Gap Pad Thermally Conductive Gap Filling Materials

Product Announcement from Quist Electronics

Gap Pad Thermally Conductive Gap Filling Materials-Image

Gap Pad VO is a cost-effective, thermally conductive interface material.The material is a filled, thermally conductive polymer supplied on a rubber-coated fiberglass carrier allowing for easy material handling.The conformable nature of Gap Pad VO allows the pad to fill in air gaps between PC boards and heat sinks or a metal chassis.

Note: Resultant thickness is defined as the final gap thickness of the application.

Features and Benefits

  • Thermal conductivity: 0.8 W/m-K
  • Enhanced puncture, shear and tear resistance
  • Conformable gap filling material
  • Electrically isolating

Typical Applications Include:

  • Telecommunications
  • Computer and peripherals
  • Power conversion
  • Between heat-generating semiconductors and a heat sink
  • Area where heat needs to be transferred to a frame, chassis, or other type of heat spreader
  • Between heat-generating magnetic components and a heat sink

Configurations Available:

Sheet form and die-cut parts

Addidional Bergquist products