Isopaste Thermally Conductive Paste
from Acrolab Ltd.

Isopaste is a high-temperature thermal bridging compound used in Acrolab's Isoplatens and Heat Transfer Tools to act as a heat conductor in the Isobar ® Heat Pipe channels. It comes in three stock sizes: 4oz., 8oz., and 16oz. cans. Larger quantities can be arranged with your Acrolab Engineering... [See More]

  • Type: Thermally Conductive
  • Cure / Technology: Thermoset; Single Component
  • Composition: Unfilled
  • Form / Shape: Grease, Paste
Surface Mount Adhesives -- Epibond® 7275
from Alpha

Epibond ® 7275-Series surface mount adhesives offer excellent performance for all SMT surface mount printing print and dispensing applications. Consistent high-dot profile and fast curing. Room temperature stability, 6-month room temperature shelf life. Non slumping and non stringing. Dispense,... [See More]

  • Type: Thermally Conductive
  • Cure / Technology: Two Component  
  • Chemical System: Epoxy
  • Form / Shape: Die Bonding Adhesives; Gel
3M™ Thermally Conductive Tape -- 8810 [8810 from 3M Electronics Design & Manufacturing]
from bisco industries

3M ™ Thermally Conductive Adhesive Transfer Tapes 8805, 8810, 8815 and 8820 are designed to provide a preferential heat-transfer path between heat-generating components and heat sinks or other cooling devices (e.g., fans, heat spreaders or heat pipes). • These tapes are tacky pressure... [See More]

  • Type: Thermally Conductive
  • Composition: Filled
  • Chemical System: Acrylic
  • Cure / Technology: Single Component
Pedigree® -- 40 VTC-40F
from ELANTAS PDG, Inc.

Mineral-filled VPI resin - semi-flexible for transformers with improved heat dissipation [See More]

  • Type: Thermally Conductive
  • Composition: Filled
  • Chemical System: Alkyd
  • Cure / Technology: Thermoset; Single Component
Conductive Encapsulant EP1285 -- EP1285 BLACK GL
from Ellsworth Adhesives

A highly filled, medium viscosity black casting resin. [See More]

  • Type: Thermally Conductive
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
  • Chemical System: Epoxy
  • Form / Shape: Liquid
Electrically and Thermally Conductive Adhesive -- EK1000
from Epoxy Technology

A single component, silver-filled adhesive that exhibits exceptional thermal and electrical conductivity along with a shiny silver appearance making it ideal for the demanding requirements of high power LED die attach applications. Other benefits include low viscosity and high thixotropy making it... [See More]

  • Type: Electrically Conductive; Thermally Conductive
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Single Component
Di-Pak™ Elastomeric Eletrical Insulating Compound -- E-4501
from Hapco, Inc.

Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E products are flame... [See More]

  • Type: Thermally Conductive
  • Form / Shape: Liquid
  • Cure / Technology: Thermoset; Two Component  
  • Industry: Electronics
NanoFoil® -- NanoFoil® 4.0 x 5.0
from Indium Corporation

NanoFoil ® Bundle Kits are small quantities of NanoFoil ® in pre-made forms on tape & reel. The kit consists of small preforms, including 0.5", 1", and 2" squares available in thicknesses of 40 microns or 60 microns. The bundle kits are available in standard NanoFoil only; however,... [See More]

  • Type: Thermally Conductive
  • Industry: Semiconductors, IC's
  • Chemical System: Metal
Low Viscosity Thermally Conductive Epoxy -- EP112AO
from Master Bond, Inc.

Master Bond Polymer System EP112AO is a solventless, moderate viscosity two component epoxy resin system which is specifically designed for high performance outdoor and indoor electrical and electronic applications where good thermal conductivity and electrial isolation is required. The two... [See More]

  • Type: Thermally Conductive
  • Composition: Filled
  • Chemical System: 100% Solids; Epoxy
  • Cure / Technology: Thermoset; Two Component  
Thermal Compound -- TC70
from Nordson EFD

High-performance electronics contain many components - including central processing units (CPUs), microprocessors units (MPUs), graphics processing units (GPUs), LEDs, field-effect transistors (FETs) and integrated bipolar transistors (IGBT ’s), uninterrupted power supplies - that heat up... [See More]

  • Type: Thermally Conductive
  • Composition: Unfilled
  • Chemical System: Synthetic Based
  • Cure / Technology: Single Component
High Temperature Cement -- OMEGABOND® Air Set Series
from OMEGA Engineering, Inc.

Air Set Cements set or cure through loss of moisture by evaporation. Atmospheric conditions therefore affect the drying rate. Air Set Cements are used mainly in thin film applications (applied in thicknesses less than 1/4")*. SELECTION CRITERIA FOR CEMENTS. 1. Type of Application Potting, sealing,... [See More]

  • Type: Thermally Conductive
  • Cure / Technology: Two Component   (optional feature); Single Component (optional feature)
  • Chemical System: Ceramic
  • Form / Shape: Liquid (optional feature); Powder (optional feature); Encapsulant or Conformal Coating
Flexible Heat Transfer Compound -- EFS-1
from Thermon Manufacturing Co.

EFS-1 is a preformed flexible heat transfer compound designed for use between plate-type external heating/ cooling coils and process vessels. Thermon ’s heat transfer compounds provide an efficient thermal connection between the coils and the process equipment. By eliminating the air voids... [See More]

  • Type: Thermally Conductive
  • Industry: Electric Power; Heating Coil Systems
  • Cure / Technology: Single Component
  • Features: Flexible
Conformal Coating -- SEMICOSIL® 960
from Wacker Chemical Corp.

SEMICOSIL ® 960 CLEAR is a RTV-1 amine cure silicone rubber dispersion that cures on contact with moisture in the air. Special features. Rapid cure. Excellent electrical properties. Excellent adhesion to many substrates. Available in clear or red. Application. SEMICOSIL ® 960 CLEAR is a... [See More]

  • Type: Thermally Conductive
  • Cure / Technology: Thermoset; Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing
  • Chemical System: Silicone; Elastomeric
  • Form / Shape: Liquid; Encapsulant or Conformal Coating
3M™ Acrylic Thermal Interface Pad -- 5589H
from 3M Electronics Design & Manufacturing

3M ™ Thermally Conductive Interface Pad 5589H is a thermally conductive acrylic elastomer based interface pad. It has very high thermal conductivity, good electrical insulation properties and is ideally suited for applications that require non-silicone properties. 2.0 W/mK [See More]

  • Type: Thermally Conductive
  • Industry: Electronics
  • Chemical System: Acrylic
  • Features: UL Rating
Grease Heat Sink Tube -- CT40-5 [CT40-5 from ITW Chemtronics]
from All-Spec Industries

The CircuitWorks CT40-5 tube dispenser is for precise application of silicone compound that facilitates heat transfer away from electronics and electrical components. [See More]

  • Type: Thermally Conductive
  • Cure / Technology: Single Component
  • Chemical System: Silicone
  • Form / Shape: Grease, Paste
2 oz. Thermally Conductive Compound, RoHS compliant -- 70115161 [100200F00000G from Aavid Thermalloy, LLC]
from Allied Electronics, Inc.

Ther-O-Link is a white thermal compound that cost effectively enhances the heat transfer between a semiconductor case and a heat sink. Silicone-based, and easy to apply, Ther-O-Link substantially reduces dry interface thermal resistance, while providing long life under a variety of conditions. [See More]

  • Type: Thermally Conductive
  • Use Temperature: -40 to 392
  • Form / Shape: Grease, Paste
Aremco-Bond™ -- 525
from Aremco Products, Inc.

Good chemical resistance and mechanical strength [See More]

  • Type: Electrically Conductive; Thermally Conductive
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset
Metal Oxide Thickened Dimethyl Silicone Compound -- Bluesil™ V-740
from Bluestar Silicones USA Corp.

Metal Oxide Thickened Dimethyl Silicone Compound. Description. Bluesil V-740 is a metal oxide thickened dimethyl silicone compound. It is a white, heavy paste used for heat dissipation applications where high thermal conductivity is required. [See More]

  • Type: Thermally Conductive
  • Cure / Technology: Two Component  
  • Chemical System: Silicone
  • Form / Shape: Grease, Paste
Thermal Interface Materials -- DTIM Series
from Device Technologies, Inc.

The performance of electronic devices is constantly improving but with this evolution comes greater power consumption and heat generation. If heat cannot escape efficiently, the performance of the device suffers. To transfer heat effectively, the introduction of DTIM Thermal Interface Materials... [See More]

  • Type: Thermally Conductive
  • Composition: Filled
  • Chemical System: Silicone
  • Cure / Technology: Single Component; Adhesive Tape
Flame Retardant Thermally Conductive -- 50-3150 FR
from Epoxies Etc...

50-3150 FR has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-3150 FR Black Epoxy with Catalyst 190 and Catalyst 105 are listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low shrinkage, and outstanding insulation... [See More]

  • Type: Thermally Conductive
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
GSP 1345
from GS Polymers, Inc.

Two part, 1:1, thermal conductive compound, available in cartridges [See More]

  • Type: Thermally Conductive
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Circuit Board Protection -- US5520
from Henkel Corporation - Electronics

Superior environmental protection, extreme thermal cycling resistance [See More]

  • Type: Thermally Conductive
  • Composition: Filled
  • Chemical System: Castor/MDI; Polyurethane
  • Cure / Technology: Thermoset; Single Component
Dissipator® -- 745
from Hernon Manufacturing, Inc.

Dissipator ® structural acrylics provide specific adhesion for bonding electrical heat sink components with high thermal conductivity. Heat trapped and not dissipated by the components can lead to premature component failure and costly repair and replacement. Thermal conductivity is assured and... [See More]

  • Type: Thermally Conductive
  • Composition: Unfilled
  • Chemical System: Modified Acrylic; Acrylic
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Dissipator® Adhesive -- Grade 745
from Hi-Tech Seals, Inc.

HERNON ® offers a complete line of structural acrylic adhesives. These systems are two-part, no mix, and reactive adhesives. Each acrylic adhesive has two components: the adhesive base or resin, and the Activator. Structural acrylic adhesives are termed “reactive ” cure systems. The... [See More]

  • Type: Thermally Conductive
  • Cure / Technology: Two Component  ; Reactive or Moisture Cured
  • Chemical System: Acrylic
  • Form / Shape: Grease, Paste
Antec Formula 7 -- FORMULA7
from Howard Computers

Antec's Formula 7 thermal compound protects your CPU even when your rig is running on all cylinders. Since little of the CPU's surface actually touches the heat sink, you need a solution that isolates and facilitates the transfer of heat. Formula 7's nano diamond particles minimize the distance... [See More]

  • Type: Thermally Conductive
Thermal Grease
from PENCOM

For heat sinks/spreaders in virtually any commercially available material [See More]

  • Type: Thermally Conductive
  • Industry: Electronics
Arctic AS5-12G Silver 5 Thermal Compound -- AS5-12G
from Pixel USA

Arctic AS5-12G Silver 5 Thermal Compound [See More]

  • Type: Thermally Conductive
Conductive Hybrid Adhesive -- ACH-20120
from Protavic America, Inc.

The electrically conductive PROTAVIC ACH 20120 adhesive is designed for BGA packages and LED dies PROTAVIC ACH 20120 presents excellent properties of flexibility, good adhesion and moisture resistance, no voids which allow package 10 withstand 260C Pb-free reflow temperature. More over PROTAVIC ACH... [See More]

  • Type: Electrically Conductive; Thermally Conductive
  • Composition: Unfilled
  • Chemical System: Hybrid
  • Cure / Technology: Thermoset; Single Component
Adhesive Paste -- No. 19
from Sauereisen, Inc.

Sauereisen Adhesive Paste No. 19 is an inorganic, odorless, nontoxic cement used for bonding glass, porcelain, wood, felt, cork, metals and ceramic fiber. Some typical applications include protection of exposed metal surfaces during heat treating, bonding wallboard to brick or concrete and cementing... [See More]

  • Type: Thermally Conductive
  • Composition: Unfilled
  • Chemical System: Ceramic
  • Cure / Technology: Single Component
Arctic Alumina Thermal Compound (1.75 gram) -- 407
from Xoxide

Introducing Arctic Alumina Thermal Compound, the first ceramic-based, polysynthetic thermal compound for use between modern high-power CPUs and high performance heatsinks or water-cooling solutions. Features: Made with micronized aluminum oxide and boron nitride: Arctic Alumina uses a layered... [See More]

  • Type: Thermally Conductive