Microcontrollers (MCU) Specifications

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General Specifications


	Data Bus		The number of bits the data bus can transfer at the same time. A bidirectional set of conductive paths on which data or instruction codes are transferred into the DSP, or on which the result of an operation or computation is sent out from the DSP.
	Your choices are...
	4 Bit		The microcontroller has a 4-bit data bus.
	8 Bit		The microcontroller has an 8-bit data bus.
	16 Bit		The microcontroller has a 16-bit data bus.
	32 Bit		The microcontroller has a 32-bit data bus.
	64 Bit		The microcontroller has a 64-bit data bus.
	128 Bit		The microcontroller has a 128-bit data bus.
	Other		Other unlisted data bus.
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	Life Cycle Stage		This is the current product lifecycle stage, as defined by EIA-724.
	Your choices are...
	Introduction		Product planning or design is underway. Samples may or may not exist. Specification changes may occur and planned introduction dates may be delayed. Orders and product shipments are not permitted. This stage is not part of the EIA-724 product life cycle data model.
	New Product		Production is beginning to ramp up. Limited quantities are available. Orders and shipments are permitted. This stage is part of the EIA-724 product life cycle data model.
	Rapid Growth		Production is increasing rapidly. Manufacturing capacity is being added. Orders and shipments are permitted. This stage is part of the EIA-724 product life cycle data model.
	Maturity		Product growth has stabilized or peaked. Product quality is very high. Orders and shipments are permitted. Product is recommended for use in new designs. This stage is part of the EIA-724 product life cycle data model.
	Saturation		Sales and capacity have peaked. Orders and shipments are permitted. This stage is part of the EIA-724 product life cycle data model.
	Not Recommended (Declining)		Capacity is beginning to decline. Orders and shipments are permitted, but devices are not recommended for new designs. This stage is part of the EIA-724 product life cycle data model.
	Phase Out		Capacity is declining rapidly. A formal discontinuance notice may be issued. Limitations on shipments can occur, but orders are still allowed. Devices are not considered for new designs. This stage is part of the EIA-724 product life cycle data mode.
	Last Shipments		Final shipments are made for existing orders. New orders are limited to existing or residual inventories. Manufacturing capacity limitations may exist. This stage is not part of the EIA-724 product life cycle data model.
	Removed		Devices are unavailable. Product inventories and all supporting hardware, software, and documentation have been removed. New orders and new shipments are not permitted. This stage is not part of the EIA-724 product life cycle data model.
	Other		Other unlisted life cycle stages.
	Search Logic:		All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.

	Clock Speed:		The speed of the microcontroller clock. The maximum frequency of the device.
	Search Logic:		All matching products will have a value greater than or equal to the specified value.

	Number of Interrupts		An asynchronous electrical signal from a peripheral to the processor. When the peripheral asserts this signal, we say that an interrupt occurs. When an interrupt occurs, the current context is saved and an interrupt service routine is executed. When the interrupt service routine exits, control of the processor is returned to whatever part of the software was previously running.
	Search Logic:		User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.

Memory


	Internal RAM Size		Random access memory (RAM) can be read from or written to in a nonlinear manner. RAM derives its name from the fact that any byte of memory can be accessed randomly instead of sequentially. RAM does not retain data in memory when power is removed.
	Search Logic:		User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.

	Internal ROM Size		Read-only memory (ROM) contains pre-programmed data and is either unchangeable or requires a special operation to overwrite. ROM retains data in memory when power is removed. A photosensitive material is etched to hold the required bit pattern.
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	Internal ROM Type		The type of the on-chip instruction ROM.
	Your choices are...
	ROMLess		Devices do not include read-only memory (ROM).
	Mask ROM		Mask ROM is static, read-only memory (ROM) that is programmed during fabrication with a special mask that contains the customer code. The code cannot be modified afterwards. Manufacturers that produce large semiconductors often use Mask ROM because it is the most cost-effective ROM available.
	EPROM		Erasable programmable read-only memory (EPROM) is a type of PROM that can be erased through exposure to ultraviolet light and then reprogrammed.
	EEPROM		Electrically erasable programmable read-only memory (EEPROM) is a type of PROM that can be erased electrically and then reprogrammed.
	Flash		Flash is a form of electrically erasable, programmable, read-only memory (EEPROM) that can be erased and reprogrammed in blocks instead of one byte at a time. Flash memory is non-volatile, which means that it does not need a constant power supply in order to retain data. Flash offers extremely fast access times, low power consumption, and relative immunity to severe shock or vibration. Flash memory chips have a lifespan of approximately 100,000 write cycles - a fact that makes Flash unsuitable for use as computer main memory. Typically, Flash memory chips are used in portable or compact devices such as digital cameras, cell phones, pagers, and scanners. Flash memory chips are also used as solid-state disks in laptops and as memory cards for video game consoles.
	FASTROM		Factory advanced service technique read-only memory (FASTROM) is pre-programmed by the manufacturer with the customer's code and selected options. Compared to Flash, FASTROM provides improved programming efficiency for large quantities (10,000+). Compared to Mask ROM, FASTROM offers shorter lead-times and reprogrammability.
	OTP		One time programmed memory (OTP).
	Other		Other unlisted or proprietary ROM types.
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Power Characteristics


	Supply Voltage (V_cc):		The value as specified by level (Min-Typ-Max) of the direct supply voltage, applied to an IC.
	Search Logic:		User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.

	Supply Current		The continuous current (in A) required by this item during normal operation.
	Search Logic:		All matching products will have a value less than or equal to the specified value.

	Power Dissipation		The maximum permissible power dissipation per output (in W) of this item at specified ambient temperature.
	Search Logic:		All matching products will have a value less than or equal to the specified value.

Timers The timer type(s), and the number of bits and number of channels provided.


	Number of bits		The number of bits of the timer.
	Your choices are...
	8 Bit		The microcontroller has an 8-bit timer.
	16 Bit		The microcontroller has a 16-bit timer.
	24 Bit		The microcontroller has a 24-bit timer.
	32 Bit		The microcontroller has a 32-bit timer.
	Other		Any other timer not listed.
	Search Logic:		All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.

	Number of Timers:		The number of timers embedded in the microcontroller.
	Search Logic:		User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.

Interfaces and Ports Connection to a microcontroller that provides a data path between the microcontroller and external devices, such as a keyboard, display, or reader. It may provide input only, output only, or both input and output.


	Serial Interfaces		The serial interface type(s), and the number of channels provided.
	Your choices are...
	CAN		The Controller Area Network (CAN) protocol is a serial communication protocol originally developed by Robert Bosch for use in serial communication networks in vehicles. Several major auto manufacturers are either using CAN networks in their vehicles or are developing them for future vehicles. In addition, CAN is becoming very popular for use in factory-floor automation-type industrial networks. The major players in industrial automation, including Allen-Bradley, Honeywell, and Eaton Cutler-Hammer, are all manufacturing CAN-based industrial control systems, and are publicizing their beliefs that the CAN protocol is the best solution for this type of control network.
	I²C		Inter-Integrated Circuit (I²C) is a bus is an inexpensive type of chip interconnection that is popular on circuit boards (pronounced "Eye Squared C").
	SPI		The Serial Peripheral Interface (SPI) is similar to the SCI, although it is used to communicate synchronously over shorter distances at up to 4 Mbit/s. The SPI allows the microcontroller to communicate with peripheral devices, which could be anything from a simple TTL shift register to a complete subsystem such as an LCD display or an A/D converter system. The SPI is flexible enough to interface directly with numerous standard peripherals from many manufacturers. SPIs can also be used to expand the number of inputs and outputs of the microcontroller with the minimum number of pins.
	SCI		The Serial Communications Interface (SCI) is an independent serial I/O subsystem (full-duplex UART-type asynchronous system). The SCI can be used for communications between the microcontroller and a terminal, PC, or other microcontrollers in the form of a network. An on-chip baud rate generator derives standard baud-rate frequencies from the microcontroller oscillator.
	UART		Generically, this refers to any device capable of implementing a variety of asynchronous serial protocols, such as RS 232, HDLC and SDLC. In this context, it refers to the operating mode of the SCCs that provides this functionality.
	USART		USART is a full duplex synchronous / asynchronous receiver and transmitter that supports a wide range of software programmable baud rates and data formats
	USB		Universal Serial Port.
	Other		Other unlisted interface types.
	Search Logic:		All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.

	Serial Port Channels:		The number of serial ports the microcontroller has.
	Search Logic:		User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.

	Number of I/O Ports		The total number of input, output, and I/O ports combined. An I/O port is a connection to a CPU that is configured or programmed to provide data path between the CPU and external devices such as a keyboard, display, or reader; it may be an input port or an output port, or it may be bi-directional.
	Search Logic:		All matching products will have a value greater than or equal to the specified value.

Converters The resolution of the A/D and D/A converters, and the number of channels provided.


	A/D Converter		The resolution of the A/D converter.
	Your choices are...
	8 Bit		The microcontroller has an 8-bit A/D.
	16 Bit		The microcontroller has a 16-bit timer.
	24 Bit		The microcontroller has a 24-bit timer.
	32 Bit		The microcontroller has a 32-bit timer.
	Other		Other unlisted converters.
	Search Logic:		All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.

	Number of A/D Converters		A/D converters take analog inputs and convert them to digital signals. For example, a sine wave input can be converted into a series of numbers that represent the value of the input curve at any given point on the curve. The resolution of the converter is determined by the number of bits (the more the better) and the sample rate (the faster the better).
	Search Logic:		All matching products will have a value greater than or equal to the specified value.

Packaging Information


	IC Package Type
	Your choices are...
	Bare Die		The device is sold in semiconductor die form. It does not have a case or packaging.
	BGA		Ball-grid array (BGA) places output pins in a solder ball matrix. Generally, BGA traces are fabricated on laminated (BT-based) substrates or polyimide-based films. Therefore, the entire area of substrates or films can be used to route the interconnection. BGA has another advantage of lower ground or power inductance by assigning ground or power nets via a shorter current path to PCB. Thermally enhanced mechanisms (heat sink, thermal balls, etc.) can be applied to BGA to reduce the thermal resistance. The sophisticated capabilities make BGA the desirable package to implement electrical and thermal enhancement in response to the need for high power and high speed ICs.
	FCBGA		Flip chip ball-grid array (FCBGA) uses a combination of flip chip and ball grid array features. FCBGA enables short electrical paths for high frequency applications. The simultaneous soldering of all joints in one pass through a reflow furnace facilitates the mounting of packages with thousands of solder joints.
	MCM-PBGA		Multi-chip module plastic ball-grid array (MCM-PBGA).
	PBGA		Plastic ball-grid array (PBGA) is the general terminology for the BGA package adopting plastic (epoxy molding compound) as the encapsulation. According to JEDEC standard, PBGA refers to an overall thickness of over 1.7mm.
	TBGA		Tape ball-grid array (TBGA) uses a fine, polyimide substrate and provides good thermal performance with high pin counts.
	CSP		Chip scale package or chip size package (CSP) has an area that is no more than 20% larger than the built-in die. CSP is compact for second level packaging efficiency and encapsulated for second level reliability. CSP is superior to both direct-chip-attach (DCA) and chip-on-board (COB) technologies. CSP is used in a variety of integrated circuits (IC), including radio frequency ICs (RFIC), memory ICs, and communication ICs.
	FCCSP		Flip-chip chip-scale package (FCCSP).
	SuperFC®		Super flip-chip or SuperFC® packages feature a controlled bondline die attached directly to a copper heat spreader. SuperFC® is a registered trademark of Amkor.
	SCSP		Stacked-chip scale package (SCSP) is a technology where two or more dies are stacked within a single package assembly.
	UCSP		Ultra chip scale package (UCSP).
	FCPGA		Flip-chip pin-grid array (FCPGA) attaches the chip to the board facedown, without any wire bonding.
	CPGA		Ceramic pin-grid array (CPGA).
	PPGA		Plastic pin-grid array (PPGA).
	CDIP		Ceramic dual in-line package (CDIP) consists of two pieces of dry pressed ceramic surrounding a "DIP formed" lead frame. The ceramic / LF / ceramic system is held together hermetically by frit glass reflowed at temperatures between 400° - 460° centigrade.
	PDIP		Plastic dual in-line package (PDIP) is widely used for low cost, hand-insertion applications including consumer products, automotive devices, logic, memory ICs, micro-controllers, logic and power ICs, video controllers commercial electronics and telecommunications.
	FLGA		Fine-pitch land-grid array (FLGA) is extremely compact and lightweight, making it suitable for miniature disc drives and digital cameras.
	HSOF		Small outline flat-leaded package with heat sink (HSOF).
	LCCC		Leadless ceramic chip carrier (LCCC).
	PLCC		Plastic leaded chip carrier (PLCC).
	QFP		Quad flat packages (QFP) contain a large number of fine, flexible, gull wing shaped leads. Lead width can be as small as 0.16 mm. Lead pitch is 0.4 mm. QFPs provide good second-level reliability and are used in processors, controllers, ASICs, DSPs, gate arrays, logic, memory ICs, PC chipsets, and other applications.
	LQFP		Low quad flat package (LQFP).
	PQFP		Plastic quad flat package (PQFP).
	QFNL		Quad flat non-leaded package (QFNL).
	TQFP		Thin quad flat package (TQFP).
	SDIP		Shrink dual in-line package (SDIP).
	SIP		Single in-line package (SIP).
	SOJ		Small outline J-lead (SOJ) is a common form of surface-mount DRAM packaging. It is a rectangular package with J-shaped leads on the two long sides of the device.
	SOIC		Small outline integrated circuit (SOIC).
	SOP		Small outline package (SOP).
	SSOP		Shrink small outline package (SSOP).
	SZIP		Shrink zigzag in-line package (SZIP).
	TSOP Type I		Thin small outline package (TSOP), Type I is a type of DRAM package that uses gull wing shaped leads on both sides. TSOP DRAM mounts directly on the surface of the printed circuit board. The advantage of the TSOP package is that it is one-third the thickness of an SOJ package. TSOP components are commonly used in small outline DIMM and credit card memory applications.
	TSOP Type II		Thin small outline package (TSOP), Type II is a type of DRAM package that uses gull wing shaped leads on both sides. TSOP DRAM mounts directly on the surface of the printed circuit board. The advantage of the TSOP package is that it is one-third the thickness of an SOJ package. TSOP components are commonly used in small outline DIMM and credit card memory applications. Thin small outline package may be Type I or Type II.
	TSSOP		Thin shrink small outline L-leaded package (TSSOP).
	TVSOP		Thin very small outline package (TVSOP).
	Other		Other unlisted, specialized, or proprietary packages.
	Search Logic:		Products with the selected attribute will be returned as matches. Leaving or selecting "No Preference" will not limit the search criteria for this question; products with all attribute options will be returned as matches.

	Operating Range		The industrial field in which the device will be used.
	Your choices are...
	Commercial
	Industrial
	Military
	Automotive
	Other
	Search Logic:		Products with the selected attribute will be returned as matches. Leaving or selecting "No Preference" will not limit the search criteria for this question; products with all attribute options will be returned as matches.

	Pin Count		The number of pins the DSP has. The question is presented as a range for convenience of selection.
	Search Logic:		User may specify either, both, or neither of the "At Least" and "No More Than" values. Products returned as matches will meet all specified criteria.

	Operating Temperature:		The value as specified by level (Min-Typ-Max) of the ambient temperature (in degree Celsius) in which this microcontroller was designed to operate.
	Search Logic:		User may specify either, both, or neither of the limits in a "From - To" range; when both are specified, matching products will cover entire range. Products returned as matches will meet all specified criteria.

Other Functions / Features


	Watchdog Timer?		A watchdog timer is a simple countdown timer, which is used to reset a microprocessor after a specific interval of time.
	Search Logic:		"Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.

	DMA Channels		Direct Memory Access (DMA is a technique for transferring data directly between two peripherals (usually memory and an I/O device) with only minimal intervention by the processor.
	Search Logic:		"Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.

	PWM Channels		Pulse Width Modulation (PWM) is a technique for controlling analog circuits with a processor's digital outputs. PWM is employed in a wide range of applications, from measurement and communications to power control and conversion.
	Search Logic:		"Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.

	Power Saving Modes		Functions that allow the microcontroller to same power. Some of these functions include: Wait Mode, STOP Mode, SLEEP Mode, etc.
	Search Logic:		"Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.

	Oscillator Safeguard (OSG)		The Oscillator Safeguard (OSG) feature provides the following functions to the MCU: Filters spikes in the oscillator lines, Manages the Low Frequency Auxiliary Oscillator (LFAO), and Automatically limits the internal frequency (f_INT) clock frequency as a function of supply voltage.
	Search Logic:		"Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.

	Low Frequency Auxiliary Oscillator (LFAO)		A backup oscillator.
	Search Logic:		"Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.

	Low Voltage Detector (LVD)		The Low Voltage Detector (LVD) allows the MCU to be used without any external RESET circuitry. If the LVD is not used, an external circuit is mandatory to ensure correct Power On Reset operation.
	Search Logic:		"Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.

	Readout Protection		The Readout Protection feature is used to protect the program memory against external readout. Once the Readout Protection is active, it is no longer possible to gain access to the OTP or ROM content.
	Search Logic:		"Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.

	LCD Driver		A feature used to connect and control external LCDs.
	Search Logic:		"Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.

Microcontrollers (MCU) Specifications

Data Bus:

Life Cycle Stage:

Clock Speed:

Number of Interrupts:

Internal RAM Size:

Internal ROM Size:

Internal ROM Type:

Supply Voltage (Vcc):

Supply Current:

Power Dissipation:

Number of bits:

Number of Timers:

Serial Interfaces:

Serial Port Channels:

Number of I/O Ports:

A/D Converter:

Number of A/D Converters:

IC Package Type:

Operating Range:

Pin Count:

Operating Temperature:

Watchdog Timer?

DMA Channels?

PWM Channels?

Power Saving Modes?

Oscillator Safeguard (OSG)?

Low Frequency Auxiliary Oscillator (LFAO)?

Low Voltage Detector (LVD)?

Readout Protection?

LCD Driver?

Help with Microcontrollers (MCU) specifications:

Supply Voltage (V_cc):