See Product Details

Temperature Control System Reduces Variability in Precision Fluid Dispensing Processes

For adhesives, epoxies, solder, paste fluxes, RTV/sealants & solder resists and many temperature-sensitive materials temperature changes as small as 1ºC can make or break a process. Elevated material temperatures due to nearby equipment or operator handling can cause a variety of problems, including clogged needles, inconsistent shots and wasted material.

The new ProcessMate™ 6500 Temperature Control System eliminates temperature fluctuations that can cause variations in shot size, viscosity and pot life when dispensing solder pastes, adhesives and other assembly fluids.

Designed for use with air-powered benchtop dispensers and automated dispense valves, the ProcessMate is a cost-effective alternative to the large, expensive environmental control systems typically used for room and machine enclosures. The compact, stand-alone unit will maintain precise temperature control within +/- 0.25°C over an operating range from 10° to 40°C, for more consistent fluid deposits and better process control.

The ProcessMate is available with a comprehensive and customizable line of static dissipative enclosures for automated, handheld, benchtop, and cartridge dispensing operations.

Click on the link to the right for a detailed pdf or send us an e mail regarding your dispensing challenges. Our application engineers will be happy to help