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COMSOL, Inc. - Heat Transfer Module

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Problems involving any combination of conduction, convection, and radiation are solved easily with the Heat Transfer Module. It finds extensive use in systems that involve the generation and flow of heat in any form.

A variety of specialized modeling interfaces are available for different formulations
and applications such as surface-to-surface radiation, non-isothermal flow, heat transfer in structures made of thin layers and shells, and heat transfer in biological tissue.

The Heat Transfer Module allows for arbitrary couplings to other application modes in COMSOL Multiphysics as well as other add on modules. This is particularly relevant to applications such as thermal management in the electronics industry, thermal processing and manufacturing, and medical technology and bioengineering.

Application Examples

  • Bioheat treatment and thermal therapy
  • Casting and thermal processing
  • Convection cooling of electronics and power electronics
  • Drying and freeze drying
  • Food processing, cooking and sterilization
  • Friction stir welding (FSW)
  • Furnace and burner design
  • Heat exchangers
  • Heating, ventilation and air-conditioning (HVAC) in building design
  • Material heat treatment
  • Resistive and inductive heating
  • Thermal design—brake discs, cooling flanges, exhaust pipes
  • Vacuum processes using radiation
  • Welding

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