Thermal Interface Material...Heat-Spring®

Featured Product from Indium Corporation

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Indium Corporation - Many applications call for TIM that can easily be placed on a chip, on a lid or perhaps just against a heat source and a cooling solution contact plate. We developed a metal TIM which would work as a compressible Interface Solution for such an application. Our pressure range is 35psi to 100+ psi.

An SMA-TIM made of indium offers uniform thermal resistance at lower applied stresses in compressed interfaces. The malleability of indium minimizes surface resistance and increases heat flow. Our patented Heat-Spring® technology will further reduce the thermal resistance.

Indium's line of high-end thermal interface materials delivers superior performance over time. As SMA-TIM products are made of metal, they cannot experience pump out problems even under power cycling. The Heat-Spring® material, which does not contain silicone, will conform to surface disparities over time, thereby reducing thermal resistance through the life of the TIM. Due to its solid state, the SMA-TIM also resists bake out. Heat-Spring® Research Kits are available for testing in specific applciations.

Visit to purchase your kit or contact our technical support or applications engineers at for help in selecting the kit that is right for your application.