protective coating for electrical applications such as power supplies, transformers, sensors, amplifiers, and connectors. It provides good flowability, moderate thermal... [See More]

  • Industry: Electric Power
  • Cure / Technology: Two Component  
  • Chemical System: Silicone
  • Thermal Conductivity: 0.3900
Moderate Viscosity Thermally Conductive Epoxy -- EP112AO
from Master Bond, Inc.

Master Bond Polymer System EP112AO is a solventless, moderate viscosity two component epoxy resin system which is specifically designed for high performance outdoor and indoor electrical and electronic applications where good thermal conductivity and electrial isolation is required. The two... [See More]

  • Industry: Marine; Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
Dow SYLGARD™ 182 Silicone Encapsulant Clear 19.9 kg Kit -- 182 SIL ELAST KIT 19.9KG [2225999 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow SYLGARD ™ 182 Silicone Elastomer Clear is a two component, heat curing encapsulant that is used as a protective coating for electrical applications such as power supplies, transformers, sensors, amplifiers, and connectors. It provides flexibility, low stress, easy to repair, long pot life,... [See More]

  • Industry: Electric Power
  • Cure / Technology: Two Component  
  • Chemical System: Silicone
  • Thermal Conductivity: 0.1600
Nanosilica Filled Optically Clear Epoxy with High Abrasion Resistance -- EP30NS
from Master Bond, Inc.

Master Bond EP30NS is a nanosilica filled epoxy system featuring high abrasion resistance. It has exceptional dimensional stability and low shrinkage upon curing of less than 0.01%. EP30NS is optically clear and meets NASA low outgassing specifications. [See More]

  • Industry: Marine; Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Type: High Dielectric; Optical; Thermally Conductive
  • Chemical System: Epoxy
Dow SYLGARD™ 182 Silicone Encapsulant Clear 3.9 kg Kit -- 182 SIL ELAST KIT 3.9KG [2065657 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow SYLGARD ™ 182 Silicone Elastomer Clear is a two component, heat curing encapsulant that is used as a protective coating for electrical applications such as power supplies, transformers, sensors, amplifiers, and connectors. It provides flexibility, low stress, easy to repair, long pot life,... [See More]

  • Industry: Electric Power
  • Cure / Technology: Two Component  
  • Chemical System: Silicone
  • Thermal Conductivity: 0.1600
NASA Low Outgassing Rated Epoxy Features Enhanced Chemical Resistance -- EP42-2LV Black
from Master Bond, Inc.

EP42-2LV Black is a two component, room temperature curing epoxy compound featuring low viscosity and superior chemical resistance. It meets NASA low outgassing specifications, is black in color and optically opaque. [See More]

  • Industry: Marine; Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
Dow SYLGARD™ 184 Silicone Encapsulant Clear 19.9 kg Kit -- 184 SIL ELAST KIT 19.9KG [2085925 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow SYLGARD ™ 184 Silicone Elastomer Clear is a two component, room temperature and heat curing, encapsulant that is used as protective coating for LED lighting, power supplies, transformers, sensors, amplifiers, and connectors. It provides flowability, flame resistance, and good dielectric... [See More]

  • Industry: Electric Power
  • Cure / Technology: Two Component  
  • Chemical System: Silicone
  • Thermal Conductivity: 0.1600
New Epoxy Offers Rapid Cures and Chemical Resistance -- EP41S-F
from Master Bond, Inc.

Offering impressive physical strength characteristics, EP41S-F is an electrically insulative two component epoxy that cures rapidly at ambient and elevated temperatures. Typically faster curing epoxies are somewhat less chemically resistant than other types of systems, but EP41S-F is one of the few... [See More]

  • Industry: Marine; Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
Dow SYLGARD™ 184 Silicone Encapsulant Clear 3.9 kg Kit -- 184 SIL ELAST KIT 3.9KG [2065622 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow SYLGARD ™ 184 Silicone Elastomer Clear is a two component, room temperature and heat curing, encapsulant that is used as protective coating for LED lighting, power supplies, transformers, sensors, amplifiers, and connectors. It provides flowability, flame resistance, and good dielectric... [See More]

  • Industry: Electric Power
  • Cure / Technology: Two Component  
  • Chemical System: Silicone
  • Thermal Conductivity: 0.1600
Nickel Filled Electrically Conductive Epoxy System -- EP76M
from Master Bond, Inc.

Master Bond Polymer System EP76M is a two component, nickel filled, electrically conductive adhesive for high performance bonding, sealing, and coating formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part nickel conductive systems, EP76M... [See More]

  • Industry: Marine; Aerospace; Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Die Bonding Adhesives
  • Type: Anti-static, ESD; Electrically Conductive; EMI/RFI Shielding; Thermally Conductive
  • Chemical System: Epoxy
Dow SYLGARD™ 186 Silicone Elastomer Clear 19.9 kg Kit -- 186 ELAST PLASTIC 19.9KG [3150305 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow SYLGARD ™ 186 Silicone Elastomer Clear is a two component, room temperature and heat curing, encapsulant that is used as a protective coating for electrical applications such as power supplies, transformers, sensors, amplifiers, and connectors. It provides flexibility, high tear strength,... [See More]

  • Industry: Electric Power
  • Cure / Technology: Two Component  
  • Chemical System: Silicone; Elastomeric
  • Thermal Conductivity: 0.2100
One Component Toughened Epoxy System For Bonding And Sealing -- Supreme 17HT
from Master Bond, Inc.

Master Bond Supreme 17HT is a one component toughened epoxy for bonding and sealing. It has a moderate viscosity system with good flow properties. [See More]

  • Industry: Marine; Aerospace; Automotive; Electronics; Electric Power; Photonics; OEM or Industrial; Semiconductors, IC's
  • Form / Function: Liquid
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Epoxy
Dow SYLGARD™ 186 Silicone Elastomer Clear 4 kg Kit -- 186 ELAST PLASTIC 4KG KIT [2099551 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow SYLGARD ™ 186 Silicone Elastomer Clear is a two component, room temperature and heat curing, encapsulant that is used as a protective coating for electrical applications such as power supplies, transformers, sensors, amplifiers, and connectors. It provides flexibility, high tear strength,... [See More]

  • Industry: Electric Power
  • Cure / Technology: Two Component  
  • Chemical System: Silicone; Elastomeric
  • Thermal Conductivity: 0.2100
One Component, High Temperature Resistant Epoxy -- EP36
from Master Bond, Inc.

Master Bond Polymer System EP36 is a unique one component high performance toughened epoxy system for electrical potting, casting, encapsulation, baked coatings and adhesive applications. It features an outstanding combination of properties including high temperature stability up to 500 °F,... [See More]

  • Industry: Marine; Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Semiconductors, IC's
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
  • Type: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding
  • Chemical System: Epoxy
Dow SYLGARD™ Q3-3600 Encapsulant Gray 4 kg Kit -- Q3-3600 A/B ENCAP 4KG KIT [2170493 from Dow Chemical Company (The)]
from Ellsworth Adhesives

Dow SYLGARD ™ Q3-3600 Thermally Conductive Encapsulant Gray is a two component, heat curing, silicone adhesive that is used to improve thermal transfers of cooling mechanisms in the industrial and automotive industries. It provides high flowability, long working times, low viscosity, flame... [See More]

  • Industry: Electric Power
  • Thermal Conductivity: 0.7700
  • Cure / Technology: Two Component  
  • Tensile (Break): 957
Silicone Elastomer Gel Encapsulant And Potting Compound -- SilGel® 612 A/B
from Wacker Chemical Corp.

WACKER SilGel ® 612 A/B is a pourable, additioncuring, RTV-2 silicone rubber that vulcanizes at room temperature to a very soft silicone gel. Special features. two-part, 1 : 1 mixing ratio. low viscosity. rapid heat cure. very low hardness (silicone gel). crystal clear. pronounced inherent tack. [See More]

  • Industry: Automotive; Electronics; Electric Power
  • Form / Function: Liquid
  • Type: Optical
  • Chemical System: Silicone; Elastomeric
Potting, Encapsulant Elastomer -- Bluesil™ Esa 7252 QC A/B
from Bluestar Silicones USA Corp.

Potting, encapsulant elastomer. Properties. Viscosity 3500. Hardness Sha 48. Description. a quick curing two-component silicone elastomer which cures at room temperature, cure can be acceleration by the application of heat. BLUESIL ™ ESA 7252 QC A & B is supplied as a viscous liquid which... [See More]

  • Industry: Electronics; Electric Power
  • Form / Function: Liquid; Encapsulant or Conformal Coating
  • Type: High Dielectric
  • Chemical System: Silicone
Electrical Encapsulation System -- VORATRON®
from Dow Polyurethanes

Energy has always had a special bond with Dow. Over 110 years ago, our company was founded when Herbert Dow used electricity to create bromine and chlorine from salt – a process still in use. Today, we ’re one of the largest suppliers of solutions that protect, conserve and manage energy... [See More]

  • Industry: Electric Power; Power Equipment, Power Transmission and Distribution Equipment
  • Chemical System: Epoxy; Polyurethane
Flame Retardant Thermally Conductive -- 50-3150 FR
from Epoxies Etc...

50-3150 FR has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-3150 FR Black Epoxy with Catalyst 190 and Catalyst 105 are listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low shrinkage, and outstanding insulation... [See More]

  • Industry: Electronics; Electric Power
  • Form / Function: Liquid
  • Type: Thermally Conductive
  • Chemical System: Epoxy
TECHNOMELT PA 341 -- 8802588327937
from Henkel Corporation - Electronics

Henkel's TECHNOMELT product family is diverse and versatile. No matter the application or market, there is a TECHNOMELT material for you. Despite containing features specific to particular applications, all TECHNOMELT materials provide the same common benefits, including watertight encapsulation,... [See More]

  • Industry: Electronics; Electric Power
  • Form / Function: Pellets
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Polyamide
Clear Non-Yellowing Silicone Encapsulant -- PNS-56225
from Protavic America, Inc.

PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]

  • Industry: Automotive; Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Form / Function: Liquid; Encapsulant or Conformal Coating; Die Bonding Adhesives
  • Type: Electrically Conductive; Thermally Conductive
  • Chemical System: Silicone
Cement -- No. 31
from Sauereisen, Inc.

Sauereisen Cement No. 31 is a white, porcelain-like cement that is widely used throughout industry in a variety of applications. including assembling, sealing, insulating and cementing of ceramics, porcelain, metal, and glass. [See More]

  • Industry: Electronics; Electric Power
  • Form / Function: Powder; Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
  • Type: High Dielectric; Thermally Conductive
  • Chemical System: Ceramic
Non-Sag, Butter-On Epoxy Coating -- 10-3050
from Epoxies Etc...

10-3050 is a thixotropic, Non-Sag, gel epoxy designed to protect motor windings from abrasives, chemicals, vibration, oils, jet fuels, etc... 10-3050 self levels to a smooth void free coating once applied with a spatula or brush. [See More]

  • Industry: Electronics; Electric Power
  • Chemical System: Epoxy
  • Type: High Dielectric
  • Composition: Unfilled
Clear Urethane Cast/Adhesive -- PNU-46201
from Protavic America, Inc.

The two component polyurethane compound described in this data sheet is specifically designed for the encapsulation by casting of completed circuit board. The cured material meets the flammability requirements of UL 94, V-O at thickness of 0.070 in. and greater (UL File Number E116296) and provides... [See More]

  • Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Form / Function: Liquid; Encapsulant or Conformal Coating
  • Type: High Dielectric; Thermal Insulation
  • Chemical System: Polyurethane
Epoxy Adhesive -- ANE-26144
from Protavic America, Inc.

Clear unfilled epoxy also available in a one-part system. Use life is over three days after mixing at room temperature. Excellent for ferrite and optical bonding applications. Requires heat assist to cure. [See More]

  • Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Form / Function: Liquid; Encapsulant or Conformal Coating; Die Bonding Adhesives
  • Type: High Dielectric
  • Chemical System: Epoxy
Optically Clear UV Adhesive -- ANA-97290
from Protavic America, Inc.

ANA-97290 is a clear Ultraviolet/ Visible light curing adhesive. It has very low shrinkage during cure for alignment sensitive parts. It is recommended for small electrical/electronic casting and encapsulating applications that require a unique combination of excellent wetting, flow, good thermal... [See More]

  • Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Form / Function: Liquid; Encapsulant or Conformal Coating; Gel (optional feature); Die Bonding Adhesives
  • Type: Electrically Conductive; Thermal Insulation
  • Composition: Unfilled
Polyurethane Adhesive -- PNU-56200
from Protavic America, Inc.

PNU-56200 ™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term circuit protection and... [See More]

  • Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Form / Function: Liquid; Encapsulant or Conformal Coating; Die Bonding Adhesives
  • Type: High Dielectric
  • Chemical System: Polyurethane
Reworkable Underfill Epoxy Resin -- ANA-10199R
from Protavic America, Inc.

Fast flow, fast cure capillary reworkable underfill. The rheology of the PROTAVIC ANA 10199 R in combination with its fineness make the product perfectly adapted to high reliability small gap underfill applications. It presents a good pot life at room temperature 20-22C and a high reactivity at... [See More]

  • Industry: Electronics; Electric Power; OEM or Industrial; Semiconductors, IC's
  • Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
  • Type: High Dielectric; Thermal Insulation
  • Composition: Unfilled