Electrically Conductive Encapsulants and Potting Compounds
from MacDermid Alpha Electronics Solutions
Flame-retardant, thermally conductive epoxy potting compound designed for easy processing and enhanced thermal conductivity. Product Overview. ER2220 Highly Thermally Conductive Epoxy Potting Compound is a flame retardant, two-part epoxy resin designed to meet the increasing demands for efficient... [See More]
- Type: Electrically Conductive; Thermally Conductive
- Cure / Technology: Two Component
- Chemical System: Epoxy
- Features: Flame Retardant
from Ellsworth Adhesives
ResinLab EP1285 Black is a two component, highly filled casting resin that is used for applications that require low CTE and high thermal conductivity. It is medium viscosity and resistance to bases, acids, water, and most organic solvents. Resin only, 1 gal Pail. [See More]
- Type: Electrically Conductive
- Thermal Conductivity: 0.7900 to 1.2
- Cure / Technology: Two Component
- Tensile (Break): 4000 to 6900
from Master Bond, Inc.
MasterSil 973S-LO is a two component, silver filled silicone with superb electrical and thermal conductivity. Its exceptionally low volume resistivity allows it to be used for many different applications involving bonding, sealing and coating. It is a paste like system with minimal flow. Its... [See More]
- Type: Electrically Conductive; Thermally Conductive
- Chemical System: Silicone
- Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating
- Composition: Filled
from Ellsworth Adhesives
ResinLab EP1285 Black is a two component, highly filled casting resin that is used for applications that require low CTE and high thermal conductivity. It is medium viscosity and resistance to bases, acids, water, and most organic solvents. Resin only, 1 qt Can. [See More]
- Type: Electrically Conductive
- Thermal Conductivity: 0.7900 to 1.2
- Cure / Technology: Two Component
- Tensile (Break): 4000 to 6900
from Master Bond, Inc.
Master Bond EP17HTS-DA is a one part die attach epoxy that is electrically conductive and withstands high temperatures. [See More]
- Type: Electrically Conductive; Thermally Conductive
- Chemical System: Polyphenylene Sulfide; Epoxy
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
- Composition: Filled
from Master Bond, Inc.
Master Bond Polymer System EP29LPSP is a two component, high performance, modified low temperature heat cured epoxy system specially formulated for cryogenic applications. Not only is EP29LPSP able to function as an adhesive, sealant and protective coating at temperatures as low as 4K, but it is... [See More]
- Type: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding
- Chemical System: Epoxy
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Encapsulant or Conformal Coating
- Composition: Unfilled
from Master Bond, Inc.
Master Bond Polymer System EP76M is a two component, nickel filled, electrically conductive adhesive for high performance bonding, sealing, and coating formulated to cure at room temperature or more rapidly at elevated temperatures. Unlike the majority of two part nickel conductive systems, EP76M... [See More]
- Type: Anti-static, ESD; Electrically Conductive; EMI/RFI Shielding; Thermally Conductive
- Chemical System: Epoxy
- Form / Function: Gap Filler, Foam in Place Gasket; Encapsulant or Conformal Coating; Die Bonding Adhesives
- Composition: Filled
from Master Bond, Inc.
Master Bond Polymer System EP36 is a unique one component high performance toughened epoxy system for electrical potting, casting, encapsulation, baked coatings and adhesive applications. It features an outstanding combination of properties including high temperature stability up to 500 °F,... [See More]
- Type: Anti-static, ESD; High Dielectric; Electrically Conductive; EMI/RFI Shielding
- Chemical System: Epoxy
- Form / Function: Gap Filler, Foam in Place Gasket; Liquid; Die Bonding Adhesives
- Composition: Unfilled
from Wacker Chemical Corp.
WACKER ’s silicone adhesives and sealants are based on many years of experience, innovative research and comprehensive technological expertise. In a wide variety of industries, especially in lighting technology, flowable or non-sag silicone products offer decisive advantages in performance and... [See More]
- Type: Electrically Conductive
- Chemical System: Silicone; Elastomeric
- Form / Function: Gel
- Cure / Technology: Thermoset
from Henkel Corporation - Electronics
With the increasing proliferation of wireless devices, designers are challenged with various electromagnetic waves from multiple sources radiating at the same spectrum of frequencies resulting in electromagnetic interference(EMI). Radio-frequency(RF) emitting devices require effective isolation to... [See More]
- Type: Electrically Conductive; EMI/RFI Shielding
- Cure / Technology: Single Component
- Form / Function: Liquid; Encapsulant or Conformal Coating
- Industry: Electronics
from Protavic America, Inc.
PNS-56225 ™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature... [See More]
- Type: Electrically Conductive; Thermally Conductive
- Chemical System: Silicone
- Form / Function: Liquid; Encapsulant or Conformal Coating; Die Bonding Adhesives
- Composition: Unfilled
from Monocrystal, Inc.
AGH – series. Application: High conductive low firing silver paste for fine line screen printing. Silver conductor is specially designed to form the conductive coating and bond area to the glass and ceramic substrate by screen printing method. Composition variations: AGH-A-60 – 60%... [See More]
- Type: Electrically Conductive
- Industry: Electronics
from Protavic America, Inc.
ANA-97290 is a clear Ultraviolet/ Visible light curing adhesive. It has very low shrinkage during cure for alignment sensitive parts. It is recommended for small electrical/electronic casting and encapsulating applications that require a unique combination of excellent wetting, flow, good thermal... [See More]
- Type: Electrically Conductive; Thermal Insulation
- Composition: Unfilled
- Form / Function: Liquid; Encapsulant or Conformal Coating; Gel (optional feature); Die Bonding Adhesives
- Cure / Technology: Thermoset; Two Component ; UV or Radiation Cured