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Potting/Encapsulation Compound -- INSTAbond® 809FR
from ACCRAbond, Inc.

INSTAbond ® 809FR. INSTAbond ® 809 FR exhibits good thermal conductivity, excellent flow properties, and low exotherm characteristics in large masses. INSTAbond ® 809 FR meets the requirements for UL-94 V-0 rating for flame retardancy. [See More]

  • Type: Thermally Conductive
  • Cure / Technology: Two Component  
  • Chemical System: Epoxy
  • Features: Flame Retardant; UL Rating
Thermal Interface Materials -- DTIM Series
from Device Technologies, Inc.

The performance of electronic devices is constantly improving but with this evolution comes greater power consumption and heat generation. If heat cannot escape efficiently, the performance of the device suffers. To transfer heat effectively, the introduction of DTIM Thermal Interface Materials... [See More]

  • Type: Thermally Conductive
  • Composition: Filled
  • Chemical System: Silicone
  • Cure / Technology: Single Component; Adhesive Tape
Molykote® 111 Compound
from Dow Corning Oil & Gas Solutions

Lubrication for control and pressure plug valves, water softener and faucet valves.Sealant for vacuum and pressure systems.Sealant for outdoor equipment (also shipboard) subject to washing and harsh environmental exposure: meters, electrical service entrance and underground connections.Damping... [See More]

  • Type: Thermally Conductive
  • Form / Shape: Liquid
  • Chemical System: Silicone
  • Industry: Automotive; Electronics; Electric Power; OEM or Industrial
Pedigree® -- 40 VTC-40F
from ELANTAS PDG, Inc.

Mineral-filled VPI resin - semi-flexible for transformers with improved heat dissipation [See More]

  • Type: Thermally Conductive
  • Composition: Filled
  • Chemical System: Alkyd
  • Cure / Technology: Thermoset; Single Component
Conductive Encapsulant EP1285 -- EP1285 BLACK GL
from Ellsworth Adhesives

A highly filled, medium viscosity black casting resin. [See More]

  • Type: Thermally Conductive
  • Cure / Technology: Two Component  ; Room Temperature Vulcanizing or Curing
  • Chemical System: Epoxy
  • Form / Shape: Liquid
Electrical -- 430
from Epoxy Technology

A two component, copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics. It may be used at the PCB level for inter-connecting, grounding and EMI RF shielding. Fast curing at relatively low temperatures may be realized. [See More]

  • Type: Electrically Conductive; Thermally Conductive
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
Di-Pak™ Elastomeric Eletrical Insulating Compound -- E-4501
from Hapco, Inc.

Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E products are flame... [See More]

  • Type: Thermally Conductive
  • Form / Shape: Liquid
  • Cure / Technology: Thermoset; Two Component  
  • Industry: Electronics
NanoFoil® -- NanoFoil® 4.0 x 5.0
from Indium Corporation

NanoFoil ® Bundle Kits are small quantities of NanoFoil ® in pre-made forms on tape & reel. The kit consists of small preforms, including 0.5", 1", and 2" squares available in thicknesses of 40 microns or 60 microns. The bundle kits are available in standard NanoFoil only; however,... [See More]

  • Type: Thermally Conductive
  • Industry: Semiconductors, IC's
  • Chemical System: Metal
INSULCAST 116 FR-FC Room Temperature Cure, Equal Ratio, Potting and Casting Compound
from ITW Polymer Technologies - Insulcast Division

INSULCAST 116 FR-FC is a one to one ratio (weight or volume) epoxy potting and casting compound designed for production use. The convenient mixing ratio makes it ideal for production line mixing as well as automatic dispensing. The INSULCAST 116 FR-FC is among the safest epoxy compounds available. [See More]

  • Type: Thermally Conductive
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  
Flame Resistant, Two Component Epoxy -- EP21FRLVSP
from Master Bond, Inc.

Master Bond Polymer System EP21FRLVSP is a two component flame resistant compound for general purpose bonding, sealing and casting, formulated to cure at room temperature. With a one-to-one mix ratio, by weight only, it readily develops a high bonding strength of more than 2000psi at room... [See More]

  • Type: Electrically Conductive; Thermally Conductive
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Two Component  
Thermal Compound -- TC70
from Nordson EFD

High-performance electronics contain many components - including central processing units (CPUs), microprocessors units (MPUs), graphics processing units (GPUs), LEDs, field-effect transistors (FETs) and integrated bipolar transistors (IGBT ’s), uninterrupted power supplies - that heat up... [See More]

  • Type: Thermally Conductive
  • Composition: Unfilled
  • Chemical System: Synthetic Based
  • Cure / Technology: Single Component
High Temperature Cement -- OMEGABOND® Air Set Series
from OMEGA Engineering, Inc.

Air Set Cements set or cure through loss of moisture by evaporation. Atmospheric conditions therefore affect the drying rate. Air Set Cements are used mainly in thin film applications (applied in thicknesses less than 1/4")*. SELECTION CRITERIA FOR CEMENTS. 1. Type of Application Potting, sealing,... [See More]

  • Type: Thermally Conductive
  • Cure / Technology: Two Component   (optional feature); Single Component (optional feature)
  • Chemical System: Ceramic
  • Form / Shape: Liquid (optional feature); Powder (optional feature); Encapsulant or Conformal Coating
Bond-Ply® 100 [Bond-Ply® 100 from Bergquist Company (The)]
from Quist Electronics

High bond strength to a variety of surfaces, fiberglass reinforced tape [See More]

  • Type: Thermally Conductive
  • Form / Shape: Die Bonding Adhesives
  • Chemical System: Acrylic
  • Industry: Electronics; OEM or Industrial; Semiconductors, IC's
Flexible Heat Transfer Compound -- EFS-1
from Thermon Manufacturing Co.

EFS-1 is a preformed flexible heat transfer compound designed for use between plate-type external heating/ cooling coils and process vessels. Thermon ’s heat transfer compounds provide an efficient thermal connection between the coils and the process equipment. By eliminating the air voids... [See More]

  • Type: Thermally Conductive
  • Industry: Electric Power; Heating Coil Systems
  • Cure / Technology: Single Component
  • Features: Flexible
Conformal Coating -- SEMICOSIL® 960
from Wacker Chemical Corp.

SEMICOSIL ® 960 CLEAR is a RTV-1 amine cure silicone rubber dispersion that cures on contact with moisture in the air. Special features. Rapid cure. Excellent electrical properties. Excellent adhesion to many substrates. Available in clear or red. Application. SEMICOSIL ® 960 CLEAR is a... [See More]

  • Type: Thermally Conductive
  • Cure / Technology: Thermoset; Reactive or Moisture Cured; Room Temperature Vulcanizing or Curing
  • Chemical System: Silicone; Elastomeric
  • Form / Shape: Liquid; Encapsulant or Conformal Coating
3M™ Acrylic Thermal Interface Pad -- 5589H
from 3M Electronics Design & Manufacturing

3M ™ Thermally Conductive Interface Pad 5589H is a thermally conductive acrylic elastomer based interface pad. It has very high thermal conductivity, good electrical insulation properties and is ideally suited for applications that require non-silicone properties. 2.0 W/mK [See More]

  • Type: Thermally Conductive
  • Industry: Electronics
  • Chemical System: Acrylic
  • Features: UL Rating
Grease Heat Sink Tube -- CT40-5 [CT40-5 from ITW Chemtronics]
from All-Spec Industries

The CircuitWorks CT40-5 tube dispenser is for precise application of silicone compound that facilitates heat transfer away from electronics and electrical components. [See More]

  • Type: Thermally Conductive
  • Cure / Technology: Single Component
  • Chemical System: Silicone
  • Form / Shape: Grease, Paste
Aremco-Bond™ -- 525
from Aremco Products, Inc.

Good chemical resistance and mechanical strength [See More]

  • Type: Electrically Conductive; Thermally Conductive
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset
Flame Retardant Thermally Conductive -- 50-3150 FR
from Epoxies Etc...

50-3150 FR has been formulated to meet the stringent non-burning requirements of UL94 V-O. 50-3150 FR Black Epoxy with Catalyst 190 and Catalyst 105 are listed with Underwriter's Laboratory for passing UL94 V-O. This system offers excellent heat transfer, low shrinkage, and outstanding insulation... [See More]

  • Type: Thermally Conductive
  • Composition: Unfilled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
GSP 1345
from GS Polymers, Inc.

Two part, 1:1, thermal conductive compound, available in cartridges [See More]

  • Type: Thermally Conductive
  • Composition: Filled
  • Chemical System: Epoxy
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Circuit Board Protection -- US5520
from Henkel Corporation - Electronics

Superior environmental protection, extreme thermal cycling resistance [See More]

  • Type: Thermally Conductive
  • Composition: Filled
  • Chemical System: Castor/MDI; Polyurethane
  • Cure / Technology: Thermoset; Single Component
Dissipator® -- 745
from Hernon Manufacturing, Inc.

Dissipator ® structural acrylics provide specific adhesion for bonding electrical heat sink components with high thermal conductivity. Heat trapped and not dissipated by the components can lead to premature component failure and costly repair and replacement. Thermal conductivity is assured and... [See More]

  • Type: Thermally Conductive
  • Composition: Unfilled
  • Chemical System: Modified Acrylic; Acrylic
  • Cure / Technology: Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Antec Formula 7 -- FORMULA7
from Howard Computers

Antec's Formula 7 thermal compound protects your CPU even when your rig is running on all cylinders. Since little of the CPU's surface actually touches the heat sink, you need a solution that isolates and facilitates the transfer of heat. Formula 7's nano diamond particles minimize the distance... [See More]

  • Type: Thermally Conductive
Thermal Grease
from PENCOM

For heat sinks/spreaders in virtually any commercially available material [See More]

  • Type: Thermally Conductive
  • Industry: Electronics
Arctic AS5-12G Silver 5 Thermal Compound -- AS5-12G
from Pixel USA

Arctic AS5-12G Silver 5 Thermal Compound [See More]

  • Type: Thermally Conductive
Conductive Hybrid Adhesive -- ACH-20120
from Protavic America, Inc.

The electrically conductive PROTAVIC ACH 20120 adhesive is designed for BGA packages and LED dies PROTAVIC ACH 20120 presents excellent properties of flexibility, good adhesion and moisture resistance, no voids which allow package 10 withstand 260C Pb-free reflow temperature. More over PROTAVIC ACH... [See More]

  • Type: Electrically Conductive; Thermally Conductive
  • Composition: Unfilled
  • Chemical System: Hybrid
  • Cure / Technology: Thermoset; Single Component
Arctic Alumina Thermal Compound (1.75 gram) -- 407
from Xoxide

Introducing Arctic Alumina Thermal Compound, the first ceramic-based, polysynthetic thermal compound for use between modern high-power CPUs and high performance heatsinks or water-cooling solutions. Features: Made with micronized aluminum oxide and boron nitride: Arctic Alumina uses a layered... [See More]

  • Type: Thermally Conductive