Military / Government (MIL-SPEC / GG) Encapsulants and Potting Compounds
from Hernon Manufacturing, Inc.
Tuffbond ® 302 is a modified epoxy adhesive that provides a very fast room temperature cure. Tuffbond ® 302 exhibits very good moisture chemical and heat resistance. This very fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loud speakers. Tuffbond ® 302... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Chemical System: Ceramic; Epoxy
- Form / Function: 50 ml (two component)
from ELANTAS North America LLC
The smart meter market, encompassing electric, water, and gas sectors, is pivotal in shaping a sustainable and connected future. As these meters become integral to our utilities, they face multifaceted challenges. From fluctuating environmental conditions to potential electronic interference, the... [See More]
- Industry: Aerospace; Electronics; Military
- Chemical System: Urethane-Alkyd
- Form / Function: Liquid; Encapsulant or Conformal Coating
- Cure / Technology: Thermoset; Single Component; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]
- Industry: Marine; Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial; Semiconductors, IC's
- Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating
- Type: Electrically Conductive; Thermally Conductive
- Chemical System: Silicone
from Ellsworth Adhesives
Henkel Loctite Nuva-Sil 5091 is a one component, low viscosity, UV light and moisture curable silicone sealant. It is self leveling, has medium strength and is highly flexible. 300 mL Cartridge. [See More]
- Industry: Automotive; Military
- Cure / Technology: Single Component
- Chemical System: Silicone
- Tensile (Break): 145
from Hernon Manufacturing, Inc.
Tuffbond ® 304 is a modified epoxy adhesive that provides a very fast room temperature cure. Tuffbond ® 304 exhibits very good moisture chemical and heat resistance. This very fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loudy speakers. Tuffbond ® 304... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Chemical System: Ceramic; Epoxy
- Form / Function: 20 gm
from Master Bond, Inc.
Master Bond EP62-1 is a two component heat cured and chemically resistant epoxy resin system featuring a long pot life at ambient temperatures and efficient cures at moderately elevated temperatures. The recommended mix ratio is 100 parts of component A to 10 parts of component B. The pot life of... [See More]
- Industry: Marine; Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial; Semiconductors, IC's
- Cure / Technology: Thermoset; Two Component
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
- Use Temperature: -60 to 400
from Ellsworth Adhesives
Henkel Loctite 5092 Nuva-Sil is a one component UV light and moisture curable silicone. It is self leveling, has medium strength and is highly flexible. 300 mL Cartridge. [See More]
- Industry: Automotive; Military
- Cure / Technology: Single Component
- Chemical System: Silicone
- Tensile (Break): 87
from Hernon Manufacturing, Inc.
Tuffbond ® 305 is a modified epoxy adhesive that provides a very fast room temperature cure. Tuffbond ® 305 exhibits very good moisture chemical and heat resistance. This very fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loud speakers. Tuffbond ® 305... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Chemical System: Ceramic; Epoxy
- Form / Function: 50 ml (two component)
from Master Bond, Inc.
Master Bond Polymer System EP45HT is a two component epoxy system for high performance structural bonding and casting. It is suitable for applications where long term exposure to temperatures from -80 °F to +500 °F is required. lt is 100% reactive and does not contain any solvents or... [See More]
- Industry: Marine; Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial; Semiconductors, IC's
- Chemical System: Epoxy
- Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Die Bonding Adhesives
- Composition: Unfilled
from Ellsworth Adhesives
Henkel Loctite SI 5031 Nuva-Sil is a medium viscosity, UV/Visible light curing silicone sealant with a secondary moisture cure mechanism for shadow curing. 300 mL Cartridge. [See More]
- Industry: Automotive; Military
- Cure / Technology: Single Component
- Chemical System: Silicone
- Tensile (Break): 80
from Hernon Manufacturing, Inc.
Tuffbond ® 313 adhesive/sealant is a two component, 100% solid system, one to one ratio, room temperature cure system. Tuffbond ® 313 is recommended for bonding metals, wood, ceramics, etc., and can be used for potting and encapsulation of electrical and electronic components. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Chemical System: Ceramic
- Form / Function: 50 ml (two component)
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
Master Bond Polymer System EP13 is a one component heat curing epoxy featuring high shear strength and very high temperature resistance. This one component system is formulated to cure at temperatures from 300 °F to 350 °F for 60-90 minutes. Upon cure, EP13 readily attains tensile shear... [See More]
- Industry: Marine; Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Semiconductors, IC's
- Form / Function: Encapsulant or Conformal Coating; Die Bonding Adhesives
- Type: High Dielectric
- Chemical System: Epoxy
from Ellsworth Adhesives
Henkel Loctite SI 5083 is a one component, high strength, UV cured silicone. It is used for potting, coating and sealing of various electronic, automotive, military, and industrial components. 300 mL Cartridge. [See More]
- Industry: Automotive; Military
- Cure / Technology: Single Component
- Chemical System: Silicone
- Tensile (Break): 450
from Hernon Manufacturing, Inc.
Tuffbond ® 315 is a modified epoxy adhesive that provides a fast room temperature cure. Tuffbond ® 315 exhibits very good moisture chemical and heat resistance. This fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loudy speakers. Tuffbond ® 315 is also... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Chemical System: Ceramic; Epoxy
- Form / Function: 50 ml (two component)
from Master Bond, Inc.
Master Bond Polymer System EP36 is a unique one component high performance toughened epoxy system for electrical potting, casting, encapsulation, baked coatings and adhesive applications. It features an outstanding combination of properties including high temperature stability up to 500 °F,... [See More]
- Industry: Marine; Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial; Semiconductors, IC's
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
- Type: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding
- Chemical System: Epoxy
from Hernon Manufacturing, Inc.
Tuffbond ® 316 is a two component, room temperature cure system. By changing the ratio of resin and hardener, the cured adhesive can change from a tough and flexible to a hard and rigid system. Tuffbond ® 316 is recommended for bonding metal, glass, wood, concrete, and rubber, and can be... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Chemical System: Elastomeric
- Form / Function: 50 ml (two component)
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
Master Bond UV10 and UV10TK are one component UV curable modified epoxy compounds, ready for use as supplied, for high performance casting, coatings, sealing and bonding applications. UV10 is a low viscosity amber liquid at room temperature and UV10TK is a medium viscosity amber liquid at room... [See More]
- Industry: Marine; Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial; Semiconductors, IC's
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating; Impregnating Resin
- Type: High Dielectric; Optical; Thermal Insulation
- Cure / Technology: Thermoset; UV or Radiation Cured; Single Component
from Hernon Manufacturing, Inc.
Tuffbond ® 317 is a two component, room temperature cure system. By changing the ratio of resin and hardener, the cured adhesive can change from a tough and flexible to a hard and rigid system. The resin offers a unique combination of hardness and flexibility with high chemical and solvent... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Chemical System: Elastomeric
- Form / Function: 50 ml (two component)
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
Two component EP46HT-2AO Black is ideal for demanding bonding, sealing and encapsulation applications where thermal conductivity, electrical insulation and high temperature resistance are required. It has a service temperature range of -100 °F to +500 °F with a glass transition temperature... [See More]
- Industry: Marine; Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial; Semiconductors, IC's
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
- Type: High Dielectric; Thermally Conductive
- Chemical System: Epoxy
from Hernon Manufacturing, Inc.
Tuffbond ® 42121 is a thixotropic and modified epoxy adhesive that provides a very fast room temperature cure. Tuffbond ® 42121 exhibits very good moisture chemical and heat resistance. This very fast cure epoxy adhesive is specially formulated for rapid in-line assembly of loud-speakers. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Chemical System: Ceramic; Epoxy
- Form / Function: 50 ml (two component)
from Master Bond, Inc.
Master Bond EP39MAOHT is a two component, thermally conductive, electrically insulative epoxy for bonding, sealing, coating, potting and encapsulation. Its low exotherm makes it well suited for large castings and potting applications. It withstands rigorous thermal cycling, vibration and shock. [See More]
- Industry: Marine; Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial; Semiconductors, IC's
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating; Impregnating Resin
- Type: High Dielectric; Thermally Conductive
- Chemical System: Epoxy
from Hernon Manufacturing, Inc.
Tuffbond ® 65891 is a two-component, room temperature cure system. Tuffbond ® 65891 is recommended for bonding metal, glass, wood, concrete, and rubber, and can be used for potting and encapsulation of electrical and electronic components. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Chemical System: Elastomeric
- Form / Function: 50 ml (two component)
- Cure / Technology: Two Component ; Room Temperature Vulcanizing or Curing
from Master Bond, Inc.
Key Features. Free flowing viscosity. High temperature resistance. Exceptionally long open time. Passes NASA low outgassing. Product Description. Master Bond Supreme 121AO is a thermally conductive epoxy for bonding, sealing and encapsulation. The mix ratio is 100:80 by weight. This system has a... [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; Photonics; OEM or Industrial; Semiconductors, IC's
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid
- Type: High Dielectric; Optical; Thermally Conductive
- Chemical System: Epoxy
from Henkel Corporation - Electronics
(Known as Hysol PC18M ). LOCTITE STYCAST PC 18M is a flexible solvent-based, one-component coating. Provides good thermal shock resistance. [See More]
- Industry: Electronics; Military
- Chemical System: Polyurethane
- Form / Function: Encapsulant or Conformal Coating
- Cure / Technology: Single Component; Room Temperature Vulcanizing or Curing
from Shiu Li Technology Co., Ltd
LiPOLY's TPS series is a low-density, potting material. Its low density and lightweight properties enhance product performance, reduce production costs. The product has a thermal conductivity of 0.55-1.50 W/m*K and can cure at room temperature or high temperatures. [See More]
- Industry: Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid
- Type: Thermally Conductive
- Chemical System: Silicone
from Epoxies Etc...
50-3100 is designed for the fastest and most continuous high heat transfer. 50-3100 measures several times faster heat dissipation than other commercially available types. The most important breakthrough is the handling of 50-3100. This system can be easily mixed and poured to form a dimensionally... [See More]
- Industry: Electronics; Electric Power; Military
- Form / Function: Liquid
- Type: Thermally Conductive
- Chemical System: Epoxy